WO2015176353A1 - 一种制冷电路和终端及终端制冷方法 - Google Patents

一种制冷电路和终端及终端制冷方法 Download PDF

Info

Publication number
WO2015176353A1
WO2015176353A1 PCT/CN2014/081012 CN2014081012W WO2015176353A1 WO 2015176353 A1 WO2015176353 A1 WO 2015176353A1 CN 2014081012 W CN2014081012 W CN 2014081012W WO 2015176353 A1 WO2015176353 A1 WO 2015176353A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
refrigeration
terminal
cooling
refrigeration circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/081012
Other languages
English (en)
French (fr)
Inventor
崔其晖
吴红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Publication of WO2015176353A1 publication Critical patent/WO2015176353A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects

Definitions

  • the invention relates to the field of refrigeration technology, and in particular to a refrigeration circuit and a terminal and terminal cooling method. Background technique
  • the Peltier effect also known as the second effect of thermoelectricity, refers to the contact point formed by the flow of two metals, except for the Joule heat generated by the current flowing through the circuit. Produces an endothermic or exothermic effect, which is the inverse of the Seebeck effect. That is, two different metals form a closed loop, and when there is a direct current in the loop, a temperature difference will occur between the two joints. This is the Peltier Effect.
  • the Seebeck effect is usually called the thermoelectric first effect
  • the Peltier effect is called the thermoelectric second effect
  • the Thomson effect is called the thermoelectric third effect.
  • the charge carrier moves in the conductor to form a current. Since the energy level bands of different materials are different, when a charge carrier transitions from one material to another, it is accompanied by an energy level transition, and when it moves from a high energy level to a low energy level, excess energy is released; Conversely, when moving from a low energy level to a high energy level, energy is absorbed from the outside. The energy is mainly absorbed or released in the form of heat at the interface of the two materials. Taking a P-type semiconductor refrigerating element as an example, as shown in Fig.
  • the absorbed part of the energy originates from the thermal vibration of the lattice, so that an endothermic phenomenon occurs at the contact surface, which lowers the temperature and forms a cooling effect, that is, the P-type semiconductor refrigeration element absorbs heat near the positive end, that is, The copper piece attached to the end absorbs energy from the outside, reducing the temperature in the area. At the other end of the P-type semiconductor refrigerating element (i.e., the end near the negative end), heat is released to raise the temperature of the region.
  • the main technical problem to be solved by the present invention is that electronic products generate heat during operation, and if these heats are not dissipated in time, the reliability, performance, and service life of the electronic products may be adversely affected.
  • an embodiment of the present invention provides a refrigerating circuit including at least one semiconductor refrigerating element; each of the two ends of the semiconductor refrigerating element is respectively attached with a heat absorbing end and a heat dissipating end, and the semiconductor refrigerating element and The heat absorbing end and the heat radiating end are electrically connected to form a cooling subunit; each of the cooling subunits is electrically connected to form a refrigerating unit, and the refrigerating unit has two power input ends; the two power input ends are respectively connected Positive and negative ends.
  • the semiconductor refrigerating element is an N-type semiconductor refrigerating element
  • an end of the N-type semiconductor refrigerating element near the positive end is connected to the heat dissipating end, and the N-type semiconductor refrigerating element is adjacent to One end of the negative electrode end is connected to the heat absorbing end;
  • each of the cooling subunits is electrically connected to form a refrigerating unit, including: the refrigerating unit includes a plurality of refrigerating subunits, each of the refrigerating subunits The units are connected in parallel to form the refrigeration unit.
  • the heat dissipating ends of the cooling subunits are connected to form a common heat dissipating end, and the heat absorbing ends of the refrigerating subunits are connected to form a heat absorbing end.
  • each of the cooling subunits constitutes a refrigerating unit by electrically connecting, comprising: the refrigerating unit includes a plurality of refrigerating subunits; and a refrigerating subunit including the N-type semiconductor refrigerating element
  • the refrigeration unit is configured by alternately connecting in series with a cooling subunit including the P-type semiconductor refrigeration element.
  • the two heat dissipating ends of the adjacent cooling subunits are electrically connected to form a common heat dissipating end, and the two adjacent endothermic subunits are electrically connected to each other.
  • the end connections form a common endothermic end.
  • the electrical connection between the semiconductor refrigerating component and the heat absorbing end and the heat dissipating end is an ohmic contact.
  • the refrigeration circuit further includes at least one heat conducting sheet, the heat conducting sheet is attached to the heat absorbing end or the heat radiating end; and the heat conducting layer is attached to the at least one heat absorbing end
  • the sheet is for transferring heat from the outside to the heat absorbing end of the bonding; the heat conducting sheet attached to the at least one heat radiating end is for transferring heat from the heat radiating end to the outside.
  • the refrigeration unit further includes at least one of the following units:
  • a current control unit configured to control a current flowing through the cooling subunit
  • a switch control unit configured to control power supply of the cooling subunit.
  • an embodiment of the present invention further provides a terminal, including the above-mentioned refrigeration circuit, battery, and terminal body; two power input ends of the refrigeration circuit are respectively connected to a positive terminal and a negative terminal of the battery; The heat absorbing end of the circuit absorbs heat of the heat generating component of the terminal body and dissipates heat by the heat radiating end of the refrigeration circuit.
  • the switch control unit and/or the current control unit when the switch control unit and/or the current control unit are present in the refrigeration circuit, further comprising a temperature detecting unit, wherein the temperature detecting unit detects a temperature of the heat generating component in the terminal body And controlling the operation of the switch control unit and/or the current control unit according to the result of the detection.
  • the heat generating component in the terminal body includes a main working chip, and the terminal body is provided with a rear casing; the heat absorbing end is disposed on the rear casing close to the main body An area of the working chip, the heat dissipating end is disposed on an area of the rear case away from the main working chip.
  • an embodiment of the present invention further provides a terminal cooling control method, wherein a refrigeration circuit as described above is disposed on a terminal, and two power input ends of the refrigeration circuit are connected to a positive or negative battery in the terminal.
  • the temperature detecting unit detects the temperature of the heat generating component, and controls the operation of the cooling circuit according to the detected temperature condition, so that the heat absorbing end of the cooling circuit absorbs the heat of the heat generating component of the terminal body and is radiated by the heat radiating end of the cooling circuit. Heat.
  • the controlling the operation of the refrigeration circuit according to the detected temperature condition comprises: setting a temperature threshold, and controlling the refrigeration circuit according to a comparison between the detected temperature and the temperature threshold work.
  • the controlling the operation of the refrigeration circuit comprises: controlling the switch control unit to be turned on to operate the refrigeration circuit when the detected temperature exceeds or reaches the temperature threshold; When the detected temperature is lower than the temperature threshold, the switch control unit is controlled to be turned off to stop the refrigeration circuit from operating. In an embodiment of the present invention, when the detected temperature exceeds or reaches the temperature threshold, the controlling the operation of the refrigeration circuit further comprises: determining a temperature difference between the detected temperature and the temperature threshold The condition control current control unit adjusts the current flowing through the semiconductor refrigeration element.
  • the refrigeration circuit and the terminal and terminal refrigeration method provided by the embodiment of the invention include at least one semiconductor refrigeration component in the refrigeration circuit; each of the two ends of the semiconductor refrigeration component is respectively attached with a heat absorption end and a heat dissipation end, and the heat absorption end is combined with The end and the heat radiating end are electrically connected to form a cooling subunit; each of the refrigerating subunits is electrically connected to form a refrigerating unit, and the refrigerating unit has two power input ends; the two power input ends are respectively connected to the positive end and the negative end.
  • the heat absorbing end can absorb heat from the outside, and the heat dissipating end can dissipate heat to the outside, and the heat generated by the electronic product to generate a high temperature is transmitted to a distant low temperature, so that the electronic product can be quickly cooled at a high temperature. Avoid the impact of high temperature on electronic products, improve the reliability, performance, and service life of electronic products.
  • FIG. 1 is a schematic diagram of the principle of refrigeration of a semiconductor refrigeration component provided by the background art
  • FIG. 2 is a schematic diagram of a refrigeration circuit of a P-type semiconductor refrigeration component according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic diagram of a refrigeration circuit in which a plurality of P-type semiconductor refrigeration components are connected in parallel according to Embodiment 2 of the present invention
  • FIG. 4 is a schematic diagram of another refrigeration circuit in which a plurality of P-type semiconductor refrigeration components are connected in parallel according to Embodiment 2 of the present invention
  • FIG. 5 is a schematic diagram of a refrigeration circuit in which an N-type semiconductor refrigerating component and a P-type semiconductor refrigerating component are connected in series according to Embodiment 3 of the present invention
  • FIG. 6 is a schematic diagram of another refrigeration circuit in which an N-type semiconductor refrigerating component and a P-type semiconductor refrigerating component are connected in series according to Embodiment 3 of the present invention
  • FIG. 7 is a schematic diagram of a refrigeration circuit in which a plurality of N-type semiconductor refrigeration components and a plurality of P-type semiconductor refrigeration components are connected in series according to Embodiment 3 of the present invention
  • 8 is a schematic diagram of another refrigeration circuit in which a plurality of N-type semiconductor refrigeration components and a plurality of P-type semiconductor refrigeration components are connected in series according to Embodiment 3 of the present invention
  • FIG. 9 is a schematic diagram of a refrigeration circuit of a heat dissipating end and a heat absorbing end of a refrigerating circuit according to Embodiment 3 of the present invention.
  • FIG. 10 is a schematic diagram of another refrigeration circuit of a heat dissipating end and a heat absorbing end of a refrigerating circuit according to Embodiment 3 of the present invention.
  • FIG. 11 is a schematic diagram of a connection current control unit and a switch control unit in a refrigeration circuit according to Embodiment 4 of the present invention.
  • FIG. 12 is a schematic structural view of a refrigeration circuit according to Embodiment 5 of the present invention attached to a terminal housing;
  • FIG. 13 is a flowchart of a method for cooling a terminal according to Embodiment 6 of the present invention. detailed description
  • the refrigeration circuit of the embodiment of the invention comprises at least one semiconductor refrigeration component, the semiconductor refrigeration component is attached to one heat dissipation end at one end, and the heat absorption end is attached to the other end, and the semiconductor refrigeration component is connected with the heat dissipation end and the heat absorption end to form a cooling subunit.
  • Each of the cooling subunits is connected by a wire connection or other means capable of electrically connecting, and the refrigeration unit has two power input ends, and the two power input ends are respectively connected to the positive terminal and the negative terminal.
  • Both the heat absorbing end and the heat dissipating end in the embodiment of the present invention adopt materials having heat conducting and conducting properties, and it should be understood that all materials having heat conductivity and conductivity in the prior art can be used as the heat absorbing end in the embodiment of the present invention.
  • Cooling end Preferably, a metal material is selected as the heat dissipation end and the heat absorption end, and preferably an alloy such as copper or aluminum is selected. In order to enable better heat conduction between the heat dissipation end and the heat absorption end, it is preferable to have an ultra-thin and ultra-light as a heat dissipation end and a heat absorption end.
  • the semiconductor refrigerating element includes a semiconductor element which is capable of conducting conductance and has refrigerating, and preferably a semiconductor element having high conductivity, for example, a P-type semiconductor refrigerating element and an N-type semiconductor refrigerating element are selected, and preferably a germanium-based germanium-based refrigerating element is selected.
  • Semiconductor component of the compound when the semiconductor refrigeration component is an N-type semiconductor refrigeration component, an end of the N-type semiconductor refrigeration component near the positive terminal is connected to the heat dissipation end, and an end of the N-type semiconductor refrigeration component is adjacent to the negative terminal is connected to the heat absorption end; and the semiconductor refrigeration component is a P-type semiconductor refrigeration component.
  • the P-type semiconductor refrigeration element is adjacent to the positive end, one end is connected to the heat absorption end, and the end of the P-type semiconductor refrigeration element close to the negative end is connected to the heat dissipation end.
  • a refrigerating unit is constituted by a refrigerating subunit, and a cooling subunit is formed by a heat dissipating end and a heat absorbing end of a semiconductor refrigerating element.
  • the electrical connection therebetween is an ohmic contact.
  • the P-type semiconductor refrigeration element in the refrigeration circuit is respectively provided with a thin copper piece at one end, one end is a heat absorption end, and one end is a heat dissipation end, and the P-type semiconductor refrigeration element is connected to the heat dissipation end and sucked.
  • the hot end is connected to the positive and negative ends to form a loop, the heat sink end near the positive end, and the heat sink end near the negative end.
  • the N-type semiconductor refrigeration element can also be used to form a heat-dissipating end and a heat-absorbing end on both sides of the copper-cooled component, and then connected with the positive and negative terminals to form a loop, the heat-dissipating end near the positive end, and the heat-absorbing end close to the negative end.
  • the refrigeration unit is composed of a plurality of refrigeration subunits, and each of the refrigeration subunits is a semiconductor refrigeration element of the same type, and the plurality of refrigeration subunits are connected in series with each other in series and at the positive and negative ends to form a loop.
  • the plurality of cooling subunits can also be connected in parallel to form a loop with the positive and negative terminals.
  • the connection between the cooling subunits is not limited to the series and parallel connections given, it should be understood that no matter how the multiple subunits are connected, as long as these cooling subunits are formed into a loop and all the cooling The heat absorbing end and the heat radiating end of the subunit are respectively realized at different positions.
  • the heat absorption end of multiple cooling subunits or heat dissipation can be The ends are connected together, that is, they are set to the same shared heat absorption end or a shared heat dissipation end.
  • FIG. 3 there are four P-type semiconductor refrigeration components, and each of the four P-type semiconductor refrigeration components is respectively connected with a heat dissipation end and a heat absorption end, and four P-type semiconductor refrigeration components are connected in series with the positive and negative terminals.
  • the connection forms a loop, the heat sink end near the positive terminal and the heat sink end near the negative terminal.
  • the heat absorbing ends of the four P-type semiconductor refrigerating components are connected together to be the same common heat absorbing end; the heat dissipating ends of the four P-type semiconductor refrigerating components are connected together to be the same common The heat sink end.
  • the P-type semiconductor refrigeration element is taken as an example.
  • the N-type semiconductor refrigeration element may be connected instead of the P-type semiconductor refrigeration element, except that the heat-dissipating end is close to the positive end and the heat-absorbing end is close to the negative end.
  • the refrigeration unit has a plurality of cooling subunits, and the cooling subunit includes an N-type semiconductor refrigerating element and a P-type semiconductor refrigerating element, and the plurality of refrigerating subunits can be independently connected to the positive and negative terminals of the power source to form a loop.
  • Multiple cooling subunits can also be connected to form a series connection and then connected to the positive and negative terminals of the power supply to form a loop.
  • the same type of cooling sub-units can be first connected in parallel and then connected to other different types of cooling sub-units in series and the positive and negative ends of the power supply to form a loop, as long as the heat-dissipating ends and the heat-absorbing ends of the different cooling sub-units are made.
  • the heat dissipation end of the cooling subunit is disposed away from the heat absorption end of the cooling subunit.
  • the heat dissipation end and the heat absorption end of two different types of cooling subunits connected end to end can be connected to form a heat dissipation end or a heat absorption end.
  • the refrigeration circuit has two cooling subunits, one of which is composed of an N-type semiconductor refrigeration element and one P-type semiconductor refrigeration element.
  • the N-type semiconductor refrigeration element and the P-type semiconductor refrigeration element in the refrigeration circuit are connected in series to form a series connection and form a loop with the positive and negative terminals.
  • two heat-dissipating ends having electrical connections may be connected together to form a common heat-dissipating end.
  • two suctions having electrical connections may also be used. The hot ends are joined together to form a common endothermic end.
  • the refrigeration circuit has four cooling subunits, two of which are composed of an N-type semiconductor cooling element and two P-type semiconductor refrigerating elements.
  • the cooling subunit of the N-type semiconductor refrigerating element and the cooling subunit of the P-type semiconductor refrigerating element are alternately connected in series and connected to the positive and negative electrodes to form a loop.
  • two heat-dissipating ends having electrical connections may be connected to form a common heat-dissipating end.
  • the heat conducting sheet can be attached to the heat radiating end and the heat absorbing end.
  • the heat conducting sheet attached to the at least one heat absorbing end is used for transferring heat from the outside to the heat absorbing end of the bonding; the heat conducting sheet attached to the at least one heat radiating end is for transferring heat from the heat dissipating end of the bonding end. Passed to the outside.
  • a heat conducting sheet is attached to each of the heat radiating ends.
  • the thermal conductive sheet is generally made of a relatively light and thin material, and the material of the thermal conductive sheet here has a function of rapidly transferring heat.
  • a plurality of heat dissipation ends or heat absorption ends may be attached to one heat conductive sheet.
  • a plurality of heat dissipation ends or heat absorption ends are attached to the same heat conduction sheet.
  • the heat conduction sheets here are insulated. material.
  • the magnitude of the current through the semiconductor refrigeration element is related to the effect of its refrigeration, such as the large current, the fast cooling; the small current, the cooling is slow.
  • a current control unit is coupled to the refrigeration circuit and configured to control current flow through the refrigeration subunit. This adjusts the amount of current in the cooling subunit based on the required cooling needs.
  • the circuit control unit herein should be understood to include the refrigeration control circuit as well as all existing circuits or device components capable of controlling the current in the circuit.
  • a switch control unit can also be connected in the refrigeration circuit, and the switch control unit is used to control the on and off of the cooling subunit. For example, it can be set to automatically turn on and off the refrigeration circuit when certain preset conditions are met.
  • the switch control unit herein should be understood to include the switch control circuit and all other functions that can be used to achieve the disconnection and conduction of the circuit.
  • the pass component for example, the optional MOS transistor is the switch control unit. Referring to FIG. 11, a refrigeration unit, a switch control unit, and/or a current empty unit are connected to the refrigeration circuit.
  • the embodiment of the invention further provides a terminal.
  • the terminal can be a mobile terminal.
  • the mobile communication terminal is a mobile phone, and in the embodiment, the mobile phone is used as an example of a mobile communication terminal.
  • the mobile communication terminal can also be other mobile devices having communication functions such as a tablet computer.
  • the handset includes the refrigeration circuit of all of the above embodiments, and the circuit is attached to the rear or back cover of the handset. Of course, it is not only limited to sticking to the mobile phone, but also can be directly set inside the mobile phone, and the mobile phone and the refrigeration circuit can be combined by other means.
  • the heat-absorbing end of the cooling circuit is disposed close to the main working chip of the terminal, and the heat-dissipating end of the cooling circuit is disposed away from the terminal main chip.
  • the terminal includes a refrigeration circuit, a battery, and a terminal body.
  • the body further includes a main working chip, and the terminal body is further provided with a rear casing.
  • the two power input ends of the refrigeration circuit are respectively connected to the positive terminal and the negative terminal of the battery.
  • the heat absorbing end of the refrigeration circuit absorbs heat of the heat generating component of the terminal body and dissipates heat by the heat radiating end of the refrigeration circuit.
  • the terminal further includes a temperature detecting unit, the temperature detecting unit detects the temperature of the main working chip of the terminal, and feeds the temperature back to the main working chip of the terminal, and the main working chip of the terminal controls according to the temperature.
  • Switch control circuit and / or current control unit Embodiment 6
  • the embodiment of the present invention further provides a method for cooling a terminal, the method comprising: setting a refrigeration circuit as described above on a terminal, and connecting two power input ends of the refrigeration circuit to the positive and negative poles of the battery in the terminal;
  • the unit detects the temperature of the heat-generating component, and controls the operation of the refrigeration circuit according to the detected temperature condition, so that the heat-absorbing end of the refrigeration circuit absorbs the heat of the heat-generating component of the terminal body and dissipates heat by the heat-dissipating end of the refrigeration circuit.
  • the method controls the operation of the refrigeration circuit according to the detected temperature condition, specifically including setting the temperature
  • the threshold value controls the operation of the refrigeration circuit based on the comparison between the detected temperature and the temperature threshold.
  • the temperature threshold here may be specifically set according to a specific situation, for example, set to 40 degrees or 45 degrees, and preferably set to a value that is not much different from the current ambient temperature.
  • the method controls the switch control unit to be turned on to operate the refrigeration circuit, specifically, when the detected temperature is lower than a temperature threshold, the control switch control unit is turned off to stop the refrigeration circuit jobs. That is, when the temperature detected by the detecting unit exceeds a certain threshold, the switch control unit is automatically activated to cool the switch. When the temperature is lowered, the switch control unit stops the refrigeration circuit and saves energy.
  • the method of controlling the operation of the refrigeration circuit further includes: controlling the current control unit to adjust the current flowing through the semiconductor refrigeration element according to the temperature difference between the detected temperature and the temperature threshold. Including, when the detected temperature difference is high, in order to cool down more quickly, the circuit control unit increases the current flowing through the semiconductor refrigeration element, which is a rapid temperature drop of the terminal.
  • a refrigeration circuit is set on the mobile phone.
  • the surface temperature detecting unit of the outer casing detects the surface temperature in real time, and feeds the detection data back to the main chip of the mobile phone, when the feedback temperature is higher than a preset value.
  • the switch control unit controls the current loop path to cause it to cool down the handset.
  • the switching control circuit is turned off.
  • the preset threshold temperature is 40 degrees.
  • the current control unit can be controlled to control the speed of cooling the terminal through the magnitude of the current passed through the semiconductor refrigeration unit.
  • the current detected temperature is 50 degrees
  • the preset threshold is 40 degrees
  • the current temperature difference reaches 10 degrees.
  • the current control unit can control the current through the semiconductor refrigeration component. Large, let the cooling circuit cool down quickly.
  • Each of the above units may be implemented by a central processing unit (Central Processing Unit, CPU). Digital Signal Processor (DSP) or Field-Programmable Gate Array (FPGA) implementation.
  • CPU Central Processing Unit
  • DSP Digital Signal Processor
  • FPGA Field-Programmable Gate Array
  • embodiments of the present invention can be provided as a method, system, or computer program product. Accordingly, the present invention can take the form of a hardware embodiment, a software embodiment, or a combination of software and hardware aspects. Moreover, the invention can take the form of a computer program product embodied on one or more computer usable storage media (including but not limited to disk storage and optical storage, etc.) including computer usable program code.
  • the computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture comprising the instruction device.
  • the apparatus implements the functions specified in one or more blocks of a flow or a flow and/or block diagram of the flowchart.
  • These computer program instructions can also be loaded onto a computer or other programmable data processing device such that a series of operational steps are performed on a computer or other programmable device to produce computer-implemented processing for execution on a computer or other programmable device.
  • the instructions provide steps for implementing the functions specified in one or more of the flow or in a block or blocks of a flow diagram.
  • the refrigeration circuit and the terminal and terminal refrigeration method provided by the embodiment of the invention include at least one semiconductor refrigeration component in the refrigeration circuit; each of the two ends of the semiconductor refrigeration component is respectively attached with a heat absorption end and a heat dissipation end, and the heat absorption end is combined with The end and the heat radiating end are electrically connected to form a cooling subunit; each of the refrigerating subunits is electrically connected to form a refrigerating unit, and the refrigerating unit has two power input ends; the two power input ends are respectively connected to the positive end and the negative end.
  • the heat absorbing end can absorb heat from the outside, and the heat dissipating end can dissipate heat to the outside, and the heat generated by the electronic product to generate a high temperature is transmitted to a distant low temperature, so that the electronic product can be quickly cooled at a high temperature. Avoid the impact of high temperature on electronic products, improve the reliability, performance, and service life of electronic products.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

提供了一种制冷电路、终端及终端制冷方法。制冷电路包括至少一个半导体制冷元件，每个半导体制冷元件的两端分别贴合一个吸热端和一个散热端，并与吸热端和散热端电性连接构成制冷子单元。各制冷子单元通过电性连接构成制冷单元，制冷单元具有两个电源输入端；两个电源输入端分别连接正极端和负极端。该终端至少包括该制冷电路。该终端制冷方法包括：将制冷电路的两个电源输入端分别连接正极端和负极端；温度检测单元检测发热部件的温度，根据检测的温度控制制冷电路的工作。

Description

一种制冷电路和终端及终端制冷方法 技术领域
本发明涉制冷技术领域， 特别涉及一种制冷电路和终端及终端制冷方 法。 背景技术
珀尔贴 （Peltier )效应， 又称为热电第二效应， 是指当电流通过 、 B 两种金属组成的接触点时， 除了因为电流流经电路而产生的焦耳热外， 还 会在接触点产生吸热或放热的效应， 它是塞贝克效应的逆反应。 即两种不 同的金属构成闭合回路， 当回路中存在直流电流时， 两个接头之间将产生 温差。 这就是珀尔帖效应（ Peltier Effect )。 通常将塞贝克效应称为热电第一 效应， 帕尔帖效应称作热电第二效应， 汤姆逊效应则称作热电第三效应。
帕尔帖效应发现 100 多年来并未获得实际应用， 因为金属半导体的珀 尔帖效应很弱。 直到上世纪 90年代， 原苏联科学家约飞的研究表明， 以碲 化铋为基的化合物是最好的热电半导体， 从而出现了实用的半导体电子致 冷元件 热电致冷器 （ Thermo Electric cooling, 简称 TEC )。
对帕尔帖效应的物理解释是： 电荷载体在导体中运动形成电流。 由于 不同材料的能级带分布不同， 当电荷载体从一种材料跃迁到另外一种材料 时， 伴随有能级的跃迁， 当它从高能级向低能级运动时， 便释放出多余的 能量； 相反， 从低能级向高能级运动时， 从外界吸收能量。 能量在两种材 料的交界面处主要以热的形式吸收或放出。 以 P型半导体制冷元件为例， 如图 1所示， 当电流自金属铜片流向 P型半导体制冷元件时， 因为金属中 的空穴是在 EF附近， 由于 EF比 P型半导体制冷元件的价带顶高， 所以空 穴至少要吸收 Δ Ε的能量才能通过接触面进入半导体制冷元件（实际是价带 电子自半导体流向金属铜片）。 进入半导体制冷元件后， 空穴要在半导体中 流动还需要给予其能量 E。 因此， 空穴要通过接触面必须吸收至少 Δ Ε+Ε 的能量。 吸收的这部分能量来源于该处晶格的热振动， 所以在接触面处产 生吸热现象， 使温度降低， 形成冷却效应， 即在 P型半导体制冷元件靠近 正极端吸热， 也就是说与该端连接的铜片会从外面吸收能量， 使该区域的 温度降低。 而在该 P型半导体制冷元件的另外一端（即靠近负极端的一端） 会放出热量使该区域的温度升高。
生活的艮多电子产品都面临发热的问题， 如何有效控制电子产品发热 是电子产品发展急需攻克的重要方向。 以手机为例， 手机使用时能产生高 热量， 散发的热量降低了电池的续航能力和使用效率。 并且产生的这些热 量不能及时有效的散发出去， 在手机内部不断积累， 导致温度升高， 对其 可靠性、 性能、 使用寿命等都是一个巨大的危害。 目前在控制手机发热方 面已经有^ I多切实可行的举措， 例如， 降压降频热管理， 加贴散热膜， 增 加散热装置等。 这些措施的确能够有效控制发热， 但或多或少都会带来一 些副作用。 因此， 如何快速将电子产品发热部分的热量散发出去是电子产 品发展急需解决的问题。 发明内容
本发明要解决的主要技术问题是， 电子产品在工作的时候产生热量， 如果不及时将这些热量散发出去， 就会对电子产品的可靠性、 性能以及使 用寿命等造成不良影响。
为解决上述问题， 本发明实施例提供一种制冷电路， 包括至少一个半 导体制冷元件； 每个所述半导体制冷元件的两端分别贴合一个吸热端和一 个散热端， 所述半导体制冷元件与所述吸热端和散热端电性连接构成制冷 子单元； 各所述制冷子单元通过电性连接构成制冷单元， 所述制冷单元具 有两个电源输入端； 所述两个电源输入端分别连接正极端和负极端。 在本发明的一种实施例中， 当所述半导体制冷元件为 N型半导体制冷 元件时， 所述 N型半导体制冷元件靠近正极端的一端连接所述散热端， 所 述 N型半导体制冷元件靠近负极端的一端连接所述吸热端；
在本发明的一种实施例中， 各所述制冷子单元通过电性连接构成制冷 单元， 包括： 所述制冷单元包括多个制冷子单元， 各所述制冷子单元中的 各所述制冷子单元并联构成所述制冷单元。
在本发明的一种实施例中， 各所述制冷子单元的散热端连接形成一个 共用的散热端， 各所述制冷子单元的吸热端连接形成一个吸热端。
在本发明的一种实施例中， 各所述制冷子单元通过电性连接构成制冷 单元， 包括： 所述制冷单元包括多个制冷子单元； 包含有所述 N型半导体 制冷元件的制冷子单元与包含有所述 P型半导体制冷元件的制冷子单元交 替串联连接构成所述制冷单元。
在本发明的一种实施例中， 相邻的所述制冷子单元电性连接的两个散 热端连接形成一个共用的散热端， 相邻的所述制冷子单元电性连接的两个 吸热端连接形成一个共用的吸热端。
在本发明的一种实施例中， 所述半导体制冷元件与所述吸热端和所述 散热端之间的电性连接为欧姆接触。
在本发明的一种实施例中， 该制冷电路还包括至少一个导热片， 所述 导热片与所述吸热端或者所述散热端贴合； 与至少一个吸热端贴合的所述 导热片用于将热量从外部传递到贴合的所述吸热端； 与至少一个散热端贴 合的导热片用于将热量从贴合的所述散热端传递到外部。
在本发明的一种实施例中， 所述制冷单元还包括以下单元中的至少一 种：
电流控制单元， 配置为控制流经所述制冷子单元的电流； 开关控制单元， 配置为控制所述制冷子单元的供电。
为解决上述问题， 本发明实施例还提供一种终端， 包括上述所述的制 冷电路、 电池、 终端本体； 所述制冷电路的两个电源输入端分别连接所述 电池正极端和负极端； 制冷电路的吸热端吸收终端本体的发热部件的热量 并利用制冷电路的散热端散发热量。
在本发明的一种实施例中， 当所述制冷电路中存在开关控制单元和 /或 电流控制单元时， 还包括温度检测单元， 所述温度检测单元检测所述终端 本体内的发热部件的温度， 并根据检测的结果控制所述开关控制单元和 /或 电流控制单元的工作。
在本发明的一种实施例中， 所述终端本体内的发热部件包括主工作芯 片， 所述终端本体设有后壳体； 所述吸热端设置在所述后壳体上靠近所述 主工作芯片的区域， 所述散热端设置在所述后壳体上远离所述主工作芯片 的区域。
为解决上述问题， 本发明实施例还提供一种终端制冷控制方法， 在终 端上设置一个上述所述的制冷电路， 并将所述制冷电路的两个电源输入端 连接到终端中电池的正负极； 温度检测单元检测发热部件的温度情况， 根 据检测的所述温度情况控制所述制冷电路的工作， 使制冷电路的吸热端吸 收终端本体的发热部件的热量并利用制冷电路的散热端散发热量。
在本发明的一种实施例中， 所述根据检测的所述温度情况控制所述制 冷电路的工作包括： 设置温度阔值， 根据检测的温度与所述温度阈值的比 较情况控制所述制冷电路的工作。
在本发明的一种实施例中， 所述控制所述制冷电路的工作包括： 当检 测的温度超过或达到所述温度阈值时， 控制所述开关控制单元导通使所述 制冷电路进行工作； 当检测的温度低于所述温度阈值时， 控制所述开关控 制单元断开使得所述制冷电路停止工作。 在本发明的一种实施例中， 当检测的温度超过或达到所述温度阈值时， 所述控制所述制冷电路工作还包括： 根据检测的温度与所述温度阈值之间 的温度差值的情况控制电流控制单元， 调整流经半导体制冷元件的电流。
本发明实施例提供的制冷电路和终端及终端制冷方法， 制冷电路中包 括至少一个半导体制冷元件； 每个半导体制冷元件的两端分别贴合一个吸 热端和一个散热端， 并与述吸热端和散热端电性连接构成制冷子单元； 各 制冷子单元通过电性连接构成制冷单元， 制冷单元具有两个电源输入端； 两个电源输入端分别连接正极端和负极端。 利用半导体制冷元件在通电时， 吸热端能从外部吸收热量， 散热端能将热量散发到外部， 将电子产品工作 产生高温地方的热量传递到远离的低温处， 使电子产品高温处快速降温， 避免高温对电子产品的影响， 提高电子产品的可靠性、 性能、 使用寿命等。 附图说明
图 1为本背景技术提供的半导体制冷元件制冷的原理示意图； 图 2为本发明实施例一提供的一个 P型半导体制冷元件的制冷电路示 意图；
图 3为本发明实施例二提供的多个 P型半导体制冷元件并联的一种制 冷电路示意图；
图 4为本发明实施例二提供的多个 P型半导体制冷元件并联的另一种 制冷电路示意图；
图 5为本发明实施例三提供的一个 N型半导体制冷元件和一个 P型半 导体制冷元件串联的一种制冷电路的示意图；
图 6为本发明实施例三提供的一个 N型半导体制冷元件和一个 P型半 导体制冷元件串联的另一种制冷电路的示意图；
图 7为本发明实施例三提供的多个 N型半导体制冷元件和多个 P型半 导体制冷元件串联的一种制冷电路的示意图； 图 8为本发明实施例三提供的多个 N型半导体制冷元件和多个 P型半 导体制冷元件串联的另一种制冷电路的示意图；
图 9为本发明实施例三提供的制冷电路的散热端和吸热端贴合导热片 的一种制冷电路示意图；
图 10为本发明实施例三提供的制冷电路的散热端和吸热端贴合导热片 的另一种制冷电路示意图；
图 11为本发明实施例四提供的制冷电路中连接电流控制单元和开关控 制单元的示意图；
图 12 为本发明实施例五提供的制冷电路贴合在终端外壳的结构示意 图；
图 13为本发明实施例六提供的终端制冷的方法流程图。 具体实施方式
为使本领域技术人员更好地理解本发明的技术方案， 下面结合附图和 具体实施方式对本发明作进一步详细描述。
实施例一
本发明实施例的制冷电路包括至少一个半导体制冷元件， 该半导体制 冷元件一端贴合一个散热端， 另一端贴合一个吸热端， 半导体制冷元件与 散热端和吸热端连接构成制冷子单元， 各制冷子单元用导线连接或者其他 能够实现电性连接的方式连接构成制冷单元， 制冷单元具有两个电源输入 端， 两个电源输入端分别与连接正极端和负极端。 本发明实施例中的吸热 端和散热端都采用具有导热和导电的特性的材料， 应该理解为现有中所有 具有导热和导电性的材料都可作为本发明实施例中的吸热端和散热端。 优 选的选用金属材料作为散热端和吸热端， 优选的可以选铜、 铝等合金。 为 了使散热端和吸热端能够更好的导热， 优选的选用具有超薄和超轻的作为 散热端和吸热端。 这里的半导体制冷元件包括所用能够进行电导并且具有制冷的半导体 元件， 优选的选用导电性较强的半导体元件， 例如选用 P型半导体制冷元 件和 N型半导体制冷元件，优选可选择碲化铋为基的化合物的半导体元件。 例如半导体制冷元件为 N型半导体制冷元件时， N型半导体制冷元件靠近 正极端的一端连接散热端， N型半导体制冷元件靠近负极端的一端连接吸 热端； 半导体制冷元件为 P型半导体制冷元件时， P型半导体制冷元件靠 近正极端的一端连接吸热端， P型半导体制冷元件靠近负极端的一端连接 散热端。
本实施例中的制冷电路中由一个制冷子单元构成制冷单元， 由一个半 导体制冷元件两端贴合有散热端和吸热端构成制冷子单元， 优选的他们之 间电性连接为欧姆接触。 如图 2所示， 该制冷电路中的 P型半导体制冷元 件两端分别贴合有轻薄的铜片， 一端为吸热端， 一端为散热端， 将该 P型 半导体制冷元件连接散热端和吸热端与正负极端连接形成回路， 靠近正极 端的为吸热端， 靠近负极端的为散热端。 当然， 也可采用 N型半导体制冷 元件两边贴合铜片构成散热端和吸热端， 再与正负极端连接形成回路， 靠 近正极端的为散热端， 靠近负极端的为吸热端。 实施例二
本实施例中的制冷电路中制冷单元由多个制冷子单元构成， 并且各制 冷子单元为同一类型的半导体制冷元件， 多个制冷子单元彼此首尾串联连 接与正负极端连接形成回路。 多个制冷子单元还可以并联连接后与正负极 端形成回路。 当然， 各制冷子单元之间的连接也不仅仅限于所给出的串联 和并联连接， 应该理解为不管多个制冷子单元之间如何连接， 只要能保证 这些制冷子单元形成回路并且所有的制冷子单元的吸热端和散热端分别在 不同位置就可实现。 为了节约材料并且保证得到更好的吸热和散热， 当多 个同类型的制冷子单元并联的时候， 可将多个制冷子单元的吸热端或散热 端连接在一起， 即设置为同一个共用的吸热端或共用的散热端。 如图 3 所 示， 有 4个 P型半导体制冷元件， 每个 4个 P型半导体制冷元件两端分别 连接有散热端和吸热端， 4个 P型半导体制冷元件彼此串联连接与正负极端 连接形成回路， 靠近正极端的为吸热端， 靠近负极端的为散热端。 如图 4 所示， 把 4个 P型半导体制冷元件的吸热端连接在一起设置为同一个共用 的吸热端； 把 4个 P型半导体制冷元件的散热端连接在一起设置为同一个 共用的散热端。 这里仅仅是以 P型半导体制冷元件为例， 当然也可为 N型 半导体制冷元件代替 P型半导体制冷元件来进行连接， 只是靠近正极端的 为散热端， 靠近负极端的为吸热端。 实施例三
本实施例中制冷电路中的制冷单元有多个制冷子单元， 并且制冷子单 元包括 N型半导体制冷元件和 P型半导体制冷元件， 多个制冷子单元可独 自与电源正负极端连接形成回路。 多个制冷子单元也可进行收尾相连形成 串联后再与电源正负极端连接形成回路。 当然， 也可先将同类型的制冷子 单元先进行并联后再与其它不同的类型的制冷子单元进行串联和电源正负 极端形成回路， 只要使各不同制冷子单元的散热端和吸热端不在同一位置， 即制冷子单元的散热端设置远离制冷子单元的吸热端。 为了节约材料， 提 高散热效率， 可将两个首尾相连的不同类型的制冷子单元的散热端和吸热 端连接在一起， 形成一个散热端或吸热端。
如图 5所示， 该制冷电路中有 2个制冷子单元， 1个由 N型半导体制 冷元件构成和 1个 P型半导体制冷元件构成。 该制冷电路中的 N型半导体 制冷元件和 P型半导体制冷元件首尾连接形成串联再与正负极端形成回路。 进一步， 如图 6 所示， 可把两个具有电性连接的两个散热端连接在一起形 成一个共用的散热端。 当然， 如果 N型半导体制冷元件和 P型半导体制冷 元件串联的时， 具有电性连接到为吸热端， 也可将具有电性连接的两个吸 热端连接在一起形成一个共用的吸热端。
如图 7所示， 该制冷电路中有 4个制冷子单元， 2个由 N型半导体制 冷元件构成和 2个 P型半导体制冷元件构成。 N型半导体制冷元件的制冷 子单元与 P型半导体制冷元件的制冷子单元交替串联连接并与正负极连接 形成回路。 进一步， 如图 8所示， 可把两个具有电性连接的两个散热端连 接在一起形成一个共用的散热端。
当然为了使吸热端快速的吸收热量和散热端快速的将热量散到外部更 快的实现制冷， 可在散热端和吸热端上贴合导热片。 其中， 与至少一个吸 热端贴合的导热片用于将热量从外部传递到贴合的吸热端； 与至少一个散 热端贴合的导热片用于将热量从贴合的所述散热端传递到外部。 如图 9所 示， 每个散热端上都贴合连接有一个导热片。 导热片一般选用比较轻薄的 材料构成， 这里的导热片采用的材料具有快速传递热量的功能。 当然， 也 可将多个散热端或吸热端贴合在一个导热片上， 如图 10所示， 同一个导热 片上贴合有多个散热端或吸热端， 当然， 这里的导热片为绝缘材料。 实施例四
为了便于对制冷电路的管理， 因为通过半导体制冷元件的电流大小与 其制冷的效果相关， 如通过电流大， 制冷快； 通过电流小， 制冷慢。 制冷 电路中连接电流控制单元， 配置为控制流经制冷子单元的电流。 这样可根 据所需的制冷需要来调节制冷子单元中的电流大小。 这里的电路控制单元 应理解为包括制冷控制电路以及现有所有能够对电路中的电流进行控制的 电路或者装置元件等。
为了便于对制冷电路的控制， 还可在制冷电路中连接开关控制单元， 该开关控制单元用来控制制冷子单元的导通和关断。 例如可设置当满足一 定的预设条件后， 对制冷电路进行自动的导通和关断。 这里的开关控制单 元应理解为包括开关控制电路以及其他所有可用来实现对电路的断开和导 通的元件， 例如可选用 MOS管为开关控制单元。 参见图 11所示， 该制冷 电路中连接有制冷单元、 开关控制单元和 /或电流空单单元。 实施例五
本发明实施例还提供一种终端。 优选的该终端可为移动终端。 优选的， 该移动通信终端为手机， 且本实施例中以手机作为移动通信终端的例子进 行描述。 但应当理解， 移动通信终端也可为平板电脑等其他具有通信功能 的移动设备。 该手机包括上述所有实施例中的制冷电路， 并且该电路粘贴 在手机的后壳或者后盖上。 当然不仅仅限于粘贴在手机上， 还可以直接设 置在手机内部， 以及通过其他方式使手机与制冷电路结合。 靠近终端主工 作芯片设置制冷电路的吸热端， 相对且远离述终端主芯片设置述制冷电路 的散热端。 如图 12所示， 该终端包括制冷电路、 电池、 终端本体； 本体还 包括主工作芯片， 终端本体还设置有后壳， 制冷电路的两个电源输入端分 别连接所述电池正极端和负极端； 使制冷电路的吸热端吸收终端本体的发 热部件的热量并利用制冷电路的散热端散发热量。 当制冷电路中存在开关 控制单元和 /或电流控制单元时终端还包括温度检测单元， 温度检测单元检 测终端主工作芯片的温度， 并将温度反馈给终端主工作芯片， 终端主工作 芯片根据温度控制开关控制电路和 /或电流控制单元。 实施例六
本发明实施例还提供一种终端制冷的方法， 该方法包括在终端上设置 一个上述所述的制冷电路， 并将制冷电路的两个电源输入端连接到终端中 电池的正负极； 温度检测单元检测发热部件的温度情况， 根据检测的温度 情况控制制冷电路的工作， 使制冷电路的吸热端吸收终端本体的发热部件 的热量并利用制冷电路的散热端散发热量。
该方法的根据检测的温度情况控制制冷电路的工作具体包括设置温度 阈值， 根据检测的温度与温度阈值的比较情况控制制冷电路的工作。 应该 理解为， 这里的温度阈值可根据具体情况进行具体设置， 例如设置为 40度 或 45度， 最好设置为与当前环境温度相差不大的值。
当检测的温度超过或达到所述温度阈值时， 该方法控制所述开关控制 单元导通使制冷电路进行工作具体包括当检测的温度低于温度阈值时， 控 制开关控制单元断开使得制冷电路停止工作。 即当检测单元检测到的温度 超过一定阈值， 就自动启动开关控制单元对其降温， 当温度将下来后， 开 关控制单元就让制冷电路停止工作， 节约能源。
当检测的温度超过或达到温度阈值时， 该方法控制制冷电路工作还包 括： 根据检测的温度与温度阈值之间的温度差值的情况控制电流控制单元， 调整流经半导体制冷元件的电流。， 包括当检测温度差值很高时， 为了更快 降温， 电路控制单元使流经半导体制冷元件的电流增大， 是终端快速降温。
如图 13所示， 在手机上设置制冷电路， 手机在高负荷运行时， 外壳表 面温度检测单元实时检测表面温度， 并将检测数据反馈给手机的主芯片， 当反馈温度高于预先设定的高温预警阈值时， 开关控制单元控制电流回路 路径， 使其进入对手机进行降温。 当外壳表面温度降至一定温度值后， 开 关控制电路断开。 例如预设的阈值温度为 40度， 当检测到手机温度高于 40 度时， 就通过开关控制单元让制冷电路开始工作， 一定时间后， 检测到温 度低于 40度时， 可让制冷电路停止工作， 节约手机电能。 如果通过检测单 元检测的温度与温度阈值之间的温度差值较大时， 可控制电流控制单元控 制通过半导体制冷单元通过的电流大小来控制对终端制冷的快慢。 例如， 当前检测的温度为 50度， 而预设的阈值为 40度， 当前温度差值到达了 10 度， 为了尽快使手机的温度降低， 可通过控制电流控制单元是通过半导体 制冷元件的电流增大， 让制冷电路快速降温。
上述各单元可以由电子设备中的中央处理器（ Central Processing Unit, CPU ). 数字信号处理器 （Digital Signal Processor, DSP )或可编程逻辑阵 列 （Field - Programmable Gate Array, FPGA ) 实现。
本领域内的技术人员应明白， 本发明的实施例可提供为方法、 系统、 或计算机程序产品。 因此， 本发明可采用硬件实施例、 软件实施例、 或结 合软件和硬件方面的实施例的形式。 而且， 本发明可采用在一个或多个其 中包含有计算机可用程序代码的计算机可用存储介质 (包括但不限于磁盘 存储器和光学存储器等）上实施的计算机程序产品的形式。
本发明是参照根据本发明实施例的方法、 设备（系统）、 和计算机程序 产品的流程图和 /或方框图来描述的。 应理解可由计算机程序指令实现流程 图和 /或方框图中的每一流程和 /或方框、以及流程图和 /或方框图中的流程和 /或方框的结合。 可提供这些计算机程序指令到通用计算机、 专用计算机、 嵌入式处理机或其他可编程数据处理设备的处理器以产生一个机器， 使得 通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现 在流程图一个流程或多个流程和 /或方框图一个方框或多个方框中指定的功 能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理 设备以特定方式工作的计算机可读存储器中， 使得存储在该计算机可读存 储器中的指令产生包括指令装置的制造品， 该指令装置实现在流程图一个 流程或多个流程和 /或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备 上， 使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机 实现的处理， 从而在计算机或其他可编程设备上执行的指令提供用于实现 在流程图一个流程或多个流程和 /或方框图一个方框或多个方框中指定的功 能的步骤。
以上实施例仅用以说明本发明的技术方案而非限制， 仅仅参照较佳实 施例对本发明进行了详细说明。 本领域的普通技术人员应当理解， 可以对 本发明的技术方案进行修改或者等同替换， 而不脱离本发明技术方案的精 神和范围， 均应涵盖在本发明的权利要求范围当中。 工业实用性
本发明实施例提供的制冷电路和终端及终端制冷方法， 制冷电路中包 括至少一个半导体制冷元件； 每个半导体制冷元件的两端分别贴合一个吸 热端和一个散热端， 并与述吸热端和散热端电性连接构成制冷子单元； 各 制冷子单元通过电性连接构成制冷单元， 制冷单元具有两个电源输入端； 两个电源输入端分别连接正极端和负极端。 利用半导体制冷元件在通电时， 吸热端能从外部吸收热量， 散热端能将热量散发到外部， 将电子产品工作 产生高温地方的热量传递到远离的低温处， 使电子产品高温处快速降温， 避免高温对电子产品的影响， 提高电子产品的可靠性、 性能、 使用寿命等。

Claims

权利要求书
1、 一种制冷电路， 其中， 该制冷电路包括至少一个半导体制冷元件； 每个所述半导体制冷元件的两端分别贴合一个吸热端和一个散热端， 所述 半导体制冷元件与所述吸热端和散热端电性连接构成制冷子单元； 各所述 制冷子单元通过电性连接构成制冷单元， 所述制冷单元具有两个电源输入 端； 所述两个电源输入端分别连接正极端和负极端。
2、 如权利要求 1所述的制冷电路， 其中， 冷元件靠近正极端的一端连接所述散热端， 所述 N型半导体制冷元件靠近 负极端的一端连接所述吸热端；
当所述半导体制冷元件为 P型半导体制冷元件时， 所述 P型半导体制 冷元件靠近正极端的一端连接所述吸热端， 所述 P型半导体制冷元件靠近 负极端的一端连接所述散热端。
3、 如权利要求 2所述的制冷电路， 其中， 各所述制冷子单元通过电性 连接构成制冷单元， 包括： 所述制冷单元包括多个制冷子单元， 各所述制 导体制冷元件， 各所述制冷子单元并联构成所述制冷单元。
4、 如权利要求 3所述的制冷电路， 其中， 各所述制冷子单元的散热端 连接形成一个共用的散热端， 各所述制冷子单元的吸热端连接形成一个吸 热端。
5、 如权利要求 2所述的制冷电路， 其中， 各所述制冷子单元通过电性 连接构成制冷单元， 包括： 所述制冷单元包括多个制冷子单元； 包含有 N 型半导体制冷元件的制冷子单元与包含有 p型半导体制冷元件的制冷子单 元交替串联连接构成所述制冷单元。
6、 如权利要求 5所述的制冷电路， 其中， 相邻的所述制冷子单元电性 连接的两个散热端连接形成一个共用的散热端， 相邻的所述制冷子单元电 性连接的两个吸热端连接形成一个共用的吸热端。
7、 如权利要求 1至 6任一项所述的制冷电路， 其中， 所述半导体制冷 元件与所述吸热端和所述散热端之间的电性连接为欧姆接触。
8、 如权利要求 1至 6任一项所述的制冷电路， 其中， 该制冷电路还包 括至少一个导热片， 所述导热片与所述吸热端或者所述散热端贴合； 与至 少一个吸热端贴合的所述导热片用于将热量从外部传递到贴合的所述吸热 端； 与至少一个散热端贴合的导热片用于将热量从贴合的所述散热端传递 到外部。
9、 如权利要求 1至 6任一项所述的制冷电路， 其中， 所述制冷单元还 包括以下单元中的至少一种：
电流控制单元， 配置为控制流经所述制冷子单元的电流；
开关控制单元， 配置为控制所述制冷子单元的供电。
10、 一种终端， 其中， 该终端包括如权利要求 1 所述的制冷电路、 电 池、 终端本体； 所述制冷电路的两个电源输入端分别连接所述电池正极端 和负极端； 制冷电路的吸热端吸收终端本体的发热部件的热量并利用制冷 电路的散热端散发热量。
11、 如权利要求 10所述的终端， 其中， 当所述制冷电路中存在开关控 制单元和 /或电流控制单元时， 该终端还包括温度检测单元， 所述温度检测 单元检测所述终端本体内的发热部件的温度， 并根据检测的结果控制所述 开关控制单元和 /或电流控制单元的工作。
12、 如权利要求 10或 11所述的终端， 其中， 所述终端本体内的发热 部件包括主工作芯片， 所述终端本体设有后壳体； 所述吸热端设置在所述 后壳体上靠近所述主工作芯片的区域， 所述散热端设置在所述后壳体上远 离所述主工作芯片的区域。
13、 一种终端制冷方法， 其中，
在终端上设置一个如权利要求 1 所述的制冷电路， 并将所述制冷电路 的两个电源输入端连接到所述终端中电池的正负极；
温度检测单元检测发热部件的温度情况， 根据检测的所述温度情况控 制所述制冷电路的工作， 使制冷电路的吸热端吸收终端本体的发热部件的 热量并利用制冷电路的散热端散发热量。
14、 如权利要求 13所述的终端制冷方法， 其中， 所述才艮据检测的所述 温度情况控制所述制冷电路的工作包括： 设置温度阈值， 根据检测的温度 与所述温度阈值的比较情况控制所述制冷电路的工作。
15、 如权利要求 14所述的终端制冷方法， 其中， 所述控制所述制冷电 路的工作包括： 当检测的温度超过或达到所述温度阈值时， 控制所述开关 控制单元导通使所述制冷电路进行工作； 当检测的温度低于所述温度阈值 时， 控制所述开关控制单元断开使得所述制冷电路停止工作。
16、 如权利要求 15所述的终端制冷方法， 其中， 当检测的温度超过或 达到所述温度阈值时， 所述控制所述制冷电路工作还包括： 根据检测的温 度与所述温度阈值之间的温度差值的情况控制电流控制单元， 调整流经半 导体制冷元件的电流。
PCT/CN2014/081012 2014-05-20 2014-06-27 一种制冷电路和终端及终端制冷方法 Ceased WO2015176353A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410213968.2 2014-05-20
CN201410213968.2A CN105091399A (zh) 2014-05-20 2014-05-20 一种制冷电路和终端及终端制冷方法

Publications (1)

Publication Number Publication Date
WO2015176353A1 true WO2015176353A1 (zh) 2015-11-26

Family

ID=54553274

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/CN2014/081012 Ceased WO2015176353A1 (zh) 2014-05-20 2014-06-27 一种制冷电路和终端及终端制冷方法
PCT/CN2014/082539 Ceased WO2015176377A1 (zh) 2014-05-20 2014-07-18 一种制冷电路和终端及终端制冷方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/082539 Ceased WO2015176377A1 (zh) 2014-05-20 2014-07-18 一种制冷电路和终端及终端制冷方法

Country Status (2)

Country Link
CN (1) CN105091399A (zh)
WO (2) WO2015176353A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491864A (zh) * 2016-01-21 2016-04-13 努比亚技术有限公司 移动终端中框、移动终端及其散热方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108990363A (zh) * 2017-06-05 2018-12-11 北京小米移动软件有限公司 电子设备和散热片
CN110049655A (zh) * 2018-01-15 2019-07-23 西安中兴新软件有限责任公司 散热方法、散热装置及终端
CN108987559B (zh) * 2018-06-28 2022-06-21 江苏师范大学 一种基于石墨烯材料的集成电路热管理系统
CN109764575A (zh) * 2018-12-15 2019-05-17 中国科学院理化技术研究所 一种热电制冷和磁制冷耦合装置
CN110958817B (zh) * 2019-12-11 2020-12-25 珠海格力电器股份有限公司 一种基于珀尔帖效应的散热结构及电子设备
CN112702888A (zh) * 2020-12-15 2021-04-23 南京贝迪新材料科技股份有限公司 一种基于超薄散热膜的移动设备热管理方法及系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11167434A (ja) * 1997-12-04 1999-06-22 Matsushita Electric Ind Co Ltd Ｃｐｕ発熱制御装置および制御方法および制御方法を格納した媒体
US20070234741A1 (en) * 2006-04-11 2007-10-11 Tsung-Chu Lee Heat radiator having a thermo-electric cooler and multiple heat radiation modules and the method of the same
JP2008198671A (ja) * 2007-02-09 2008-08-28 Orion Mach Co Ltd 温度調整装置
CN201196510Y (zh) * 2008-03-17 2009-02-18 庆杨 半导体制冷器、恒温散热装置及恒温高防护电气控制柜
CN102155814A (zh) * 2011-01-19 2011-08-17 顺德职业技术学院 变电流半导体制冷器
CN103423915A (zh) * 2013-08-20 2013-12-04 上海理工大学 半导体柔性制冷带

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2704929Y (zh) * 2004-01-18 2005-06-15 张琳 单电源供电多片热电堆串、并及混联结构
JP2005228915A (ja) * 2004-02-13 2005-08-25 Toshiaki Eto セパレート型ペルチェシステム
CN201813335U (zh) * 2010-06-06 2011-04-27 詹承镇 加电pn制冷发电机
CN103000799A (zh) * 2012-12-09 2013-03-27 雍占锋 冷端和热端分离型温差电致冷半导体技术
CN103453688B (zh) * 2013-09-17 2015-09-30 北京鸿雁荣昌电子技术开发有限公司 一种热电制冷/热系统
CN103779288A (zh) * 2014-01-18 2014-05-07 西安交通大学 一种基于双电源的串并联内耦式半导体制冷模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11167434A (ja) * 1997-12-04 1999-06-22 Matsushita Electric Ind Co Ltd Ｃｐｕ発熱制御装置および制御方法および制御方法を格納した媒体
US20070234741A1 (en) * 2006-04-11 2007-10-11 Tsung-Chu Lee Heat radiator having a thermo-electric cooler and multiple heat radiation modules and the method of the same
JP2008198671A (ja) * 2007-02-09 2008-08-28 Orion Mach Co Ltd 温度調整装置
CN201196510Y (zh) * 2008-03-17 2009-02-18 庆杨 半导体制冷器、恒温散热装置及恒温高防护电气控制柜
CN102155814A (zh) * 2011-01-19 2011-08-17 顺德职业技术学院 变电流半导体制冷器
CN103423915A (zh) * 2013-08-20 2013-12-04 上海理工大学 半导体柔性制冷带

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491864A (zh) * 2016-01-21 2016-04-13 努比亚技术有限公司 移动终端中框、移动终端及其散热方法
CN105491864B (zh) * 2016-01-21 2018-06-26 努比亚技术有限公司 移动终端中框、移动终端及其散热方法

Also Published As

Publication number Publication date
CN105091399A (zh) 2015-11-25
WO2015176377A1 (zh) 2015-11-26

Similar Documents

Publication Publication Date Title
WO2015176353A1 (zh) 一种制冷电路和终端及终端制冷方法
CN102082133B (zh) 一种温控散热装置
CN107947304A (zh) 主动降温式手机无线充电座
CN107180805B (zh) 芯片封装结构
CN108780344B (zh) 用于移动电子设备的面内主动冷却设备
CN105242715B (zh) 温度控制装置及设备
CN102130076A (zh) 一种热电式计算机芯片散热器
US20150059358A1 (en) Controlling method for thermoelectric cooling device and heat-dissipating module employing same
CN105759923A (zh) 一种密闭式工业计算机的分离式散热装置及散热方法
CN201904319U (zh) 一种热电式计算机芯片散热器
CN105444461B (zh) 一种热电制冷器
JP2015094552A (ja) 冷却装置
CN102446877A (zh) 一种半导体散热装置
CN109545950A (zh) 热电散热器件及其散热系统
CN104717871A (zh) 终端散热系统及方法
WO2014166238A1 (zh) 一种移动终端及其液态金属散热方法
CN106091470A (zh) 一种制冷设备及其制冷方法
CN110581113A (zh) 中央处理器组件及其散热控制方法、电子设备、手机
CN208385396U (zh) 中央处理器组件、电子设备、手机
CN101447549B (zh) 一种具有快速开断和快速恢复能力的超导开关
WO2020001017A1 (zh) 一种无线充电装置
CN211698908U (zh) 压电模组及电子设备
CN204906945U (zh) 具有阻尼性质的散热装置
CN205068279U (zh) 一种cpu散热装置
CN108988436A (zh) 一种无线充电装置及控制方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14892825

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14892825

Country of ref document: EP

Kind code of ref document: A1