CN105684096B - 导电糊剂、连接结构体及连接结构体的制造方法 - Google Patents

导电糊剂、连接结构体及连接结构体的制造方法 Download PDF

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Publication number
CN105684096B
CN105684096B CN201580002410.2A CN201580002410A CN105684096B CN 105684096 B CN105684096 B CN 105684096B CN 201580002410 A CN201580002410 A CN 201580002410A CN 105684096 B CN105684096 B CN 105684096B
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China
Prior art keywords
conductive paste
solder
electrode
solder particles
connection
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Chinese (zh)
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CN105684096A (zh
Inventor
久保田敬士
石泽英亮
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
CN201580002410.2A 2014-03-07 2015-02-25 导电糊剂、连接结构体及连接结构体的制造方法 Active CN105684096B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014045437 2014-03-07
JP2014-045437 2014-03-07
PCT/JP2015/055343 WO2015133343A1 (ja) 2014-03-07 2015-02-25 導電ペースト、接続構造体及び接続構造体の製造方法

Publications (2)

Publication Number Publication Date
CN105684096A CN105684096A (zh) 2016-06-15
CN105684096B true CN105684096B (zh) 2018-04-17

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Country Link
JP (2) JP5851071B1 (enExample)
KR (1) KR102393302B1 (enExample)
CN (1) CN105684096B (enExample)
TW (1) TWI671382B (enExample)
WO (1) WO2015133343A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP6600234B2 (ja) * 2015-11-16 2019-10-30 積水化学工業株式会社 導電材料及び接続構造体
JP2017092424A (ja) * 2015-11-17 2017-05-25 積水化学工業株式会社 接続構造体の製造方法
JP7184759B2 (ja) * 2017-12-22 2022-12-06 積水化学工業株式会社 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法
JP7210840B2 (ja) * 2018-08-06 2023-01-24 株式会社レゾナック 伸縮性樹脂形成用熱硬化性組成物、伸縮性樹脂、及び半導体装置
CN117995822B (zh) * 2024-04-03 2024-08-23 上海聚跃检测技术有限公司 一种芯片失效分析散热测试结构和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123087A1 (ja) * 2007-03-19 2008-10-16 Namics Coropration 異方性導電ペースト
CN101501154A (zh) * 2006-08-25 2009-08-05 住友电木株式会社 粘合带、接合体和半导体封装件
CN102859797A (zh) * 2010-04-22 2013-01-02 积水化学工业株式会社 各向异性导电材料及连接结构体
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1181949C (zh) * 1999-12-27 2004-12-29 住友电木株式会社 可固化助焊剂及可固化助焊剂增强的半导体封装和半导体器件以及制造半导体封装和半导体器件的方法
DE60142119D1 (de) * 2000-10-02 2010-06-24 Asahi Kasei Emd Corp Teilchen einer funktionellen metalllegierung.
JP3930690B2 (ja) * 2001-03-13 2007-06-13 昭和電工株式会社 ハンダペースト用フラックス
JP2004223559A (ja) * 2003-01-22 2004-08-12 Asahi Kasei Corp 電極接続用金属粉体組成物、及び、電極の接続方法
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP4248944B2 (ja) * 2003-06-10 2009-04-02 旭化成エレクトロニクス株式会社 導電性ペースト、回路パターンの形成方法、突起電極の形成方法
JP2005194306A (ja) * 2003-12-26 2005-07-21 Togo Seisakusho Corp 通電接着剤とそれを用いた窓用板状部材
CN101107678B (zh) * 2005-01-25 2012-03-07 藤仓化成株式会社 导电浆料
WO2008001740A1 (en) * 2006-06-30 2008-01-03 Asahi Kasei Emd Corporation Conductive filler
JP4662483B2 (ja) * 2006-07-18 2011-03-30 旭化成イーマテリアルズ株式会社 導電性フィラー、及び中温はんだ材料
JP2009278054A (ja) * 2008-05-19 2009-11-26 Sumitomo Bakelite Co Ltd 端子間の接続方法、導電性粒子の凝集方法及びそれを用いた半導体装置の製造方法
US8420722B2 (en) * 2008-07-10 2013-04-16 Electronics And Telecommunications Research Institute Composition and methods of forming solder bump and flip chip using the same
US8710662B2 (en) * 2010-06-09 2014-04-29 Sony Corporation & Information Device Corporation Light-reflective anisotropic conductive paste and light-emitting device
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
JP2012169263A (ja) * 2011-01-24 2012-09-06 Sekisui Chem Co Ltd 異方性導電材料、接続構造体の製造方法及び接続構造体
EP2763515A4 (en) * 2011-09-30 2015-07-15 Murata Manufacturing Co ELECTRONIC DEVICE, JUNCTION MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
CN103443868B (zh) * 2012-03-26 2014-11-19 积水化学工业株式会社 导电材料及连接结构体
JP6114627B2 (ja) * 2012-05-18 2017-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2014005347A (ja) * 2012-06-22 2014-01-16 Sekisui Chem Co Ltd 接着剤組成物及び半導体チップ実装体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101501154A (zh) * 2006-08-25 2009-08-05 住友电木株式会社 粘合带、接合体和半导体封装件
WO2008123087A1 (ja) * 2007-03-19 2008-10-16 Namics Coropration 異方性導電ペースト
CN102859797A (zh) * 2010-04-22 2013-01-02 积水化学工业株式会社 各向异性导电材料及连接结构体
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体

Also Published As

Publication number Publication date
TWI671382B (zh) 2019-09-11
KR102393302B1 (ko) 2022-05-03
JP2016048691A (ja) 2016-04-07
JP5851071B1 (ja) 2016-02-03
WO2015133343A1 (ja) 2015-09-11
KR20160130738A (ko) 2016-11-14
JPWO2015133343A1 (ja) 2017-04-06
CN105684096A (zh) 2016-06-15
TW201536892A (zh) 2015-10-01

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