JP6316438B2 - 熱電冷却器を用いて電話のスキン温度を一定に保ち、モバイルセグメントのダイの許容電力/性能限界を向上させるための方法および装置 - Google Patents
熱電冷却器を用いて電話のスキン温度を一定に保ち、モバイルセグメントのダイの許容電力/性能限界を向上させるための方法および装置 Download PDFInfo
- Publication number
- JP6316438B2 JP6316438B2 JP2016543970A JP2016543970A JP6316438B2 JP 6316438 B2 JP6316438 B2 JP 6316438B2 JP 2016543970 A JP2016543970 A JP 2016543970A JP 2016543970 A JP2016543970 A JP 2016543970A JP 6316438 B2 JP6316438 B2 JP 6316438B2
- Authority
- JP
- Japan
- Prior art keywords
- tec
- temperature
- mobile device
- skin
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/021—Power management, e.g. power saving
- G09G2330/023—Power management, e.g. power saving using energy recovery or conservation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Telephone Set Structure (AREA)
- Telephone Function (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/030,901 | 2013-09-18 | ||
| US14/030,901 US20150075186A1 (en) | 2013-09-18 | 2013-09-18 | Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment |
| PCT/US2014/056090 WO2015042145A1 (en) | 2013-09-18 | 2014-09-17 | Method of, apparatus for and computer program product comprising code for maintaining constant phone skin temperature with a thermoelectric cooler. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017503424A JP2017503424A (ja) | 2017-01-26 |
| JP2017503424A5 JP2017503424A5 (enExample) | 2017-10-12 |
| JP6316438B2 true JP6316438B2 (ja) | 2018-04-25 |
Family
ID=51660048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016543970A Active JP6316438B2 (ja) | 2013-09-18 | 2014-09-17 | 熱電冷却器を用いて電話のスキン温度を一定に保ち、モバイルセグメントのダイの許容電力/性能限界を向上させるための方法および装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150075186A1 (enExample) |
| EP (1) | EP3047346B1 (enExample) |
| JP (1) | JP6316438B2 (enExample) |
| KR (1) | KR20160055832A (enExample) |
| CN (1) | CN105556415B (enExample) |
| ES (1) | ES2641050T3 (enExample) |
| HU (1) | HUE033463T2 (enExample) |
| WO (1) | WO2015042145A1 (enExample) |
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| KR102184621B1 (ko) * | 2014-02-21 | 2020-11-30 | 삼성전자주식회사 | 방열 쉬트를 구비한 이동 통신 단말기 |
| US10082847B2 (en) * | 2014-04-01 | 2018-09-25 | Qualcomm Incorporated | Method and system for optimizing performance of a PCD while mitigating thermal generation |
| US10698458B2 (en) * | 2014-06-02 | 2020-06-30 | Microsoft Technology Licensing, Llc | Integrated vapor chamber for thermal management of computing devices |
| US9836099B2 (en) * | 2014-10-08 | 2017-12-05 | AzTrong Inc. | Ultrathin heat remover for portable electronic device |
| US9836100B2 (en) * | 2014-10-15 | 2017-12-05 | Futurewei Technologies, Inc. | Support frame with integrated phase change material for thermal management |
| US9958921B2 (en) * | 2015-03-09 | 2018-05-01 | Advanced Micro Devices, Inc. | Power management to change power limits based on device skin temperature |
| KR102266263B1 (ko) * | 2015-05-07 | 2021-06-17 | 삼성전자주식회사 | 디스플레이장치 |
| US10269682B2 (en) * | 2015-10-09 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
| US9743554B2 (en) | 2015-11-18 | 2017-08-22 | Microsoft Technology Licensing, Llc | Heat dissipation in electronics with a heat spreader |
| CN205594253U (zh) * | 2016-02-02 | 2016-09-21 | 京东方科技集团股份有限公司 | 显示装置 |
| US10845375B2 (en) * | 2016-02-19 | 2020-11-24 | Agjunction Llc | Thermal stabilization of inertial measurement units |
| CN205809778U (zh) * | 2016-05-31 | 2016-12-14 | 京东方科技集团股份有限公司 | 移动显示设备 |
| JP2018026533A (ja) * | 2016-08-08 | 2018-02-15 | 株式会社デンソー | 電子制御装置 |
| US10188015B2 (en) | 2016-09-20 | 2019-01-22 | Qualcomm Incorporated | Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement |
| ES2939610T3 (es) * | 2016-12-29 | 2023-04-25 | Huawei Tech Co Ltd | Aparato terminal que comprende un dispositivo de disipación de calor |
| WO2018169890A1 (en) * | 2017-03-16 | 2018-09-20 | Systems And Software Enterprises, Llc | Power source for a vehicle service cart |
| US10705577B2 (en) * | 2017-07-11 | 2020-07-07 | Asustek Computer Inc. | Electronic device and cover adapted to electronic device |
| US10453821B2 (en) * | 2017-08-04 | 2019-10-22 | Samsung Electronics Co., Ltd. | Connection system of semiconductor packages |
| US11382215B2 (en) * | 2017-09-28 | 2022-07-05 | Kyocera Corporation | Electronic element mounting substrate and electronic device |
| US10731878B2 (en) | 2017-11-22 | 2020-08-04 | International Business Machines Corporation | Thermal cooling of an enclosure |
| JP2020065232A (ja) * | 2018-10-19 | 2020-04-23 | シャープ株式会社 | 電子機器 |
| US11830787B2 (en) | 2019-08-06 | 2023-11-28 | Intel Corporation | Thermal management in integrated circuit packages |
| US12007170B2 (en) | 2019-08-06 | 2024-06-11 | Intel Corporation | Thermal management in integrated circuit packages |
| US20210043573A1 (en) * | 2019-08-06 | 2021-02-11 | Intel Corporation | Thermal management in integrated circuit packages |
| US11784108B2 (en) | 2019-08-06 | 2023-10-10 | Intel Corporation | Thermal management in integrated circuit packages |
| US10863654B1 (en) * | 2019-09-20 | 2020-12-08 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display device |
| KR102846605B1 (ko) * | 2020-02-04 | 2025-08-19 | 삼성디스플레이 주식회사 | 표시 모듈 |
| CN111381648A (zh) * | 2020-03-03 | 2020-07-07 | 合肥联宝信息技术有限公司 | 一种降温方法、系统、电子设备及计算机存储介质 |
| US11510346B2 (en) * | 2020-08-24 | 2022-11-22 | Baidu Usa Llc | Method and system for enhancing electronics cooling using a thermoelectric element |
| US11457545B2 (en) * | 2020-09-28 | 2022-09-27 | Google Llc | Thermal-control system of a media-streaming device and associated media-streaming devices |
| DE112021007702T5 (de) * | 2021-06-23 | 2024-03-21 | LG Electronics Inc. | Anzeigevorrichtung |
| US12048126B2 (en) * | 2021-09-01 | 2024-07-23 | Baidu Usa Llc | Energy-generating fluid distribution module for servers |
| CN115826701A (zh) * | 2021-09-16 | 2023-03-21 | 戴尔产品有限公司 | 使用相变材料帮助冷却信息处置资源的系统和方法 |
| CN113747774B (zh) * | 2021-10-11 | 2024-08-20 | 中国工程物理研究院应用电子学研究所 | 一种温控冷却系统及其使用方法 |
| US12315983B2 (en) | 2021-12-16 | 2025-05-27 | Dell Products Lp | System and method for thermally controlling a wax encapsulated antenna during burst transport |
| US12237853B2 (en) | 2022-01-25 | 2025-02-25 | Dell Products Lp | System and method for integrating radio system cooling and antenna power management systems |
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| JPH11242551A (ja) * | 1997-12-18 | 1999-09-07 | Masanobu Kujirada | キー入力装置 |
| US6143975A (en) * | 1999-01-25 | 2000-11-07 | Dell Usa, L.P. | Thermoelectric regenerator |
| JP2001282396A (ja) * | 2000-03-24 | 2001-10-12 | Internatl Business Mach Corp <Ibm> | 発電機構、コンピュータ装置及び電子機器 |
| JP2001308395A (ja) * | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 電子機器における熱エネルギー再生装置 |
| US6445580B1 (en) * | 2000-06-09 | 2002-09-03 | International Business Machines Corporation | Adaptable heat dissipation device for a personal computer |
| JP2002110256A (ja) * | 2000-10-02 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 携帯用機器 |
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| US6837057B2 (en) * | 2002-12-31 | 2005-01-04 | Intel Corporation | Docking station to cool a computer |
| KR100532335B1 (ko) * | 2003-12-08 | 2005-11-29 | 삼성전자주식회사 | 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법 |
| JP2005310847A (ja) * | 2004-04-16 | 2005-11-04 | Tokyo Gas Co Ltd | 熱電変換素子付き携帯電話器 |
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| JP2007207870A (ja) * | 2006-01-31 | 2007-08-16 | Nec Access Technica Ltd | 携帯端末装置 |
| JP2007259141A (ja) * | 2006-03-23 | 2007-10-04 | Aruze Corp | 携帯電話機 |
| JP5179746B2 (ja) * | 2006-11-22 | 2013-04-10 | 京セラ株式会社 | 携帯端末装置 |
| JP2008131501A (ja) * | 2006-11-22 | 2008-06-05 | Kyocera Corp | 携帯端末装置 |
| US7739876B2 (en) * | 2006-12-27 | 2010-06-22 | Intel Corporation | Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator |
| JP2009094196A (ja) * | 2007-10-05 | 2009-04-30 | Nec Corp | 携帯通信機の放熱構造 |
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| US20090205696A1 (en) * | 2008-02-15 | 2009-08-20 | Nextreme Thermal Solutions, Inc. | Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods |
| JP2009236518A (ja) * | 2008-03-26 | 2009-10-15 | Nec Commun Syst Ltd | 端末装置、方向指示方法、及びコンピュータプログラム |
| CN102099917A (zh) * | 2008-07-23 | 2011-06-15 | Nxp股份有限公司 | 集成塞贝克器件 |
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| US8255004B2 (en) * | 2009-02-18 | 2012-08-28 | Qualcomm Incorporated | Methods and systems for communicating using variable temperature control |
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| GB2484486A (en) * | 2010-10-12 | 2012-04-18 | Oclaro Technology Ltd | Component Temperature Control |
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| US8711564B2 (en) * | 2011-01-31 | 2014-04-29 | Qualitics, Inc | Method and system for cooling of integrated circuits |
| US20130082532A1 (en) * | 2011-09-30 | 2013-04-04 | Research In Motion Limited | Use of a thermal electric generator in a portable device |
| CN103096651B (zh) * | 2011-10-31 | 2016-06-08 | 镇江福科鑫电子科技有限公司 | 电子装置 |
| CN202472460U (zh) * | 2011-11-10 | 2012-10-03 | 中兴通讯股份有限公司 | 散热装置 |
| KR101928005B1 (ko) * | 2011-12-01 | 2019-03-13 | 삼성전자주식회사 | 열전 냉각 패키지 및 이의 열관리 방법 |
| WO2014021262A1 (ja) * | 2012-08-03 | 2014-02-06 | 株式会社村田製作所 | 電子機器 |
| TWI481086B (zh) * | 2012-09-19 | 2015-04-11 | Nat Inst Chung Shan Science & Technology | 一種用於電子元件的散熱裝置 |
| US20160148917A1 (en) * | 2012-12-08 | 2016-05-26 | National Chung-Shan Institute Of Science And Technology | Cooling device for electronic components |
| JP2014220371A (ja) * | 2013-05-08 | 2014-11-20 | 富士通株式会社 | 放熱部材および電子機器 |
-
2013
- 2013-09-18 US US14/030,901 patent/US20150075186A1/en not_active Abandoned
-
2014
- 2014-09-17 WO PCT/US2014/056090 patent/WO2015042145A1/en not_active Ceased
- 2014-09-17 EP EP14780701.0A patent/EP3047346B1/en active Active
- 2014-09-17 KR KR1020167008490A patent/KR20160055832A/ko not_active Ceased
- 2014-09-17 HU HUE14780701A patent/HUE033463T2/en unknown
- 2014-09-17 ES ES14780701.0T patent/ES2641050T3/es active Active
- 2014-09-17 JP JP2016543970A patent/JP6316438B2/ja active Active
- 2014-09-17 CN CN201480051111.3A patent/CN105556415B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| ES2641050T3 (es) | 2017-11-07 |
| CN105556415B (zh) | 2019-09-03 |
| WO2015042145A1 (en) | 2015-03-26 |
| JP2017503424A (ja) | 2017-01-26 |
| EP3047346B1 (en) | 2017-06-21 |
| CN105556415A (zh) | 2016-05-04 |
| HUE033463T2 (en) | 2017-12-28 |
| KR20160055832A (ko) | 2016-05-18 |
| US20150075186A1 (en) | 2015-03-19 |
| EP3047346A1 (en) | 2016-07-27 |
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