CN105523711B - Scribing method and scribing device - Google Patents

Abstract

The present invention relates to a scribing method and a scribing apparatus. That is, even when the scribe lines are formed at positions directly above and below the sealing material, the grooves having a sufficient depth can be smoothly formed in the substrate over the entire length of the scribe lines. The upper and lower scribing wheels (301, 401) are displaced from each other in the scribing direction and moved along the sealing material (SL), thereby forming scribing lines on the upper and lower surfaces of the mother substrate (G). The movement of the scribing wheels (301, 401) is adjusted in such a manner that the scribing wheels (301, 401) pass over the other scribing lines (LV1, LV2) substantially simultaneously. After passing through the other scribing lines (LV1, LV2), the scribing wheels (301, 401) are displaced in the scribing direction and moved along the sealing material, thereby forming scribing lines on the upper and lower surfaces of the mother substrate (G).

Description

Scribing method and scribing device

Technical Field

The present invention relates to a scribing method and a scribing apparatus for forming a scribe line on a substrate.

Background

Conventionally, a brittle material substrate such as a glass substrate is cut by a scribing step of forming a scribe line on a surface of the substrate and a cutting step of applying a predetermined force to the surface of the substrate along the formed scribe line. In the scribing step, the tip of the scribing wheel is moved along a specific line while being pressed against the surface of the substrate. A scribing apparatus having a scribing head is used for forming the scribe line.

Patent document 1 below describes a method for cutting out a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a Thin Film Transistor (TFT) is formed and a substrate on which a Color Filter (CF) is formed with a sealing material interposed therebetween. The liquid crystal panels are obtained by dividing the mother substrate.

The sealing material is disposed so as to remain in a space to be a liquid crystal injection region in a state where 2 substrates are bonded.

When the mother substrate having the above-described structure is divided, a method of simultaneously forming scribe lines on both surfaces of the mother substrate using 2 scribe heads is available (for example, see patent document 2). In this case, 2 scribing heads are disposed so as to sandwich the mother substrate. The 2 scribing wheels are positioned at the same position when overlooking the mother substrate. In this state, the 2 scribing wheels are simultaneously moved in the same direction to form scribing lines on the respective surfaces of the mother substrates.

[ background Art document ]

[ patent document ]

[ patent document 1] Japanese patent laid-open No. 2006-

[ patent document 2] Japanese patent laid-open No. 2012-240902

Disclosure of Invention

[ problems to be solved by the invention ]

As shown in patent document 1, in the conventional mother substrate, a region where no sealing material is interposed exists between adjacent liquid crystal injection regions. Therefore, when the scribe lines are simultaneously formed on both surfaces of the mother substrate by the 2 scribe heads as described above, the scribe lines can be formed in the region where the sealing material is not interposed. In this way, if the mother substrate is divided by forming the scribe lines, the liquid crystal panel leaves a frame region having a specific width around the liquid crystal injection region.

However, in recent years, it has become mainstream to extremely narrow the frame region particularly in a liquid crystal panel for a mobile phone. In order to satisfy this requirement, the region of the mother substrate where no sealing material is interposed is omitted, and adjacent liquid crystal injection regions need to be configured to be separated only by the sealing material. In this case, the scribe lines are formed directly above and below the sealing material.

However, the present inventors have confirmed the following problems: if the scribe lines are formed at positions directly above and below the sealing material in this manner, cracks do not sufficiently enter 2 glass substrates. If the cutting step is performed in a state where the cracks are insufficient, fine cracks or breakage may occur at the edge of the cut substrate, and the strength of the glass substrate may be reduced.

In view of the above problems, an object of the present invention is to provide a scribing method and a scribing apparatus capable of smoothly forming a crack of a sufficient depth on a substrate over the entire length of a scribe line even when forming the scribe line at a position directly above and directly below a sealing material.

[ means for solving problems ]

A first aspect of the present invention relates to a scribing method for forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together with a sealing material. In the scribing method according to the present aspect, the first blade and the second blade are displaced from each other in the scribing direction to move the first blade and the second blade along the sealing material, thereby forming the first scribe line and the second scribe line on the surface of the first substrate and the surface of the second substrate, respectively, the movement of the first blade and the second blade is adjusted so that the first blade and the second blade pass through the other scribe line intersecting the first scribe line and the second scribe line at substantially the same time, and after passing through the other scribe line, the first blade and the second blade are displaced from each other in the scribing direction to move the first blade and the second blade along the sealing material, thereby forming the first scribe line and the second scribe line on the surface of the first substrate and the surface of the second substrate, respectively.

According to the scribing method of this aspect, when the first and second scribe lines are formed at positions directly above and below the sealing material, a crack having a sufficient depth can be formed in the mother substrate. Further, the movement of the first and second blades is adjusted so that the first and second blades pass through the other scribe lines orthogonal to the first and second scribe lines substantially simultaneously, thereby avoiding the application of forces in opposite directions from the first and second blades to positions across the other scribe lines. Thus, when the first blade and the second blade pass through the other scribe lines, the other scribe lines can be cut appropriately without generating cracks.

In the scribing method of the present aspect, for example, the first blade and the second blade can be displaced from each other by making the moving speed of the first blade different from the moving speed of the second blade. Thus, the first blade and the second blade can be displaced from each other while the formation of cracks with respect to the two substrates is advanced.

In the scribing operation, it is preferable that the first and second scribe lines are formed on the surface of the first substrate and the surface of the second substrate by keeping the displacement between the first blade and the second blade at a predetermined distance by setting the moving speed of the first blade to be the same as the moving speed of the second blade. Thus, the formation unevenness of the cracks on the scribe line can be suppressed.

In the scribing method according to the present aspect, the first blade and the second blade can be caused to pass through the other scribing lines substantially simultaneously by making the moving speed of the first blade different from the moving speed of the second blade. Thus, the first blade and the second blade can be passed through the other scribing lines substantially simultaneously while the formation of cracks with respect to the two substrates is advanced.

In the scribing method according to the present aspect, it is preferable that the first blade and the first pressing member be moved along the sealing material while the first pressing member is pressed against a position corresponding to the second blade on the surface of the first substrate, and the second blade and the second pressing member be moved along the sealing material while the second pressing member is pressed against a position corresponding to the first blade on the surface of the second substrate. Thus, the deformation of the mother substrate due to the pressing force of the first and second blades is suppressed, so that the depth of the crack can be maintained deep and the crack can be formed more stably.

A second aspect of the present invention relates to a scribing apparatus for forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together with a sealing material. The scribing device of this aspect includes: a first scribe head that forms a scribe line on a surface of the first substrate; a second scribe head that forms a scribe line on a surface of the second substrate; a driving unit which moves the first scribing head and the second scribing head in parallel with the mother substrate; and a control unit for controlling the first scribing head, the second scribing head and the driving unit. The control unit moves the first blade of the first scribing head and the second blade of the second scribing head in a scribing direction so as to move the first blade and the second blade along the sealing material, thereby forming a first scribe line and a second scribe line on the surface of the first substrate and the surface of the second substrate, respectively, adjusts the movement of the first blade and the second blade so that the first blade and the second blade pass through another scribe line intersecting the first scribe line and the second scribe line at substantially the same time, and moves the first blade and the second blade along the sealing material by moving the first blade and the second blade in the scribing direction so as to move the first blade and the second blade along the sealing material, after passing through the another scribe line, thereby forming the first scribe line and the second scribe line on the surface of the first substrate and the surface of the second substrate, respectively.

According to the scribing apparatus of this aspect, similarly to the scribing method of the first aspect, when the first and second scribe lines are formed at positions directly above and below the sealing material, a crack having a sufficient depth can be formed in the mother substrate. Further, the movement of the first and second blades is adjusted so that the first and second blades pass through the other scribe lines orthogonal to the first and second scribe lines substantially simultaneously, thereby avoiding the application of forces in opposite directions from the first and second blades to positions across the other scribe lines. Thus, when the first blade and the second blade pass through the other scribe lines, the other scribe lines can be cut appropriately without generating cracks.

In the scribing device according to the present aspect, the control unit may be configured to shift the first blade and the second blade relative to each other by making a moving speed of the first blade different from a moving speed of the second blade. Thus, the first blade and the second blade can be displaced from each other while the formation of cracks with respect to the two substrates is advanced.

The control unit may be configured to maintain the displacement between the first blade and the second blade at a specific distance by setting the moving speed of the first blade to be the same as the moving speed of the second blade, thereby forming the first scribe line and the second scribe line on the surface of the first substrate and the surface of the second substrate. Thus, the formation unevenness of the cracks on the scribe line can be suppressed.

The control unit may be configured to cause the first blade and the second blade to pass through the other scribe lines substantially simultaneously by causing the first blade to move at a speed different from that of the second blade. Thus, the first blade and the second blade can be passed through the other scribing lines substantially simultaneously while the formation of cracks with respect to the two substrates is advanced.

Further, it is preferable that the first scribing head has a first pressing member which presses the pressure contact position of the second blade from the surface of the first substrate in a state where the first blade is displaced along the sealing material with respect to the second blade, and it is preferable that the second scribing head has a second pressing member which presses the pressure contact position of the first blade from the surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade. Thus, the deformation of the mother substrate due to the pressing force of the first and second blades is suppressed, so that the depth of the crack can be maintained deep and the crack can be formed more stably.

[ Effect of the invention ]

As described above, according to the present invention, it is possible to provide a scribing method and a scribing apparatus capable of forming a crack of a sufficient depth on a substrate over the entire length of a scribe line even when the scribe line is formed at a position directly above and below a sealing material.

The effects and significance of the present invention will be more apparent from the following description of the embodiments.

However, the embodiments described below are merely examples for implementing the present invention, and the present invention is not limited to the contents described in the embodiments below.

Drawings

Fig. 1(a) and (b) are views schematically showing the configuration of the scribing apparatus according to the embodiment.

Fig. 2 is an exploded perspective view showing a structure of a scribe head according to an embodiment.

Fig. 3 is a perspective view showing a structure of the scribing head according to the embodiment.

Fig. 4(a) to (c) are diagrams for explaining the scribing method according to the embodiment.

Fig. 5(a) to (e) are graphs showing experimental results of the scribing method according to the embodiment.

Fig. 6(a) and (b) are views for explaining another scribing method according to the embodiment.

Fig. 7(a) to (e) are graphs showing experimental results of other scribing methods according to the embodiment.

Fig. 8(a) and (b) are perspective views showing the structure of the scribing tool according to the embodiment.

Fig. 9(a) and (b) are views schematically showing a method of attaching the scribing tool according to the embodiment.

Fig. 10(a) to (c) are a block diagram showing the configuration of the scribing apparatus of the embodiment and diagrams for explaining a problem in the case where the upper and lower scribing wheels pass through another scribing line while being displaced in the scribing direction.

Fig. 11 is a flowchart showing scribing control according to the embodiment.

Fig. 12(a) and (b) are diagrams illustrating scribing operations according to the embodiment.

Fig. 13(a) and (b) are diagrams illustrating scribing operations according to the embodiment.

Fig. 14(a) and (b) are diagrams illustrating scribing operations according to the embodiment.

Fig. 15 is a timing chart showing scribing control according to the embodiment.

Fig. 16 is a timing chart showing the scribing control in modification 1.

Fig. 17 is a flowchart showing scribing control in modification 2.

Fig. 18 is a flowchart showing scribing control in modification 3.

Fig. 19 is a flowchart showing the scribing control in modification 4.

Fig. 20 is a flowchart showing the scribing control in modification 5.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, for convenience, X, Y, and Z axes orthogonal to each other are shown. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

< constitution of scribing device >

Fig. 1(a) and (b) are schematic views showing the configuration of the scribing apparatus 1. Fig. 1(a) is a view of the scribing apparatus 1 viewed from the Y-axis front side, and fig. 1(b) is a view of a part of the scribing apparatus 1 viewed from the X-axis front side.

Referring to fig. 1(a), the scribing device 1 includes a conveyor belt 11, support columns 12a and 12b, guides 13 and 14, slide units 15 and 16, driving motors 17 and 18, cameras 19a and 19b, and 2 scribing heads 2.

As shown in fig. 1(b), the conveyor belt 11 is provided so as to extend in the Y-axis direction except for the position where the scribing head 2 is disposed. The conveyor belt 11 is provided with a handle 11a for holding the mother substrate G. The mother substrates G are placed on the conveyor belt 11 with the edges held by the handles 11 a. The mother substrate G has a substrate structure in which a pair of glass substrates are bonded to each other. The mother substrate G is conveyed in the Y-axis direction by the conveyor 11 while being held by the handle 11 a.

The support columns 12a and 12b are provided vertically on the base of the scribing device 1 via the conveyor belt 11. The guides 13 and 14 are respectively disposed between the columns 12a and 12b so as to be parallel to the X-axis direction. The sliding units 15 and 16 are slidably provided on the guides 13 and 14, respectively. The guides 13 and 14 are provided with drive motors 17 and 18, respectively, and the slide units 15 and 16 are driven in the X-axis direction by these drive motors 17 and 18.

The scribing heads 2 are attached to the slide units 15 and 16, respectively. Scribing tools 30 and 40 are attached to the scribing head 2 on the Z-axis positive side and the scribing head 2 on the Z-axis negative side so as to face the mother substrate G, respectively. The scribing head 2 is moved in the X-axis direction while scribing wheels held by the scribing tools 30 and 40 are pressed against the surface of the mother substrate G. Thereby, scribe lines are formed on the surface of the mother substrate G.

The cameras 19a and 19b are disposed above the guide 13, and detect alignment marks marked on the mother substrate G. The arrangement position of the mother substrate G with respect to the conveyor 11 is detected from the picked-up images from the cameras 19a and 19 b. Based on the detection result, each operation position of the scribing head 2 in the scribing operation, such as the scribing start position or the scribing end position of the scribing head 2, is determined.

< Scribe head >

Fig. 2 is a partially exploded perspective view showing the configuration of the scribing head 2, and fig. 3 is a perspective view showing the configuration of the scribing head 2.

Referring to fig. 2, the scribing head 2 includes a lifting mechanism 21, a scribe line forming mechanism 22, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28.

The lifting mechanism 21 includes: a cylindrical cam 21a coupled to a drive shaft of the servo motor 28; and a cam follower 21c formed on the upper surface of the lifting portion 21 b. The lifting unit 21b is supported on the base plate 23 via a slider (not shown) so as to be movable in the vertical direction, and is urged in the Z-axis positive direction by a spring 21 d. The cam follower 21c is pressed against the lower surface of the cylinder cam 21a by the urging of the spring 21 d. The lifting unit 21b is connected to the scribe line forming mechanism 22. When the cylindrical cam 21a is rotated by the servo motor 28, the lifting and lowering portion 21b is lifted and lowered by the cam action of the cylindrical cam 21a, and the scribe line forming mechanism 22 is lifted and lowered accordingly. Scribing tools 30 and 40 are attached to the lower end of the scribing line forming mechanism 22.

The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape fitted into the groove 23a of the base plate 23, the groove 24a of the top plate 24, and the groove 25a of the bottom plate 25. In a state where the rubber frame 26 is mounted in the grooves 23a, 24a, and 25a, the surface of the rubber frame 26 protrudes slightly outward from the side surfaces of the base plate 23, the top plate 24, and the bottom plate 25.

The cover 27 has a shape in which 3 plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. The front surface portion 27a has 2 holes 27f formed at upper and lower edges thereof.

In a state where the rubber frame 26 is fitted into the grooves 23a, 24a, and 25a, the right side surface portion 27b and the left side surface portion 27c of the cover 27 are deformed so as to be bent outward, and the cover 27 is attached to the base plate 23, the top plate 24, and the bottom plate 25. In this state, screws are screwed to the top plate 24 and the bottom plate 25 through 2 holes 27f formed at the upper and lower edges of the front surface portion 27 a. Further, screws are screwed into screw holes formed slightly outside the grooves 23a, 24a, 25a of the base plate 23, the top plate 24, and the bottom plate 25. Thus, the cover 27 is sandwiched by the base plate 23, the top plate 24, and the bottom plate 25 and the heads of the screws, and the peripheral edges of the right side surface 27b and the left side surface 27c are pressed against the rubber frame 26. Thus, the scribing head 2 is assembled as shown in fig. 3.

As shown in fig. 1(a), 2 scribe heads 2 are disposed above and below the mother substrate G, respectively. The 2 scribing heads 2 have the same configuration. The scribing tools 30 and 40 attached to the 2 scribing heads 2 are changed according to the scribing method. The scribing tools 30 and 40 holding only the scribing wheels 301 and 401 are used in the scribing method 1 of the 2 scribing methods shown below. In the scribing method 2, scribing tools 30 and 40 holding scribing wheels 301 and 401 and rollers 302 and 402 are used.

These 2 scribing methods are explained below.

< scribing method 1 >

Fig. 4(a) to (c) are diagrams for explaining the scribing method according to the present embodiment. Fig. 4(a) is a schematic view when the vicinity of the scribe line position is viewed from the Y-axis negative side, fig. 4(b) is a schematic view when the vicinity of the scribe line position is viewed from the X-axis positive side, and fig. 4(c) is a schematic view when the vicinity of the scribe line position is viewed from the Z-axis positive side.

As shown in fig. 4(a), in the scribing method, the 2 scribing wheels 301 and 401 are moved so that the scribing wheel 301 of the upper scribing head 2 (positive Z-axis) advances by a distance W1 in the scribing direction (positive X-axis) from the scribing wheel 401 of the lower scribing head 2 (negative Z-axis). On the contrary, the scribing wheel 401 may be advanced with respect to the scribing wheel 301. The 2 scribing wheels 301 and 401 are rotatably attached to the scribing tools 30 and 40 with the shafts 301a and 401a as rotation axes, respectively.

Referring to fig. 4(b), the mother substrate G is configured by bonding 2 glass substrates G1 and G2 with a sealing material SL interposed therebetween. A Color Filter (CF) is formed on the glass substrate G1, and a Thin Film Transistor (TFT) is formed on the glass substrate G2. The liquid crystal injection region R is formed by the sealing material SL and 2 glass substrates G1 and G2, and liquid crystal is injected into the liquid crystal injection region R. The 2 scribing wheels 301 and 401 are not positioned to be shifted from each other in the Y-axis direction. The scribing wheel 301 is pressed against the surface of the glass substrate G1 at a position directly above the sealing material SL, and the scribing wheel 401 is pressed against the surface of the glass substrate G2 at a position directly below the sealing material SL.

As shown in fig. 4(c), the sealing material SL is arranged in a lattice shape. The 2 scribing wheels 301 and 401 move in the positive X-axis direction along the sealing material SL. As a result, as shown in fig. 4(b) and (c), scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

In the scribing method shown in fig. 4(a) to (c), a roller for pressing the surface of the mother substrate G opposite to the scribing wheel 301 (Z-axis negative side) is not provided, and a roller for pressing the surface of the mother substrate G opposite to the scribing wheel 401 (Z-axis positive side) is not provided.

< experiment 1 >

The inventors performed experiments for forming a scribe line on the mother substrate G by the scribing method shown in fig. 4(a) to (c). The following describes the experiment and the experimental results.

In the experiment, glass substrates G1 and G2 each having a thickness of 0.2mm were bonded via a sealing material SL to obtain a substrate (mother substrate), the bonded substrate (mother substrate) had a size of 118mm × 500mm, scribing wheels 301 and 401 had a structure in which V-shaped cutting edges were formed on the outer periphery of the disk and grooves were formed at specific intervals on ridge lines of the cutting edges, scribing wheels 301 and 401 had a diameter of 3mm, a cutting edge angle of 110 °, the number of grooves of 550, and a groove depth of 3 μm.

The scribing wheels 301 and 401 having this configuration are moved while being pressed against the glass substrates G1 and G2 as shown in fig. 4(a) to (c), respectively, to perform scribing operation. The load applied to the scribing wheels 301 and 401 during the scribing operation is controlled to 6.5N. The moving speed of the scribing wheels 301 and 401 is set to be constant (200 mm/sec).

Based on the above conditions, the penetration amount of the cracks in the glass substrates G1 and G2 was measured while changing the distance W1 between the 2 scribing wheels 301 and 401. As a comparative example, the amount of penetration of the crack was measured when the distance W1 between the scribing wheels 301 and 401 was 0. In each measurement, the amount of rib mark (rib mark) was measured in addition to the amount of penetration of the crack.

Fig. 5(a) to (e) show the experimental results. Fig. 5(a) is a graph in which the penetration amount of cracks and the rib amount are shown as numerical values, and fig. 5(b) to (e) are cross-sectional photographs of the mother substrate G on a scribe line, the cross-sectional photographs being taken at distances W1 of 0.4mm, 0.6mm, 0.8mm, and 1.0mm, respectively. In fig. 5(b) to (e), D1 and D3 indicate rib widths, and D2 and D4 indicate penetration widths of cracks.

When referring to fig. 5(a), if the distance W1 exceeds 0.6mm, the amount of penetration of the crack of the glass substrate G1 becomes larger than when the distance W1 is 0 mm. If the crack penetrates into any one of the glass substrates G1, G2 in a large amount, the mother substrate G can be properly divided in the cutting step.

For example, as in the comparative example (W1 ═ 0mm), if the glass substrates G1 and G2 both have a fracture amount of about half the thickness (0.2mm) of the glass substrates G1 and G2, the glass substrates G1 and G2 must be cut from both sides of the mother substrate G in the cutting step. If the glass substrates G1 and G2 are cut from both sides of the mother substrate G in this manner, fine cracks or breakage may occur at the edges of the glass substrates G1 and G2, and the strength of the glass substrates G1 and G2 may be reduced.

On the other hand, when the distance W1 is 0.6mm to 1.4mm, the amount of penetration of the crack in the glass substrate G2 is small, but the amount of penetration of the crack in the glass substrate G1 is large. When the amount of penetration of the crack in the glass substrate G1 is large, the glass substrate G2 having a small amount of penetration of the crack may be cut from only one side of the mother substrate G in the cutting step, and the glass substrate G1 having a deep crack may be simultaneously broken along the crack in the cutting operation. If the glass substrates G1 and G2 are cut from only one side of the mother substrate G in this manner, the strength of the glass substrates G1 and G2 is kept high without causing fine cracks or breakage at the edges of the glass substrates G1 and G2.

For the above reasons, it is preferable that the cracks penetrate into any of the glass substrates G1 and G2 in a large amount in the division of the mother substrate G. In this experiment, as shown in fig. 5(a), if the distance W1 between the 2 scribing wheels 301 and 401 exceeds 0.6mm, the amount of penetration of the crack in the glass substrate G1 becomes larger than that in the comparative example (W1 is 0 mm). In this case, it is preferable that the distance W1 between the 2 scribing wheels 301 and 401 is 0.6mm or more. By setting the distance W1 between the 2 scribing wheels 301 and 401 in this manner, the mother substrates G can be cut appropriately.

< scribing method 2 >

In the scribing method (scribing method 1) shown in fig. 4(a) to (c), the surface of the mother substrate G on the side opposite to the scribing wheel 301 (negative side of Z axis) is not pressed by a roller, and the surface of the mother substrate G on the side opposite to the scribing wheel 401 (positive side of Z axis) is not pressed by a roller. In contrast, in the scribing method, the surface of the mother substrate G opposite to the scribing wheel 301 (negative Z-axis side) and the surface of the mother substrate G opposite to the scribing wheel 401 (positive Z-axis side) are pressed by rollers. As the pressing member for pressing the surface opposite to the scribing wheels 301 and 401, other members than rollers may be used.

Fig. 6(a) and (b) are diagrams for explaining the scribing method 2. Fig. 6(a) is a schematic view when the vicinity of the scribe line position is viewed from the Y-axis negative side, and fig. 6(b) is a schematic view when the vicinity of the scribe line position is viewed from the X-axis positive side.

As shown in fig. 6(a), in the scribing method, the surface of the mother substrate G opposite to the scribing wheel 301 (Z-axis negative side) is pressed by 2 rollers 402, and the surface of the mother substrate G opposite to the scribing wheel 401 (Z-axis positive side) is also pressed by 2 rollers 302. The 2 rollers 302 are disposed so as to sandwich the scribing wheel 301, and are rotatable about the shaft 302a as a rotation axis. The 2 rollers 402 are disposed so as to sandwich the scribing wheel 401, and are rotatable about a shaft 402a as a rotation axis.

As in the scribing method 1, the 2 scribing wheels 301 and 401 are shifted in the scribing direction (X-axis direction) by a distance W1. In the case of the scribing method 2, the lower scribing wheel 401 may precede the upper scribing wheel 301. The 2 scribing wheels 301 and 401 are moved along the sealing material SL while being pressed against the glass substrates G1 and G2, respectively. A gap in the Y axis direction exists between the scribing wheel 301 and the 2 rollers 302, and a gap in the Y axis direction also exists between the scribing wheel 401 and the 2 rollers 402. Therefore, the rollers 302 and 402 move in the positive X-axis direction so as to straddle the scribe lines L1 and L2 formed by the scribe wheels 301 and 401.

< experiment 2 >

The inventors performed an experiment for forming a scribe line on a mother substrate G by the scribing method shown in fig. 6(a) and (b). The following describes the experiment and the experimental results.

The mother substrates G and the scribing wheels 301 and 401 used in this experiment are the same as those in experiment 1. In this experiment, the distance W1 between the scribing wheels 301 and 401 was set to 2.2 mm. The moving speed of the scribing wheels 301 and 401 is set to be constant (200 mm/sec). The eccentricity of the scribing wheel 301 with respect to the load center of the upper scribing head 2 is 1.0mm, and the eccentricity of the scribing wheel 401 with respect to the load center of the lower scribing head 2 is 3.2 mm.

The center positions of the axes 301a and 401a of the scribing wheels 301 and 401 are aligned with the center positions of the axes 302a and 402a of the rollers 302 and 402 in the Z-axis direction, respectively, and the diameters of the rollers 302 and 402 are set to be 3mm in the same manner as the diameters of the scribing wheels 301 and 401, respectively.

Based on the above conditions, the amount of penetration of cracks in the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.

Fig. 7(a) to (e) show the experimental results. Fig. 7(a) is a graph in which the penetration amount of cracks and the rib amount are numerically represented, and fig. 7(b) to (e) are sectional photographs of the mother substrate G on a scribe line, the sectional photographs being taken under loads of 6N, 7N, 8N, and 9N, respectively. In fig. 5(b) to (e), D1 and D3 indicate rib widths, and D2 and D4 indicate penetration widths of cracks.

Referring to fig. 7(a), it is understood that if the load is changed from 5N to 6N, the amount of penetration of the crack in the glass substrate G1 increases rapidly. In addition, if the load exceeds 6N, the penetration amount of the crack of the glass substrate G1 exceeds 80% of the thickness (0.2mm) of the glass substrate G1, and the crack enters the glass substrate G1 with a large penetration amount. As described above, if the crack enters any one of the glass substrates G1, G2 with a large penetration amount, the mother substrate G can be properly divided in the cutting step. Therefore, it can be said that in the scribing method 2, it is preferable to set the load applied to the scribing tools 30 and 40 to 6N or more.

In addition, in this experiment, the amount of penetration into the crack of the glass substrate G1 was larger than in experiment 1. In this experiment, since the lower side of the scribing wheel 301 is supported by the roller 402 and the upper side of the scribing wheel 401 is supported by the roller 302, the mother substrate G is prevented from being deformed by the pressing force of the blades of the scribing wheels 301 and 401. Therefore, it is preferable that the surface of the mother substrate G opposite to the scribing wheels 301 and 401 is pressed by the rollers 402 and 302 as in the scribing method 2 in order to form the crack stably with a large amount of penetration of the crack.

< marking tool >

Fig. 8(a) and (b) are perspective views showing configuration examples of the scribing tools 30 and 40 used in the scribing method 2.

The scribing tools 30 and 40 have the same configuration except for the arrangement order of the scribing wheels 301 and 401 and the rollers 302 and 402. The scribing tools 30 and 40 are provided with holders 303 and 403 for holding scribing wheels 301 and 401 and rollers 302 and 402, respectively. The holders 303, 403 are provided with grooves 303a, 403a to which the scribing wheels 301, 401 are attached, grooves 303b, 403b to which the rollers 302, 402 are attached, and inclined surfaces 303c, 403 c. The scribing wheels 301, 401 are mounted by fitting the shafts 301a, 401a into holes of the holders 303, 403. The rollers 302, 402 are mounted by inserting the shafts 302a, 402a into the holes of the holders 303, 403.

Fig. 9(a) and (b) are views schematically showing a method of attaching the scribing tool 30 to the scribe line forming mechanism 22. Fig. 9(a) and (b) show the inside of the see-through scribe line forming mechanism 22.

A holding portion 221 for holding the scribing tool 30 is provided at the lower end of the scribing line forming mechanism 22, and a hole 222 into which the scribing tool 30 can be inserted is formed in the holding portion 221. A magnet 224 is provided at the bottom of the hole 222, and a pin 223 is provided at an intermediate position of the hole 222. The holder 303 of the scribing tool 30 includes a ferromagnetic body. The holding portion 221 is supported by the scribe line forming mechanism 22 via a bearing, not shown, so as to be rotatable 360 degrees in the horizontal direction.

When the scribing tool 30 is attached to the scribe line forming mechanism 22, the holder 303 of the scribing tool 30 is inserted into the hole 222 of the holding portion 221. The holder 303 adheres to the magnet 224 if the upper end of the holder 303 approaches the magnet 224. At this time, the inclined surface 303c of the holder 303 abuts on the pin 223, and the holder 303 is positioned at the normal position. In this way, as shown in fig. 9(b), the scribing tool 30 is attached to the lower end of the scribe line forming mechanism 22.

The scribing tool 40 is also mounted on the lower end of the scribe line forming mechanism 22. In this way, if the scribing tools 30 and 40 are respectively attached to the scribing line forming mechanisms 22 of the corresponding scribing heads 2, the roller 402 is positioned at a position corresponding to the scribing wheel 301 and the roller 302 is positioned at a position corresponding to the scribing wheel 401 as shown in fig. 6(a) and (b). By using the scribing tools 30 and 40 having the configurations shown in fig. 8(a) and (b), the scribing wheels 301 and 401 and the rollers 402 and 302 can be opposed to each other while keeping the distance W1 between the scribing wheel 301 and the scribing wheel 401 at a specific distance simply by attaching the scribing tools 30 and 40 to the scribing forming mechanisms 22 of the corresponding scribing heads 2.

The experiment 2 was performed using the scribing tools 30 and 40 having the configurations shown in fig. 8(a) and (b). The experiment 1 was performed using the scribing tools 30 and 40 in which the grooves 303b and 403b were omitted from the holders 303 and 403, and only the scribing wheels 301 and 401 were attached to the holders 303 and 403 having only the grooves 303a and 403a, respectively.

< scribing control >

Next, scribing control by the scribing apparatus 1 will be described.

Fig. 10(a) is a block diagram showing the configuration of the scribing apparatus 1.

The scribing device 1 includes a control unit 101, a detection unit 102, a drive unit 103, an input unit 104, and a display unit 105.

The control Unit 101 includes a processor such as a CPU (Central Processing Unit) and a Memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and controls each Unit according to a control program stored in the Memory. In addition, the memory is also used as a work area when controlling each part. The detection unit 102 includes various sensors in addition to the cameras 19a and 19b shown in fig. 1 (a). The driving unit 103 includes the mechanism of the scribing apparatus 1 shown in fig. 1(a) and the driving motors 17 and 18. The input unit 104 includes a mouse and a keyboard. The input unit 104 is used for inputting various parameter values in a scribing operation, such as a start position and an end position of scribing, or a scribing interval. The display unit 105 includes a monitor, and displays a specific input screen when an input is made through the input unit 104.

Fig. 10(b) and (c) are diagrams illustrating a problem when the upper and lower scribing wheels 301 and 401 pass through the other scribing lines LV1 and LV2 while being displaced in the scribing direction. Fig. 10(b) is a side view of a part of the mother substrate G, and fig. 10(c) is an enlarged view of the vicinity of the other scribe lines LV1, LV 2.

The other scribe lines LV1, LV2 shown in fig. 10(b) and (c) are formed as follows: in the configuration of fig. 1(a) and (b), the mother substrate G is moved in the Y-axis direction by the conveyor 11 while being held by the handle 11 a. At this time, the upper and lower scribing wheels 301 and 401 are horizontally rotated by 90 degrees from the state shown in fig. 4(a) or 6(a) so that the ridge line is parallel to the Y-axis direction. As described above, the holding portion 221 of fig. 9 is supported by a bearing, not shown, so as to be rotatable 360 degrees in the horizontal direction. Therefore, when the mother substrate G is moved in the Y-axis direction by the conveyor 11 in a state where the upper and lower scribing wheels 301 and 401 are pressed against the upper and lower surfaces of the mother substrate G, the holding portion 221 rotates to position the scribing wheels 301 and 401 so that the ridgelines are parallel to the Y-axis direction.

At this time, the upper and lower scribing wheels 301 and 401 are displaced from each other by a predetermined distance in the Y-axis direction. The upper and lower scribing wheels 301 and 401 are positioned directly above and below the sealing material SL shown in fig. 4(c), respectively. In this way, the mother substrate G is moved in the Y-axis direction by the conveyor 11 in a state where the upper and lower scribing wheels 301 and 401 are pressed against the upper and lower surfaces of the mother substrate G, whereby the scribing lines LV1 and LV2 parallel to the Y-axis direction are formed on the upper and lower surfaces of the mother substrate G. The scribe lines LV1, LV2 are formed with the number of seal materials SL arranged in the X-axis direction.

After the scribe lines LV1 and LV2 are formed in this manner, the scribe head 2 is moved in the X-axis direction to form scribe lines L1 and L2 parallel to the X-axis direction. Therefore, in the forming operation of the scribe lines L1 and L2, the upper and lower scribe wheels 301 and 401 pass through the scribe lines LV1 and LV2 perpendicularly crossing the scribe lines L1 and L2.

As verified in the above experiments 1 and 2, when the scribe lines are simultaneously formed on both surfaces of the mother substrate G, it is preferable that the upper scribing wheel 301 and the lower scribing wheel 401 are shifted by a predetermined distance in the scribing direction. However, if this scribing method is also applied to the upper and lower scribing wheels 301 and 401 as shown in fig. 10(b) and the scribing wheels pass through the scribing lines LV1 and LV2, forces F1 and F2 in opposite directions are applied from the scribing wheels 301 and 401 to the positions crossing the scribing lines LV1 and LV2 as shown in fig. 10 (c). Thus, when the scribing wheels 301 and 401 pass the scribe lines LV1 and LV2, the cracks C1 and C2 enter from the scribe lines LV2 and LV 2.

This problem can occur not only when the rollers 302 and 402 are not arranged as in the scribing method 1, but also when the rollers 302 and 402 are arranged as in the scribing method 2. That is, even when the rollers 302 and 402 are provided as in the scribing method 2, the scribing wheels 301 and 401 are firmly pressed against the surface of the mother substrate G by the position adjustment of the scribing wheels 301 and 401 with respect to the load center or the relative position adjustment of the scribing wheels 301 and 401 and the rollers 302 and 402 in the vertical direction (Z-axis direction). At this time, the rollers 302 and 402 suppress the bending of the mother substrate G only from the opposite side of the scribing wheels 301 and 401, and do not firmly press against the surface of the mother substrate G. Therefore, even when the rollers 302 and 402 are provided as in the scribing method 2, as shown in fig. 10(C), forces F1 and F2 in opposite directions are applied from the scribing wheels 301 and 401 to positions across the scribing lines LV1 and LV2, and when the scribing wheels 301 and 401 pass through the scribing lines LV1 and LV2, cracks C1 and C2 enter from the scribing lines LV2 and LV 2.

Therefore, in the present embodiment, the upper and lower scribing wheels 301 and 401 are controlled substantially simultaneously by the other scribing lines LV1 and LV 2. Here, in a range other than the passing position of the other scribing lines LV1, LV2, the lower scribing wheel 401 is controlled to advance in the scribing direction with respect to the upper scribing wheel 301.

Fig. 11 is a flowchart showing scribing control. The scribing control shown in fig. 11 is a control for forming a scribe line on both surfaces of the mother substrate G by moving the scribing tools 30 and 40 without moving the conveyor belt 11 of fig. 1 (a). Before the scribing control shown in fig. 11 is executed, the conveyor belt 11 is moved without moving the scribing tools 30 and 40 as described above to form the scribing lines LV1 and LV2 on both surfaces of the mother substrate G.

The scribing control shown in fig. 11 is performed by the control unit 101 in fig. 10 (a). Fig. 12(a) to 14(b) are diagrams schematically showing the positions of the scribing tools 30 and 40 at a specific control sequence. Here, the scribing tools 30 and 40 shown in fig. 8(a) and (b) are used. Instead of this, the scribing tools 30 and 40 in which the rollers 302 and 402 are omitted may be used.

Referring to fig. 11, the control unit 101 processes the captured images of the cameras 19a and 19b to detect the position of the mother substrate G (S11). Based on the detection result, the control unit 101 sets the initial position of the scribing head 2 (scribing tools 30 and 40) above and below each scribe line and the switching timing of the feeding control for each scribing head 2 (S12). In addition, the control unit 101 stores the positions of the scribe lines LV1 and LV2 in advance in the previous forming operation of the scribe lines LV1 and LV 2. The control unit 101 sets a switching timing of the feeding control for each scribing head 2 based on the positions of the scribed lines LV1, LV 2.

Next, the control unit 101 moves the upper and lower scribing heads 2 to the start positions of the target scribing lines L1 and L2 (S13). Fig. 12(a) is a diagram showing the state of the scribing tools 30 and 40 at this time. In this state, the scribing wheel 301 and the roller 402 are aligned in the X-axis direction, and the scribing wheel 401 and the roller 302 are aligned in the X-axis direction.

In this state, the control unit 101 drives the servo motors 28 of the upper and lower scribing heads 2 to press the scribing tools 30 and 40 against the upper and lower surfaces of the mother substrate G with a predetermined load, respectively (S14). Fig. 12(b) is a diagram showing the state of the scribing tools 30 and 40 at this time. In this state, in a state where the positions of the scribing wheels 301 and 401 are displaced from each other in the X axis direction, the scribing wheels 301 and 401 are pressed against the position facing the sealing material SL on the upper surface of the mother substrate G and the position facing the sealing material SL on the lower surface of the mother substrate G, respectively.

In a state where the scribing tools 30 and 40 are pressed against both surfaces of the mother substrate G in this manner, the control unit 101 drives the driving motors 17 and 18 to move the upper and lower scribing heads 2 at the same speed Vn (S15). Therefore, the scribing operation is performed on both surfaces of the mother substrate G while maintaining the interval between the scribing wheels 301 and 401.

Then, the control unit 101 waits for the timing Tb before the passage (S16). The previous timing Tb is a timing at which the leading lower scribing wheel 401 reaches the position Pb just before a specific distance from the position Pp of the next other scribe lines LV1, LV 2. When the passing timing Tb arrives (S16: yes), the control unit 101 decreases the moving speed of the lower scribing head 2 from the speed Vn to the speed Vs (S17). Thereby, the scribing wheel 301 on the upper side gradually approaches the scribing wheel 401 on the lower side. Fig. 13(a) is a diagram showing the state of the scribing tools 30 and 40 at this time.

Then, the control unit 101 waits for the passage timing Tp to arrive (S18). The passage timing Tp is a timing at which the leading lower scribing wheel 401 reaches the position Pp of the next other scribe line LV1, LV 2. When the passage timing Tp arrives (S18: yes), the control unit 101 increases the moving speed of the lower scribing head 2 from the speed Vs to the speed Vf (S19).

Fig. 13(b) is a diagram showing the state of the scribing tools 30 and 40 at this time. As shown in fig. 13(b), at the passage timing Tp, the upper scribing wheel 301 overtakes the lower scribing wheel 401, and the upper and lower scribing wheels 301 and 401 pass other scribing lines LV1 and LV2 substantially simultaneously. In this way, at the passage timing Tp, the speed Vs in S17 in fig. 11 is adjusted so that the upper scribing wheel 301 catches up with the lower scribing wheel 401.

When the scribing wheels 301 and 401 pass the other scribing lines LV1 and LV2 in this manner, in S19, the moving speed of the lower scribing head 2 is increased from the speed Vs to the speed Vf. Here, the speed Vf is set higher than the speed Vn. Therefore, after passing through the other scribing lines LV1, LV2, the lower scribing wheel 401 gradually advances with respect to the upper scribing wheel 301. Fig. 14(a) is a diagram showing the state of the scribing tools 30 and 40 at this time.

Then, the control unit 101 waits for the post-passage timing Ta to arrive (S20). The post-passage timing Ta is a timing at which the leading lower scribing wheel 401 reaches the position Pa advanced by a specific distance from the position Pp of the other scribe lines LV1 and LV2 which has just passed. When the passage timing Ta arrives (S20: yes), the controller 101 decreases the moving speed of the lower scribe head 2 from the speed Vf to the speed Vn (S21). Thus, the moving speeds of the upper and lower scribing wheels 301 and 401 are the same.

Fig. 14(b) is a diagram showing the state of the scribing tools 30 and 40 at this time. As shown in fig. 14(b), at the post-passage timing Ta, the upper scribing wheel 301 faces the lower roller 402, and the lower scribing wheel 401 faces the upper roller 302. In this way, the interval between the upper and lower scribing wheels 301 and 401 is maintained at a desired interval. In this way, at the post timing Ta, the speed Vf in S19 in fig. 11 is adjusted so that the interval between the upper scribing wheel 301 and the lower scribing wheel 401 becomes a desired interval.

Then, the control unit 101 determines whether or not the scribing operation for the scribe line is finished (S22). That is, the control unit 101 determines whether or not the scribe line position is close to the end position of the scribe line, and the other scribe lines LV1, LV2 do not come further. If the scribing operation is not completed (no in S22), controller 101 returns the process to S16 and continues the scribing operation. When the scribing operation is completed (no in S22), the control unit 101 continues the scribing operation to the scribing completion position, and drives the servo motors 28 of the upper and lower scribing heads 2 to separate the scribing tools 30 and 40 from the upper and lower surfaces of the mother substrate G, respectively (S23).

Then, the control unit 101 determines whether or not the processing for moving the upper and lower scribe heads 2 is finished for all the scribe lines set in advance (S24). If the processing for all scribe lines has not been completed (no in S24), control unit 101 returns the processing to S13 and executes the processing for the next scribe line. When the processing for all the drawn lines is finished in this manner (yes in S24), the control unit 101 ends the processing.

Fig. 15 is a timing chart showing the scribing control. In the lower part of fig. 15, a drive signal for the upper scribe head 2 and a drive signal for the lower scribe head 2 are shown. These drive signals are applied to the drive motors 17 and 18 shown in fig. 1(a), respectively. In the upper part of fig. 15, the relative positions of the scribing wheels 301 and 401 and the position on the mother substrate G in the scribing direction are shown.

As described above, the position Pp is a position where the scribe lines LV1, LV2 are formed, and the positions Pa, Pb are a position advanced from the position Pp by a certain distance and a position just before the certain distance, respectively. As described above, the passage timing Tp, the post-passage timing Ta, and the pre-passage timing Tb are timings corresponding to the positions Pp, Pa, and Pb, respectively.

The drive signal of the upper scribe head 2 is maintained at a level Dn throughout the entire scribing operation. The driving signal of the lower scribe head 2 is set to the level Ds from the pre-passage timing Pb to the passage timing Pp, set to the level Df from the passage timing Pp to the post-passage timing Pa, and set to the level Dn in the other periods. Therefore, in the range Rc, the moving speeds of the upper and lower scribing wheels 301 and 401 are Vn, and the interval between the scribing wheels 301 and 401 is maintained at a specific interval. In the range Rb, the moving speeds of the upper and lower scribing wheels 301 and 401 are Vn and Vs, respectively (Vn > Vs), and the interval between the scribing wheels 301 and 401 gradually decreases. Further, in the range Ra, the moving speeds of the upper and lower scribing wheels 301 and 401 are Vn and Vf, respectively (Vn < Vf), and the interval between the scribing wheels 301 and 401 gradually increases.

By this control, the positions of the upper and lower scribing wheels 301 and 401 are matched at the timing Pp, and the upper and lower scribing wheels 301 and 401 pass through the other scribing lines LV1 and LV2 at substantially the same time. This control is repeated similarly every time another scribe line LV1, LV2 comes. Therefore, the positions of the upper and lower scribing wheels 301 and 401 coincide with each other at the passage timing Pp of all the other scribing lines LV1 and LV 2. In the range Rc, the scribing operation is performed while maintaining the interval between the upper and lower scribing wheels 301 and 401 at a predetermined distance. Therefore, in the range Rc occupying most of the scribe line, as shown in the above experiments 1 and 2, a crack having a good depth is formed.

< effects of the embodiment >

According to the present embodiment, the following effects are exhibited.

As shown in experiments 1 and 2, a scribe line can be formed with a deep crack at a position directly above the sealing material SL. In particular, as in the scribing method 2, by pressing the side opposite to the scribing wheels 301 and 401 with the rollers 302 and 402, the amount of penetration of the crack can be increased and the crack can be stably formed.

Further, since the scribing wheels 301 and 401 are adjusted to move so that the scribing wheels 301 and 401 pass through the other scribing lines LV1 and LV2 orthogonal to the scribing lines L1 and L2 at substantially the same time, forces F1 and F2 in opposite directions are not applied from the scribing wheels 301 and 401 to positions across the other scribing lines LV1 and LV 2. Accordingly, when the scribing wheels 301 and 401 pass the other scribing lines LV1 and LV2, cracks are not generated from the other scribing lines LV1 and LV2, and the other scribing lines LV1 and LV2 can be appropriately divided.

In the range Ra of fig. 15, the scribing wheel 401 is advanced relative to the scribing wheel 301 by making the moving speed of the scribing wheel 401 faster than the moving speed of the scribing wheel 301. Accordingly, cracks may be formed on both surfaces of the mother substrate G with a space between the scribing wheel 401 and the scribing wheel 301.

In the range Rc of fig. 15, the movement speed of the scribing wheel 301 is made equal to the movement speed of the scribing wheel 401, so that the distance between the scribing wheel 401 and the scribing wheel 301 is maintained at a predetermined distance. Therefore, cracks can be formed satisfactorily in the mother substrate G without unevenness.

In the range Rc of fig. 15, the moving speed of the scribing wheel 401 is made slower than the moving speed of the scribing wheel 301, so that the scribing wheel 301 catches up with the scribing wheel 401 at the position Pp where the other scribing lines LV1, LV2 are formed. Therefore, cracks are formed on both surfaces of the mother substrate G, and the scribing wheels 301 and 401 can pass the other scribing lines LV1 and LV2 substantially simultaneously.

While the embodiments of the present invention have been described above, the present invention is not limited to the embodiments, and various modifications other than the above-described modifications may be made to the embodiments of the present invention.

< example 1 of variation

For example, the method of displacing the scribing wheel 301 relative to the scribing wheel 401 is not limited to the method described in the above embodiment, and other methods may be used.

Fig. 16 is a timing chart showing the scribing control in modification 1. The timing chart of fig. 16 corresponds to the timing chart of fig. 15.

In the above embodiment, the position Pp is controlled such that the upper scribing wheel 301 overtakes the lower scribing wheel 401, and in the modification 1, the upper scribing wheel 301 overtakes the lower scribing wheel 401 at the position Pb1 just before the position Pp by a predetermined distance.

That is, in the modification 1, at the timing Tb2 corresponding to the position Pb2, the drive signal for the lower scribing head 2 is set to the level Ds, and the moving speed of the lower scribing wheel 401 is decelerated to the speed Vs. Thus, in the range Rb2, the distance between the upper and lower scribing wheels 301 and 401 gradually decreases, and the upper scribing wheel 301 overtakes the lower scribing wheel 401 at the position Pb 1.

At a timing Tb1 corresponding to the position Pb1, the driving signal for the lower scribing head 2 is returned to the level Dn, and the moving speed of the lower scribing wheel 401 is increased to the speed Vn. Accordingly, in the range Rb1 and the range Ra1, the upper and lower scribing wheels 301 and 401 move in the scribing direction at the speed Vn without any delay. Therefore, the upper and lower scribing wheels 301 and 401 pass through the other scribing lines LV1 and LV2 at substantially the same time.

Further, at a timing Ta1 corresponding to the position Pa1, the driving signal for the lower scribing head 2 is increased to the level Df, and the moving speed of the lower scribing wheel 401 is increased to the speed Vf. Accordingly, in the range Ra2, the distance between the upper and lower scribing wheels 301 and 401 gradually increases, and the lower scribing wheel 401 advances by a predetermined distance from the upper scribing wheel 301 at the position Pa 2. At the position Pa2, the upper and lower scribing wheels 301 and 401 are positioned as shown in fig. 14 (b).

Then, at a timing Ta2 corresponding to the position Pa2, the driving signal for the lower scribing head 2 is returned to the level Dn, and the moving speed of the lower scribing wheel 401 is decelerated to the speed Vn. Thus, in the range Rc, the upper and lower scribing wheels 301 and 401 are moved while maintaining the interval between the upper and lower scribing wheels 301 and 401 at a predetermined distance. The above control is repeated every time other scribe lines LV1, LV2 come.

According to modification 1, the upper and lower scribing wheels 301 and 401 are positioned in the front and rear ranges Rb1 and Ra1 with the position Pp therebetween. Therefore, compared to the above-described embodiment, it is easier to more reliably cause the upper and lower scribing wheels 301 and 401 to pass through the other scribing lines LV1 and LV2 substantially simultaneously. In the ranges Rb1 and Ra1, the upper and lower scribing wheels 301 and 401 do not move forward and backward and perform the scribing operation, and therefore, as shown in the above-described experiments 1 and 2, the depth of the crack becomes shallow. In view of this, it is preferable to set the ranges Rb1 and Ra1 as narrow as possible.

< modification 2 >

In the above-described embodiment and modification 1, only the moving speed of the lower scribe head 2 is changed, but only the moving speed of the upper scribe head 2 may be changed, or both the moving speeds of the upper and lower scribe heads 2 may be changed.

Fig. 17 is a timing chart showing the scribing control in modification 2. In modification 2, in the range Rb2 of modification 1, the moving speed of the upper scribing head 2 is increased instead of decelerating the lower scribing head 2. Specifically, in the range Rb2, the drive signal of the upper scribe head 2 is set to the level Df. This increases the moving speed of the upper scribing head 2 to a speed Vf, and the upper scribing wheel 301 overtakes the lower scribing wheel 401 at the position Pb 1. According to modification 2, the same effects as those of modification 1 can be exhibited.

In the case where only the moving speed of the scribe head 2 on the upper side is changed, the driving signal of the scribe head 2 on the upper side in the range Ra2 is set to the level Df, and the driving signal of the scribe head 2 on the lower side in the range Ra2 is set to the level Dn in the timing chart of fig. 17. Similarly, in the timing chart of fig. 15, control may be performed to change only the moving speed of the upper scribe head 2, or control may be performed to change both the moving speeds of the upper and lower scribe heads 2.

< example 3 >

Fig. 18 is a timing chart showing the scribing control in modification 3. In modification 3, the drive signal of the upper scribe head 2 and the drive signal of the lower scribe head 2 are set to Dn and Df, respectively, from the timing Ta1 corresponding to the position Pa1 to the timing Tc corresponding to the position Pc, and the drive signal of the upper scribe head 2 and the drive signal of the lower scribe head 2 are set to Df and Dn, respectively, from the timing Tc corresponding to the position Pc to the timing Tb1 corresponding to the position Pb 1. Here, the position Pc is an intermediate position between the position Pa1 and the position Pb 1.

Then, in the range Rc1, the scribing wheel 401 on the lower side gradually advances with respect to the scribing wheel 301 on the upper side, and in the range Rc2, the scribing wheel 301 on the upper side gradually catches up with respect to the scribing wheel 401 on the lower side. At the position Pb1, the positions of the upper and lower scribing wheels 301 and 401 coincide in the scribing direction, and then the upper and lower scribing wheels 301 and 401 move in the scribing direction at the same moving speed Vn. Therefore, in modification 3, the upper and lower scribing wheels 301 and 401 pass through the other scribing lines LV1 and LV2 substantially simultaneously. According to modification 3, the same effects as those of the above-described embodiment and modifications 1 to 3 can be exhibited.

In the above-described embodiment and modifications 1 to 3, when the upper and lower scribing wheels 301 and 401 are spaced apart from each other, the lower scribing wheel 401 is always advanced, but instead of this, the upper scribing wheel 301 may be always advanced, or the advanced scribing wheels may be switched at a specific timing. For example, the preceding scribing wheel may be switched every time another scribing line LV1 or LV2 passes.

< example 4 >

In the above-described embodiment and modifications 1 to 3, the load of pressing the upper and lower scribing wheels 301 and 401 against the upper and lower surfaces of the mother substrate G is set to be constant over the entire length of the scribing line. However, the load of pressing the upper and lower scribing wheels 301 and 401 against the upper and lower surfaces of the mother substrate G may be controlled to vary depending on the position of the scribing line.

Fig. 19 is a timing chart showing the scribing control in modification 4. In the timing chart of fig. 19, a timing chart of the load applied to the upper and lower scribing tools 30 and 40 is added to the lower stage of the timing chart of fig. 15. As shown in fig. 19, in modification 4, the load applied to the upper and lower scribing tools 30 and 40 is reduced from N0 to NL in the vicinity of the position Pp, that is, in a range where the interval between the upper and lower scribing wheels 301 and 401 is 0 or relatively narrow.

By adjusting the pressure contact load of the scribing tools 30 and 40 in this manner, an excessive load is not applied to the mother substrate G in the vicinity of the position Pp. In the vicinity of the position Pp, the positions of the scribing wheels 301 and 401 are substantially matched, and thus the mother substrates G are directly held by the scribing wheels 301 and 401. Therefore, the mother substrates G receive a larger force from the scribing wheels 301 and 401 than in the case where the scribing wheels 301 and 401 are displaced from each other in the scribing direction. By the control of fig. 19, the load is reduced near the position Pp, thereby preventing the mother substrates G from receiving excessive force from the scribing wheels 301 and 401. Therefore, a crack having an appropriate depth can be formed in the vicinity of the position Pp without damaging the mother substrate G.

The press contact load N0 in the range Rc is adjusted so that a crack of a desired depth is formed when the distance between the scribing wheels 301 and 401 is a specific distance.

< example 5 >

Fig. 20 is a timing chart showing the scribing control in modification 5. Modification 5 is a control for adjusting the pressure load added to the control of modification 2. In the timing chart of fig. 20, a timing chart of the load applied to the upper and lower scribing tools 30 and 40 is added to the lower stage of the timing chart of fig. 17.

As shown in fig. 20, in modification 5, the load applied to the upper and lower scribing tools 30 and 40 is reduced from N0 to NL in the range Rb1 and the range Ra1 across the position Pp. According to modification 5, the same effects as those of modification 4 can be obtained. Further, in the modified examples 1 and 3, it is preferable that the loads applied to the upper and lower scribing tools 30 and 40 be adjusted in the same manner.

< other modification >

In the above embodiment, the scribing wheel having the grooves formed at the ridge line of the tip at regular intervals is used, but it is conceivable that the same effect can be obtained even if the scribing wheel having no grooves formed at the ridge line is used. The size and shape of the scribing wheel (cutting edge) are not limited to those described in the above embodiments, and other cutting edges of different sizes, shapes, and kinds may be used as appropriate.

In the above embodiment, as shown in fig. 12(a), the interval between the scribing wheels 301 and 401 is already set to a desired interval at the start position of scribing, but the method of setting the interval between the scribing wheels 301 and 401 to a desired interval is not limited to this, and the interval between the scribing wheels 301 and 401 may be controlled to be a desired interval when the scribing operation is advanced by a specific distance from the start position of scribing.

In the configuration of fig. 6(a) and (b) and fig. 8(a) and (b), the center positions of the axes 301a and 401a of the scribing wheels 301 and 401 are respectively aligned with the center positions of the axes 302a and 402a of the rollers 302 and 402 in the Z-axis direction, and the diameters of the scribing wheels 301 and 401 are respectively identical with the diameters of the rollers 302 and 402. However, the relationship between the scribing wheels 301 and 401 and the rollers 302 and 402 is not limited to this, and various other modifications may be made.

In the configuration of fig. 6(a), (b) and fig. 8(a), (b), a pair of rollers 302, 402 are disposed on both sides of the scribing wheels 301, 401, but a configuration may be conceived in which only one roller 302, 402 is disposed on one side of the scribing wheels 301, 401.

The configuration, thickness, material, and the like of the mother substrate G are not limited to those shown in the above embodiments, and the scribing methods 1 and 2 and the scribing apparatus described above may be used to cut the mother substrate G having another configuration.

The embodiments of the present invention can be modified in various ways within the scope of the technical idea shown in the claims.

[ description of symbols ]

1 scribing device

2 scribing head

30. 40 marking tool

101 control unit

301. 401 line marking wheel

302. 402 roller

G mother substrate

G1, G2 glass substrate

L1 and L2 lines

LV1, LV2 other marking lines

Claims (10)

1. A scribing method, characterized by: forming a scribe line on a mother substrate obtained by bonding a first substrate and a second substrate with a sealing material, and

displacing the first and second blades relative to each other in a scribing direction to move the first and second blades in the scribing direction along the sealing material, thereby forming first and second scribe lines on the surface of the first and second substrates, respectively,

adjusting movement of the first and second blades in such a way that the first and second blades pass other scribe lines intersecting the first and second scribe lines substantially simultaneously,

after passing through the other scribing lines, the first blade and the second blade are displaced from each other in the scribing direction to move the first blade and the second blade in the scribing direction along the sealing material, respectively, thereby forming the first and second scribing lines on the surface of the first substrate and the surface of the second substrate, respectively.

2. The scribing method according to claim 1, wherein:

the first and second blades are displaced from each other by making the moving speed of the first blade different from the moving speed of the second blade.

3. The scribing method according to claim 1 or 2, wherein:

the first and second scribe lines are formed on the surface of the first substrate and the surface of the second substrate by maintaining a displacement between the first blade and the second blade at a certain distance by making a moving speed of the first blade the same as a moving speed of the second blade.

4. The scribing method according to claim 1 or 2, wherein:

the first knife and the second knife pass the other scribe line substantially simultaneously by moving the first knife at a different speed than the second knife.

5. The scribing method according to claim 1 or 2, wherein:

moving a first blade and a first pressing member along the sealing material in the scribing direction while pressing the first pressing member against a position corresponding to the second blade on the surface of the first substrate, and

the second blade and the second pressing member are moved in the scribing direction along the sealing material while the second pressing member is pressed against a position corresponding to the first blade on the surface of the second substrate.

6. A line marking apparatus characterized by: a scribe line is formed on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material, and the scribe line forming apparatus includes:

a first scribe head that forms a scribe line on a surface of the first substrate;

a second scribe head that forms a scribe line on a surface of the second substrate;

a driving unit which moves the first scribing head and the second scribing head in parallel with the mother substrate; and

a control unit for controlling the first scribing head, the second scribing head, and the driving unit;

the control unit:

displacing a first blade of the first scribing head and a second blade of the second scribing head from each other in a scribing direction to move the first blade and the second blade in the scribing direction along the sealing material, thereby forming a first scribing line and a second scribing line on a surface of the first substrate and a surface of the second substrate, respectively,

adjusting movement of the first and second blades in such a way that the first and second blades pass other scribe lines intersecting the first and second scribe lines substantially simultaneously,

after passing through the other scribing lines, the first blade and the second blade are displaced from each other in the scribing direction to move the first blade and the second blade in the scribing direction along the sealing material, respectively, thereby forming the first and second scribing lines on the surface of the first substrate and the surface of the second substrate, respectively.

7. The scribing apparatus according to claim 6, wherein:

the first and second blades are displaced from each other by making the moving speed of the first blade different from the moving speed of the second blade.

8. The scribing apparatus according to claim 6 or 7, wherein:

the control section maintains a displacement between the first blade and the second blade at a specific distance by making a moving speed of the first blade and a moving speed of the second blade the same, and forms the first and second scribe lines on the surface of the first substrate and the surface of the second substrate.

9. The scribing apparatus according to claim 6 or 7, wherein:

the control unit causes the first blade and the second blade to pass through the other scribe lines substantially simultaneously by causing the first blade and the second blade to move at different speeds.

10. The scribing apparatus according to claim 6 or 7, wherein:

the first scribing head has a first pressing member that presses a pressure contact position of the second blade from a surface of the first substrate in a state where the first blade is displaced in the scribing direction along the sealing material with respect to the second blade,

the second scribing head has a second pressing member that presses a press contact position of the first blade from a surface of the second substrate in a state where the second blade is displaced in the scribing direction along the sealing material with respect to the first blade.

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