JP2013080606A - Electronic component mounting substrate, light-emitting device, and lighting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an electronic component mounting substrate easy to incurvate while maintaining high reliability in electric connection.SOLUTION: The electronic component mounting substrate has a first face, a second face opposite to the first face, and a linear outline. The first face includes a first mounting part and a second mounting part for mounting electronic components, both of which are arranged along a length direction of the linear outline, with an elasticity modulus of the first mounting part and that of the second mounting part being higher than those of sites between the first mounting part and the second mounting part.

Description

  The present invention relates to an electronic component mounting substrate, a light emitting device, and a lighting device.

  In recent years, an illumination device using a white LED (Light Emitting Diode) has been proposed, but the illumination device may not be usable unless it is in a specific form due to restrictions such as standards or space. In this regard, if the substrate on which the LED is mounted (electronic component mounting substrate) can be curved, the degree of freedom in form is greatly improved. Patent Document 1 describes that a groove is provided in a linear substrate, so that the substrate can be easily bent.

JP 2009-59909 A

  In the light emitting device described in Patent Document 1, there is a concern that disconnection or the like may occur in the wiring on the substrate when the substrate is bent.

  An object of the present invention is to improve the reliability of electrical connection when an electronic component mounting board is bent.

  An electronic component mounting board according to the present invention is an electronic component mounting board having a first surface, a second surface opposite to the first surface, and a linear outer shape. A first mounting portion and a second mounting portion for mounting an electronic component, wherein the first mounting portion and the second mounting portion are disposed along a longitudinal direction of the linear outer shape, In one aspect, the elastic modulus of the first mounting portion and the elastic modulus of the second mounting portion are higher than the elastic modulus of the portion between the first mounting portion and the second mounting portion, respectively. And

  At least one of the first mounting portion and the second mounting portion is formed with a concave portion by laminating an upper layer on the base portion on which the concave portion is formed, and the concave portion of the base portion is based on plastic deformation. It is preferable that there is.

  It is preferable that the concave portion of the base portion is work-cured.

  It is preferable to have a substrate having a linear outer shape, an insulating layer formed on the substrate, and a conductor layer formed on the insulating layer.

  The substrate is preferably made of metal.

  It is preferable that the edge of the conductor layer jumps up to the opposite side of the substrate.

  The insulating layer preferably includes a first component that increases adhesion and a second component that increases flexibility.

  The first component is at least one of methacrylic acid, methyl methacrylate, and glycidyl methacrylate, and the second component is at least one of an olefin resin, a fluorine resin, and a silicone resin. preferable.

  The conductor layer has wiring for the electronic component to be mounted, and a conductor pad is formed on an end of the wiring, and the conductor pad is formed of the first mounting portion and the second mounting portion. It is preferable to arrange each.

  It is preferable that the dimension in the short direction of the insulating layer is larger than the dimension in the short direction of the conductor layer.

  The maximum dimension in the short direction of the first mounting part and the maximum dimension in the short direction of the second mounting part are respectively the short direction of the portion between the first mounting part and the second mounting part. It is preferably larger than the maximum dimension.

  It is preferable that the dimension in the longitudinal direction of the first mounting part and the dimension in the longitudinal direction of the second mounting part are respectively larger than the interval between the first mounting part and the second mounting part.

  A plurality of mounting parts including the first mounting part and the second mounting part are arranged along the longitudinal direction, and the elastic modulus of all the mounting parts arranged along the longitudinal direction is between the mounting parts. It is preferable that the elastic modulus is higher than any elastic modulus of the part.

  It is preferable that all the mounting portions arranged along the longitudinal direction have substantially the same elastic modulus, and each portion between the mounting portions has substantially the same elastic modulus.

  The light emitting device according to the present invention is a light emitting device having an electronic component mounting substrate and a light emitting element, and the electronic component mounting substrate is an electronic component mounting substrate according to the present invention and is mounted on the first mounting portion. It has a 1st light emitting element and the 2nd light emitting element mounted in the said 2nd mounting part, It is characterized by the above-mentioned.

  The lighting device according to the present invention is a lighting device including a light emitting device having an electronic component mounting substrate and a light emitting element, wherein at least one of the light emitting devices according to the present invention is formed in a ring shape. To do.

  The plurality of light emitting devices are preferably connected to each other and formed into the ring shape.

  The light emitting device is preferably housed in an annular tube.

  ADVANTAGE OF THE INVENTION According to this invention, an electronic component mounting board | substrate can be made easy to curve, maintaining the high reliability about electrical connection. Therefore, it is possible to obtain an electronic component mounting board, a light emitting device, and a lighting device having high reliability for electrical connection.

It is a figure which shows the outline of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is a figure which expands and shows a part of electronic component mounting board | substrate shown to FIG. 1A. It is sectional drawing of the connection part of the electronic component mounting board | substrate shown to FIG. 1A. It is a figure for demonstrating the dimension of the electronic component mounting board | substrate shown to FIG. 1A. It is a top view of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is sectional drawing of the transversal direction of the electronic component mounting board | substrate shown in FIG. It is sectional drawing of the longitudinal direction of the electronic component mounting board | substrate shown in FIG. It is a figure which shows the electronic component mounting substrate which concerns on Embodiment 1 of this invention in the state curved in the thickness direction. It is a figure which shows the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention in the state curved to the side. 4 is a graph showing a relationship between a radius of curvature (horizontal axis) and a deformation rate (vertical axis) when each of the mounting portion and the connecting portion in the electronic component mounting board according to Embodiment 1 of the present invention is bent sideways. is there. It is a figure which shows typically a mode when the electronic component mounting substrate which concerns on Embodiment 1 of this invention is curved in the thickness direction. It is a figure which shows typically a mode when the electronic component mounting substrate which concerns on Embodiment 1 of this invention is curved to the side. It is a figure which shows the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention in the state which does not curve. It is a figure which shows the state of wiring when the electronic component mounting board which concerns on Embodiment 1 of this invention is curved in the 1st thickness direction. It is a figure which shows the state of wiring when the electronic component mounting board which concerns on Embodiment 1 of this invention is curved in the 2nd thickness direction. In the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention, it is a figure which shows the starting material which has a conductor layer. It is a figure for demonstrating the process of forming a conductor pad on the 1st surface of the conductor layer shown to FIG. 11A. It is a figure for demonstrating the process of forming an insulating layer on the 2nd surface of the conductor layer shown to FIG. 11B. It is a figure for demonstrating the process of providing a carrier on the conductor layer and conductor pad shown in FIG. It is a figure for demonstrating the process of forming a notch in the conductor layer in which the carrier was provided by the process of FIG. 13A. It is a figure for demonstrating the 1st process of forming a recessed part in a board | substrate in the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the 2nd process after the process of FIG. 14A. It is a figure for demonstrating the 3rd process after the process of FIG. 14B. It is a figure for demonstrating the process of mounting the conductor layer in which the cut was formed through the insulating layer on the board | substrate with which the recessed part was formed by the process of FIG. 14A-FIG. 14C. It is a figure for demonstrating the process of temporarily bonding the board | substrate and insulating layer which are shown in FIG. It is a figure for demonstrating the process of removing a carrier after temporarily adhering at the process shown in FIG. It is a figure for demonstrating the process of closely_contact | adhering an insulating layer to the inner surface of the recessed part of a board | substrate by press after removing a carrier at the process shown in FIG. It is a figure which shows the laminated body pressed at the process of FIG. It is a figure which shows the reflection layer in the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is a figure which shows the opening part of the reflection layer in the manufacturing method of the electronic component mounting board | substrate which concerns on Embodiment 1 of this invention. It is a figure for demonstrating the process of closely_contact | adhering the reflecting layer shown to FIG. 20A and FIG. 20B on a conductor layer by press. It is a figure which shows the laminated body pressed at the process of FIG. It is a figure which shows the light-emitting device which concerns on Embodiment 2 of this invention. It is sectional drawing of the longitudinal direction of the light-emitting device shown to FIG. 23A. It is a figure which shows the outline of the electronic component mounting board | substrate which concerns on Embodiment 3 of this invention. It is sectional drawing of the longitudinal direction of the electronic component mounting board | substrate shown to FIG. 24A. In the method for manufacturing an electronic component mounting board according to the third embodiment of the present invention, a first example of a process of forming a mounting part on the board having a higher elastic modulus than that of a portion between the mounting parts is described. FIG. In the method for manufacturing an electronic component mounting board according to the third embodiment of the present invention, a second example of a process of forming a mounting part on the board having a higher elastic modulus than that of a portion between the mounting parts is described. FIG. It is a figure which shows the light-emitting device which concerns on Embodiment 4 of this invention. It is sectional drawing of the longitudinal direction of the light-emitting device shown to FIG. 26A. It is a figure which shows the 1st example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 2nd example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 3rd example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 4th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 5th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 1st arrangement | positioning of the light-emitting device in the illuminating device which concerns on embodiment of this invention. It is a figure which shows the light irradiation aspect of the illuminating device with which the light-emitting device is arrange | positioned in the aspect shown to FIG. 30A. It is a figure which shows 2nd arrangement | positioning of the light-emitting device in the illuminating device which concerns on embodiment of this invention. It is a figure which shows the light irradiation aspect of the illuminating device with which the light-emitting device is arrange | positioned in the aspect shown to FIG. 31A. It is a figure which shows the 6th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 7th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 8th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. It is a figure which shows the 9th example of the illuminating device using the light-emitting device which concerns on embodiment of this invention. In other embodiment of this invention, it is sectional drawing which shows another example of the shape of the connection part of an electronic component mounting board | substrate. In other embodiment of this invention, it is sectional drawing which shows another example of the shape of the mounting part of an electronic component mounting board | substrate. In other embodiment of this invention, it is a figure which shows the 1st modification of the shape of the wiring for the electronic components mounted. In other embodiment of this invention, it is a figure which shows the 2nd modification of the shape of the wiring for the electronic components mounted.

(Embodiment 1)
FIG. 1A is a diagram showing an outline of an electronic component mounting board according to Embodiment 1 of the present invention. FIG. 1B is an enlarged view of a part of the electronic component mounting board shown in FIG. 1A.

  As shown in FIGS. 1A and 1B, the electronic component mounting board 10 of the present embodiment has a linear outer shape. Hereinafter, one (Z1 side) of the front and back surfaces (two main surfaces) of the electronic component mounting substrate 10 is referred to as a first surface F1, and the other (surface on the Z2 side opposite to the first surface F1) is referred to as a second surface F2. . 1A and 1B, the Y direction corresponds to the longitudinal direction of the electronic component mounting board 10 when no force is applied, and the X direction is a short of the electronic component mounting board 10 when no force is applied. Corresponds to the hand direction.

  The electronic component mounting board 10 of the present embodiment has a plurality of mounting portions P1 and a plurality of connecting portions P2 on the first surface F1. The mounting portions P1 and the connecting portions P2 are alternately arranged along the Y direction (the longitudinal direction of the linear outer shape). The mounting part P1 is a part on which electronic components (for example, LEDs) are mounted. The connecting part P2 is located between the adjacent mounting parts P1 (the first mounting part and the second mounting part), and connects the mounting parts P1 to each other. Hereinafter, among the side surfaces of the mounting part P1, the side surface on the X1 side is referred to as a side surface F31, and the side surface on the X2 side is referred to as a side surface F41. Of the side surfaces of the connecting portion P2, the side surface on the X1 side is referred to as a side surface F32, and the side surface on the X2 side is referred to as a side surface F42. The side surface F3 on the X1 side of the electronic component mounting board 10 is composed of side surfaces F31 and F32, and the side surface F4 on the X2 side of the electronic component mounting board 10 is composed of side surfaces F41 and F42.

  A cavity R0 (concave portion) is formed in each of the mounting portions P1. In the electronic component mounting board 10 of the present embodiment, since the electronic component is mounted on the bottom surface of the recess, the deformation amount of the bottom surface of the recess on which the electronic component is mounted is small when the electronic component mounting substrate 10 is deformed in the thickness direction. Become. Therefore, since the deformation around the electronic component can be reduced, the connection reliability of the electronic component can be improved.

  In the electronic component mounting substrate 10 of the present embodiment, the cavity R0 (concave portion) has an upper layer (insulating layer 12, conductor layer 13, insulating layer 15, reflective film 16) on the base portion (substrate 11) on which the concave portion R1 is formed. It is formed by being laminated (see FIG. 6 described later), and the recess R1 of the base portion is based on plastic deformation (see FIG. 14B described later). If the concave portion R1 is based on plastic deformation, the surface of the concave portion R1 is work-hardened to increase the elastic modulus, thereby reducing deformation around the electronic component and improving the connection reliability of the electronic component. it can.

  The cavity R0 has a bottom surface F21 and a wall surface F22. The shape of the cavity R0 is, for example, a truncated pyramid having a tapered wall surface F22 (see FIGS. 3 and 6 described later). However, the shape is not limited to this, and the shape of the cavity R0 is arbitrary, and may be a rectangular parallelepiped in which the wall surface F22 is not tapered, for example.

  In the present embodiment, each of the side surfaces F31 and F41 of the mounting portion P1 has a central portion in the longitudinal direction (Y direction) that is lateral (X1 side or X2) from both ends (near the boundary between the mounting portion P1 and the connecting portion P2). It has a convex surface that protrudes to the side. On the other hand, the side surfaces F32 and F42 of the connecting portion P2 are respectively convex surfaces orthogonal to both the first surface F1 and the second surface F2, and the connecting portion P2 has a certain width. That is, in this embodiment, the width (average value) of the mounting portion P1 is larger than the width (average value) of the connecting portion P2.

  2 is a cross-sectional view of a connecting portion of the electronic component mounting board shown in FIG. 1A. As shown in FIG. 2, in the present embodiment, the side surfaces F32 and F42 of the connecting portion P2 are respectively lateral to the center in the thickness direction (Z direction) from both ends (first surface F1 and second surface F2). It has a convex surface protruding to (X1 side or X2 side). Similarly to the side surfaces F32 and F42, the side surfaces F31 and F41 of the mounting portion P1 are also lateral (X1 side) at the center in the thickness direction (Z direction) from both ends (first surface F1 and second surface F2). Or a convex surface protruding to the X2 side).

  Hereinafter, an example of a preferable dimension is shown. Of the dimensions of the electronic component mounting board 10, the dimension in the longitudinal direction (Y direction) is referred to as the length, and the dimension in the short direction (X direction) is referred to as the width.

  The total length of the electronic component mounting board 10 is, for example, 320 mm. The number of mounting parts P1 and the number of connecting parts P2 are each 80, for example.

  FIG. 3 is a view for explaining dimensions of the electronic component mounting board shown in FIG. 1A. In FIG. 3, the length d11 of the cavity R0 (= the length of the mounting portion P1) is, for example, 2.5 mm, the length d12 of the bottom surface F21 of the cavity R0 is, for example, 1.5 mm, and the width of the cavity R0. d21 is, for example, 1.5 mm, and the width d22 of the bottom surface F21 of the cavity R0 is, for example, 0.5 mm.

  The width (largest portion) d23 of the mounting portion P1 is, for example, 3.0 mm, and the width d24 of the connecting portion P2 is, for example, 2.5 mm. In the present embodiment, the width d23 of the mounting portion P1 is larger than the width d24 of the connecting portion P2. That is, the maximum dimension (width d23) in the short direction of the first mounting part (mounting part P1) and the maximum dimension (width d23) in the short direction of the second mounting part (mounting part P1) are respectively It is larger than the maximum dimension (width d24) in the short direction of the portion (connecting portion P2) located between the mounting portion and the second mounting portion. As a result, the area of the mounting portion P1 is increased, and it is easy to secure a mounting space or wiring space for electronic components.

  In FIG. 1, a distance d13 (= length of the connecting portion P2) between adjacent mounting portions P1 (first mounting portion and second mounting portion) is, for example, 1.5 mm. The pitch d14 of the mounting portions P1 (cavity R0) in the longitudinal direction (Y direction) is, for example, 4.0 mm (= 2.5 mm + 1.5 mm).

  In the present embodiment, the lengths of the adjacent mounting portions P1 (first mounting portion and second mounting portion) (= the length d11 of the cavity R0) are each greater than the distance d13 between the mounting portions P1. For this reason, many electronic components can be mounted on an electronic component mounting board.

  In the present embodiment, all the mounting parts P1 or all the connecting parts P2 have the same dimensions. However, the present invention is not limited to this, and some of the plurality of mounting portions P1 or the plurality of connecting portions P2 included in the electronic component mounting substrate 10 may have dimensions different from those of the others.

  FIG. 4 is a plan view of the electronic component mounting board according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view of the electronic component mounting board shown in FIG. 4 in the short direction. 6 is a cross-sectional view in the longitudinal direction of the electronic component mounting board shown in FIG.

  As shown in FIGS. 4 to 6, the electronic component mounting substrate 10 of the present embodiment is formed on a substrate 11 having a linear outer shape, an insulating layer 12 formed on the substrate 11, and the insulating layer 12. The conductive layer 13, the conductive pad 14, the insulating layer 15, and the reflective film 16 are included. In the embodiment of the present invention, the conductor layer is a layer composed of one or more conductor patterns.

  Since the electronic component mounting substrate 10 of the present embodiment includes the insulating layer 12 formed on the substrate 11, the conductor layer 13 formed on the insulating layer 12, and the conductor pad 14, the electronic component It is easy to supply current to the electronic component mounted on the mounting portion P1 of the mounting substrate 10.

  As shown in FIG. 4, the conductor layer 13 has wiring 13a (conductor pattern) for an electronic component mounted on the mounting portion P1. The wiring 13a is located at the center in the short side direction (X direction) of the electronic component mounting substrate 10 and extends in the longitudinal direction (Y direction) of the electronic component mounting substrate 10. The end of the wiring 13a is located on the bottom surface F21 of the cavity R0 (concave portion). The conductor pad 14 is formed on the end of the wiring 13a located on the bottom surface F21. For this reason, an electronic component can be mounted on the bottom surface of the cavity R0. As shown in FIG. 6, a gap R3 is formed between the adjacent wirings 13a.

  As shown in FIG. 5, the width of each layer is an insulating layer 12, a conductor layer 13, and a conductor pad 14 from the largest, and the insulating layer 12 is the center of the substrate 11 in the short direction (X direction). The conductor layer 13 is located in the center of the insulating layer 12 in the short direction (X direction), and the conductor pad 14 is located in the center of the conductor layer 13 in the short direction (X direction). In the present embodiment, the width (dimension in the short direction) of the insulating layer 12 is larger than the width (dimension in the short direction) of the conductor layer 13. This makes it difficult for the conductor layer 13 and the substrate 11 to conduct (short). In addition, since the conductor layer 13 is disposed in the center of the insulating layer 12, the conductor layer 13 and the substrate 11 are less likely to conduct (short-circuit).

  In the present embodiment, the edge (end portion P11) of the conductor layer 13 jumps up to the side opposite to the substrate 11 (Z1 side). Accordingly, the edge (end portion P11) of the conductor layer 13 is less likely to contact the substrate 11, and the conductor layer 13 and the substrate 11 are less likely to conduct (short-circuit).

  As shown in FIG. 6, the substrate 11 has a recess R <b> 1. The recess R1 is located in the center of the substrate 11 in the short direction (X direction). Since the recess R1 is located in the center of the short side direction (X direction) of the substrate 11, the amount of deformation when the substrate 11 is bent sideways becomes small. For this reason, the connection reliability of the electronic component mounted can be improved. Then, the insulating layer 12, the conductor layer 13, the insulating layer 15, and the reflective film 16 on the substrate 11 are formed along the surface of the substrate 11 (including the inner surface of the recess R1), so that the first surface F1 is formed. A cavity R0 (concave portion) is formed. For this reason, as shown in FIG. 4, the cavity R0 is also located in the center of the short side direction (X direction) of the substrate 11 like the concave portion R1.

  The substrate 11 is preferably made of metal. Metals have malleability and ductility, are easy to bend, and are excellent in workability or durability. Further, if the substrate 11 is made of metal and the concave portion R1 is formed by plastic deformation, the surface of the concave portion R1 is work-hardened and is less likely to deform than the surroundings. Since the recess R1 is difficult to deform, the connection reliability of the electronic component mounted on the recess R1 can be improved. In the present embodiment, the substrate 11 is made of aluminum. However, the substrate 11 is not limited to this, and the substrate 11 may be made of a metal (such as copper) other than aluminum, or may be made of a nonmetal. In the embodiment of the present invention, the metal includes a metal or an alloy containing a small amount of impurities other than the metal.

  The insulating layer 12 is made of, for example, an adhesive material. The insulating layer 12 preferably has a first component that increases adhesion and a second component that increases flexibility. With such a configuration, the insulating layer 12 having both adhesiveness and flexibility can be easily formed. The first component is preferably at least one of methacrylic acid, methyl methacrylate, and glycidyl methacrylate, and the second component is an olefin resin (such as polyethylene or polypropylene), a fluorine resin, and a silicone resin. It is preferable that it is at least one of these. In the present embodiment, the insulating layer 12 is made of a copolymer of polyethylene (first component) and methyl methacrylate (second component). The ratio (weight ratio) of polyethylene contained in the copolymer is, for example, in the range of 75 to 95%. When the proportion of polyethylene contained in the copolymer is less than 75%, the insulating layer 12 is likely to be discolored by the light emitted from the LED, the reflectance is lowered, and the color of the emitted light is changed. When the ratio of polyethylene contained in the copolymer exceeds 95%, the insulating layer 12 is easily deformed by heat, and is easily short-circuited. However, it is not restricted to this, The material of the insulating layer 12 is arbitrary.

  In the present embodiment, the conductor layer 13 is made of copper. However, the material of the conductor layer 13 is not limited to this and is arbitrary.

  In the present embodiment, the conductor pad 14 includes a first pad portion 14a and a second pad portion 14b that covers the surface of the first pad portion 14a. The first pad portion 14a is made of, for example, nickel (Ni), and the second pad portion 14b is made of, for example, gold (Au). By forming the conductor pad 14, the surface of the conductor layer 13 is partially hardened, so that wire bonding is facilitated. The material of the conductor pad 14 is arbitrary.

  The reflective film 16 is formed on the substrate 11, the insulating layer 12, the conductor layer 13, and the conductor pad 14 exposed to the Z1 side via the insulating layer 15. In the case where a light emitting element is mounted as an electronic component on the mounting part P1, the reflectance of light emitted from the light emitting element is increased by forming the reflective film 16. In the present embodiment, the reflective film 16 is made of, for example, aluminum (Al). Furthermore, as for the aluminum of the reflecting film 16, the Z2 side back surface (Z2 side surface) may be anodized. By the alumite treatment, the insulating property of the reflective film 16 is enhanced. Moreover, it is preferable that the insulating layer 15 has the adhesive component which improves adhesiveness, and the soft component which improves a softness | flexibility. The adhesive component is preferably at least one of methacrylic acid, methyl methacrylate, and glycidyl methacrylate, and the flexible component is at least one of an olefin resin (such as polyethylene or polypropylene), a fluorine resin, and a silicone resin. It is preferable that In the present embodiment, the insulating layer 15 is made of a copolymer of polyethylene and methyl methacrylate. The ratio (weight ratio) of polyethylene contained in the copolymer is, for example, in the range of 75 to 95%. When the proportion of polyethylene contained in the copolymer is less than 75%, the insulating layer 15 is likely to be discolored by the light emitted from the LED, the reflectance is lowered, and the color of the emitted light is changed. When the ratio of polyethylene contained in the copolymer exceeds 95%, the insulating layer 15 is easily deformed by heat and is easily short-circuited. However, the material of the insulating layer 15 and the reflective film 16 is not limited to this, and the insulating layer 15 and the reflective film 16 may be omitted if the reflectance of the surface of the conductor layer 13 is high.

Hereinafter, an example of a preferable dimension is shown.
In FIG. 5, the width d31 of the insulating layer 12 is, for example, 0.6 mm, the width d32 of the conductor layer 13 is, for example, 0.5 mm, and the width d33 of the conductor pad 14 is, for example, 0.3 mm.

  In FIG. 6, the thickness d41 of the substrate 11 is 1.0 mm, for example, and the depth d42 of the recess R1 formed in the base portion (substrate 11) to form the cavity R0 (recess) is, for example, 0. 5 mm. In the present embodiment, the depth of the cavity R0 (recessed portion) is substantially equal to the depth d42 of the recessed portion R1.

  In the present embodiment, the depth d42 of the recess R1 is in the range of 25 to 80% of the thickness d41 of the substrate 11. The depth of the recess R <b> 1 is preferably 25 to 80% of the thickness of the substrate 11. If the depth of the recess R1 is in the range of 25 to 80% of the thickness of the substrate 11, the bottom surface of the recess R1 is separated from the first main surface or the second main surface of the substrate 11, so that the electronic component mounting substrate 10 is removed. The amount of deformation of the bottom of the recess R1 when bent in the thickness direction can be reduced. For this reason, the connection reliability of the electronic component mounted can be improved.

  The thickness d43 of the insulating layer 12 is, for example, 50 μm, the thickness d44 of the conductor layer 13 is, for example, 18 μm, the thickness d45 of the insulating layer 15 is, for example, 50 μm, and the thickness d46 of the reflective film 16 is For example, 20 μm. Moreover, the thickness of the 1st pad part 14a is 10 micrometers, for example, and the thickness of the 2nd pad part 14b is 0.1-2.0 micrometers, for example.

  The angle θ1 formed between the bottom surface F11 and the wall surface F12 in the recess R1 is, for example, in the range of 90 to 150 °, and the angle θ2 formed between the bottom surface F21 and the wall surface F22 in the cavity R0 is in the range of, for example, 90 to 150 °.

  FIG. 7A is a diagram illustrating the electronic component mounting board according to Embodiment 1 of the present invention in a state where the electronic component mounting board is curved in the thickness direction. FIG. 7B is a diagram illustrating the electronic component mounting board according to the first exemplary embodiment of the present invention in a state where the electronic component mounting board is bent sideways.

  As shown in FIGS. 7A and 7B, the electronic component mounting board 10 of this embodiment can be bent in both the thickness direction (Z direction) and the side direction (X direction) by applying a force. When the electronic component mounting substrate 10 is curved in the thickness direction, the first surface F1 and the second surface F2 are deformed so as to draw an arc, as shown in FIG. 7A. Further, when the electronic component mounting substrate 10 is bent to the side, as shown in FIG. 7B, the side surfaces F3 and F4 are deformed so as to draw an arc.

  In the electronic component mounting substrate 10 of the present embodiment, a cavity R0 (concave portion) is formed in the mounting portion P1. Since the substrate 11 is expanded laterally (x direction) at the cavity R0 portion, the X-axis sectional secondary moment Ix of the mounting portion P1 is increased. For this reason, the mounting part P1 becomes difficult to deform.

  Further, the recess R1 is formed based on plastic deformation (see FIG. 14B). For this reason, the surface (for example, area | region R4 in FIG. 6) of recessed part R1 formed in the mounting part P1 hardens | cures (work hardening). In the first surface F1, the elastic moduli of the adjacent mounting parts P1 (first mounting part and second mounting part) are the parts between the adjacent mounting parts P1 (first mounting part and second mounting part) ( It is higher than the elastic modulus of the connecting part P2). In this embodiment, all the mounting parts P1 have a higher elastic modulus than all the connection parts P2. That is, the elastic modulus of all the mounting portions arranged along the longitudinal direction is higher than any elastic modulus of the portion between the mounting portions. Further, all the mounting portions arranged along the longitudinal direction have substantially the same elastic modulus, and each portion between the mounting portions has substantially the same elastic modulus.

In one example, the X-axis sectional secondary moment Ix (mm ⁴ ) is 1.76 at the connecting portion P2, 2.51 at the mounting portion P1 (bottom surface F21), and the Young's modulus (kN / mm ² ) is at the connecting portion P2. And 70 at the mounting portion P1 (bottom surface F21). The X-axis cross-sectional secondary moment Ix of the mounting part P1 is 43% higher than that of the connecting part P2, and the Young's modulus of the mounting part P1 is 92% higher than that of the connecting part P2. In addition, the cross-sectional secondary moment was calculated using CAD software and Solid Works (registered trademark of Solid Works Corporation).

  FIG. 8 shows the relationship between the radius of curvature (horizontal axis) and the deformation rate (vertical axis) when the mounting portion and the connecting portion of the electronic component mounting board according to Embodiment 1 of the present invention are bent sideways. It is a graph which shows. In FIG. 8, the line L1 is data relating to the deformation in the longitudinal direction (Y direction) of the central portion of the first surface F1 of the connecting portion P2, and the line L2 is the longitudinal direction (Y direction of the central portion of the bottom surface F11 of the mounting portion P1. ), The line L3 is data related to the deformation in the short side direction (X direction) of the center portion of the bottom surface F11 of the mounting portion P1, and the line L4 is the center portion of the first surface F1 of the connecting portion P2. It is the data by the simulation regarding a deformation | transformation of a transversal direction (X direction).

  Moreover, FIG. 9A is a figure which shows typically a mode when the electronic component mounting substrate which concerns on Embodiment 1 of this invention is curved in the thickness direction. FIG. 9B is a diagram schematically showing a state when the electronic component mounting board according to Embodiment 1 of the present invention is bent sideways. F100 indicates a surface that does not stretch or contract when the electronic component mounting board is curved in the thickness direction (the cross-sectional center when curved in the thickness direction). F200 indicates a surface that does not stretch or contract when the electronic component mounting board is bent sideways (the cross-sectional center when bent sideways).

  As shown in FIG. 8, the deformation rate of the mounting portion P1 is about ½ in the longitudinal direction and substantially the same in the short direction as compared to the deformation rate of the connecting portion P2. It is confirmed that the mounting portion P1 is less likely to be deformed (displaced) than the connecting portion P2 because the X-axis sectional secondary moment Ix is larger than that of the connecting portion P2. In the electronic component mounting board 10 of the present embodiment, even when the electronic component mounting board 10 is bent, high deformation can be obtained with respect to electrical connection because the deformation rate of the mounting portion P1 is small. Such characteristics are prominent when the depth d42 of the cavity R0 is in the range of 25 to 80% of the thickness d41 of the substrate 11.

  As shown in FIGS. 9A and 9B, an electronic component (for example, a light emitting element) is mounted near the center of the cross section when bent in the thickness direction and near the center of the cross section when bent sideways. Even if the electronic component mounting substrate 10 is bent, the change in the distance between the conductor pads can be reduced, so that the connection reliability between the electronic component mounting substrate 10 and the electronic component can be improved. When the electronic component is a flip chip, since the plurality of electrodes of the electronic component and the conductor pads are directly connected, the effect that the distance between the conductor pads does not change can be further exhibited.

  FIG. 10A is a diagram showing the electronic component mounting board according to Embodiment 1 of the present invention in a state where it is not curved. FIG. 10B is a diagram showing a state of wiring when the electronic component mounting board according to Embodiment 1 of the present invention is bent in the first thickness direction. FIG. 10C is a diagram showing a state of wiring when the electronic component mounting board according to Embodiment 1 of the present invention is bent in the second thickness direction. In FIGS. 10A to 10C, illustration of the insulating layer 12 and the like is omitted.

  As shown in FIG. 10A, the conductor layer 13 is formed along the surface of the substrate 11 when the electronic component mounting substrate 10 is not curved. When force is applied to the electronic component mounting board 10 and the electronic component mounting board 10 is bent so that the central portion of the electronic component mounting board 10 protrudes to the Z1 side as shown in FIG. 10B, the bottom surface F21 in the cavity R0. It is considered that the conductor layer 13 is easily separated from the substrate 11 at the bent portion P12 located at the boundary between the wall surface F22 and the wall surface F22. As a result, the distance d15 between the conductor pads 14 is easily maintained before and after the curve. Further, as shown in FIG. 10C, when the electronic component mounting board 10 is curved so that the central portion of the electronic component mounting board 10 protrudes to the Z2 side, the electronic component mounting board 10 is positioned at the boundary between the first surface F1 and the wall surface F22 of the cavity R0. It is considered that the conductor layer 13 is easily separated from the substrate 11 at the bent portion P13. As a result, the distance d15 between the conductor pads 14 is easily maintained before and after the curve. In the electronic component mounting substrate 10 of the present embodiment, even when the electronic component mounting substrate 10 is curved, the distance d15 between the conductor pads 14 hardly changes, so that it is considered that high reliability can be obtained for electrical connection. As described above, the insulating layer 12 preferably has elasticity so that the conductor layer 13 can be partly separated from the surface of the substrate 11. If the insulating layer 12 has elasticity, it is difficult to apply tension to the conductor layer 13 when the electronic component mounting substrate 10 is bent, and therefore the interval between the conductor pads 14 is unlikely to change. Therefore, the connection reliability between the conductor pad 14 and the electronic component (for example, a light emitting element) can be improved.

  Hereinafter, a method for manufacturing the electronic component mounting board 10 according to the present embodiment will be described. FIG. 11A is a diagram showing a starting material having a conductor layer in the method for manufacturing an electronic component mounting board according to Embodiment 1 of the present invention. FIG. 11B is a diagram for explaining a process of forming a conductor pad on the first surface of the conductor layer shown in FIG. 11A. FIG. 12 is a diagram for explaining a step of forming an insulating layer on the second surface of the conductor layer shown in FIG. 11B. FIG. 13A is a diagram for explaining a process of providing carriers on the conductor layer and the conductor pad shown in FIG. 12. FIG. 13B is a diagram for explaining a step of forming a cut in the conductor layer provided with a carrier by the step of FIG. 13A. FIG. 14A is a diagram for describing a first step of forming a recess in a substrate in the method for manufacturing an electronic component mounting substrate according to Embodiment 1 of the invention. FIG. 14B is a diagram for explaining a second step after the step of FIG. 14A. FIG. 14C is a diagram for explaining a third step after the step of FIG. 14B. FIG. 15 is a diagram for explaining a process of placing a conductor layer having cuts formed on an insulating layer on a substrate having a recess formed by the processes of FIGS. 14A to 14C. FIG. 16 is a diagram for explaining a process of temporarily bonding the substrate and the insulating layer shown in FIG. FIG. 17 is a view for explaining a process of removing the carrier after temporary bonding in the process shown in FIG. 16. FIG. 18 is a view for explaining a step of bringing the insulating layer into close contact with the inner surface of the cavity of the substrate by pressing after removing the carrier in the step shown in FIG. FIG. 19 is a view showing the laminated body pressed in the step of FIG. FIG. 20A is a diagram showing a reflective layer in the method of manufacturing an electronic component mounting board according to Embodiment 1 of the present invention. FIG. 20B is a diagram showing an opening of the reflective layer in the method for manufacturing the electronic component mounting board according to Embodiment 1 of the present invention. FIG. 21 is a diagram for explaining a step of bringing the reflective layer shown in FIGS. 20A and 20B into close contact with the conductor layer by pressing. FIG. 22 is a view showing the laminated body pressed in the step of FIG.

  First, as shown in FIG. 11A, a peelable copper foil laminate plate 1001 is prepared. The peelable copper foil laminate plate 1001 is configured by laminating a support copper foil 1001b, a release layer 1001a, and a conductor layer 13 in this order. The conductor layer 13 is made of, for example, a copper foil having a thickness of 18 μm.

  Subsequently, as shown in FIG. 11B, the first pad portion 14a and the second pad portion 14b are formed on the conductor layer 13 by plating, for example. Here, the first pad portion 14 a and the second pad portion 14 b become the conductor pads 14. Thereafter, the support copper foil 1001b and the release layer 1001a are removed.

  Subsequently, as shown in FIG. 12, the insulating layer 12 is formed on the conductor layer 13 (on the side opposite to the conductor pad 14) by, for example, lamination. Thereby, the laminated body 1003 comprised from the insulating layer 12, the conductor layer 13, and the conductor pad 14 is formed. The insulating layer 12 is made of, for example, a copolymer (adhesive) of polyethylene (83% by weight) and methyl methacrylate (17% by weight) having a thickness of 50 μm.

  Subsequently, as shown in FIG. 13A, a carrier 1002 is provided on the laminate 1003 (Z1 side of the conductor layer 13). The carrier 1002 is made of, for example, PET (PolyEthylene Terephthalate) having a thickness of 150 μm.

  Instead of the peelable copper foil laminate plate 1001, the conductor pad 14 may be formed directly on the laminate in which the insulating layer 12 and the conductor layer 13 are laminated, and the insulating layer is formed on the conductor layer 13 on which the conductor pad 14 is formed. 12 may be formed. By using such a method, the peeling process can be omitted.

  Subsequently, as shown in FIG. 13B, a cut P3 is formed in the conductor layer 13 and the insulating layer 12 corresponding to the patterns shown in FIGS. At this time, the blade 1004 is inserted from the insulating layer 12 side. As a result, the edge (end portion P11) of the conductor layer 13 is formed so as to jump up to the opposite side (Z1 side) from the substrate 11 (see FIG. 5). Further, the portion where only the conductor layer 13 and the insulating layer 12 are to be cut is stopped (half cut) in the middle of the carrier 1002, and the portion where the carrier 1002 is to be cut together with the conductor layer 13 and the insulating layer 12 is the carrier 1002. Insert the blade 1004 until it penetrates (full cut). Thereafter, the unnecessary conductor layer 13 and insulating layer 12 are separated from the carrier 1002 and removed, for example, manually.

  Subsequently, a substrate 11 having a recess R1 is prepared. Specifically, as shown in FIG. 14A, for example, using the aluminum wire 11a as a starting material, as shown in FIG. 14B, the aluminum wire 11a is plastically deformed by being pressed by a mold 1011 having a convex portion 1011a. As shown in FIG. 5, a concave portion R1 corresponding to the convex portion 1011a is formed. Thereafter, the substrate 11 having the recess R1 is obtained by, for example, processing the outer shape by header processing and cleaning (for example, plasma cleaning). Since the material is pushed out to the side by forming the concave portion R1, the width of the portion where the concave portion R1 is formed (the portion corresponding to the mounting portion P1) becomes wide.

  Subsequently, as shown in FIG. 15, the position of the concave portion R1 of the substrate 11 and the position of the conductor pad 14 of the multilayer body 1003 are aligned, and as shown in FIG. The layer 12 is temporarily bonded.

  Subsequently, as shown in FIG. 17, the carrier 1002 is removed from the stacked body 1003.

  Subsequently, as shown in FIG. 18, for example, pressing is performed by a mold 1012 having a convex portion 1012 a corresponding to the concave portion R <b> 1, and the laminate 1003 is brought into close contact with the substrate 11. Thereby, as shown in FIG. 19, the laminated body 1003 is cut | disconnected by the cut line P3, and the space | gap R3 (refer FIG. 6) is formed. As a result, the conductor layer 13 is patterned in a manner as shown in FIGS. Further, the laminate 1003 is pressed against the inner surface of the recess R1 by the convex portion 1012a, and the insulating layer 12 of the laminate 1003 is bonded to the inner surface (the bottom surface F11 and the wall surface F12) of the recess R1. Further, the insulating layer 12 (resin) is spread by pressing, and the width of the insulating layer 12 (dimension in the short direction) becomes larger than the width of the conductor layer 13 (dimension in the short direction). Thereby, the laminated body 1006 comprised from the board | substrate 11, the insulating layer 12, the conductor layer 13, and the conductor pad 14 is formed. Further, the laminated body 1003 is deformed, and a concave portion R2 corresponding to the concave portion R1 is formed on the surface of the laminated body 1006.

  Subsequently, as shown in FIG. 20A, a reflection layer 1007 having an opening R5 is prepared. The reflective layer 1007 is configured by laminating the insulating layer 15 and the reflective film 16. The insulating layer 15 is made of, for example, a copolymer (adhesive) of polyethylene (83% by weight) and methyl methacrylate (17% by weight) having a thickness of 50 μm. The reflective film 16 is made of, for example, an aluminum foil having a thickness of 20 μm. The external shape processing of the reflective layer 1007 is performed by, for example, a pinnacle blade.

  In the reflective layer 1007, the opening R5 is formed at a position corresponding to the recess R2. The planar shape (XY plane) of the opening R5 is a quadrangle corresponding to the recess R2, for example, as shown in FIG. 20B. However, incisions are made at the four corners of the opening R5 to form slits P41 to P44.

  Subsequently, as shown in FIG. 21, a mold 1013 having a convex portion 1013a corresponding to the concave portion R2, for example, is positioned so that the position of the concave portion R2 of the laminated body 1006 and the position of the opening portion R5 of the reflective layer 1007 are aligned. To make the reflective layer 1007 adhere to the stacked body 1006. Thus, as shown in FIG. 22, the reflective layer 1007 is pressed against the inner surface of the recess R2 by the convex portion 1013a, and the insulating layer 15 of the reflective layer 1007 is bonded to the inner surface of the recess R2 (on the conductor layer 13). Further, the reflective layer 1007 is deformed to form a cavity R0 (concave portion). As a result, the electronic component mounting board 10 of this embodiment is completed. The molds 1011 to 1013 may be the same or different.

(Embodiment 2)
FIG. 23A is a diagram showing a light-emitting device according to Embodiment 2 of the present invention. FIG. 23B is a longitudinal sectional view of the light emitting device shown in FIG. 23A.

  As shown in FIGS. 23A and 23B, the light emitting device 20 according to the present embodiment includes the electronic component mounting substrate 10 according to the first embodiment of the present invention and a plurality of light emitting elements 20a. A light emitting element 20 a is mounted on each of the mounting portions P <b> 1 on the electronic component mounting substrate 10. Each of the light emitting elements 20a is disposed in the cavity R0 (concave portion) of the mounting portion P1. The light emitting element 20a is made of, for example, a blue LED. However, the present invention is not limited to this, and instead of the blue LED, another color LED, EL (Electro Luminescence), laser diode, or the like may be used as the light emitting element 20a. The light emitting element 20a may be disposed so that the entire light emitting element 20a is completely accommodated in the cavity R0 (see FIG. 23B), or only a part of the light emitting element 20a is disposed in the cavity R0. May be.

  In the light emitting device 20 of the present embodiment, as shown in FIG. 23B, the electrode of the light emitting element 20 a is electrically connected to the conductor pad 14 via the solder 17. However, the mounting method of the light emitting element 20a is not limited to the flip chip and is arbitrary. For example, the light emitting element 20a may be mounted by wire bonding.

(Embodiment 3)
The third embodiment of the present invention will be described focusing on the differences from the first embodiment of the present invention. Here, the same elements as those shown in FIG. 1 and the like are denoted by the same reference numerals, and the description of the already explained common parts, that is, the duplicated explanations, is omitted or simplified. .

  FIG. 24A is a diagram showing an electronic component mounting board according to Embodiment 3 of the present invention. 24B is a longitudinal sectional view of the electronic component mounting board shown in FIG. 24A.

  In the electronic component mounting substrate 10 of the present embodiment, as shown in FIGS. 24A and 24B, the elastic modulus of the mounting portion P1 is made higher than the elastic modulus of the connecting portion P2 without forming the cavity R0 (concave portion) in the mounting portion P1. Is also increasing. Thereby, in the 1st surface F1, the elasticity modulus of the adjacent mounting part P1 (1st mounting part and 2nd mounting part) is respectively between those adjacent mounting parts P1 (1st mounting part and 2nd mounting part). It is higher than the elastic modulus of the part (connecting part P2). In this embodiment, all the mounting parts P1 have a higher elastic modulus than all the connection parts P2. That is, the elastic modulus of all the mounting portions arranged along the longitudinal direction is higher than any elastic modulus of the portion between the mounting portions.

  Specifically, the difference in elastic modulus is caused between the mounting part P1 and the connecting part P2 by utilizing the difference in thermal history. Specifically, the crystal size is changed due to the difference in thermal history between the region R4 (part corresponding to the mounting portion P1) on the surface F10 (for example, the Z1 side) of the substrate 11 and the surrounding region. Thus, it is considered that a difference in elastic modulus can be generated between the mounting portion P1 and the connecting portion P2.

  For example, as shown in FIG. 25A, the method of increasing the elastic modulus of the mounting portion P1 higher than the elastic modulus of the connecting portion P2 increases the temperature of the substrate 11 to, for example, about 200 ° C. or more, and corresponds to each mounting portion P1 of the substrate 11. For example, a mold 2001 cooled to about 0 to 50 ° C. is brought into contact with the portion to be performed. Thereby, the part (part corresponding to the mounting part P1) of the substrate 11 that is in contact with the mold 2001 is cooled (specifically, rapidly cooled) and is not cooled (slowly cooled) (the part corresponding to the connecting part P2). ) Higher than the elastic modulus. In addition, the material of each layer which comprises the electronic component mounting board | substrate 10 which concerns on this embodiment is the same as Embodiment 1 of this invention, and the board | substrate 11 consists of aluminum in this embodiment. However, it is not limited to this, and the material of the substrate 11 is arbitrary.

  The method for increasing the elastic modulus of the mounting portion P1 beyond the elastic modulus of the connecting portion P2 is not limited to the method using the mold shown in FIG. 25A and is arbitrary. It is desirable to select a preferable method depending on the material of the substrate 11 or other conditions.

  For example, as shown in FIG. 25B, a portion corresponding to the mounting portion P1 of the substrate 11 may be selectively cooled by spraying a cold gas.

  The elastic modulus of the mounting portion P1 may be made higher than the elastic modulus of the connecting portion P2 by reducing the elastic modulus of the connecting portion P2 without being limited to increasing the elastic modulus of the mounting portion P1.

  The elastic modulus of the mounting portion P1 may be higher than the elastic modulus of the connecting portion P2 by selectively raising the temperature of either the mounting portion P1 or the connecting portion P2 with a mold or gas. .

  For example, the elastic modulus of the mounting part P1 can be made higher than the elastic modulus of the connecting part P2 also by the following method. The entire substrate 11 is work-hardened, and many dislocations are generated in the metal constituting the substrate 11. The entire substrate 11 is rapidly heated while a mold or the like is in contact with the portion corresponding to the mounting portion P1 of the substrate 11.

The heating temperature at this time satisfies the following two conditions A and B.
A: The part corresponding to the mounting part P1 of the substrate 11 is heated to a temperature lower than the recrystallization temperature of the metal constituting the substrate 11.
B: Parts other than the part corresponding to the mounting part P1 of the substrate 11 are heated to a temperature exceeding the recrystallization temperature of the metal constituting the substrate 11.

  By heating in this way, it is considered that the crystal growth of the metal in a portion other than the portion corresponding to the mounting portion P1 of the substrate 11 is promoted, dislocations are reduced, and the elastic modulus is lowered.

  For example, the recrystallization temperature of pure copper is 150 ° C., and the recrystallization temperature of pure aluminum is 390 ° C.

  Moreover, you may make it the elasticity modulus of the mounting part P1 become higher than the elasticity modulus of the connection part P2 except the difference in a heat history. For example, the crystal structure in the region R4 on the surface F10 (for example, Z1 side) of the substrate 11 may be changed by mechanical processing (blasting or the like).

  Alternatively, the substrate 11 may be obtained by applying pressure to only the portion corresponding to the mounting part P1 of the substrate 11 and then crushing or polishing the surface. According to such a method, the elastic modulus of the mounting portion P1 can be increased regardless of the presence or absence of the recess.

  In the electronic component mounting board 10 of the present embodiment, as shown in FIG. 24A, the side surfaces F3 and F4 of the electronic component mounting board 10 are flat surfaces with no irregularities. For this reason, the width | variety of the mounting part P1 and the width | variety of the connection part P2 become substantially equal. However, the present invention is not limited to this, and the side surface of the mounting portion P1 may be a convex surface as in the first embodiment of the present invention.

  In the electronic component mounting substrate 10 of the present embodiment, the elastic modulus of the adjacent mounting portions P1 (first mounting portion and second mounting portion) on the first surface F1 is respectively the adjacent mounting portion P1 (first mounting portion). And the elastic modulus of the part (connecting part P2) between the second mounting part). For this reason, the deformation rate of the mounting part P1 is smaller than the deformation rate of the connecting part P2. And when it curves, since the deformation rate of the mounting part P1 is small, high reliability is obtained about electrical connection.

  In addition, about the structure similar to Embodiment 1 of this invention, the effect according to the effect of Embodiment 1 of this invention mentioned above is acquired.

(Embodiment 4)
FIG. 26A is a diagram showing a light emitting device according to Embodiment 4 of the present invention. 26B is a cross-sectional view in the longitudinal direction of the light-emitting device shown in FIG. 26A.

  As shown in FIGS. 26A and 26B, the light-emitting device 20 according to the present embodiment includes an electronic component mounting substrate 10 (see FIGS. 24A and 24B) according to Embodiment 3 of the present invention, a plurality of light-emitting elements 20a, Have A light emitting element 20 a is mounted on each of the mounting portions P <b> 1 on the electronic component mounting substrate 10. Each of the light emitting elements 20a is disposed on the mounting portion P1. The light emitting element 20a is made of, for example, a blue LED. However, the present invention is not limited thereto, and instead of the blue LED, another color LED, EL, laser diode, or the like may be used as the light emitting element 20a.

  In the light emitting device 20 of the present embodiment, as shown in FIG. 26B, the electrode of the light emitting element 20 a is electrically connected to the conductor pad 14 via the solder 17. However, the mounting method of the light emitting element 20a is not limited to the flip chip and is arbitrary. For example, the light emitting element 20a may be mounted by wire bonding.

  In the present embodiment, the elastic modulus of the mounting portion P1 is higher than the elastic modulus of the connecting portion. For this reason, even if the electronic component mounting substrate is bent, it is possible to make it difficult for the mounting portion P1 to be distorted. Therefore, in the electronic component mounted on the conductor pad formed at the end of the conductor layer on the mounting portion P1, Since distortion or stress can be made difficult to occur, the connection reliability of electronic components can be improved.

(Embodiment 5)
First to eighth examples of a lighting device using a light emitting device according to an embodiment of the present invention will be described.

  FIG. 27A is a diagram showing a first example of an illumination device using the light emitting device according to the embodiment of the present invention. FIG. 27B is a diagram illustrating a second example of an illumination device using the light-emitting device according to the embodiment of the present invention. 27A and 27B show the XY plane. As the light emitting device 20, for example, the light emitting device according to Embodiment 2 or 4 can be used.

  As shown in FIG. 27A, the illumination device 31 is configured such that one light emitting device 20 formed in a ring shape is accommodated in an annular tube 31 a. In addition, as shown in FIG. 27B, the lighting device 32 includes a plurality of light emitting devices 20 housed in an annular tube 32a. The plurality of light emitting devices 20 in the illumination device 32 may be connected to each other or may not be connected. The light emitting device 20 in the illuminating devices 31 and 32 is formed into a shape corresponding to the annular tubes 31a and 32a, for example, by curving the electronic component mounting substrate 10 to the side as shown in FIG. 7B.

  The sizes of the cylinders 31a and 32a are arbitrary. However, if it is a general use, it is considered that the size is preferably the size of 30 to 40 fluorescent lamps. Specifically, any one of FCL28 / 30, FCL32 / 30, and FCL40 / 38 in JISC7618-2 is preferable. Here, type 30 (FCL28 / 30) has a center diameter of 196 mm and an arc length of 615 mm. For example, it is preferable to form a type 30 annular illumination device by connecting two light emitting devices 20. Further, type 32 (FCL32 / 30) has a center diameter of 270 mm and an arc length of 848 mm. For example, it is preferable to configure a type 32 annular illumination device by connecting three light emitting devices 20. Type 40 (FCL40 / 38) has a central diameter of 344 mm and an arc length of 1080 mm. For example, it is preferable to configure a 40-type annular illumination device by connecting four light emitting devices 20. According to the light emitting device 20 of the present embodiment, it is possible to manufacture an LED lighting device that can be substituted for the 30-40 type fluorescent tubes.

  When the LED lighting device of the present embodiment is attached to a ring-type fluorescent lamp lighting fixture, for example, by replacing the power source of the ring-type fluorescent lamp with a DC constant current power source, the lighting fixture of the ring-type fluorescent lamp is LED-illuminated. Can be used as an instrument.

  FIG. 28A is a diagram illustrating a third example of the illumination device using the light-emitting device according to the embodiment of the present invention. FIG. 28B is a diagram illustrating a fourth example of the illumination device using the light-emitting device according to the embodiment of the present invention. 28A and 28B show the XY plane. As each of the light emitting devices 20, 21, and 22, for example, the light emitting device according to Embodiment 2 or 4 of the present invention can be used.

  As shown in FIG. 28A, the illumination device 33 includes a single light emitting device 20 formed in a spiral shape. In addition, as shown in FIG. 28B, the illumination device 34 includes a plurality of light emitting devices (for example, two light emitting devices 21 and 22) each formed in a spiral shape. In the illuminating devices 33 and 34, the light emitting elements 20a (see FIG. 23A or FIG. 26A) are arranged in a spiral shape.

  FIG. 29 is a diagram illustrating a fifth example of the illumination device using the light-emitting device according to the embodiment of the present invention. As the light emitting device 20, for example, the light emitting device according to Embodiment 2 or 4 of the present invention can be used.

  As shown in FIG. 29, the illuminating device 35 includes a single light emitting device 20 formed in a spiral shape. In the illumination device 35, the light emitting elements 20a (see FIG. 23A or FIG. 26A) are arranged in a spiral shape.

  FIG. 30A is a diagram showing a first arrangement of the light emitting devices in the illumination device according to the embodiment of the present invention. FIG. 30B is a diagram illustrating a light irradiation mode of the lighting device in which the light-emitting device is arranged in the mode illustrated in FIG. 30A. FIG. 31A is a diagram showing a second arrangement of the light-emitting devices in the illumination device according to the embodiment of the present invention. FIG. 31B is a diagram showing a light irradiation mode of the lighting device in which the light emitting device is arranged in the mode shown in FIG. 31A. FIG. 30A and FIG. 31A illustrate the case where the light emitting device according to Embodiment 2 of the present invention is used, but basically the same applies when the light emitting device according to Embodiment 4 of the present invention is used. I can say that.

  As shown in FIG. 30A and FIG. 30B, when the light emitting device 20 formed in an annular shape is arranged in such a posture that the light from each light emitting element 20a is irradiated toward the center P0 of the circle, local concentration occurs due to the concentration of light. Illuminance can be increased. When such a light-emitting device is used as illumination for photography, it can shoot brightly and with little shadow. In addition, as shown in FIGS. 31A and 31B, when the light emitting device 20 formed in an annular shape is arranged in such a posture that the light from each light emitting element 20a is irradiated in the direction opposite to the center P0 of the circle, It becomes possible to blur the whole by dispersion of the. Such a light-emitting device can be suitably used for a lighting fixture that illuminates the entire room because light is easily diffused.

  FIG. 32A is a diagram illustrating a sixth example of the illumination device using the light-emitting device according to the embodiment of the present invention. FIG. 32B is a diagram illustrating a seventh example of the illumination device using the light-emitting device according to the embodiment of the present invention. As the light emitting device 20, for example, the light emitting device according to Embodiment 2 or 4 of the present invention can be used.

  As shown in FIG. 32A, the illuminating device 36 includes a light emitting device 20 that is twisted so that light is alternately irradiated on the front and back along the longitudinal direction. In addition, as illustrated in FIG. 32B, the illumination device 37 includes a light emitting device 20 that is twisted so that light is irradiated in three or more different directions (for example, various directions randomly). These illuminations can be used for electrical appliances and the like.

  FIG. 33 is a diagram illustrating an eighth example of the illumination device using the light-emitting device according to the embodiment of the present invention. As the light emitting device 20, for example, the light emitting device according to Embodiment 2 or 4 of the present invention can be used.

  As shown in FIG. 33, the illuminating device 38 includes a light emitting device 20 bent in various directions. According to the illumination device 38, light is irradiated in various directions. Further, it may be a flexible lighting device that can be freely bent in any direction.

  FIG. 34 is a diagram illustrating a ninth example of the illumination device using the light-emitting device according to the embodiment of the present invention. As the light emitting device 20, for example, the light emitting device according to Embodiment 2 or 4 of the present invention can be used.

  In the illumination device 39, as shown in FIG. 34, the light emitting devices 21 to 29 (a plurality of linear light sources) are arranged in parallel. The illumination device 39 can be used as a planar light source.

  The illuminating device is used as, for example, an indoor / outdoor illumination lamp, an interior illumination lamp, an emergency lamp, a decorative lamp, a backlight light source for a liquid crystal display, an eraser for a copier, a light source for reading a document in a FAX or a scanner, or a light source for various displays. be able to. However, it is not limited to this, and the use of the lighting device is arbitrary.

  The shape, size, or light color of the lighting device is arbitrary. For example, the shape of the lighting device may be U-shaped, L-shaped, V-shaped, or the like.

(Other embodiments)
FIG. 35 is a cross-sectional view showing another example of the shape of the connecting portion of the electronic component mounting board in another embodiment of the present invention.

  The side surfaces F31 and F41 of the mounting portion P1 and the side surfaces F32 and F42 of the connecting portion P2 are not limited to convex surfaces protruding from the central portion in the thickness direction (Z direction) as shown in FIG. The side surfaces F31 and F41 of the mounting portion P1 and the side surfaces F32 and F42 of the connecting portion P2 may be flat surfaces that intersect perpendicularly with both the first surface F1 and the second surface F2, for example, as shown in FIG. Further, the side surfaces F31, F32, F41, and F42 may be concave surfaces in which the central portion in the thickness direction (Z direction) is recessed more than both end portions.

  FIG. 36 is a cross-sectional view showing another example of the shape of the mounting portion of the electronic component mounting board in another embodiment of the present invention.

  As shown in FIG. 36, the side surfaces F3 and F4 of the electronic component mounting board 10 according to the first embodiment may be flat surfaces without unevenness. In the example of FIG. 36, the width of the mounting portion P1 and the width of the connecting portion P2 are substantially equal.

  FIG. 37 is a diagram showing a first modification of the shape of the wiring for the electronic component to be mounted in another embodiment of the present invention. FIG. 38 is a diagram showing a second modification of the shape of the wiring for the electronic component to be mounted in another embodiment of the present invention.

  In the above embodiment, the wiring 13a extending in the longitudinal direction of the electronic component mounting board 10 is located at the center in the short direction of the electronic component mounting board 10 (see FIG. 4). However, the shape of the wiring for the electronic component to be mounted is not limited to that shown in FIG. 4. For example, the wiring extending in the longitudinal direction of the electronic component mounting board is the end in the short direction of the electronic component mounting board. May be located in the section.

  For example, as shown in FIG. 37, the electronic component mounting board is positioned between the side surface F3 or F4 of the first surface F1 of the electronic component mounting board and the cavity R0 instead of the wiring 13a shown in FIG. The wiring 13b extending in the longitudinal direction (Y direction) of the component mounting board and the first surface F1 of the electronic component mounting board are formed, one end is connected to the wiring 13b, and the other end is located on the bottom surface F21 of the cavity R0. Wiring 13c to be used. For example, a conductor pad 14 is formed on the end of the wiring 13c located on the bottom surface F21. According to such wirings 13b and 13c, it becomes easy to electrically connect a plurality of electronic components mounted in each cavity R0 in the electronic component mounting substrate in parallel. For example, by connecting the plurality of wirings 13c (branch lines) formed for each cavity R0 (electronic component) to the common wiring 13b (main line), the plurality of electronic components can be electrically connected in parallel. . Note that the wiring 13b and the wiring 13c may be formed integrally, or may be formed separately and electrically connected to each other by a conductive adhesive or the like.

  In the example of FIG. 37, one wiring 13b extending in the longitudinal direction of the electronic component mounting board is provided between each of the side surfaces F3 and F4 of the electronic component mounting board and the cavity R0. It is not limited to. For example, a plurality of wirings extending in the longitudinal direction of the electronic component mounting board may be provided between the side surfaces F3 and F4 of the electronic component mounting board and the cavity R0.

  For example, as shown in FIG. 38, the electronic component mounting substrate is located between the side surface F3 or F4 on the first surface F1 of the electronic component mounting substrate and the cavity R0, and is in the longitudinal direction (Y direction) of the electronic component mounting substrate. The extended wirings 13b and 13d, the wiring 13c formed on the first surface F1 of the electronic component mounting board, one end connected to the wiring 13b, and the other end positioned on the bottom surface F21 of the cavity R0, and the electronic component mounting board The wiring 13e may be formed on the first surface F1, with one end connected to the wiring 13d and the other end positioned on the bottom surface F21 of the cavity R0 (concave portion). For example, conductor pads 14 are formed on the ends of the wirings 13c and 13e located on the bottom surface F21. In the example of FIG. 38, the wiring 13d is disposed on the outer side (sides F3, F4 side) than the wiring 13b, and the wiring 13e extending from the wiring 13d to the bottom surface F21 of the cavity R0 crosses the wiring 13b, and the cavity R0. It extends to the bottom surface F21. In the portion crossing the wiring 13b, the wiring 13e may pass over or under the wiring 13b, but in the example of FIG. 38, it passes over the wiring 13b. Although not shown, an insulating layer is interposed between the wiring 13b and the wiring 13e, and the wiring 13b and the wiring 13e are insulated from each other. According to such wirings 13b, 13c, 13d, and 13e, it becomes easy to electrically connect a plurality of electronic components mounted in each cavity R0 in the electronic component mounting board in parallel. Further, by increasing the number of wirings (trunk lines) extending in the longitudinal direction of the electronic component mounting board, it becomes possible to increase the number of conductor pads 14 arranged on the bottom surface F21 of the cavity R0, and to increase the number of terminals. Many electronic components can be mounted. Note that the wiring 13b and the wiring 13c, and the wiring 13d and the wiring 13e may be formed integrally, or may be formed separately and electrically connected to each other by a conductive adhesive or the like.

  37 and 38 show a modification of the light emitting device according to the second embodiment of the present invention in which the cavity R0 is formed, but the light emitting device according to the fourth embodiment of the present invention in which the cavity R0 is not formed. However, it is possible to apply the form of wiring as shown in FIGS.

  The configurations (components, dimensions, material, shape, number of layers, arrangement, etc.) of the electronic component mounting substrate, the light emitting device, and the lighting device described above may be arbitrarily changed or omitted without departing from the spirit of the present invention. Can do. For example, in the electronic component mounting substrate 10 according to each embodiment of the present invention, the insulating layer 15 and the reflective film 16 may be omitted. The number of mounting parts (cavities) formed on one electronic component mounting board is arbitrary.

  The use of the light emitting device is not limited to the lighting device, but is arbitrary.

  All the mounting parts arranged along the longitudinal direction have substantially the same elastic modulus, and it is not essential that the respective portions between the mounting parts have substantially the same elastic modulus. Further, it is not essential that the elastic modulus of all the mounting portions arranged along the longitudinal direction is higher than any elastic modulus of the portion between the mounting portions. At least on the first surface F1, the elastic modulus of the adjacent mounting portions P1 (first mounting portion and second mounting portion) is between the adjacent mounting portions P1 (first mounting portion and second mounting portion). If there is a part that is higher than the elastic modulus of the part (the connecting part P2), the deformation rate of the mounting part P1 is smaller in that part than the deformation rate of the connecting part P2. And when it curves, since the deformation rate of the mounting part P1 is small, high reliability is obtained about electrical connection.

  The manufacturing method of the electronic component mounting substrate, the light emitting device, and the lighting device of the present invention is not limited to the contents and order shown in the embodiment of the present invention, and can be arbitrarily set within the scope of the present invention. Contents and order can be changed. Moreover, you may omit the process which is not required according to a use etc.

  The above embodiment of the present invention and other modifications can be arbitrarily combined. For example, both the structure shown in FIG. 35 and the structure shown in FIG. 36 may be applied to the electronic component mounting board 10 according to the first embodiment of the present invention. It is preferable to select an appropriate combination according to the application.

DESCRIPTION OF SYMBOLS 10 Electronic component mounting board 11 Board | substrate 11a Aluminum wire 12 Insulating layer 13 Conductor layer 13a, 13b, 13c, 13d, 13e Wiring 14 Conductor pad 14a 1st pad part 14b 2nd pad part 15 Insulating layer 16 Reflective film 17 Solder 20-29 Light emitting device 20a Light emitting element 31-39 Illumination device 31a, 32a Tube 1001 Peelable copper foil laminate plate 1001a Release layer 1001b Support copper foil 1002 Carrier 1003 Laminated body 1004 Blade 1006 Laminated body 1007 Reflective layer 1011-1013a Mold 1011a-1013a Convex Part 2001 Mold F1 First face F2 Second face F3 Side face F4 Side face F11, F21 Bottom face F12, F22 Wall face F31, F32, F41, F42 Side face P1 Mounting part P2 Connecting part P3 Cut P11 End part P12, P13 Bend Part P41~P44 slit R0 cavity R1, R2 recess R3 void R4 region R5 opening

Claims (18)

An electronic component mounting board having a first surface, a second surface opposite to the first surface, and a linear outer shape,
The first surface has a first mounting portion and a second mounting portion for mounting an electronic component,
The first mounting part and the second mounting part are arranged along the longitudinal direction of the linear outer shape,
In the first surface, the elastic modulus of the first mounting portion and the elastic modulus of the second mounting portion are higher than the elastic modulus of the portion between the first mounting portion and the second mounting portion, respectively.
An electronic component mounting board characterized by that. At least one of the first mounting part and the second mounting part is formed with a recess by laminating an upper layer on a base part on which a recess is formed,
The concave portion of the base portion is based on plastic deformation.
The electronic component mounting board according to claim 1. The concave portion of the base portion is work-cured,
The electronic component mounting board according to claim 2, wherein: A substrate having a linear outline;
An insulating layer formed on the substrate;
A conductor layer formed on the insulating layer;
Having
The electronic component mounting substrate according to any one of claims 1 to 3, wherein The substrate is made of metal;
The electronic component mounting board according to claim 4, wherein: The edge of the conductor layer has jumped to the opposite side of the substrate,
The electronic component mounting board according to claim 4, wherein the electronic component mounting board is provided. The insulating layer has a first component that increases adhesiveness and a second component that increases flexibility.
The electronic component mounting board according to any one of claims 4 to 6, wherein The first component is at least one of methacrylic acid, methyl methacrylate, and glycidyl methacrylate,
The second component is at least one of an olefin resin, a fluorine resin, and a silicone resin.
The electronic component mounting board according to claim 7. The conductor layer has wiring for the electronic component to be mounted,
Conductor pads are formed on the ends of the wiring,
The conductor pad is disposed in each of the first mounting portion and the second mounting portion.
The electronic component mounting substrate according to claim 4, wherein the electronic component mounting substrate is a substrate. The dimension in the short direction of the insulating layer is larger than the dimension in the short direction of the conductor layer,
The electronic component mounting substrate according to any one of claims 4 to 9, wherein The maximum dimension in the short direction of the first mounting part and the maximum dimension in the short direction of the second mounting part are respectively the short direction of the portion between the first mounting part and the second mounting part. Larger than the maximum dimension of
The electronic component mounting substrate according to claim 1, wherein the electronic component mounting substrate is the same as the electronic component mounting substrate. The longitudinal dimension of the first mounting part and the longitudinal dimension of the second mounting part are respectively larger than the interval between the first mounting part and the second mounting part.
The electronic component mounting board according to claim 1, wherein the electronic component mounting board is a board. A plurality of mounting parts including the first mounting part and the second mounting part are arranged along the longitudinal direction,
The elastic modulus of all the mounting parts arranged along the longitudinal direction is higher than the elastic modulus of any part between the mounting parts,
The electronic component mounting substrate according to any one of claims 1 to 12, All the mounting portions arranged along the longitudinal direction have substantially the same elastic modulus,
Each part between the mounting parts has substantially the same elastic modulus.
The electronic component mounting board according to claim 13, wherein A light emitting device having an electronic component mounting substrate and a light emitting element,
The electronic component mounting board is the electronic component mounting board according to any one of claims 1 to 14,
A first light emitting element mounted on the first mounting portion;
A second light emitting element mounted on the second mounting portion;
Having
A light emitting device characterized by that. A lighting device including a light emitting device having an electronic component mounting substrate and a light emitting element,
At least one of the light emitting devices according to claim 15 is formed in a ring shape.
A lighting device characterized by that. A plurality of the light emitting devices are connected to each other and formed into the ring shape.
The lighting device according to claim 16. The light emitting device is housed in an annular tube.
The lighting device according to claim 16 or 17,

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