M339084 八、新型說明： 【新型所屬之技術領域】 本新型是有關於發光二極體用的電路基板，特別是指 一種發光二極體用的柔性薄型電路基板及應用其形成的發 光二極體燈條。 【先前技術】 由於發光二極體具有省電、環保、高亮度、使用壽命 長等優點，已逐漸取代傳統的光源，廣泛應用於照明、告 示燈、廣告看板、液晶顯示器等領域。 愈光二極體為點光源，為了增加發光的範圍，一般使 用發光二極體為光源的照明裝置或是電子裝置，是先將多 數個發光二極體排列設置於—印刷電路板上形成發光二極 體燈組’再將該發光二極體燈組安裝於照明裝置或電子裝 置中。然而，一般印刷電路板的熱傳導效果不佳，無法快 速將發光二極體發光所產生的熱能移除，而影響發光二極 體的發光效率及使用壽命。而且，目前以多數個發光二極 體排列於印刷電路板所形成的發光二極體燈條或發光二極 體陣列，須另外組裝反射 β “ > 反射片才旎產生聚光效果，用以提 歼向照射売度，使得製程較為繁瑣耗時。 【新型内容】 :撓曲-體成形反射片之發光二極體用的柔性== 本新型之另一目的 ’在提供一 種以柔性薄型電路基板 M339084 組裝發光二極體所形成的發光二極體燈條。 於是，本新型發光二極體用的柔性薄型電路基板，包 含：一底銅層、一表銅層及一夾置於該底銅層與該表銅層 之間的絕緣層，使該底銅層與該表銅層為電性不導通；該 表銅層上定義有一線路區，且該線路區形成有一可供至少 一發光二極體電連接的電路圖案。 本新型發光一極體燈條包含一前述的電路基板及多數 個設於該電路基板上的發光二極體。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 楚的呈現。 在本新型被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖1與圖2，說明本新型發光二極體用的柔性薄型 電路基板之較佳實施例。本新型較佳實施例為一長條形的 電路基板1，包含一底銅層11、一表銅層12，及一夾置於 底銅層11與表銅層12之間的絕緣層13，絕緣層13可由導 熱絕緣膠所形成，用以黏合底銅層11與表銅層12，並使底 銅層11與表銅層12為電性不導通。表銅層12上定義有一 線路區21及二分別位於線路區21的兩相反側並鄰近電路 基板1之兩長邊的反射區22。在線路區21中，利用蝕刻方 式在表銅層12上餘刻線路31以形成電路圖案3，可供多數 個發光二極體4 (參閱圖8 )設置。在該等反射區22的表 6 M339084 銅層12上分別形成有一亮光層14及—透明防焊層15。亮 光層14用以提昇表銅層12表面的平坦度，以增加光線到 達反射區22時產生反射的機會。透明防焊層15是用以避 免在組裝發光二極體時焊料污染反射區22而降低反射光線 的效果。各反射區22相對於線路區21分別具有一彎折角 23、24’且各彎折角23、24可介於9〇~18〇度，當組裝在 電路基板1的發光二極體4發光時，可藉由反射區22作為 反射面反射侧向光線，使其往正向射出，用以增加正向的 光線強度。而且，由於銅箱為良好的導熱材料，發光二極 體4發光時所產生的熱，可藉由表銅層12、具有導熱功能 的絕緣層以及底銅層u快速散熱，避免熱能累積而影響 發光·一極體4的發光效能。 圖3〜圖5為製作本實施例電路基板！的步驟示圖。如 圖3所示，先提供二銅箱並清潔其表面，其一作為底銅層 11並在底銅層的表面塗佈具有導熱絕緣功能㈣膠，待黏 膠半固化後’貼上另-銅羯作為表銅層12,使黏朦完全固 化形成絕緣層13並將底銅層U與表鋼層12黏合。再於表 銅層12的表面印刷塗佈阻刻油墨5以定義須在°表銅層 蝕刻線路的位4 51。如圖4所示，利用蝕刻方法蝕刻表銅 層U形成射 1線路31以形成可供多數個發光二極體設置 的電路圖案3(再參閱w υ’並將其定義為線路區〜如 圖5所示，餘刻完成後’去除阻刻油墨5,然後在線路區 2!兩侧塗佈亮光塗料形成亮光& 14，再於亮光層μ上塗 佈透明防焊油墨以形成透明防焊層 而凡成本實施例的 7 M339084 電路基板1。如圖6與圖7所示，電路基板i可進一步利用 模具6將線路區21兩側彎折形成彎折角23、24，並形成定 義的反射區22。 如圖8與圖9所示’可利用錫膠41將發光二極體4與 表銅層12黏合，而使發光二極體4組裝於電路基板i上？ 形成發光二極體燈條7。在組裝發光二極體4時，透明防焊 層15可防止錫膠41附著其表面。組裝發光二極體4的步 驟可以在電路基板1形成彎折角23、24之後，也可以是在 形成彎折角23、24之前，可視製程需求調整。 如圖10與圖11所示，製作發光二極體燈條7較佳的方 式，可在一組㈣（可形成底銅層u及表銅層12)利用前 述印刷塗佈、㈣等實施步驟__次形成多數個發光二極體 燈條7的基本結構，再將相連接的底銅層u與絕緣層Η分 離，即可形成多數個發光二極體燈條7,可使節省製程時間 ，具有生產速度快的優點。如圖12所示，將個別的發光三 極體燈條7置於模具6巾即可·彎折形成弯折肖23、24。當 然’如圖1G與圖11所示的製程中，也可以不未設置錫膠 41與發光二極體4 ’即可-次形成多數個電路基板卜 參閱圖U與圖14,結合發光二極體與本新型之電路基 板i的發光二極體燈條7可應詩液晶顯示器的f光板81 82圖13所不為直下式的背光板81，可排列多數個發光 二極體燈條7作為光源。圖14所示為側光式背光板82，發 光二極體燈條7設於導光板821側邊作為側光式背光板82 的光源，發光二極體燈條7之電路基板i的彎折角乃、％ 8 M339084 為90度’故能直接設於導光板821側邊，不需要再另外組 裝反射罩’可使組裝製程更為簡便。本實施例亦可應用於 照明燈具、廣告看板等具有光源的裝置。 歸納上述’本新型之柔性薄型電路基板容易f折形成 反射面’可增加發光二極體的正向發光亮度，並具有高散 熱性，可避免熱能累積影響發光二極體的發光效能。而其 結合多數個發光二極體所形成的發光二極體燈條，除了生 產的製程簡單、快速之外，也可使應用其為光源的照明裝 置或電子裝置在組裝光源時較為簡冑，故_實能達成本新 型之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一示意圖，說明本新型柔性薄型電路基板之一 較佳實施例； 圖2是一沿圖1中的π — η直線所取的剖視示意圖； 圖3〜圖7是說明製作該較佳實施例的實施步驟之示意 圖； 圖8是一不意圖，說明本新型發光二極體燈條之較佳 實施例； 圖9是一沿圖8中的！χ—仅直線所取的剖視示意圖； 圖10〜圖11是說明一次形成多個發光二極體燈條的示 M339084 【主要元件符號說明】 1…… •…電路基板 31 …·線路 11 ••… •…底銅層 4…… …·發光二極體 12···.· •…表銅層 41 ··.·· …·錫膠 13·.··· 5…… …·阻刻油墨 14··.·_ •…亮光層 51 ····. •…蝕刻線路的位置 15••… …··透明防焊層 6…… •…模具 21 •…· ••…線路區 7…… •…發光二極體燈條 22.•… .....反射£ 81 ••… •…背光板 23•…· •…·彎折角 82"… •…背光板 24…… .....彎折角 821… •…導光板 3…… ••…電路圖案M339084 VIII. New description: [New technical field] The present invention relates to a circuit substrate for a light-emitting diode, and more particularly to a flexible thin circuit substrate for a light-emitting diode and a light-emitting diode formed using the same Light. [Prior Art] Since the light-emitting diode has the advantages of power saving, environmental protection, high brightness, long service life, etc., it has gradually replaced the traditional light source and is widely used in the fields of lighting, notice lights, advertising billboards, liquid crystal displays and the like. The light-emitting diode is a point light source. In order to increase the range of light emission, a lighting device or an electronic device using a light-emitting diode as a light source is generally used, and a plurality of light-emitting diodes are arranged on a printed circuit board to form a light-emitting diode. The polar body light group 'installs the light emitting diode lamp set in the lighting device or the electronic device. However, the heat conduction effect of the printed circuit board is generally poor, and the heat energy generated by the light emitting diode cannot be quickly removed, which affects the luminous efficiency and the service life of the light emitting diode. Moreover, at present, a plurality of light-emitting diodes are arranged on a printed circuit board to form a light-emitting diode light bar or a light-emitting diode array, and a reflection β “ > a reflective sheet is additionally assembled to generate a light collecting effect. The enthalpy of the illuminating process makes the process cumbersome and time consuming. [New content]: Flexibility of the light-emitting diode of the flex-body-formed reflecting sheet == Another object of the present invention is to provide a flexible thin circuit The substrate M339084 is assembled with the light-emitting diode light bar formed by the light-emitting diode. Therefore, the flexible thin circuit substrate for the novel light-emitting diode comprises: a bottom copper layer, a copper layer and a clip on the bottom An insulating layer between the copper layer and the copper layer of the watch such that the bottom copper layer and the copper layer are electrically non-conductive; a copper line defines a line region, and the circuit region is formed with at least one light emitting layer The circuit pattern of the diode electrical connection. The novel light-emitting diode light bar comprises the above-mentioned circuit substrate and a plurality of light-emitting diodes disposed on the circuit substrate. [Embodiment] The foregoing and other technologies related to the present invention The content, features, and effects will be apparent from the following detailed description of a preferred embodiment of the drawings. Before the present invention is described in detail, it is noted that in the following description, similar The components are denoted by the same reference numerals. A preferred embodiment of the flexible thin circuit substrate for the novel light-emitting diode is described with reference to Fig. 1 and Fig. 2. The preferred embodiment of the present invention is an elongated circuit substrate. 1, comprising a bottom copper layer 11, a copper layer 12, and an insulating layer 13 sandwiched between the bottom copper layer 11 and the copper layer 12, the insulating layer 13 may be formed of a thermal insulating adhesive for bonding the bottom The copper layer 11 and the copper layer 12 are electrically non-conductive to the bottom copper layer 11 and the copper layer 12. The copper layer 12 defines a line region 21 and two on opposite sides of the line region 21 and adjacent to the circuit. Two long side reflection regions 22 of the substrate 1. In the line region 21, a line 31 is left on the copper layer 12 by etching to form a circuit pattern 3 for a plurality of light-emitting diodes 4 (see FIG. 8). Set. On the copper layer 12 of Table 6 M339084 of the reflection regions 22 respectively A bright light layer 14 and a transparent solder resist layer 15 are formed. The bright light layer 14 is used to enhance the flatness of the surface of the copper layer 12 to increase the chance of reflection when the light reaches the reflective region 22. The transparent solder resist layer 15 is used to avoid When the light emitting diode is assembled, the solder contaminates the reflective region 22 to reduce the effect of reflecting light. Each of the reflective regions 22 has a bending angle 23, 24' with respect to the line region 21, and each of the bending angles 23, 24 may be between 9 〇~ 18 degrees, when the light-emitting diode 4 assembled on the circuit board 1 emits light, the side light can be reflected by the reflection area 22 as a reflection surface to be emitted in the forward direction to increase the forward light intensity. Since the copper box is a good heat conductive material, the heat generated when the light emitting diode 4 emits light can be quickly dissipated by the surface copper layer 12, the insulating layer having the heat conducting function, and the bottom copper layer u, thereby avoiding the accumulation of heat energy and affecting the light emission. · The luminous efficacy of a polar body 4. 3 to 5 show the circuit board of this embodiment! Step diagram. As shown in FIG. 3, a copper box is first provided and the surface thereof is cleaned, one of which serves as the bottom copper layer 11 and is coated with a heat-insulating and insulating function on the surface of the bottom copper layer. After the semi-curing of the adhesive, the other is attached. The copper matte is used as the copper layer 12 to completely cure the adhesive to form the insulating layer 13 and bond the bottom copper layer U to the surface steel layer 12. The resist ink 5 is then applied to the surface of the copper layer 12 to define the location 4 51 where the copper trace must be etched. As shown in FIG. 4, the copper layer U is etched by an etching method to form the emitter 1 line 31 to form a circuit pattern 3 which is provided for a plurality of light emitting diodes (see w υ ' and define it as a line region~ 5, after the completion of the engraving, 'removing the resist ink 5, and then coating the bright paint on both sides of the line area 2! to form a bright light & 14, and then applying a transparent solder resist ink on the bright layer μ to form a transparent solder resist 7 M339084 circuit substrate 1 of the embodiment of the present invention. As shown in FIG. 6 and FIG. 7, the circuit substrate i can be further bent by the mold 6 to form the bending angles 23, 24 on both sides of the line region 21, and form a defined reflection. In the region 22, as shown in FIG. 8 and FIG. 9, the light-emitting diode 4 can be bonded to the surface copper layer 12 by using the tin-glue 41, and the light-emitting diode 4 is assembled on the circuit substrate i to form a light-emitting diode lamp. Article 7. When the light-emitting diode 4 is assembled, the transparent solder resist layer 15 prevents the solder 41 from adhering to the surface thereof. The step of assembling the light-emitting diode 4 may be after the circuit board 1 is formed with the bending angles 23, 24, or Before the bending angles 23, 24 are formed, the process requirements can be adjusted. As shown in Fig. 10 and Fig. 11 Preferably, the light-emitting diode strip 7 can be formed in a group (4) (the bottom copper layer u and the copper layer 12 can be formed) by using the printing coating, (4), etc., to form a plurality of light-emitting diodes. The basic structure of the pole light strip 7 separates the connected bottom copper layer u from the insulating layer , to form a plurality of light-emitting diode strips 7, which can save process time and has the advantages of high production speed. As shown in Fig. 12, the individual light-emitting diode strips 7 are placed in the mold 6 and can be bent to form the bends 23, 24. Of course, as shown in the processes shown in Figs. 1G and 11, The solder paste 41 and the light-emitting diode 4' are not provided, and a plurality of circuit substrates can be formed in a plurality of times. Referring to FIG. 9 and FIG. 14, the light-emitting diode strip 7 combining the light-emitting diode and the circuit board i of the present invention is used. The light-emitting panel 81 82 of FIG. 13 can not be a direct-type backlight board 81, and a plurality of light-emitting diode strips 7 can be arranged as a light source. FIG. 14 shows an edge-light type backlight board 82, which emits light. The pole light strip 7 is disposed on the side of the light guide plate 821 as a light source of the edge light type backlight board 82, and the circuit of the light emitting diode strip 7 The bending angle of the plate i is 90 degrees of % 8 M339084, so it can be directly disposed on the side of the light guide plate 821, and the assembly process is not required to be assembled separately. This embodiment can also be applied to the lighting fixture. A device having a light source, such as an advertisement billboard. The above-mentioned 'the flexible thin circuit substrate of the present invention is easy to fold into a reflecting surface' to increase the forward luminance of the LED, and has high heat dissipation, which can prevent the accumulation of heat energy from affecting the illumination. The luminous efficacy of the diode, and the LED light bar formed by combining a plurality of light-emitting diodes, in addition to the simple and rapid manufacturing process, can also be used as a light source illumination device or electronic device. When assembling the light source, it is relatively simple, so _ can achieve the purpose of this new type. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a preferred embodiment of the novel flexible thin circuit substrate; FIG. 2 is a cross-sectional view taken along line π-η of FIG. 1; FIG. 7 is a schematic view showing the steps of the implementation of the preferred embodiment; FIG. 8 is a schematic view of a preferred embodiment of the novel LED strip; FIG. 9 is a cross-sectional view of FIG. Χ—a cross-sectional view taken only by a straight line; FIGS. 10 to 11 are diagrams showing M339084 for forming a plurality of light-emitting diode light bars at a time. [Main component symbol description] 1... •...circuit substrate 31 ...·line 11 • •... •...Bottom copper layer 4... ...·Light-emitting diode 12······...Table copper layer 41 ········Tin glue 13····· 5... Ink 14····_ •... Bright layer 51 ····. •...The position of the etching line 15••...··Transparent solder mask 6... •...Mold 21 •...· ••...Line area 7 ...... •...Lighting diode strips 22.•.....reflection £ 81 ••... •...Backlight 23•...·•...·Bend angle 82"... •...Backlight 24... ...bend angle 821... •...light guide 3... ••...circuit pattern
1111