CN110098164A - 用于半导体部件的同轴互连结构 - Google Patents
用于半导体部件的同轴互连结构 Download PDFInfo
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- CN110098164A CN110098164A CN201811279333.7A CN201811279333A CN110098164A CN 110098164 A CN110098164 A CN 110098164A CN 201811279333 A CN201811279333 A CN 201811279333A CN 110098164 A CN110098164 A CN 110098164A
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- semiconductor component
- signal
- interconnection structure
- bare die
- package substrate
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (20)
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US201862623416P | 2018-01-29 | 2018-01-29 | |
US62/623,416 | 2018-01-29 | ||
US16/133,381 | 2018-09-17 | ||
US16/133,381 US10734334B2 (en) | 2018-01-29 | 2018-09-17 | Coaxial-interconnect structure for a semiconductor component |
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CN110098164A true CN110098164A (zh) | 2019-08-06 |
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CN201811279333.7A Pending CN110098164A (zh) | 2018-01-29 | 2018-10-30 | 用于半导体部件的同轴互连结构 |
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US (1) | US10734334B2 (zh) |
CN (1) | CN110098164A (zh) |
TW (2) | TWM622591U (zh) |
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CN112490610A (zh) * | 2020-11-27 | 2021-03-12 | 浙江集迈科微电子有限公司 | 用于硅基射频收发微系统的三维多通道功分器及制备方法 |
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US11785707B2 (en) | 2021-01-21 | 2023-10-10 | Unimicron Technology Corp. | Circuit board and manufacturing method thereof and electronic device |
Citations (3)
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US9368440B1 (en) * | 2013-07-31 | 2016-06-14 | Altera Corporation | Embedded coaxial wire and method of manufacture |
CN106489191A (zh) * | 2014-07-11 | 2017-03-08 | 高通股份有限公司 | 包括同轴互连的集成器件 |
CN106663645A (zh) * | 2014-07-16 | 2017-05-10 | 泰拉丁公司 | 用于在测试设备中传输信号的同轴结构 |
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US6812401B2 (en) * | 1998-10-05 | 2004-11-02 | Temp-Flex Cable, Inc. | Ultra-small high-speed coaxial cable with dual filament insulator |
US7906730B2 (en) * | 2008-09-29 | 2011-03-15 | Amphenol Corporation | Ground sleeve having improved impedance control and high frequency performance |
US8940631B1 (en) * | 2013-03-15 | 2015-01-27 | Maxim Integrated Products, Inc. | Methods of forming coaxial feedthroughs for 3D integrated circuits |
US10020249B2 (en) * | 2016-10-21 | 2018-07-10 | Ciena Corporation | Electronic device package using a substrate side coaxial interface |
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- 2018-10-02 TW TW110211486U patent/TWM622591U/zh not_active IP Right Cessation
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Publication number | Priority date | Publication date | Assignee | Title |
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US9368440B1 (en) * | 2013-07-31 | 2016-06-14 | Altera Corporation | Embedded coaxial wire and method of manufacture |
CN106489191A (zh) * | 2014-07-11 | 2017-03-08 | 高通股份有限公司 | 包括同轴互连的集成器件 |
CN106663645A (zh) * | 2014-07-16 | 2017-05-10 | 泰拉丁公司 | 用于在测试设备中传输信号的同轴结构 |
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CN112490610A (zh) * | 2020-11-27 | 2021-03-12 | 浙江集迈科微电子有限公司 | 用于硅基射频收发微系统的三维多通道功分器及制备方法 |
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TWM622591U (zh) | 2022-01-21 |
TW201933562A (zh) | 2019-08-16 |
US10734334B2 (en) | 2020-08-04 |
US20190237418A1 (en) | 2019-08-01 |
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