KR20160055832A - 열전 냉각기로 일정한 폰 스킨 온도를 유지하는 방법, 장치 및 코드를 포함하는 컴퓨터 프로그램 제품 - Google Patents

열전 냉각기로 일정한 폰 스킨 온도를 유지하는 방법, 장치 및 코드를 포함하는 컴퓨터 프로그램 제품 Download PDF

Info

Publication number
KR20160055832A
KR20160055832A KR1020167008490A KR20167008490A KR20160055832A KR 20160055832 A KR20160055832 A KR 20160055832A KR 1020167008490 A KR1020167008490 A KR 1020167008490A KR 20167008490 A KR20167008490 A KR 20167008490A KR 20160055832 A KR20160055832 A KR 20160055832A
Authority
KR
South Korea
Prior art keywords
tec
temperature
mobile device
skin
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020167008490A
Other languages
English (en)
Korean (ko)
Inventor
루팔 고빈드바이 프라자파티
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20160055832A publication Critical patent/KR20160055832A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G09G2330/021—Power management, e.g. power saving
    • G09G2330/023—Power management, e.g. power saving using energy recovery or conservation

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Telephone Set Structure (AREA)
  • Telephone Function (AREA)
KR1020167008490A 2013-09-18 2014-09-17 열전 냉각기로 일정한 폰 스킨 온도를 유지하는 방법, 장치 및 코드를 포함하는 컴퓨터 프로그램 제품 Ceased KR20160055832A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/030,901 2013-09-18
US14/030,901 US20150075186A1 (en) 2013-09-18 2013-09-18 Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
PCT/US2014/056090 WO2015042145A1 (en) 2013-09-18 2014-09-17 Method of, apparatus for and computer program product comprising code for maintaining constant phone skin temperature with a thermoelectric cooler.

Publications (1)

Publication Number Publication Date
KR20160055832A true KR20160055832A (ko) 2016-05-18

Family

ID=51660048

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167008490A Ceased KR20160055832A (ko) 2013-09-18 2014-09-17 열전 냉각기로 일정한 폰 스킨 온도를 유지하는 방법, 장치 및 코드를 포함하는 컴퓨터 프로그램 제품

Country Status (8)

Country Link
US (1) US20150075186A1 (enExample)
EP (1) EP3047346B1 (enExample)
JP (1) JP6316438B2 (enExample)
KR (1) KR20160055832A (enExample)
CN (1) CN105556415B (enExample)
ES (1) ES2641050T3 (enExample)
HU (1) HUE033463T2 (enExample)
WO (1) WO2015042145A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210099710A (ko) * 2020-02-04 2021-08-13 삼성디스플레이 주식회사 표시 모듈

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102184621B1 (ko) * 2014-02-21 2020-11-30 삼성전자주식회사 방열 쉬트를 구비한 이동 통신 단말기
US10082847B2 (en) * 2014-04-01 2018-09-25 Qualcomm Incorporated Method and system for optimizing performance of a PCD while mitigating thermal generation
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US9836099B2 (en) * 2014-10-08 2017-12-05 AzTrong Inc. Ultrathin heat remover for portable electronic device
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
US9958921B2 (en) * 2015-03-09 2018-05-01 Advanced Micro Devices, Inc. Power management to change power limits based on device skin temperature
KR102266263B1 (ko) * 2015-05-07 2021-06-17 삼성전자주식회사 디스플레이장치
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US9743554B2 (en) 2015-11-18 2017-08-22 Microsoft Technology Licensing, Llc Heat dissipation in electronics with a heat spreader
CN205594253U (zh) * 2016-02-02 2016-09-21 京东方科技集团股份有限公司 显示装置
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
CN205809778U (zh) * 2016-05-31 2016-12-14 京东方科技集团股份有限公司 移动显示设备
JP2018026533A (ja) * 2016-08-08 2018-02-15 株式会社デンソー 電子制御装置
US10188015B2 (en) 2016-09-20 2019-01-22 Qualcomm Incorporated Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement
ES2939610T3 (es) * 2016-12-29 2023-04-25 Huawei Tech Co Ltd Aparato terminal que comprende un dispositivo de disipación de calor
WO2018169890A1 (en) * 2017-03-16 2018-09-20 Systems And Software Enterprises, Llc Power source for a vehicle service cart
US10705577B2 (en) * 2017-07-11 2020-07-07 Asustek Computer Inc. Electronic device and cover adapted to electronic device
US10453821B2 (en) * 2017-08-04 2019-10-22 Samsung Electronics Co., Ltd. Connection system of semiconductor packages
US11382215B2 (en) * 2017-09-28 2022-07-05 Kyocera Corporation Electronic element mounting substrate and electronic device
US10731878B2 (en) 2017-11-22 2020-08-04 International Business Machines Corporation Thermal cooling of an enclosure
JP2020065232A (ja) * 2018-10-19 2020-04-23 シャープ株式会社 電子機器
US11830787B2 (en) 2019-08-06 2023-11-28 Intel Corporation Thermal management in integrated circuit packages
US12007170B2 (en) 2019-08-06 2024-06-11 Intel Corporation Thermal management in integrated circuit packages
US20210043573A1 (en) * 2019-08-06 2021-02-11 Intel Corporation Thermal management in integrated circuit packages
US11784108B2 (en) 2019-08-06 2023-10-10 Intel Corporation Thermal management in integrated circuit packages
US10863654B1 (en) * 2019-09-20 2020-12-08 Wuhan China Star Optoelectronics Technology Co., Ltd. Display device
CN111381648A (zh) * 2020-03-03 2020-07-07 合肥联宝信息技术有限公司 一种降温方法、系统、电子设备及计算机存储介质
US11510346B2 (en) * 2020-08-24 2022-11-22 Baidu Usa Llc Method and system for enhancing electronics cooling using a thermoelectric element
US11457545B2 (en) * 2020-09-28 2022-09-27 Google Llc Thermal-control system of a media-streaming device and associated media-streaming devices
DE112021007702T5 (de) * 2021-06-23 2024-03-21 LG Electronics Inc. Anzeigevorrichtung
US12048126B2 (en) * 2021-09-01 2024-07-23 Baidu Usa Llc Energy-generating fluid distribution module for servers
CN115826701A (zh) * 2021-09-16 2023-03-21 戴尔产品有限公司 使用相变材料帮助冷却信息处置资源的系统和方法
CN113747774B (zh) * 2021-10-11 2024-08-20 中国工程物理研究院应用电子学研究所 一种温控冷却系统及其使用方法
US12315983B2 (en) 2021-12-16 2025-05-27 Dell Products Lp System and method for thermally controlling a wax encapsulated antenna during burst transport
US12237853B2 (en) 2022-01-25 2025-02-25 Dell Products Lp System and method for integrating radio system cooling and antenna power management systems

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11242551A (ja) * 1997-12-18 1999-09-07 Masanobu Kujirada キー入力装置
US6143975A (en) * 1999-01-25 2000-11-07 Dell Usa, L.P. Thermoelectric regenerator
JP2001282396A (ja) * 2000-03-24 2001-10-12 Internatl Business Mach Corp <Ibm> 発電機構、コンピュータ装置及び電子機器
JP2001308395A (ja) * 2000-04-21 2001-11-02 Matsushita Electric Ind Co Ltd 電子機器における熱エネルギー再生装置
US6445580B1 (en) * 2000-06-09 2002-09-03 International Business Machines Corporation Adaptable heat dissipation device for a personal computer
JP2002110256A (ja) * 2000-10-02 2002-04-12 Matsushita Electric Ind Co Ltd 携帯用機器
JP3753995B2 (ja) * 2002-03-13 2006-03-08 インターナショナル・ビジネス・マシーンズ・コーポレーション 冷却装置および情報処理装置
US6837057B2 (en) * 2002-12-31 2005-01-04 Intel Corporation Docking station to cool a computer
KR100532335B1 (ko) * 2003-12-08 2005-11-29 삼성전자주식회사 냉각 및 발전 장치 및 이를 채용한 휴대 단말기 및 그동작 방법
JP2005310847A (ja) * 2004-04-16 2005-11-04 Tokyo Gas Co Ltd 熱電変換素子付き携帯電話器
US7161809B2 (en) * 2004-09-15 2007-01-09 Advanced Energy Technology Inc. Integral heat spreader
US7523617B2 (en) * 2004-10-22 2009-04-28 Nextreme Thermal Solutions, Inc. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
US7560640B2 (en) * 2004-11-22 2009-07-14 Intel Corporation Densely packed thermoelectric cooler
JP2007207870A (ja) * 2006-01-31 2007-08-16 Nec Access Technica Ltd 携帯端末装置
JP2007259141A (ja) * 2006-03-23 2007-10-04 Aruze Corp 携帯電話機
JP5179746B2 (ja) * 2006-11-22 2013-04-10 京セラ株式会社 携帯端末装置
JP2008131501A (ja) * 2006-11-22 2008-06-05 Kyocera Corp 携帯端末装置
US7739876B2 (en) * 2006-12-27 2010-06-22 Intel Corporation Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
JP2009094196A (ja) * 2007-10-05 2009-04-30 Nec Corp 携帯通信機の放熱構造
JP4864855B2 (ja) * 2007-11-05 2012-02-01 株式会社リコー 携帯型電子機器
US20090205696A1 (en) * 2008-02-15 2009-08-20 Nextreme Thermal Solutions, Inc. Thermoelectric Heat Pumps Providing Active Thermal Barriers and Related Devices and Methods
JP2009236518A (ja) * 2008-03-26 2009-10-15 Nec Commun Syst Ltd 端末装置、方向指示方法、及びコンピュータプログラム
CN102099917A (zh) * 2008-07-23 2011-06-15 Nxp股份有限公司 集成塞贝克器件
US20100104485A1 (en) * 2008-10-28 2010-04-29 Microfluidic Systems, Inc. Flow-through thermal cycling device
US8255004B2 (en) * 2009-02-18 2012-08-28 Qualcomm Incorporated Methods and systems for communicating using variable temperature control
US20120240882A1 (en) * 2009-08-28 2012-09-27 The Boeing Company Dual Use Cooling Systems
JP4799658B2 (ja) * 2009-11-30 2011-10-26 株式会社東芝 情報処理装置
GB2484486A (en) * 2010-10-12 2012-04-18 Oclaro Technology Ltd Component Temperature Control
US20120096871A1 (en) * 2010-10-22 2012-04-26 Yuefeng Wang Dynamic switching thermoelectric thermal management systems and methods
US8711564B2 (en) * 2011-01-31 2014-04-29 Qualitics, Inc Method and system for cooling of integrated circuits
US20130082532A1 (en) * 2011-09-30 2013-04-04 Research In Motion Limited Use of a thermal electric generator in a portable device
CN103096651B (zh) * 2011-10-31 2016-06-08 镇江福科鑫电子科技有限公司 电子装置
CN202472460U (zh) * 2011-11-10 2012-10-03 中兴通讯股份有限公司 散热装置
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
WO2014021262A1 (ja) * 2012-08-03 2014-02-06 株式会社村田製作所 電子機器
TWI481086B (zh) * 2012-09-19 2015-04-11 Nat Inst Chung Shan Science & Technology 一種用於電子元件的散熱裝置
US20160148917A1 (en) * 2012-12-08 2016-05-26 National Chung-Shan Institute Of Science And Technology Cooling device for electronic components
JP2014220371A (ja) * 2013-05-08 2014-11-20 富士通株式会社 放熱部材および電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210099710A (ko) * 2020-02-04 2021-08-13 삼성디스플레이 주식회사 표시 모듈

Also Published As

Publication number Publication date
ES2641050T3 (es) 2017-11-07
CN105556415B (zh) 2019-09-03
JP6316438B2 (ja) 2018-04-25
WO2015042145A1 (en) 2015-03-26
JP2017503424A (ja) 2017-01-26
EP3047346B1 (en) 2017-06-21
CN105556415A (zh) 2016-05-04
HUE033463T2 (en) 2017-12-28
US20150075186A1 (en) 2015-03-19
EP3047346A1 (en) 2016-07-27

Similar Documents

Publication Publication Date Title
KR20160055832A (ko) 열전 냉각기로 일정한 폰 스킨 온도를 유지하는 방법, 장치 및 코드를 포함하는 컴퓨터 프로그램 제품
US10649506B2 (en) Thermal dock for a mobile computing device
US7974090B2 (en) Portable medical device cooling system
KR102591735B1 (ko) 손목 밴드를 히트 싱크로서 사용하는 것에 의한 웨어러블 디바이스들을 위한 열 솔루션
US9268376B2 (en) Mobile computing device dock station with headset jack heat pipe interface
US9301429B2 (en) Thermal blocker for mobile device skin hot spot management
WO2021169807A1 (zh) 电子设备及控制的方法、散热系统
CN108780344B (zh) 用于移动电子设备的面内主动冷却设备
US11209893B2 (en) Electronic device having an active edge
US20160187927A1 (en) Direct attach dock cooling leveraging maximum silicon junction temperature control
JP2010140194A (ja) 携帯型情報処理装置及びドッキングステ−ション並びに情報処理装置
CN116954332A (zh) 电子芯片散热控制方法、装置、设备及存储介质
CN206212557U (zh) 移动终端、充电装置和散热结构
CN104602484A (zh) 便携式设备及其散热装置
CN206211879U (zh) 具有能量转换功能的移动终端
US20140293849A1 (en) Powering a network device with converted electrical power
JPH11282577A (ja) 情報処理装置及び拡張装置
CN114828590A (zh) 终端及其散热控制方法
JP2008131803A (ja) 携帯端末装置
TWM658564U (zh) 電子裝置
US10681845B2 (en) Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20160330

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190903

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20201209

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20210216

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20201209

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I