CN106332443B - 软性电路板的制作方法 - Google Patents
软性电路板的制作方法 Download PDFInfo
- Publication number
- CN106332443B CN106332443B CN201510371517.6A CN201510371517A CN106332443B CN 106332443 B CN106332443 B CN 106332443B CN 201510371517 A CN201510371517 A CN 201510371517A CN 106332443 B CN106332443 B CN 106332443B
- Authority
- CN
- China
- Prior art keywords
- layer
- native copper
- connection gasket
- area
- native
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510371517.6A CN106332443B (zh) | 2015-06-29 | 2015-06-29 | 软性电路板的制作方法 |
TW104125032A TWI608776B (zh) | 2015-06-29 | 2015-07-31 | 軟性電路板的製作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510371517.6A CN106332443B (zh) | 2015-06-29 | 2015-06-29 | 软性电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106332443A CN106332443A (zh) | 2017-01-11 |
CN106332443B true CN106332443B (zh) | 2019-03-08 |
Family
ID=57723061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510371517.6A Active CN106332443B (zh) | 2015-06-29 | 2015-06-29 | 软性电路板的制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106332443B (zh) |
TW (1) | TWI608776B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113423172B (zh) * | 2021-05-24 | 2023-04-14 | 鹏鼎控股(深圳)股份有限公司 | 软硬结合电路板及其制作方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1798484A (zh) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | 挠性多层印刷线路板导通孔选择性镀铜的工艺方法 |
CN200980203Y (zh) * | 2006-12-19 | 2007-11-21 | 比亚迪股份有限公司 | 一种印刷线路板 |
TWM339084U (en) * | 2007-07-25 | 2008-08-21 | Sensitive Electronic Co Ltd | Soft thin circuit substrate for LED and LED light bar |
CN101790288A (zh) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | 一种新型的印制电路板的制造方法 |
CN102098872A (zh) * | 2009-12-09 | 2011-06-15 | 联致科技股份有限公司 | 接垫结构及其制法 |
CN102480845A (zh) * | 2010-11-30 | 2012-05-30 | 比亚迪股份有限公司 | 一种柔性印刷线路板的制作方法 |
CN103429008A (zh) * | 2012-05-25 | 2013-12-04 | 镇江华扬信息科技有限公司 | 一种含焊垫内贯孔结构的印刷电路板制作方法 |
-
2015
- 2015-06-29 CN CN201510371517.6A patent/CN106332443B/zh active Active
- 2015-07-31 TW TW104125032A patent/TWI608776B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1798484A (zh) * | 2004-12-27 | 2006-07-05 | 淳华科技(昆山)有限公司 | 挠性多层印刷线路板导通孔选择性镀铜的工艺方法 |
CN200980203Y (zh) * | 2006-12-19 | 2007-11-21 | 比亚迪股份有限公司 | 一种印刷线路板 |
TWM339084U (en) * | 2007-07-25 | 2008-08-21 | Sensitive Electronic Co Ltd | Soft thin circuit substrate for LED and LED light bar |
CN101790288A (zh) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | 一种新型的印制电路板的制造方法 |
CN102098872A (zh) * | 2009-12-09 | 2011-06-15 | 联致科技股份有限公司 | 接垫结构及其制法 |
CN102480845A (zh) * | 2010-11-30 | 2012-05-30 | 比亚迪股份有限公司 | 一种柔性印刷线路板的制作方法 |
CN103429008A (zh) * | 2012-05-25 | 2013-12-04 | 镇江华扬信息科技有限公司 | 一种含焊垫内贯孔结构的印刷电路板制作方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI608776B (zh) | 2017-12-11 |
TW201711549A (zh) | 2017-03-16 |
CN106332443A (zh) | 2017-01-11 |
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PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190103 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518105 Yanchuan Yanluo Road, Songgang Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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