CN105834418A - 一种电子浆料中铜粉的乙基纤维素微胶囊处理方法 - Google Patents
一种电子浆料中铜粉的乙基纤维素微胶囊处理方法 Download PDFInfo
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- CN105834418A CN105834418A CN201610153172.1A CN201610153172A CN105834418A CN 105834418 A CN105834418 A CN 105834418A CN 201610153172 A CN201610153172 A CN 201610153172A CN 105834418 A CN105834418 A CN 105834418A
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- copper powder
- wall material
- ethyl cellulose
- microcapsule
- microcapsule wall
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Abstract
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CN201610153172.1A CN105834418B (zh) | 2016-03-17 | 2016-03-17 | 一种电子浆料中铜粉的乙基纤维素微胶囊处理方法 |
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CN201610153172.1A CN105834418B (zh) | 2016-03-17 | 2016-03-17 | 一种电子浆料中铜粉的乙基纤维素微胶囊处理方法 |
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CN105834418A true CN105834418A (zh) | 2016-08-10 |
CN105834418B CN105834418B (zh) | 2018-01-05 |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003016832A (ja) * | 2001-04-27 | 2003-01-17 | Dowa Mining Co Ltd | 耐酸化性に優れた導電ペースト用銅粉およびその製法 |
CN101486094A (zh) * | 2008-01-16 | 2009-07-22 | 赖秋郎 | 抗氧化的微细铜粉及具有抗氧化的微细铜粉的导电性浆料 |
KR20110112560A (ko) * | 2010-04-07 | 2011-10-13 | 한국과학기술원 | 내산화성 물질로 표면이 코팅된 도전성 구리 분말 및 그 제조방법 |
WO2011145378A1 (ja) * | 2010-05-19 | 2011-11-24 | 三井金属鉱業株式会社 | 導電性ペースト用銅粉及び導電性ペースト |
CN102773475A (zh) * | 2012-07-31 | 2012-11-14 | 东南大学 | 一种导电浆料用抗氧化铜银复合粉及其制备方法 |
CN104036876A (zh) * | 2014-06-12 | 2014-09-10 | 西安工程大学 | 一种高温铜电子浆料的制备方法 |
CN104240841A (zh) * | 2013-06-14 | 2014-12-24 | 中国振华集团云科电子有限公司 | 一种贱金属导体浆料制备方法 |
CN104361950A (zh) * | 2014-10-21 | 2015-02-18 | 西安工程大学 | 一种碳包覆铜电子浆料的制备方法 |
CN105254974A (zh) * | 2015-09-30 | 2016-01-20 | 大禹节水(天津)有限公司 | 一种改性防藻类生长薄壁透明聚氯乙烯滴灌带 |
-
2016
- 2016-03-17 CN CN201610153172.1A patent/CN105834418B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003016832A (ja) * | 2001-04-27 | 2003-01-17 | Dowa Mining Co Ltd | 耐酸化性に優れた導電ペースト用銅粉およびその製法 |
CN101486094A (zh) * | 2008-01-16 | 2009-07-22 | 赖秋郎 | 抗氧化的微细铜粉及具有抗氧化的微细铜粉的导电性浆料 |
KR20110112560A (ko) * | 2010-04-07 | 2011-10-13 | 한국과학기술원 | 내산화성 물질로 표면이 코팅된 도전성 구리 분말 및 그 제조방법 |
WO2011145378A1 (ja) * | 2010-05-19 | 2011-11-24 | 三井金属鉱業株式会社 | 導電性ペースト用銅粉及び導電性ペースト |
CN102773475A (zh) * | 2012-07-31 | 2012-11-14 | 东南大学 | 一种导电浆料用抗氧化铜银复合粉及其制备方法 |
CN104240841A (zh) * | 2013-06-14 | 2014-12-24 | 中国振华集团云科电子有限公司 | 一种贱金属导体浆料制备方法 |
CN104036876A (zh) * | 2014-06-12 | 2014-09-10 | 西安工程大学 | 一种高温铜电子浆料的制备方法 |
CN104361950A (zh) * | 2014-10-21 | 2015-02-18 | 西安工程大学 | 一种碳包覆铜电子浆料的制备方法 |
CN105254974A (zh) * | 2015-09-30 | 2016-01-20 | 大禹节水(天津)有限公司 | 一种改性防藻类生长薄壁透明聚氯乙烯滴灌带 |
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CN105834418B (zh) | 2018-01-05 |
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Effective date of registration: 20210126 Address after: Room 1011, 4 / F, building 5, No. 299, Hangfu Road, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Tongxiang Beite Technology Co.,Ltd. Address before: 710048 No. 19 Jinhua South Road, Shaanxi, Xi'an Patentee before: XI'AN POLYTECHNIC University |
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Effective date of registration: 20230724 Address after: 441700 Gucheng County Economic Development Zone, Xiangyang City, Hubei Province Patentee after: Hubei Fulinhua Textile Co.,Ltd. Address before: Room 1011, 4 / F, building 5, No. 299, Hangfu Road, Chongfu Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: Tongxiang Beite Technology Co.,Ltd. |