CN105556415B - 用于利用热电冷却器维持恒定电话皮肤温度方法和装置以及计算机可读介质 - Google Patents

用于利用热电冷却器维持恒定电话皮肤温度方法和装置以及计算机可读介质 Download PDF

Info

Publication number
CN105556415B
CN105556415B CN201480051111.3A CN201480051111A CN105556415B CN 105556415 B CN105556415 B CN 105556415B CN 201480051111 A CN201480051111 A CN 201480051111A CN 105556415 B CN105556415 B CN 105556415B
Authority
CN
China
Prior art keywords
tec
skin
temperature
face
mobile device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480051111.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN105556415A (zh
Inventor
R·G·普拉加帕蒂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN105556415A publication Critical patent/CN105556415A/zh
Application granted granted Critical
Publication of CN105556415B publication Critical patent/CN105556415B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G09G2330/021—Power management, e.g. power saving
    • G09G2330/023—Power management, e.g. power saving using energy recovery or conservation

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Telephone Set Structure (AREA)
  • Telephone Function (AREA)
  • Electrodes Of Semiconductors (AREA)
CN201480051111.3A 2013-09-18 2014-09-17 用于利用热电冷却器维持恒定电话皮肤温度方法和装置以及计算机可读介质 Active CN105556415B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/030,901 US20150075186A1 (en) 2013-09-18 2013-09-18 Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
US14/030,901 2013-09-18
PCT/US2014/056090 WO2015042145A1 (en) 2013-09-18 2014-09-17 Method of, apparatus for and computer program product comprising code for maintaining constant phone skin temperature with a thermoelectric cooler.

Publications (2)

Publication Number Publication Date
CN105556415A CN105556415A (zh) 2016-05-04
CN105556415B true CN105556415B (zh) 2019-09-03

Family

ID=51660048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480051111.3A Active CN105556415B (zh) 2013-09-18 2014-09-17 用于利用热电冷却器维持恒定电话皮肤温度方法和装置以及计算机可读介质

Country Status (8)

Country Link
US (1) US20150075186A1 (enExample)
EP (1) EP3047346B1 (enExample)
JP (1) JP6316438B2 (enExample)
KR (1) KR20160055832A (enExample)
CN (1) CN105556415B (enExample)
ES (1) ES2641050T3 (enExample)
HU (1) HUE033463T2 (enExample)
WO (1) WO2015042145A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102184621B1 (ko) * 2014-02-21 2020-11-30 삼성전자주식회사 방열 쉬트를 구비한 이동 통신 단말기
US10082847B2 (en) * 2014-04-01 2018-09-25 Qualcomm Incorporated Method and system for optimizing performance of a PCD while mitigating thermal generation
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US9836099B2 (en) * 2014-10-08 2017-12-05 AzTrong Inc. Ultrathin heat remover for portable electronic device
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
US9958921B2 (en) * 2015-03-09 2018-05-01 Advanced Micro Devices, Inc. Power management to change power limits based on device skin temperature
KR102266263B1 (ko) * 2015-05-07 2021-06-17 삼성전자주식회사 디스플레이장치
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US9743554B2 (en) 2015-11-18 2017-08-22 Microsoft Technology Licensing, Llc Heat dissipation in electronics with a heat spreader
CN205594253U (zh) * 2016-02-02 2016-09-21 京东方科技集团股份有限公司 显示装置
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
CN205809778U (zh) * 2016-05-31 2016-12-14 京东方科技集团股份有限公司 移动显示设备
JP2018026533A (ja) * 2016-08-08 2018-02-15 株式会社デンソー 電子制御装置
US10188015B2 (en) 2016-09-20 2019-01-22 Qualcomm Incorporated Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement
EP3554203B1 (en) * 2016-12-29 2023-01-25 Huawei Technologies Co., Ltd. Terminal apparatus comprising a heat dissipation device
JP7106567B2 (ja) * 2017-03-16 2022-07-26 サフラン パッセンジャー イノベーションズ， エルエルシー 輸送機関のサービスカート用電源
US10705577B2 (en) * 2017-07-11 2020-07-07 Asustek Computer Inc. Electronic device and cover adapted to electronic device
US10453821B2 (en) * 2017-08-04 2019-10-22 Samsung Electronics Co., Ltd. Connection system of semiconductor packages
CN111108594B (zh) 2017-09-28 2024-03-19 京瓷株式会社 电子元件搭载用基板及电子装置
US10731878B2 (en) 2017-11-22 2020-08-04 International Business Machines Corporation Thermal cooling of an enclosure
JP2020065232A (ja) * 2018-10-19 2020-04-23 シャープ株式会社 電子機器
US12007170B2 (en) 2019-08-06 2024-06-11 Intel Corporation Thermal management in integrated circuit packages
US11784108B2 (en) 2019-08-06 2023-10-10 Intel Corporation Thermal management in integrated circuit packages
US20210043573A1 (en) * 2019-08-06 2021-02-11 Intel Corporation Thermal management in integrated circuit packages
US11830787B2 (en) 2019-08-06 2023-11-28 Intel Corporation Thermal management in integrated circuit packages
US10863654B1 (en) * 2019-09-20 2020-12-08 Wuhan China Star Optoelectronics Technology Co., Ltd. Display device
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
CN111381648A (zh) * 2020-03-03 2020-07-07 合肥联宝信息技术有限公司 一种降温方法、系统、电子设备及计算机存储介质
US11510346B2 (en) * 2020-08-24 2022-11-22 Baidu Usa Llc Method and system for enhancing electronics cooling using a thermoelectric element
US11457545B2 (en) 2020-09-28 2022-09-27 Google Llc Thermal-control system of a media-streaming device and associated media-streaming devices
WO2022270689A1 (ko) * 2021-06-23 2022-12-29 엘지전자 주식회사 디스플레이 디바이스
US12048126B2 (en) * 2021-09-01 2024-07-23 Baidu Usa Llc Energy-generating fluid distribution module for servers
CN115826701A (zh) * 2021-09-16 2023-03-21 戴尔产品有限公司 使用相变材料帮助冷却信息处置资源的系统和方法
CN113747774B (zh) * 2021-10-11 2024-08-20 中国工程物理研究院应用电子学研究所 一种温控冷却系统及其使用方法
US12315983B2 (en) 2021-12-16 2025-05-27 Dell Products Lp System and method for thermally controlling a wax encapsulated antenna during burst transport
US12237853B2 (en) 2022-01-25 2025-02-25 Dell Products Lp System and method for integrating radio system cooling and antenna power management systems

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102447216A (zh) * 2010-10-12 2012-05-09 奥兰若技术有限公司 组件温度控制
CN202472460U (zh) * 2011-11-10 2012-10-03 中兴通讯股份有限公司 散热装置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11242551A (ja) * 1997-12-18 1999-09-07 Masanobu Kujirada キー入力装置
US6143975A (en) * 1999-01-25 2000-11-07 Dell Usa, L.P. Thermoelectric regenerator
JP2001282396A (ja) * 2000-03-24 2001-10-12 Internatl Business Mach Corp <Ibm> 発電機構、コンピュータ装置及び電子機器
JP2001308395A (ja) * 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd 電子機器における熱エネルギー再生装置
US6445580B1 (en) * 2000-06-09 2002-09-03 International Business Machines Corporation Adaptable heat dissipation device for a personal computer
JP2002110256A (ja) * 2000-10-02 2002-04-12 Matsushita Electric Ind Co Ltd 携帯用機器
JP3753995B2 (ja) * 2002-03-13 2006-03-08 インターナショナル・ビジネス・マシーンズ・コーポレーション 冷却装置および情報処理装置
US6837057B2 (en) * 2002-12-31 2005-01-04 Intel Corporation Docking station to cool a computer
KR100532335B1 (ko) * 2003-12-08 2005-11-29 삼성전자주식회사 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법
JP2005310847A (ja) * 2004-04-16 2005-11-04 Tokyo Gas Co Ltd 熱電変換素子付き携帯電話器
US7161809B2 (en) * 2004-09-15 2007-01-09 Advanced Energy Technology Inc. Integral heat spreader
US7523617B2 (en) * 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US7560640B2 (en) * 2004-11-22 2009-07-14 Intel Corporation Densely packed thermoelectric cooler
JP2007207870A (ja) * 2006-01-31 2007-08-16 Nec Access Technica Ltd 携帯端末装置
JP2007259141A (ja) * 2006-03-23 2007-10-04 Aruze Corp 携帯電話機
JP2008131501A (ja) * 2006-11-22 2008-06-05 Kyocera Corp 携帯端末装置
JP5179746B2 (ja) * 2006-11-22 2013-04-10 京セラ株式会社 携帯端末装置
US7739876B2 (en) * 2006-12-27 2010-06-22 Intel Corporation Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
JP2009094196A (ja) * 2007-10-05 2009-04-30 Nec Corp 携帯通信機の放熱構造
JP4864855B2 (ja) * 2007-11-05 2012-02-01 株式会社リコー 携帯型電子機器
US20090205696A1 (en) * 2008-02-15 2009-08-20 Nextreme Thermal Solutions, Inc. Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods
JP2009236518A (ja) * 2008-03-26 2009-10-15 Nec Commun Syst Ltd 端末装置、方向指示方法、及びコンピュータプログラム
WO2010010520A2 (en) * 2008-07-23 2010-01-28 Nxp B.V. Integrated seebeck device
US20100104485A1 (en) * 2008-10-28 2010-04-29 Microfluidic Systems, Inc. Flow-through thermal cycling device
US8255004B2 (en) * 2009-02-18 2012-08-28 Qualcomm Incorporated Methods and systems for communicating using variable temperature control
US20120240882A1 (en) * 2009-08-28 2012-09-27 The Boeing Company Dual Use Cooling Systems
JP4799658B2 (ja) * 2009-11-30 2011-10-26 株式会社東芝 情報処理装置
US20120096871A1 (en) * 2010-10-22 2012-04-26 Yuefeng Wang Dynamic switching thermoelectric thermal management systems and methods
US8711564B2 (en) * 2011-01-31 2014-04-29 Qualitics, Inc Method and system for cooling of integrated circuits
US20130082532A1 (en) * 2011-09-30 2013-04-04 Research In Motion Limited Use of a thermal electric generator in a portable device
CN103096651B (zh) * 2011-10-31 2016-06-08 镇江福科鑫电子科技有限公司 电子装置
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
CN104584705A (zh) * 2012-08-03 2015-04-29 株式会社村田制作所 电子设备
TWI481086B (zh) * 2012-09-19 2015-04-11 Nat Inst Chung Shan Science & Technology 一種用於電子元件的散熱裝置
US20160148917A1 (en) * 2012-12-08 2016-05-26 National Chung-Shan Institute Of Science And Technology Cooling device for electronic components
JP2014220371A (ja) * 2013-05-08 2014-11-20 富士通株式会社 放熱部材および電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102447216A (zh) * 2010-10-12 2012-05-09 奥兰若技术有限公司 组件温度控制
CN202472460U (zh) * 2011-11-10 2012-10-03 中兴通讯股份有限公司 散热装置

Also Published As

Publication number Publication date
US20150075186A1 (en) 2015-03-19
JP6316438B2 (ja) 2018-04-25
EP3047346B1 (en) 2017-06-21
EP3047346A1 (en) 2016-07-27
WO2015042145A1 (en) 2015-03-26
JP2017503424A (ja) 2017-01-26
ES2641050T3 (es) 2017-11-07
CN105556415A (zh) 2016-05-04
HUE033463T2 (en) 2017-12-28
KR20160055832A (ko) 2016-05-18

Similar Documents

Publication Publication Date Title
CN105556415B (zh) 用于利用热电冷却器维持恒定电话皮肤温度方法和装置以及计算机可读介质
CN107112809B (zh) 无线充电设备的热管理系统及方法
WO2021169807A1 (zh) 电子设备及控制的方法、散热系统
US10649506B2 (en) Thermal dock for a mobile computing device
US11611366B2 (en) Method and apparatus to thermally optimize a protective case for temperature regulation and heat transfer to or from a mobile device
US20100266885A1 (en) Battery cooling apparatus
CN106663662B (zh) 用于使用集成热电冷却来减少片上系统的泄漏功率的系统和方法
CN109168302B (zh) 一种可穿戴设备
US9996110B2 (en) Direct attach dock cooling leveraging maximum silicon junction temperature control
WO2020143517A1 (zh) 一种套设于智能终端外的壳体组件及智能终端
TWI539892B (zh) 電子裝置
CN108199491A (zh) 一种充电模块及具有该充电模块的无线充电系统
JP2019517128A (ja) モバイル電子機器のための面内能動冷却デバイス
CN110214298A (zh) 用于便携式计算设备中的情境感知热管理和工作负荷调度的系统和方法
CN108513515A (zh) 壳体组件以及电子装置
WO2015176353A1 (zh) 一种制冷电路和终端及终端制冷方法
US9753506B2 (en) Electronic devices with multi-layer heat reduction components
CN116954332A (zh) 电子芯片散热控制方法、装置、设备及存储介质
CN206302665U (zh) 移动终端的后壳及移动终端
CN115643716A (zh) 电子设备和电子设备的控制方法
CN108988436A (zh) 一种无线充电装置及控制方法
CN113924538B (zh) 自适应散热框架
CN206211879U (zh) 具有能量转换功能的移动终端
CN110581113A (zh) 中央处理器组件及其散热控制方法、电子设备、手机
CN114828590A (zh) 终端及其散热控制方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant