JP5851071B1 - 導電ペースト、接続構造体及び接続構造体の製造方法 - Google Patents

導電ペースト、接続構造体及び接続構造体の製造方法 Download PDF

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Publication number
JP5851071B1
JP5851071B1 JP2015512828A JP2015512828A JP5851071B1 JP 5851071 B1 JP5851071 B1 JP 5851071B1 JP 2015512828 A JP2015512828 A JP 2015512828A JP 2015512828 A JP2015512828 A JP 2015512828A JP 5851071 B1 JP5851071 B1 JP 5851071B1
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conductive paste
electrode
solder
connection
solder particles
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JP2015512828A
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Japanese (ja)
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JPWO2015133343A1 (ja
Inventor
敬士 久保田
敬士 久保田
石澤　英亮
英亮 石澤
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
JP2015512828A 2014-03-07 2015-02-25 導電ペースト、接続構造体及び接続構造体の製造方法 Active JP5851071B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015512828A JP5851071B1 (ja) 2014-03-07 2015-02-25 導電ペースト、接続構造体及び接続構造体の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014045437 2014-03-07
JP2014045437 2014-03-07
PCT/JP2015/055343 WO2015133343A1 (ja) 2014-03-07 2015-02-25 導電ペースト、接続構造体及び接続構造体の製造方法
JP2015512828A JP5851071B1 (ja) 2014-03-07 2015-02-25 導電ペースト、接続構造体及び接続構造体の製造方法

Related Child Applications (1)

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JP5851071B1 true JP5851071B1 (ja) 2016-02-03
JPWO2015133343A1 JPWO2015133343A1 (ja) 2017-04-06

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JP2015222624A Pending JP2016048691A (ja) 2014-03-07 2015-11-13 導電ペースト、接続構造体及び接続構造体の製造方法

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Country Status (5)

Country Link
JP (2) JP5851071B1 (enExample)
KR (1) KR102393302B1 (enExample)
CN (1) CN105684096B (enExample)
TW (1) TWI671382B (enExample)
WO (1) WO2015133343A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017033934A1 (ja) * 2015-08-24 2017-03-02 積水化学工業株式会社 導電材料及び接続構造体
JP6600234B2 (ja) * 2015-11-16 2019-10-30 積水化学工業株式会社 導電材料及び接続構造体
JP2017092424A (ja) * 2015-11-17 2017-05-25 積水化学工業株式会社 接続構造体の製造方法
JP7184759B2 (ja) * 2017-12-22 2022-12-06 積水化学工業株式会社 導電材料、導電材料の保管方法、導電材料の製造方法及び接続構造体の製造方法
JP7210840B2 (ja) * 2018-08-06 2023-01-24 株式会社レゾナック 伸縮性樹脂形成用熱硬化性組成物、伸縮性樹脂、及び半導体装置
CN117995822B (zh) * 2024-04-03 2024-08-23 上海聚跃检测技术有限公司 一种芯片失效分析散热测试结构和方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002028574A1 (fr) * 2000-10-02 2002-04-11 Asahi Kasei Kabushiki Kaisha Particules d'alliage fonctionnel
JP2002263885A (ja) * 2001-03-13 2002-09-17 Showa Denko Kk ハンダ付け用フラックス
JP2004223559A (ja) * 2003-01-22 2004-08-12 Asahi Kasei Corp 電極接続用金属粉体組成物、及び、電極の接続方法
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP2005005054A (ja) * 2003-06-10 2005-01-06 Asahi Kasei Corp 導電性ペースト
WO2008001740A1 (en) * 2006-06-30 2008-01-03 Asahi Kasei Emd Corporation Conductive filler
JP2008027588A (ja) * 2006-07-18 2008-02-07 Asahi Kasei Electronics Co Ltd 導電性フィラー、及び中温はんだ材料
WO2008023452A1 (en) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Adhesive tape, joint structure, and semiconductor package
WO2008123087A1 (ja) * 2007-03-19 2008-10-16 Namics Coropration 異方性導電ペースト
WO2011132658A1 (ja) * 2010-04-22 2011-10-27 積水化学工業株式会社 異方性導電材料及び接続構造体
JP2012019203A (ja) * 2010-06-09 2012-01-26 Sony Chemical & Information Device Corp 光反射性異方性導電ペースト及び発光装置
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1181949C (zh) * 1999-12-27 2004-12-29 住友电木株式会社 可固化助焊剂及可固化助焊剂增强的半导体封装和半导体器件以及制造半导体封装和半导体器件的方法
JP2005194306A (ja) * 2003-12-26 2005-07-21 Togo Seisakusho Corp 通電接着剤とそれを用いた窓用板状部材
CN101107678B (zh) * 2005-01-25 2012-03-07 藤仓化成株式会社 导电浆料
JP2009278054A (ja) * 2008-05-19 2009-11-26 Sumitomo Bakelite Co Ltd 端子間の接続方法、導電性粒子の凝集方法及びそれを用いた半導体装置の製造方法
US8420722B2 (en) * 2008-07-10 2013-04-16 Electronics And Telecommunications Research Institute Composition and methods of forming solder bump and flip chip using the same
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
JP2012169263A (ja) * 2011-01-24 2012-09-06 Sekisui Chem Co Ltd 異方性導電材料、接続構造体の製造方法及び接続構造体
EP2763515A4 (en) * 2011-09-30 2015-07-15 Murata Manufacturing Co ELECTRONIC DEVICE, JUNCTION MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
CN103443868B (zh) * 2012-03-26 2014-11-19 积水化学工业株式会社 导电材料及连接结构体
JP6114627B2 (ja) * 2012-05-18 2017-04-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2014005347A (ja) * 2012-06-22 2014-01-16 Sekisui Chem Co Ltd 接着剤組成物及び半導体チップ実装体の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002028574A1 (fr) * 2000-10-02 2002-04-11 Asahi Kasei Kabushiki Kaisha Particules d'alliage fonctionnel
JP2002263885A (ja) * 2001-03-13 2002-09-17 Showa Denko Kk ハンダ付け用フラックス
JP2004223559A (ja) * 2003-01-22 2004-08-12 Asahi Kasei Corp 電極接続用金属粉体組成物、及び、電極の接続方法
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP2005005054A (ja) * 2003-06-10 2005-01-06 Asahi Kasei Corp 導電性ペースト
WO2008001740A1 (en) * 2006-06-30 2008-01-03 Asahi Kasei Emd Corporation Conductive filler
JP2008027588A (ja) * 2006-07-18 2008-02-07 Asahi Kasei Electronics Co Ltd 導電性フィラー、及び中温はんだ材料
WO2008023452A1 (en) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Adhesive tape, joint structure, and semiconductor package
WO2008123087A1 (ja) * 2007-03-19 2008-10-16 Namics Coropration 異方性導電ペースト
WO2011132658A1 (ja) * 2010-04-22 2011-10-27 積水化学工業株式会社 異方性導電材料及び接続構造体
JP2012019203A (ja) * 2010-06-09 2012-01-26 Sony Chemical & Information Device Corp 光反射性異方性導電ペースト及び発光装置
JP2013149610A (ja) * 2011-12-20 2013-08-01 Sekisui Chem Co Ltd 電子部品接続材料及び接続構造体

Also Published As

Publication number Publication date
TWI671382B (zh) 2019-09-11
KR102393302B1 (ko) 2022-05-03
JP2016048691A (ja) 2016-04-07
CN105684096B (zh) 2018-04-17
WO2015133343A1 (ja) 2015-09-11
KR20160130738A (ko) 2016-11-14
JPWO2015133343A1 (ja) 2017-04-06
CN105684096A (zh) 2016-06-15
TW201536892A (zh) 2015-10-01

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