AU2015287804B2 - Integrated device comprising coaxial interconnect - Google Patents

Integrated device comprising coaxial interconnect Download PDF

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Publication number
AU2015287804B2
AU2015287804B2 AU2015287804A AU2015287804A AU2015287804B2 AU 2015287804 B2 AU2015287804 B2 AU 2015287804B2 AU 2015287804 A AU2015287804 A AU 2015287804A AU 2015287804 A AU2015287804 A AU 2015287804A AU 2015287804 B2 AU2015287804 B2 AU 2015287804B2
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AU
Australia
Prior art keywords
interconnect
substrate
electrical
integrated device
interconnects
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Active
Application number
AU2015287804A
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English (en)
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AU2015287804A1 (en
Inventor
Kyu-Pyung Hwang
Dong Wook Kim
Young Kyu Song
Hong Bok We
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
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Qualcomm Inc
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Publication date
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Publication of AU2015287804A1 publication Critical patent/AU2015287804A1/en
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Publication of AU2015287804B2 publication Critical patent/AU2015287804B2/en
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/267—Patterned shielding planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
AU2015287804A 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect Active AU2015287804B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/329,646 US9385077B2 (en) 2014-07-11 2014-07-11 Integrated device comprising coaxial interconnect
US14/329,646 2014-07-11
PCT/US2015/039678 WO2016007706A1 (en) 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect

Publications (2)

Publication Number Publication Date
AU2015287804A1 AU2015287804A1 (en) 2017-01-05
AU2015287804B2 true AU2015287804B2 (en) 2020-02-27

Family

ID=53719982

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2015287804A Active AU2015287804B2 (en) 2014-07-11 2015-07-09 Integrated device comprising coaxial interconnect

Country Status (8)

Country Link
US (1) US9385077B2 (enExample)
EP (1) EP3167483A1 (enExample)
JP (1) JP6802146B2 (enExample)
KR (1) KR102411667B1 (enExample)
CN (2) CN106489191A (enExample)
AU (1) AU2015287804B2 (enExample)
BR (1) BR112017000154B1 (enExample)
WO (1) WO2016007706A1 (enExample)

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US10381303B2 (en) * 2016-07-01 2019-08-13 Vanguard International Semiconductor Corporation Semiconductor device structures
TWI594338B (zh) * 2016-08-09 2017-08-01 矽品精密工業股份有限公司 電子堆疊結構及其製法
US10070525B2 (en) * 2016-12-28 2018-09-04 Intel Corporation Internal to internal coaxial via transition structures in package substrates
WO2018182652A1 (en) * 2017-03-30 2018-10-04 Intel Corporation Semiconductor package having a coaxial first layer interconnect
US10734334B2 (en) * 2018-01-29 2020-08-04 Marvell Asia Pte, Ltd. Coaxial-interconnect structure for a semiconductor component
KR102740257B1 (ko) * 2019-12-17 2024-12-10 삼성전자주식회사 반도체 패키지
KR102903835B1 (ko) * 2020-08-25 2025-12-31 삼성전자주식회사 반도체 패키지
US11984421B2 (en) * 2020-11-03 2024-05-14 Samsung Electronics Co., Ltd. Integrated circuit chip having BS-PDN structure
KR20220124583A (ko) * 2021-03-03 2022-09-14 삼성전자주식회사 인터포저를 포함하는 전자 장치
US20230036650A1 (en) * 2021-07-27 2023-02-02 Qualcomm Incorporated Sense lines for high-speed application packages
CN115023038A (zh) * 2022-04-29 2022-09-06 清华大学 微系统集成电路的叠装结构和叠装方法
US20240047319A1 (en) * 2022-08-04 2024-02-08 Samsung Electronics Co., Ltd. Semiconductor package and method of fabricating the same
US12520417B2 (en) * 2022-12-12 2026-01-06 Rolls-Royce North American Technologies Inc. Circuit board assembly having a security shield and method of the same
US20250273612A1 (en) * 2024-02-28 2025-08-28 Qualcomm Incorporated Package comprising a substrate including an inter substrate interconnect structure comprising an inner interconnect

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DE102005002707A1 (de) * 2005-01-19 2006-07-27 Infineon Technologies Ag Halbleiterbauteil mit Mikroverbindungselementen und Verfahren zur Herstellung desselben
EP2244291A1 (en) * 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
US20120313226A1 (en) * 2011-06-08 2012-12-13 Shinko Electric Industries Co., Ltd. Wiring substrate, semiconductor device and manufacturing method thereof

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JP3601462B2 (ja) * 2001-03-05 2004-12-15 オムロン株式会社 電子部品のパッケージ構造
US6476476B1 (en) 2001-08-16 2002-11-05 Amkor Technology, Inc. Integrated circuit package including pin and barrel interconnects
US7045893B1 (en) * 2004-07-15 2006-05-16 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
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DE102005002707A1 (de) * 2005-01-19 2006-07-27 Infineon Technologies Ag Halbleiterbauteil mit Mikroverbindungselementen und Verfahren zur Herstellung desselben
EP2244291A1 (en) * 2009-04-20 2010-10-27 Nxp B.V. Multilevel interconnection system
US20120313226A1 (en) * 2011-06-08 2012-12-13 Shinko Electric Industries Co., Ltd. Wiring substrate, semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
JP6802146B2 (ja) 2020-12-16
CN106489191A (zh) 2017-03-08
KR20170028901A (ko) 2017-03-14
EP3167483A1 (en) 2017-05-17
US20160013125A1 (en) 2016-01-14
WO2016007706A1 (en) 2016-01-14
BR112017000154B1 (pt) 2022-05-17
CN115036287A (zh) 2022-09-09
KR102411667B1 (ko) 2022-06-20
BR112017000154A2 (pt) 2017-11-07
JP2017520929A (ja) 2017-07-27
AU2015287804A1 (en) 2017-01-05
US9385077B2 (en) 2016-07-05

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