JP2018069610A - Crack extending method and substrate parting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crack extending method which can extend the crack along the scribe line without reversing the substrate and a substrate parting system applying this crack extending method.SOLUTION: The crack extending method consists of a process to form a scribe line 15a along the surface of substrate 15 while pressing the tooth point against the surface of the substrate 15, and a process to give flexure moment M1 to the substrate 15 in the direction that cracks CL1, CL2 close. At the process of forming the scribe line 15a, at least at one end of the scribe line 15a, the tooth point load is increased, and crack CL2 is made to penetrate to the surface of the opposite side of the substrate 15. At the process of giving the flexure moment M1, the flexure moment M1 is given to the substrate 15 in the direction that the cracks CL1, CL2 close with one end of the scribe line 15a as the starting point.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a crack extension method for extending a crack in a substrate and a substrate cutting system for cutting a substrate.

  Dividing a brittle material substrate such as a glass substrate is performed by a scribe process for forming a scribe line on the substrate surface and a break process for dividing the substrate along the formed scribe line. In the scribing step, the cutting edge is moved along a predetermined line while being pressed against the substrate surface. A scribe device equipped with a scribe head is used to form the scribe line.

  The following Patent Document 1 describes an apparatus that divides a substrate along a scribe line. In this apparatus, the substrate is divided along the scribe line by pressing the upper surface of the end portion of the substrate with the break bar while the substrate is sandwiched from above and below by the clamp bar.

JP 2014-18962 A

  Generally, in the substrate cutting step, the substrate is bent in a direction to open a crack in the substrate thickness direction formed in the scribe step. By bending the substrate in this manner, the crack extends to the surface opposite to the surface on which the crack is formed, whereby the substrate is divided along the scribe line.

  However, in this dividing method, after the scribe line is formed on the substrate, it is necessary to invert the substrate upside down after the scribe process in order to press the opposite surface of the substrate. For this reason, a mechanism for inverting the substrate is required, and the system becomes large. Moreover, in the operation | movement which reverses a board | substrate, unintended stress is applied to a board | substrate and it may be assumed that the extension of a crack arises.

  In view of such a problem, the present invention aims to provide a crack extension method capable of extending a crack along a scribe line without inverting the substrate, and a substrate cutting system to which the crack extension method is applied. And

  A first aspect of the present invention relates to a crack extension method. The crack extension method according to this aspect includes a step of forming a scribe line by a crack in the substrate thickness direction on the surface of the substrate by moving the blade edge along the surface of the substrate while pressing the blade edge against the surface of the substrate, Applying a bending moment to the substrate in a direction in which the crack is closed. In the step of forming the scribe line, at least at one end of the scribe line, the load of the blade edge is increased more than the other part of the scribe line, and the crack penetrates to the surface on the opposite side of the substrate. In the step of applying the bending moment, the bending moment is applied to the substrate in the direction of closing the crack, starting from the one end of the scribe line.

  According to the crack extension method according to this aspect, since a bending moment is applied to the substrate in the direction of closing the crack, after the scribe line is formed on the surface of the substrate, the substrate is turned upside down for extension of the crack. There is no need to let them. Further, since a crack penetrating the substrate is formed at least at one end of the scribe line, the other end of the scribe line is caused by a bending moment in the direction of closing the crack by using this end as a starting point. Up to a depth that penetrates the substrate. Therefore, the vertical crack can be smoothly extended along the scribe line without inverting the substrate.

  In the crack extension method according to this aspect, in the step of applying the bending moment, the pressing force applied to the surface of the substrate on which the scribe line is formed is applied from the one end to the other end. A moving step may be included. If it carries out like this, the crack formed in one edge part of a scribe line can be extended to the other edge part with the movement of pressing force.

  In this case, the step of applying the bending moment may include a step of moving a roller that presses the surface of the substrate on which the scribe line is formed from the one end to the other end. If it carries out like this, the crack formed in one edge part of a scribe line can be extended sequentially to the other edge part with the movement of a roller.

  The crack extension method according to this aspect is suitable for use when the thickness of the substrate is 0.4 mm or less.

  A second aspect of the present invention relates to a substrate cutting system. The substrate cutting system according to this aspect includes a scribing device that moves along the surface of the substrate while pressing a blade edge against the surface of the substrate to form a scribe line due to a crack in the substrate thickness direction on the surface of the substrate; A cutting device that applies a bending moment to the substrate in a direction in which the crack is closed to divide the substrate along the scribe line. The scribing device increases the load on the cutting edge at least at one end of the scribe line more than the other part of the scribe line, and penetrates the crack to the surface on the opposite side of the substrate. The cutting device applies a bending moment to the substrate in the direction of closing the crack, starting from the one end of the scribe line.

  In the substrate cutting system according to this aspect, the cutting device is configured to move a pressing force applied to the surface of the substrate on which the scribe line is formed from the one end to the other end. It can be set as the structure provided.

  For example, the cutting device may include a configuration for moving a roller that presses the surface of the substrate on which the scribe line is formed from the one end to the other end.

  According to the substrate cutting system according to this aspect, the same effect as in the first aspect can be obtained.

  As described above, according to the present invention, it is possible to provide a crack extension method capable of extending a crack along a scribe line without inverting the substrate, and a substrate cutting system to which the crack extension method is applied. it can.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

FIG. 1 is a diagram schematically illustrating a configuration of a scribing apparatus according to an embodiment. 2A and 2B are a front view and a side view, respectively, of the cutting edge according to the embodiment. FIGS. 3A and 3B are diagrams schematically showing an operation of forming a scribe line on the substrate surface by the cutting edge according to the embodiment. FIG. 4 is a diagram schematically showing the configuration of the table according to the embodiment and the step of placing the substrate on the table. FIG. 5A is a block diagram illustrating a configuration of a scribing apparatus according to the embodiment. FIG. 5B is a flowchart showing control at the time of forming a scribe line according to the embodiment. FIGS. 6A to 6C are diagrams each schematically showing the transfer operation of the blade edge when forming the scribe line according to the embodiment. FIGS. 7A to 7C are diagrams each schematically showing the transfer operation of the blade edge when forming the scribe line according to the embodiment. Fig.8 (a) is a figure which shows typically the formation state of the crack in positions other than the edge part of the scribe line which concerns on embodiment. FIG. 8B is a diagram schematically showing the formation of cracks at the end of the scribe line according to the embodiment. FIG. 9 is a perspective view schematically showing a substrate on which a scribe line according to the embodiment is formed. Fig.10 (a) is a top view which shows typically the structure of the cutting device which concerns on embodiment. FIG.10 (b) is a side view which shows typically the structure of the cutting device which concerns on embodiment. Fig.11 (a) is a block diagram which shows the structure of the cutting device which concerns on embodiment. FIG.11 (b) is a flowchart which shows the control at the time of the crack extension which concerns on embodiment. FIGS. 12A and 12B are plan views schematically showing a crack extension method according to a modified example. FIGS. 13A and 13B are plan views schematically showing a crack extension method according to another modification.

  Embodiments of the present invention will be described below with reference to the drawings. In each figure, an X axis, a Y axis, and a Z axis that are orthogonal to each other are added for convenience. The XY plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

  FIG. 1 is a diagram schematically showing the configuration of the scribe device 1.

  The scribing apparatus 1 includes a moving table 10. The moving table 10 is screwed with the ball screw 11. The movable table 10 is supported by a pair of guide rails 12 so as to be movable in the Y-axis direction. When the ball screw 11 is rotated by driving the motor, the movable table 10 moves in the Y-axis direction along the pair of guide rails 12. A motor 13 is installed on the upper surface of the movable table 10. The motor 13 rotates the table 14 positioned on the upper part in the XY plane and positions it at a predetermined angle.

  The table 14 is for supporting the substrate 15. As will be described later, a large number of holes 141 (see FIG. 4) are provided on the surface of the table 14. When a negative pressure is applied to the hole 141 by an air pressure source (not shown), the substrate 15 is adsorbed and fixed to the table 14.

  The substrate 15 is made of a material such as glass. The thickness of the board | substrate 15 is 0.4 mm or less, for example, More preferably, it is 0.3 mm or less.

  The scribing apparatus 1 includes two cameras 16 that image the alignment marks formed on the surface of the substrate 15 above the substrate 15 placed on the table 14. A bridge 17 is installed on the support columns 18a and 18b so as to straddle the movable table 10 and the table 14 on the upper side thereof.

  A guide 19 is attached to the bridge 17. The scribe head 20 is installed so as to move in the X-axis direction while being guided by the guide 19. The scribe head 20 includes a holder joint 21 at the lower end. A holder unit 30 is attached to the holder joint 21, and a cutting edge 40 is fixed to the holder unit 30. The scribe head 20 includes a lifting mechanism (not shown) that lifts and lowers the blade edge 40 together with the holder joint 21. The lifting mechanism includes, for example, a cam mechanism and an air cylinder. By raising and lowering the blade edge 40, the load of the blade edge 40 on the substrate 15 can be changed.

  When a scribe line is formed on the substrate 15 using the scribe device 1, the scribe device 1 positions the substrate 15 with a pair of cameras 16. Then, the scribe device 1 forms a scribe line on the surface of the substrate 15 under the control of FIG. The scribe line forming operation will be described in detail later.

  2A and 2B are a front view and a side view of the blade edge 40, respectively.

  As shown in FIG. 2A, the cutting edge 40 has a shape obtained by cutting off rectangular corners in plan view. In plan view, the cutting edge 40 has an axisymmetric shape. The cutting edge 40 is made of single crystal diamond. A top surface 41 and an inclined portion 42 are formed at each corner portion of the blade edge 40.

  As shown in FIG. 2B, the cutting edge 40 has a predetermined thickness. The inclined portion 42 includes two inclined surfaces 42a and 42b chamfered in a mountain shape. The inclined surfaces 42 a and 42 b are connected by a linear ridge line, and one end thereof is connected to the top surface 41. The two inclined surfaces 42a and 42b are inclined at an equal angle with respect to the front surface and the back surface of the blade edge 40, respectively.

  FIGS. 3A and 3B are diagrams schematically showing an operation of forming a scribe line on the surface of the substrate 15 by the blade edge 40, respectively. FIG. 3B is an enlarged view of one corner portion of FIG.

  As shown in FIGS. 3A and 3B, the cutting edge 40 is attached to the holder unit 30 so that the angle formed by the ridge line of the inclined portion 42 and the surface of the substrate 15 is an angle θ. The angle θ is about 2 to 10 °. During the scribing operation, the corner portion including the top surface 41 on the front side in the scribing direction is pressed against the surface of the substrate 15 among the two corner portions of the cutting edge 40 shown in FIG. The direction indicated by the arrows in FIGS. 3A and 3B is the scribe direction.

  FIG. 4 is a diagram schematically illustrating the configuration of the table 14 and the installation process of the substrate 15 with respect to the table 14.

  A large number of holes 141 are provided in a rectangular region R1 on the upper surface of the table 14. The region R1 is slightly smaller than the upper surface of the table 14. The hole 141 is used to apply air-mediated pressure to the back surface of the substrate 15 placed on the table 14. That is, a negative pressure is applied to the hole 141 by an air pressure source (not shown), whereby the substrate 15 is adsorbed and fixed to the table 14. During the scribe operation, the substrate 15 is adsorbed on the upper surface of the table 14.

  FIG. 5A is a block diagram showing the configuration of the scribe device 1.

  As shown in FIG. 5A, the scribing apparatus 1 includes a control unit 101, a head transfer unit 102, a head drive unit 103, a table drive unit 104, a pressure applying unit 105, a detection unit 106, and an input unit. And an output unit 107.

  The control unit 101 includes an arithmetic processing circuit such as a CPU (Central Processing Unit) and a storage medium such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The control unit 101 controls each unit according to a program stored in the storage medium.

  The head transfer unit 102 is for moving the scribe head 20 in the X-axis direction. The head transfer unit 102 includes a bridge 17 and a guide 19 shown in FIG. 1, a motor for moving the scribe head 20 along the guide 19, and the like. The head drive unit 103 includes a mechanism that raises and lowers the cutting edge 40 attached to the scribe head 20 in the Z-axis direction. The table driving unit 104 includes a motor 13 for rotating the table 14, a ball screw 11 for moving the table 14 in the Y-axis direction, and the like.

  The pressure applying unit 105 is for applying pressure to the back surface of the substrate 15 placed on the table 14. The pressure applying unit 105 includes a hole 141 shown in FIG. 4, an air pressure source for applying a negative pressure to the hole 141, and the like.

  The detection unit 106 includes the camera 16 shown in FIG. 1 and various sensors for detecting the position of each unit during the scribing operation. The input / output unit 107 includes input means such as a touch panel, a mouse, and a keyboard, and output means such as a monitor and a speaker. The input / output unit 107 is used, for example, for setting the size of the substrate 15 and the formation position of the scribe line.

  FIG. 5B is a flowchart showing control at the time of forming a scribe line.

  When the substrate 15 is positioned by the pair of cameras 16 after the substrate 15 is placed on the table 14, the control unit 101 applies pressure to the pressure applying unit 105 to attract the substrate 15 to the table 14 (S10). ). Thereby, the substrate 15 is fixed to the upper surface of the table 14. Next, the control unit 101 positions the cutting edge 40 at a cutting position outside the substrate 15 (S11).

  Thereafter, the control unit 101 causes the head transfer unit 102 to transfer the scribe head 20. Accordingly, the blade edge 40 moves in the positive direction of the X axis with respect to the substrate 15 and moves while being pressed against the surface of the substrate 15. As a result, a groove due to plastic deformation to be a scribe line later is formed on the surface of the substrate 15 (S12).

  The load of the cutting edge 40 pressed against the surface of the substrate 15 in step S12 is set to a load with which a vertical crack having a predetermined depth can be formed in the substrate 15 in step S14 described later. For example, the depth of the crack is set to about half the thickness of the substrate 15.

  The control unit 101 moves the scribe head 20 and continues the groove formation until the cutting edge 40 reaches just before the end position of the scribe line (S13). When the cutting edge 40 reaches just before the end position of the scribe line (S13: YES), the control unit 101 controls the head driving unit 103 to increase the load of the cutting edge 40 on the substrate 15. As a result, the cutting edge 40 forms a groove while being pushed by a predetermined amount in the direction approaching the table 14, and passes through the end position P2 as it is (S14).

  The load of the cutting edge 40 set in step S <b> 14 is set to a load that can penetrate the crack to the surface on the opposite side of the substrate 15. Thereby, a crack penetrating from the upper surface to the lower surface of the substrate 15 is generated below the groove at the end position of the scribe line. Also, starting from this crack, a scribe line is formed by generating a crack of a predetermined depth below the groove other than the terminal position formed in step S12.

  Thereafter, the control unit 101 further moves the scribe head 20 in the positive X-axis direction and moves the blade edge 40 to the outside of the substrate 15 (S15). Thereby, the control part 101 complete | finishes the formation operation of the said scribe line.

  6 (a) to 6 (c) and FIGS. 7 (a) to 7 (c) are diagrams each schematically showing a blade tip transfer operation when forming a scribe line. This operation is performed by steps S12 to S15 in FIG.

  First, in step S <b> 10 of FIG. 5B, the substrate 15 is attracted to the table 14. Next, in step S11 of FIG. 5B, the blade edge 40 is positioned at the cutting position P1 shown in FIG. The cutting position P1 is located at a position deviating from the X-axis negative side edge of the substrate 15 placed on the table 14 to the X-axis negative side. In the cutting position P1, the lower end of the blade edge 40 is positioned at a distance D1 from the upper surface of the table 14 in the positive direction of the Z axis. The distance D1 is smaller than the distance from the table 14 to the surface on the positive side of the Z axis of the substrate 15.

  Furthermore, the cutting edge 40 is transferred to the X axis positive side by step S12 of FIG. As a result, as shown in FIG. 6B, the blade edge 40 was pressed against the upper surface of the substrate 15 and further, the blade edge 40 was pressed against the surface of the substrate 15 as shown in FIG. 6C. In the state, it is transferred in the positive direction of the X axis. The transfer of the cutting edge 40 is continued until it is determined in step S13 in FIG. 5B that the cutting edge 40 has arrived just before the end position of the scribe line. Thus, a groove extending in the X-axis direction is formed on the surface of the substrate 15.

  If it is determined in step S13 that the cutting edge 40 has arrived immediately before the end position of the scribe line, step S14 in FIG. 5B is executed. Accordingly, in front of the terminal position P2 shown in FIG. 7A, the blade edge 40 is pushed in a direction approaching the table 14 by a predetermined amount (Z-axis negative direction), and the pushing position shown in FIG. 7B. It reaches P3 and passes through the end position P2 as it is. By this operation, a deep crack penetrating the substrate 15 is generated (penetrated) in the vicinity of the terminal position P2, and a crack is generated on the entire surface of the groove extending in the X-axis direction formed on the substrate surface, thereby forming a scribe line. .

  Thereafter, the cutting edge 40 is further moved in the positive direction of the X-axis by step S15 of FIG. As a result, the cutting edge 40 is positioned at the end position P4 on the X-axis positive side further than the edge on the X-axis positive side of the substrate 15, as shown in FIG. Thereby, the forming operation of the scribe line is completed. When a plurality of scribe lines are formed on the substrate 15, the processes of steps S10 to S15 are repeated.

  FIG. 8A is a diagram schematically showing a state of a crack CL1 formed as a scribe line in a region where the cutting edge 40 is located immediately before the end position P2 from the start point of the scribe line. As shown in FIG. 8A, the crack CL <b> 1 penetrates to about half of the thickness of the substrate 15.

  FIG. 8B is a diagram schematically showing the state of the crack CL2 formed as the scribe line at the end position of the scribe line. As shown in FIG. 8B, the crack CL2 penetrates to the surface on the opposite side of the substrate 15 and penetrates the substrate 15 up and down.

  FIG. 9 is a perspective view schematically showing the substrate on which the scribe line 15a is formed. As shown in FIG. 9, the crack CL <b> 2 formed at the end on the X axis positive side of the scribe line 15 a penetrates the substrate 15 up and down. The crack CL1 formed in the range of the other scribe line 15a does not penetrate the substrate 15 up and down and stops in the middle of the thickness of the substrate 15.

  After the scribe line 15a is thus formed, a cutting process is performed.

  In the dividing step, a bending moment M1 is applied to the substrate 15 in the direction of closing the cracks CL2 and CL1, starting from the end of the scribe line 15a where the crack CL2 is formed. Thereby, the crack CL1 extends from the crack CL2 to the opposite surface of the substrate 15 in the range up to the other end of the scribe line 15a. Thus, the substrate 15 is divided along the scribe line 15a. The substrate 15 is divided using a cutting device.

  FIG. 10A is a plan view schematically showing the configuration of the cutting device 2, and FIG. 10B is a side view schematically showing the configuration of the cutting device 2.

  The dividing device 2 includes two conveying units 50 and 60 and a pressing head 70.

  The conveyance unit 50 is configured by a belt conveyor in which a belt is stretched between a pair of support shafts 51. The support shaft 51 is supported by the support frame 52. A rotating shaft of a motor 53 is connected to one support shaft 51. Similarly to the conveyance unit 50, the conveyance unit 60 is configured by a belt conveyor in which a belt is stretched around a pair of support shafts 61. The support shaft 61 is supported by the support frame 62. A rotating shaft of a motor 63 is connected to one support shaft 61. The conveyance units 50 and 60 may be configured to convey the substrate 15 by means other than a belt conveyor.

  The pressing head 70 is supported by the guide 71 so as to be movable in the X-axis direction. The guide 71 is supported by a pair of support columns 72. The pressing head 70 moves along the guide 71 by the driving force from the motor 73. A roller 74 is attached to the lower end of the pressing head 70. The rotation axis of the roller 74 is parallel to the Y-axis direction. The pressing head 70 includes an elevating mechanism including a cam mechanism and an air cylinder. The elevating mechanism moves the roller 74 up and down in the Z-axis direction. In a plan view, the roller 74 is disposed at a position of a gap between the conveyance units 50 and 60.

  The substrate 15 is placed on the transport unit 50 so that the surface on which the scribe line 15a is formed is on the positive side of the Z axis, and the scribe line 15a is parallel to the X axis. A crack CL2 penetrating vertically through the substrate 15 is formed at the end on the X-axis positive side of each scribe line 15a. The transport unit 50 transports the substrate 15 in the negative Y-axis direction, and positions the scribe line 15 a at a position immediately above the gap between the transport units 50 and 60. Thereafter, the pressing head 70 is transferred in the negative direction of the X axis, and the crack CL1 extends along the scribe line 15a to a depth that penetrates the substrate 15 up and down. The extension operation of the crack CL1 will be described later with reference to FIG.

  FIG. 11A is a block diagram illustrating a configuration of the cutting apparatus 2.

  As shown in FIG. 11A, the cutting apparatus 2 includes a control unit 201, a head transfer unit 202, a head drive unit 203, a substrate transfer unit 204, a detection unit 205, and an input / output unit 206. I have.

  The control unit 201 includes an arithmetic processing circuit such as a CPU and a storage medium such as a ROM and a RAM. The control unit 201 controls each unit according to a program stored in the storage medium.

  The head transfer unit 202 is for moving the pressing head 70 in the X-axis direction. The head transfer unit 202 includes a column 72, a guide 71, and a motor 73 shown in FIGS. 10 (a) and 10 (b). The head driving unit 203 includes a mechanism for moving the roller 74 attached to the pressing head 70 up and down in the Z-axis direction. The substrate transfer unit 204 includes transfer units 50 and 60 shown in FIGS.

  The detection unit 205 includes various sensors for detecting the position of each unit during the dividing operation. The input / output unit 206 includes input means such as a touch panel, a mouse, and a keyboard, and output means such as a monitor and a speaker. The input / output unit 206 is used, for example, for setting the size of the substrate 15, the formation position of the scribe line, and the like.

  FIG. 11B is a flowchart showing the control during crack extension.

  First, the control unit 201 causes the transfer units 50 and 60 to transfer the substrate 15 so that the scribe line 15a is positioned immediately above the gap between the transfer units 50 and 60 (S20). Next, the control unit 201 controls the head transfer unit 202 to position the roller 74 at a position directly above the end of the scribe line 15a where the crack CL2 is formed (S21). Then, the control unit 201 causes the head driving unit 203 to lower the roller 74 so that the roller 74 is pressed against the upper surface of the substrate 15 with a predetermined load (S22). Thereby, a bending moment in the direction of closing the cracks CL2 and CL1 is applied to the substrate 15.

  Thereafter, the control unit 201 causes the head transfer unit 202 to move the roller 74 toward the other end of the scribe line 15a while maintaining this load (S23). As the roller 74 moves, the position where the bending moment is applied moves along the scribe line 15a. As a result, the crack CL1 in the vicinity of the moving position of the roller 74 sequentially extends to a depth reaching the lower surface.

  The control unit 201 continues the transfer of the roller 74 to the end position of the other end of the scribe line 15a (S24). When the roller 74 reaches the end position of the other end of the scribe line 15a (S24: YES), the crack CL1 extends to the depth at which the crack CL1 reaches the lower surface in the entire range of the scribe line 15a. Thereby, the board | substrate 15 is parted along the scribe line 15a. Thereafter, the control unit 201 stops the movement of the roller 74 and further raises the roller 74 (S25).

  Thus, the dividing process for one scribe line 15a is completed. When the scribe line 15a to be divided remains on the substrate 15, the control unit 201 returns the process to step S20 and executes the division process for the next scribe line 15a. Thus, the substrate 15 is divided along all the scribe lines 15a formed on the upper surface.

<Effect of embodiment>
According to the present embodiment, the following effects are exhibited.

  Since a bending moment is applied to the substrate 15 in the direction of closing the cracks CL2 and CL1, it is not necessary to invert the substrate 15 upside down for the extension of the crack CL1 after the scribe line 15a is formed on the surface of the substrate 15. . Further, since a crack CL2 penetrating the substrate 15 is formed at least at one end portion of the scribe line 15a, the scribe line is caused by a bending moment in a direction in which the cracks CL1 and CL2 are closed by using this end portion as a starting point. The crack CL1 can be extended to a depth penetrating the substrate 15 to the other end of the line 15a. Therefore, it is possible to form a vertical crack that penetrates the substrate 15 up and down smoothly along the scribe line 15a without inverting the substrate 15.

  In addition, when this inventor experimented, when the board | substrate 15 consists of glass, when the thickness of the board | substrate 15 is 0.2 mm or less, it is a crack which penetrates the board | substrate 15 up and down in the edge part of the scribe line 15a. CL2 could be easily formed, and the substrate 15 could be smoothly divided along the scribe line 15a by the bending moment in the direction of closing the cracks CL1 and CL2. Further, as shown in the embodiment, when the crack CL2 is formed using a fixed blade, it is difficult to form the crack CL2 penetrating the substrate 15 up and down if the thickness of the substrate 15 exceeds 0.3 mm. It was confirmed. Therefore, the thickness of the substrate 15 is preferably 0.4 mm or less, and when a fixed blade is used, it can be assumed that the thickness of the substrate 15 is preferably 0.3 mm or less.

  In addition, when the present inventor conducted an experiment, it was confirmed that the depth of the crack CL1 can be better divided as compared with the conventional method of applying a bending moment in the crack opening direction. It was. Therefore, it can be assumed that the load on the blade edge when forming the crack CL1 is preferably set larger than that in the conventional method.

  In the present embodiment, as shown in FIGS. 10A and 10B, the roller 74 that presses the surface of the substrate 15 on which the scribe line 15a is formed is moved from one end of the scribe line 15a to the other. Therefore, the crack CL1 formed on the scribe line 15a can be smoothly and smoothly extended to the opposite surface as the roller 74 moves.

<Example of change>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications other than those described above can be made to the embodiments of the present invention.

  For example, in the above embodiment, the bending moment is applied to the cracks CL2 and CL1 by moving the roller 74 along the scribe line 15a. However, the method of applying the bending moment is not limited to this.

  For example, as shown in FIG. 12A, by lifting the vicinity of the two corners on the negative side of the X axis and folding the substrate 15 so that the position of the scribe line 15a is at the bottom, the cracks CL2 and CL1 are removed. A bending moment M1 may be applied in the closing direction. Also by this method, as indicated by a dotted line in FIG. 12B, the crack CL1 can be extended to a depth penetrating the substrate 15 up and down (in the Z-axis direction), starting from the crack CL2. FIG. 12B shows a state in which the crack CL1 extends to a depth penetrating the substrate 15 up to about ¾ of the entire length of the scribe line 15a. In this case, the cutting device 2 is changed to a configuration in which the vicinity of the two corners on the X-axis negative side is lifted and the substrate 15 is valley-folded so that the position of the scribe line 15a is at the bottom.

  Alternatively, as shown in FIG. 13A, a plurality of positions (here, positions Ps1 to Ps4) on the scribe line 15a are pressed in order from the upper surface side (Z-axis positive side), and the cracks CL2 and CL1 are removed. A bending moment M1 may be applied in the closing direction. That is, the pressing force applied to the surface of the substrate 15 may be moved from one end of the scribe line 15a to the other end by pressing a plurality of positions on the scribe line 15a in order. Also by this method, as shown by a dotted line in FIG. 13B, the crack CL1 can be extended along the scribe line 15a to a depth that penetrates the substrate 15 up and down (in the Z-axis direction). it can. In FIG. 12B, the position Ps1 is pressed from the upper surface side (Z-axis positive side), and the crack CL1 extends to a depth that penetrates the substrate 15 up and down to the next pressed position Ps2. It is shown.

  In this case, the cutting device 2 is changed to a configuration in which the positions Ps1 to Ps4 are sequentially pressed from above and the substrate 15 is sequentially valley-folded at these positions. The pressing of the substrate 15 is performed by, for example, a configuration in which a plurality of break bars respectively disposed at the positions Ps1 to Ps4 are sequentially lowered, or a configuration in which break bars having different positions from the substrate at the positions Ps1 to Ps4 are simultaneously lowered. Is called.

  In the above embodiment, the crack CL2 is formed at the end on the X axis positive side of the scribe line by pushing the blade edge 40 in the vicinity of the terminal position P2 shown in FIG. The crack CL2 may be formed at the negative end, or the crack CL2 may be formed at both ends of the scribe line. In either case, a bending moment may be applied to the substrate 15 so that the crack CL2 is the starting point.

  Further, the formation operation of the crack CL2 is not necessarily performed by a series of operations following the formation of the crack CL1, and the formation operation of the crack CL1 and the formation operation of the crack CL2 may be performed individually by different sequences. Good. Furthermore, a scribe line may be formed by simultaneously forming a groove and a crack due to plastic deformation of the surface on the substrate 15 by scribing.

  In the above embodiment, the blade edge 40 and the substrate 15 are moved relative to each other by moving the blade edge 40. However, by moving the substrate 15 side (for example, the table 14), A configuration in which the substrate 15 is relatively moved may be employed. In addition, the shape of the blade edge 40 is not limited to the shape of the above-described embodiment, and various changes can be made. Further, a scribing operation for forming the cracks CL <b> 1 and CL <b> 2 may be performed using a cutting edge that rolls on the surface of the substrate 15.

  The embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.

DESCRIPTION OF SYMBOLS 1 ... Scribe device 15 ... Board | substrate 15a ... Scribe line 20 ... Scribe head 40 ... Blade tip 2 ... Cutting device 70 ... Press head 74 ... Roller CL1, CL2 ... Crack

Claims (7)

Moving the cutting edge along the surface of the substrate while pressing the blade edge against the surface of the substrate, and forming a scribe line by a crack in the substrate thickness direction on the surface of the substrate;
Applying a bending moment to the substrate in a direction in which the crack is closed,
In the step of forming the scribe line, at least at one end portion of the scribe line, the load of the blade edge is increased more than the other part of the scribe line, and the crack penetrates to the surface on the opposite side of the substrate,
In the step of applying the bending moment, starting from the one end of the scribe line, the bending moment is applied to the substrate in the direction of closing the crack.
A crack extension method characterized by that. In the crack extension method according to claim 1,
The step of applying the bending moment includes the step of moving the pressing force applied to the surface of the substrate on which the scribe line is formed from the one end to the other end.
A crack extension method characterized by that. In the crack extension method according to claim 2,
The step of applying the bending moment includes a step of moving a roller that presses the surface of the substrate on which the scribe line is formed from the one end to the other end.
A crack extension method characterized by that. In the crack extension method according to any one of claims 1 to 3,
The thickness of the substrate is 0.4 mm or less.
A crack extension method characterized by that. A scribing device that moves along the surface of the substrate while pressing the blade edge against the surface of the substrate, and forms a scribe line by cracks in the substrate thickness direction on the surface of the substrate;
A cutting device that applies a bending moment to the substrate in a direction in which the crack is closed to divide the substrate along the scribe line, and
The scribing device increases the load on the cutting edge at least at one end of the scribe line to increase the load on the blade edge than the other part of the scribe line, and penetrates the crack to the surface on the opposite side of the substrate,
The cutting device applies a bending moment to the substrate in the direction of closing the crack, starting from the one end of the scribe line.
A substrate cutting system characterized by that. The substrate cutting system according to claim 5,
The cutting apparatus includes a configuration for moving a pressing force applied to the surface of the substrate on which the scribe line is formed, from the one end to the other end.
A substrate cutting system characterized by that. The substrate cutting system according to claim 6,
The cutting apparatus includes a configuration that moves a roller that presses the surface of the substrate on which the scribe line is formed from the one end to the other end.
A substrate cutting system characterized by that.

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