CN105773398B - 基于光谱的监测化学机械研磨的装置及方法 - Google Patents

基于光谱的监测化学机械研磨的装置及方法 Download PDF

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Publication number
CN105773398B
CN105773398B CN201610227541.7A CN201610227541A CN105773398B CN 105773398 B CN105773398 B CN 105773398B CN 201610227541 A CN201610227541 A CN 201610227541A CN 105773398 B CN105773398 B CN 105773398B
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China
Prior art keywords
spectrum
grinding
substrate
spectra
current
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Active
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CN201610227541.7A
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English (en)
Chinese (zh)
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CN105773398A (zh
Inventor
D.J.本韦格努
J.D.戴维
B.斯韦德克
H.Q.李
L.卡鲁皮亚
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Applied Materials Inc
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Applied Materials Inc
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Priority claimed from US11/213,344 external-priority patent/US7764377B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN105773398A publication Critical patent/CN105773398A/zh
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201610227541.7A 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法 Active CN105773398B (zh)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US60/710,682 2005-08-22
US11/213,344 2005-08-26
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,675 2005-08-26
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 2005-08-26
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US11/261,742 2005-10-28
US74776806P 2006-05-19 2006-05-19
US60/747,768 2006-05-19
CN2006800304049A CN101242931B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2006800304049A Division CN101242931B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Publications (2)

Publication Number Publication Date
CN105773398A CN105773398A (zh) 2016-07-20
CN105773398B true CN105773398B (zh) 2019-11-19

Family

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CN201210109226.6A Active CN102626895B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法
CN201610227541.7A Active CN105773398B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法
CN201410667878.0A Active CN104526536B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Family Applications Before (1)

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Country Status (4)

Country Link
JP (6) JP5622807B2 (ko)
KR (5) KR101593927B1 (ko)
CN (3) CN102626895B (ko)
TW (1) TWI361454B (ko)

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TWI496661B (zh) * 2010-04-28 2015-08-21 Applied Materials Inc 用於光學監測之參考光譜的自動產生
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US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
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US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
US10350728B2 (en) * 2014-12-12 2019-07-16 Applied Materials, Inc. System and process for in situ byproduct removal and platen cooling during CMP
CN104802091A (zh) * 2015-05-19 2015-07-29 肥西县三星玻璃有限公司 一种玻璃磨边机
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
KR101870701B1 (ko) 2016-08-01 2018-06-25 에스케이실트론 주식회사 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템
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KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN107900788B (zh) * 2017-11-24 2020-04-24 上海华力微电子有限公司 一种改善层间介质研磨工艺厚度稳定性的方法
KR102527659B1 (ko) 2017-11-27 2023-05-03 삼성전자주식회사 공기청정기
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JP7447284B2 (ja) * 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
CN112025547B (zh) * 2020-09-15 2021-11-02 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113478382B (zh) * 2021-07-20 2022-11-04 湖北鼎汇微电子材料有限公司 检测窗口、化学机械抛光垫及抛光系统

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Also Published As

Publication number Publication date
KR101423579B1 (ko) 2014-07-25
JP2015079984A (ja) 2015-04-23
KR101593927B1 (ko) 2016-02-15
JP6047327B2 (ja) 2016-12-21
JP2012256913A (ja) 2012-12-27
JP5622806B2 (ja) 2014-11-12
JP2015077684A (ja) 2015-04-23
TWI361454B (en) 2012-04-01
JP2012256911A (ja) 2012-12-27
KR20130041397A (ko) 2013-04-24
KR20130041396A (ko) 2013-04-24
CN102626895B (zh) 2016-05-25
KR20140019484A (ko) 2014-02-14
JP2012256912A (ja) 2012-12-27
KR101398567B1 (ko) 2014-05-22
JP6052906B2 (ja) 2016-12-27
TW200717637A (en) 2007-05-01
KR101398570B1 (ko) 2014-05-22
CN104526536A (zh) 2015-04-22
JP2013048259A (ja) 2013-03-07
CN102626895A (zh) 2012-08-08
KR101521414B1 (ko) 2015-05-19
CN105773398A (zh) 2016-07-20
KR20140140598A (ko) 2014-12-09
JP5624099B2 (ja) 2014-11-12
JP5622807B2 (ja) 2014-11-12
KR20130042059A (ko) 2013-04-25
CN104526536B (zh) 2017-09-22
JP6438288B2 (ja) 2018-12-12

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