CN105523710B - Scribing method and scribing device - Google Patents
Scribing method and scribing device Download PDFInfo
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- CN105523710B CN105523710B CN201510578090.7A CN201510578090A CN105523710B CN 105523710 B CN105523710 B CN 105523710B CN 201510578090 A CN201510578090 A CN 201510578090A CN 105523710 B CN105523710 B CN 105523710B
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Abstract
The present invention relates to a scribing method and a scribing apparatus. That is, when the scribe lines are formed at positions directly above and below the sealing material, the grooves having a sufficient depth can be formed in the substrate over the entire length of the scribe lines. The scribing wheels (301, 401) are pressed against the position of the upper surface of the mother substrate (G) facing the sealing material and the position of the lower surface of the mother substrate (G) facing the sealing material so that the start positions of scribing on both surfaces of the mother substrate (G) coincide with each other in a plan view. Then, the scribing wheels (301, 401) are moved to form a scribing line so that the scribing wheel (301) is delayed with respect to the scribing wheel (401). Then, the movement of the scribing wheel (301) is advanced relative to the scribing wheel (401), and the positions of the scribing wheels (301, 401) are matched at the scribing end position.
Description
Technical Field
The present invention relates to a scribing method and a scribing apparatus for forming a scribe line on a substrate.
Background
Conventionally, a brittle material substrate such as a glass substrate is cut by a scribing step of forming a scribe line on a surface of the substrate and a cutting step of applying a predetermined force to the surface of the substrate along the formed scribe line. In the scribing step, the tip of the scribing wheel is moved along a specific line while being pressed against the surface of the substrate. A scribing apparatus having a scribing head is used for forming the scribe line.
The sealing material is disposed so as to remain in a space to be a liquid crystal injection region in a state where 2 substrates are bonded.
When the mother substrate having the above-described structure is divided, a method of simultaneously forming scribe lines on both surfaces of the mother substrate using 2 scribe heads is available (for example, see patent document 2). In this case, 2 scribing heads are disposed so as to sandwich the mother substrate. The 2 scribing wheels are positioned at the same position when overlooking the mother substrate. In this state, the 2 scribing wheels are simultaneously moved in the same direction to form scribing lines on the respective surfaces of the mother substrates.
[ background Art document ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2006-
[ patent document 2] Japanese patent laid-open No. 2012-240902
Disclosure of Invention
[ problems to be solved by the invention ]
As shown in patent document 1, in the conventional mother substrate, a region where no sealing material is interposed exists between adjacent liquid crystal injection regions. Therefore, when the scribe lines are simultaneously formed on both surfaces of the mother substrate by the 2 scribe heads as described above, the scribe lines can be formed in the region where the sealing material is not interposed. In this way, if the mother substrate is divided by forming the scribe lines, the liquid crystal panel leaves a frame region having a specific width around the liquid crystal injection region.
However, in recent years, it has become mainstream to extremely narrow the frame region particularly in a liquid crystal panel for a mobile phone. In order to satisfy this requirement, the region of the mother substrate where no sealing material is interposed is omitted, and adjacent liquid crystal injection regions need to be configured to be separated only by the sealing material. In this case, the scribe lines are formed directly above and below the sealing material.
However, the present inventors have confirmed the following problems: if the scribe lines are formed at positions directly above and below the sealing material in this manner, cracks do not sufficiently enter 2 glass substrates. If the cutting step is performed in a state where the cracks are insufficient, fine cracks or breakage may occur at the edge of the cut substrate, and the strength of the glass substrate may be reduced.
In view of the above problems, an object of the present invention is to provide a scribing method and a scribing apparatus capable of forming a crack of a sufficient depth on a substrate over the entire length of a scribe line even when the scribe line is formed at a position directly above and directly below a sealing material.
[ means for solving problems ]
A first aspect of the present invention relates to a scribing method for forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together with a sealing material. In the scribing method according to the present aspect, the first blade and the second blade are pressed against the position of the surface of the first substrate facing the sealing material and the position of the surface of the second substrate facing the sealing material so that the start position of the scribing on the first substrate and the start position of the scribing on the second substrate coincide with each other in a plan view, and the first blade and the second blade are moved along the sealing material so that the first blade is displaced in a scribing direction relative to the second blade, thereby forming scribing lines on the surface of the first substrate and the surface of the second substrate, respectively, moving the first blade and the second blade in such a manner that displacement of the first blade and the second blade is eliminated, and the end position of the scribe line of the first substrate and the end position of the scribe line of the second substrate are made to coincide with each other in a plan view.
According to the scribing method of this aspect, when the scribe line is formed at the position directly above and directly below the sealing material, a crack having a sufficient depth can be formed in the mother substrate. Further, since the start positions of the scribe lines formed on the first substrate and the second substrate respectively coincide with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate at the start positions of the scribe lines in the cutting step. Similarly, since the end positions of the scribe lines formed on the respective substrates coincide with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate at the end positions of the scribe lines in the dividing step. Therefore, the shape of the substrate fragment after cutting can be adjusted to an appropriate shape.
In the scribing method of the present aspect, for example, the first blade may be displaced relative to the second blade by adjusting the moving speed of the first blade and the moving speed of the second blade. For example, when the first and second blades are moved along the sealing member from the respective start positions, the second blade is moved at a slower speed than the first blade, whereby the first blade can be displaced relative to the second blade. Thus, the first blade can be displaced relative to the second blade while advancing the formation of cracks for the two substrates.
In the scribing operation, it is preferable that the displacement of the first blade with respect to the second blade is maintained at a predetermined distance by setting the moving speed of the first blade to be the same as the moving speed of the second blade, thereby forming the scribe line on the surface of the first substrate and the surface of the second substrate. Thus, cracks can be formed satisfactorily on the mother substrate without unevenness.
In the scribing method according to the present aspect, the displacement of the first blade and the second blade can be eliminated at the end position by making the moving speed of the first blade different from the moving speed of the second blade. Thus, the displacement of the first blade and the second blade can be eliminated while the formation of the crack with respect to the two substrates is advanced.
In the scribing method according to the present aspect, it is preferable that the first blade and the first pressing member be moved along the sealing material while the first pressing member is pressed against a position corresponding to the second blade on the surface of the first substrate, and the second blade and the second pressing member be moved along the sealing material while the second pressing member is pressed against a position corresponding to the first blade on the surface of the second substrate. Thus, the deformation of the mother substrate due to the pressing force of the first and second blades is suppressed, so that the depth of the crack can be maintained deep and the crack can be formed more stably.
A second aspect of the present invention relates to a scribing apparatus for forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together with a sealing material. The scribing device of this aspect includes: a first scribe head that forms a scribe line on a surface of the first substrate; a second scribe head that forms a scribe line on a surface of the second substrate; a driving unit which moves the first scribing head and the second scribing head in parallel with the mother substrate; and a control unit for controlling the first scribing head, the second scribing head and the driving unit. The control unit presses the first blade of the first scribing head and the second blade of the second scribing head against the surface of the first substrate and the surface of the second substrate, respectively, so that the start position of the scribing on the first substrate and the start position of the scribing on the second substrate coincide with each other in a plan view. The control unit moves the first blade and the second blade along the sealing material so that the first blade is displaced in a scribing direction with respect to the second blade, thereby forming a scribing line on the surface of the first substrate and the surface of the second substrate, and moves the first blade and the second blade so that the displacement of the first blade and the second blade is eliminated, thereby aligning an end position of the scribing line of the first substrate and an end position of the scribing line of the second substrate with each other in a plan view.
According to the scribing apparatus of this aspect, similarly to the scribing method of the first aspect, when the scribe line is formed at the position directly above and directly below the sealing material, the crack having a sufficient depth can be formed in the mother substrate. Further, since the start positions of the scribe lines formed on the first substrate and the second substrate respectively coincide with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate at the start positions of the scribe lines in the cutting step. Similarly, since the end positions of the scribe lines formed on the respective substrates coincide with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate at the end positions of the scribe lines in the dividing step. Therefore, the shape of the substrate fragment after cutting can be made appropriate.
In the scribing device according to the present aspect, the control unit may be configured to shift the first blade relative to the second blade by making a moving speed of the first blade different from a moving speed of the second blade. Thus, the second blade can be delayed with respect to the first blade while the formation of cracks with respect to the two substrates is advanced.
The control unit may be configured to maintain the displacement of the first blade with respect to the second blade at a specific distance by setting the moving speed of the first blade to be the same as the moving speed of the second blade, thereby forming the scribe line on the surface of the first substrate and the surface of the second substrate. Thus, cracks can be formed satisfactorily on the mother substrate without unevenness.
In addition, the control portion may be configured to cancel the displacement of the first blade and the second blade at the end position by making a moving speed of the first blade different from a moving speed of the second blade. Thus, the second blade can catch up with the first blade while the formation of the crack with respect to the two substrates is advanced.
Further, it is preferable that the first scribing head has a first pressing member which presses the pressure contact position of the second blade from the surface of the first substrate in a state where the first blade is displaced along the sealing material with respect to the second blade, and it is preferable that the second scribing head has a second pressing member which presses the pressure contact position of the first blade from the surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade. Thus, the deformation of the mother substrate due to the pressing force of the first and second blades is suppressed, so that the depth of the crack can be maintained deep and the crack can be formed more stably.
[ Effect of the invention ]
As described above, according to the present invention, it is possible to provide a scribing method and a scribing apparatus capable of forming a crack of a sufficient depth on a substrate over the entire length of a scribe line even when the scribe line is formed at a position directly above and below a sealing material.
The effects and significance of the present invention will be more apparent from the following description of the embodiments.
However, the embodiments described below are merely examples for implementing the present invention, and the present invention is not limited to the contents described in the embodiments below.
Drawings
Fig. 1(a) and (b) are views schematically showing the configuration of the scribing apparatus according to the embodiment.
Fig. 2 is an exploded perspective view showing a structure of a scribe head according to an embodiment.
Fig. 3 is a perspective view showing a structure of the scribing head according to the embodiment.
Fig. 4(a) to (c) are diagrams for explaining the scribing method according to the embodiment.
Fig. 5(a) to (e) are graphs showing experimental results of the scribing method according to the embodiment.
Fig. 6(a) and (b) are views for explaining another scribing method according to the embodiment.
Fig. 7(a) to (e) are graphs showing experimental results of other scribing methods according to the embodiment.
Fig. 8(a) and (b) are perspective views showing the structure of the scribing tool according to the embodiment.
Fig. 9(a) and (b) are views schematically showing a method of attaching the scribing tool according to the embodiment.
Fig. 10(a) to (c) are block diagrams showing the configuration of the scribing apparatus according to the embodiment and diagrams for explaining a problem in the case where the start positions of scribing on the upper surface and the lower surface of the mother substrate are different.
Fig. 11 is a flowchart showing scribing control according to the embodiment.
Fig. 12(a) and (b) are diagrams illustrating scribing operations according to the embodiment.
Fig. 13(a) and (b) are diagrams illustrating scribing operations according to the embodiment.
Fig. 14(a) and (b) are diagrams illustrating scribing operations according to the embodiment.
Fig. 15 is a timing chart showing scribing control according to the embodiment.
Fig. 16(a) and (b) are timing charts showing the scribe control according to the modified example.
Fig. 17 is a flowchart showing scribing control according to another modification.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, for convenience, X, Y, and Z axes orthogonal to each other are shown. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.
< constitution of scribing device >
Fig. 1(a) and (b) are schematic views showing the configuration of the scribing apparatus 1. Fig. 1(a) is a view of the scribing apparatus 1 viewed from the Y-axis front side, and fig. 1(b) is a view of a part of the scribing apparatus 1 viewed from the X-axis front side.
Referring to fig. 1(a), the scribing device 1 includes a conveyor belt 11, support columns 12a and 12b, guides 13 and 14, slide units 15 and 16, driving motors 17 and 18, cameras 19a and 19b, and 2 scribing heads 2.
As shown in fig. 1(b), the conveyor belt 11 is provided so as to extend in the Y-axis direction except for the position where the scribing head 2 is disposed. The conveyor belt 11 is provided with a handle 11a for holding the mother substrate G. The mother substrates G are placed on the conveyor belt 11 with the edges held by the handles 11 a. The mother substrate G has a substrate structure in which a pair of glass substrates are bonded to each other. The mother substrate G is conveyed in the Y-axis direction by the conveyor 11 while being held by the handle 11 a.
The support columns 12a and 12b are provided vertically on the base of the scribing device 1 via the conveyor belt 11. The guides 13 and 14 are respectively disposed between the columns 12a and 12b so as to be parallel to the X-axis direction. The sliding units 15 and 16 are slidably provided on the guides 13 and 14, respectively. The guides 13 and 14 are provided with drive motors 17 and 18, respectively, and the slide units 15 and 16 are driven in the X-axis direction by these drive motors 17 and 18.
The scribing heads 2 are attached to the slide units 15 and 16, respectively. Scribing tools 30 and 40 are attached to the scribing head 2 on the Z-axis positive side and the scribing head 2 on the Z-axis negative side so as to face the mother substrate G, respectively. The scribing head 2 is moved in the X-axis direction while scribing wheels held by the scribing tools 30 and 40 are pressed against the surface of the mother substrate G. Thereby, scribe lines are formed on the surface of the mother substrate G.
The cameras 19a and 19b are disposed above the guide 13, and detect alignment marks marked on the mother substrate G. The arrangement position of the mother substrate G with respect to the conveyor 11 is detected from the picked-up images from the cameras 19a and 19 b. Based on the detection result, each operation position of the scribing head 2 in the scribing operation, such as the scribing start position or the scribing end position of the scribing head 2, is determined.
< Scribe head >
Fig. 2 is a partially exploded perspective view showing the configuration of the scribing head 2, and fig. 3 is a perspective view showing the configuration of the scribing head 2.
Referring to fig. 2, the scribing head 2 includes a lifting mechanism 21, a scribe line forming mechanism 22, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28.
The lifting mechanism 21 includes: a cylindrical cam 21a coupled to a drive shaft of the servo motor 28; and a cam follower 21c formed on the upper surface of the lifting portion 21 b. The lifting unit 21b is supported on the base plate 23 via a slider (not shown) so as to be movable in the vertical direction, and is urged in the Z-axis positive direction by a spring 21 d. The cam follower 21c is pressed against the lower surface of the cylinder cam 21a by the urging of the spring 21 d. The lifting unit 21b is connected to the scribe line forming mechanism 22. When the cylindrical cam 21a is rotated by the servo motor 28, the lifting and lowering portion 21b is lifted and lowered by the cam action of the cylindrical cam 21a, and the scribe line forming mechanism 22 is lifted and lowered accordingly. Scribing tools 30 and 40 are attached to the lower end of the scribing line forming mechanism 22.
The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape fitted into the groove 23a of the base plate 23, the groove 24a of the top plate 24, and the groove 25a of the bottom plate 25. In a state where the rubber frame 26 is mounted in the grooves 23a, 24a, and 25a, the surface of the rubber frame 26 protrudes slightly outward from the side surfaces of the base plate 23, the top plate 24, and the bottom plate 25.
The cover 27 has a shape in which 3 plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. The front surface portion 27a has 2 holes 27f formed at upper and lower edges thereof.
In a state where the rubber frame 26 is fitted into the grooves 23a, 24a, and 25a, the right side surface portion 27b and the left side surface portion 27c of the cover 27 are deformed so as to be bent outward, and the cover 27 is attached to the base plate 23, the top plate 24, and the bottom plate 25. In this state, screws are screwed to the top plate 24 and the bottom plate 25 through 2 holes 27f formed at the upper and lower edges of the front surface portion 27 a. Further, screws are screwed into screw holes formed slightly outside the grooves 23a, 24a, 25a of the base plate 23, the top plate 24, and the bottom plate 25. Thus, the cover 27 is sandwiched by the base plate 23, the top plate 24, and the bottom plate 25 and the heads of the screws, and the peripheral edges of the right side surface 27b and the left side surface 27c are pressed against the rubber frame 26. Thus, the scribing head 2 is assembled as shown in fig. 3.
As shown in fig. 1(a), 2 scribe heads 2 are disposed above and below the mother substrate G, respectively. The 2 scribing heads 2 have the same configuration. The scribing tools 30 and 40 attached to the 2 scribing heads 2 are changed according to the scribing method. The scribing tools 30 and 40 holding only the scribing wheels 301 and 401 are used in the scribing method 1 of the 2 scribing methods shown below. In the scribing method 2, scribing tools 30 and 40 holding scribing wheels 301 and 401 and rollers 302 and 402 are used.
These 2 scribing methods are explained below.
< scribing method 1 >
Fig. 4(a) to (c) are diagrams for explaining the scribing method according to the present embodiment. Fig. 4(a) is a schematic view when the vicinity of the scribe line position is viewed from the Y-axis negative side, fig. 4(b) is a schematic view when the vicinity of the scribe line position is viewed from the X-axis positive side, and fig. 4(c) is a schematic view when the vicinity of the scribe line position is viewed from the Z-axis positive side.
As shown in fig. 4(a), in the scribing method, the 2 scribing wheels 301 and 401 are moved so that the scribing wheel 301 of the upper scribing head 2 (positive Z-axis) advances by a distance W1 in the scribing direction (positive X-axis) from the scribing wheel 401 of the lower scribing head 2 (negative Z-axis). On the contrary, the scribing wheel 401 may be advanced with respect to the scribing wheel 301. The 2 scribing wheels 301 and 401 are rotatably attached to the scribing tools 30 and 40 with the shafts 301a and 401a as rotation axes, respectively.
Referring to fig. 4(b), the mother substrate G is configured by bonding 2 glass substrates G1 and G2 with a sealing material S L interposed therebetween, a Color Filter (CF) is formed on the glass substrate G1, and a Thin Film Transistor (TFT) is formed on the glass substrate G2, a liquid crystal injection region R is formed by the sealing material S L and the 2 glass substrates G1 and G2, and liquid crystal is injected into the liquid crystal injection region R, the 2 scribing wheels 301 and 401 are positioned so as not to be shifted from each other in the Y axis direction, the scribing wheel 301 is pressed against the surface of the glass substrate G1 at a position immediately above the sealing material S L, and the scribing wheel 401 is pressed against the surface of the glass substrate G2 at a position immediately below the sealing material S L.
As shown in fig. 4(c), the sealing material S L is arranged in a grid pattern, and the 2 scribing wheels 301 and 401 are moved in the X-axis positive direction along the sealing material S L, thereby forming the scribe lines L1 and L2 on the surfaces of the glass substrates G1 and G2, respectively, as shown in fig. 4(b) and (c).
In the scribing method shown in fig. 4(a) to (c), a roller for pressing the surface of the mother substrate G opposite to the scribing wheel 301 (Z-axis negative side) is not provided, and a roller for pressing the surface of the mother substrate G opposite to the scribing wheel 401 (Z-axis positive side) is not provided.
< experiment 1 >
The inventors performed experiments for forming a scribe line on the mother substrate G by the scribing method shown in fig. 4(a) to (c). The following describes the experiment and the experimental results.
In the experiment, glass substrates G1 and G2 each having a thickness of 0.2mm were bonded to each other with a sealing material S L interposed therebetween, the bonded substrates (mother substrates) had a size of 118mm × 500mm, scribing wheels 301 and 401 had a structure in which V-shaped cutting edges were formed on the outer periphery of the disk and grooves were formed at specific intervals on ridge lines of the cutting edges, scribing wheels 301 and 401 had a diameter of 3mm, a cutting edge angle of 110 °, the number of grooves of 550, and a groove depth of 3 μm, respectively, as manufactured by samsung diamond industries, inc.
The scribing wheels 301 and 401 having this configuration are moved while being pressed against the glass substrates G1 and G2 as shown in fig. 4(a) to (c), respectively, to perform scribing operation. The load applied to the scribing wheels 301 and 401 during the scribing operation is controlled to 6.5N. The moving speed of the scribing wheels 301 and 401 is set to be constant (200 mm/sec).
Based on the above conditions, the penetration amount of the cracks in the glass substrates G1 and G2 was measured while changing the distance W1 between the 2 scribing wheels 301 and 401. As a comparative example, the amount of penetration of the crack was measured when the distance W1 between the scribing wheels 301 and 401 was 0. In each measurement, the amount of rib mark (rib mark) was measured in addition to the amount of penetration of the crack.
Fig. 5(a) to (e) show the experimental results. Fig. 5(a) is a graph in which the penetration amount of cracks and the rib amount are shown as numerical values, and fig. 5(b) to (e) are cross-sectional photographs of the mother substrate G on a scribe line, the cross-sectional photographs being taken at distances W1 of 0.4mm, 0.6mm, 0.8mm, and 1.0mm, respectively. In fig. 5(b) to (e), D1 and D3 indicate rib widths, and D2 and D4 indicate penetration widths of cracks.
When referring to fig. 5(a), if the distance W1 exceeds 0.6mm, the amount of penetration of the crack of the glass substrate G1 becomes larger than when the distance W1 is 0 mm. If the crack penetrates into any one of the glass substrates G1, G2 in a large amount, the mother substrate G can be properly divided in the cutting step.
For example, as in the comparative example (W1 ═ 0mm), if the glass substrates G1 and G2 both have a fracture amount of about half the thickness (0.2mm) of the glass substrates G1 and G2, the glass substrates G1 and G2 must be cut from both sides of the mother substrate G in the cutting step. If the glass substrates G1 and G2 are cut from both sides of the mother substrate G in this manner, fine cracks or breakage may occur at the edges of the glass substrates G1 and G2, and the strength of the glass substrates G1 and G2 may be reduced.
On the other hand, when the distance W1 is 0.6mm to 1.4mm, the amount of penetration of the crack in the glass substrate G2 is small, but the amount of penetration of the crack in the glass substrate G1 is large. When the amount of penetration of the crack in the glass substrate G1 is large, the glass substrate G2 having a small amount of penetration of the crack may be cut from only one side of the mother substrate G in the cutting step, and the glass substrate G1 having a deep crack may be simultaneously broken along the crack in the cutting operation. If the glass substrates G1 and G2 are cut from only one side of the mother substrate G in this manner, the strength of the glass substrates G1 and G2 is kept high without causing fine cracks or breakage at the edges of the glass substrates G1 and G2.
For the above reasons, it is preferable that the cracks penetrate into any of the glass substrates G1 and G2 in a large amount in the division of the mother substrate G. In this experiment, as shown in fig. 5(a), if the distance W1 between the 2 scribing wheels 301 and 401 exceeds 0.6mm, the amount of penetration of the crack in the glass substrate G1 becomes larger than that in the comparative example (W1 is 0 mm). In this case, it is preferable that the distance W1 between the 2 scribing wheels 301 and 401 is 0.6mm or more. By setting the distance W1 between the 2 scribing wheels 301 and 401 in this manner, the mother substrates G can be cut appropriately.
< scribing method 2 >
In the scribing method (scribing method 1) shown in fig. 4(a) to (c), the surface of the mother substrate G on the side opposite to the scribing wheel 301 (negative side of Z axis) is not pressed by a roller, and the surface of the mother substrate G on the side opposite to the scribing wheel 401 (positive side of Z axis) is not pressed by a roller. In contrast, in the scribing method, the surface of the mother substrate G opposite to the scribing wheel 301 (negative Z-axis side) and the surface of the mother substrate G opposite to the scribing wheel 401 (positive Z-axis side) are pressed by rollers. As the pressing member for pressing the surface opposite to the scribing wheels 301 and 401, other members than rollers may be used.
Fig. 6(a) and (b) are diagrams for explaining the scribing method 2. Fig. 6(a) is a schematic view when the vicinity of the scribe line position is viewed from the Y-axis negative side, and fig. 6(b) is a schematic view when the vicinity of the scribe line position is viewed from the X-axis positive side.
As shown in fig. 6(a), in the scribing method, the surface of the mother substrate G opposite to the scribing wheel 301 (Z-axis negative side) is pressed by 2 rollers 402, and the surface of the mother substrate G opposite to the scribing wheel 401 (Z-axis positive side) is also pressed by 2 rollers 302. The 2 rollers 302 are disposed so as to sandwich the scribing wheel 301, and are rotatable about the shaft 302a as a rotation axis. The 2 rollers 402 are disposed so as to sandwich the scribing wheel 401, and are rotatable about a shaft 402a as a rotation axis.
As with the scribing method 1, the 2 scribing wheels 301, 401 are offset by a distance w1 in the scribing direction (X-axis direction). in the case of the scribing method 2, the lower scribing wheel 401 may be advanced with respect to the upper scribing wheel 301. the 2 scribing wheels 301, 401 are moved along the sealing material S L while being pressed against the glass substrates G1, G2, respectively, and a gap in the Y-axis direction is present between the scribing wheel 301 and the 2 roller 302, and a gap in the Y-axis direction is also present between the scribing wheel 401 and the 2 roller 402. therefore, the rollers 302, 402 are moved in the X-axis positive direction so as to straddle the scribe lines L1, L2 formed by the scribing wheels 301, 401.
< experiment 2 >
The inventors performed an experiment for forming a scribe line on a mother substrate G by the scribing method shown in fig. 6(a) and (b). The following describes the experiment and the experimental results.
The mother substrates G and the scribing wheels 301 and 401 used in this experiment are the same as those in experiment 1. In this experiment, the distance W1 between the scribing wheels 301 and 401 was set to 2.2 mm. The moving speed of the scribing wheels 301 and 401 is set to be constant (200 mm/sec). The eccentricity of the scribing wheel 301 with respect to the load center of the upper scribing head 2 is 1.0mm, and the eccentricity of the scribing wheel 401 with respect to the load center of the lower scribing head 2 is 3.2 mm.
The center positions of the axes 301a and 401a of the scribing wheels 301 and 401 are aligned with the center positions of the axes 302a and 402a of the rollers 302 and 402 in the Z-axis direction, respectively, and the diameters of the rollers 302 and 402 are set to be 3mm in the same manner as the diameters of the scribing wheels 301 and 401, respectively.
Based on the above conditions, the amount of penetration of cracks in the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.
Fig. 7(a) to (e) show the experimental results. Fig. 7(a) is a graph in which the penetration amount of cracks and the rib amount are numerically represented, and fig. 7(b) to (e) are sectional photographs of the mother substrate G on a scribe line, the sectional photographs being taken under loads of 6N, 7N, 8N, and 9N, respectively. In fig. 5(b) to (e), D1 and D3 indicate rib widths, and D2 and D4 indicate penetration widths of cracks.
Referring to fig. 7(a), it is understood that if the load is changed from 5N to 6N, the amount of penetration of the crack in the glass substrate G1 increases rapidly. In addition, if the load exceeds 6N, the penetration amount of the crack of the glass substrate G1 exceeds 80% of the thickness (0.2mm) of the glass substrate G1, and the crack enters the glass substrate G1 with a large penetration amount. As described above, if the crack enters any one of the glass substrates G1, G2 with a large penetration amount, the mother substrate G can be properly divided in the cutting step. Therefore, it can be said that in the scribing method 2, it is preferable to set the load applied to the scribing tools 30 and 40 to 6N or more.
In addition, in this experiment, the amount of penetration into the crack of the glass substrate G1 was larger than in experiment 1. In this experiment, since the lower side of the scribing wheel 301 is supported by the roller 402 and the upper side of the scribing wheel 401 is supported by the roller 302, the mother substrate G is prevented from being deformed by the pressing force of the blades of the scribing wheels 301 and 401. Therefore, it is preferable that the surface of the mother substrate G opposite to the scribing wheels 301 and 401 is pressed by the rollers 402 and 302 as in the scribing method 2 in order to form the crack stably with a large amount of penetration of the crack.
< marking tool >
Fig. 8(a) and (b) are perspective views showing configuration examples of the scribing tools 30 and 40 used in the scribing method 2.
The scribing tools 30 and 40 have the same configuration except for the arrangement order of the scribing wheels 301 and 401 and the rollers 302 and 402. The scribing tools 30 and 40 are provided with holders 303 and 403 for holding scribing wheels 301 and 401 and rollers 302 and 402, respectively. The holders 303, 403 are provided with grooves 303a, 403a to which the scribing wheels 301, 401 are attached, grooves 303b, 403b to which the rollers 302, 402 are attached, and inclined surfaces 303c, 403 c. The scribing wheels 301, 401 are mounted by fitting the shafts 301a, 401a into holes of the holders 303, 403. The rollers 302, 402 are mounted by inserting the shafts 302a, 402a into the holes of the holders 303, 403.
Fig. 9(a) and (b) are views schematically showing a method of attaching the scribing tool 30 to the scribe line forming mechanism 22. Fig. 9(a) and (b) show the inside of the see-through scribe line forming mechanism 22.
A holding portion 221 for holding the scribing tool 30 is provided at the lower end of the scribing line forming mechanism 22, and a hole 222 into which the scribing tool 30 can be inserted is formed in the holding portion 221. A magnet 224 is provided at the bottom of the hole 222, and a pin 223 is provided at an intermediate position of the hole 222. The holder 303 of the scribing tool 30 includes a ferromagnetic body. The holding portion 221 is supported by the scribe line forming mechanism 22 via a bearing, not shown, so as to be rotatable 360 degrees in the horizontal direction.
When the scribing tool 30 is attached to the scribe line forming mechanism 22, the holder 303 of the scribing tool 30 is inserted into the hole 222 of the holding portion 221. The holder 303 adheres to the magnet 224 if the upper end of the holder 303 approaches the magnet 224. At this time, the inclined surface 303c of the holder 303 abuts on the pin 223, and the holder 303 is positioned at the normal position. In this way, as shown in fig. 9(b), the scribing tool 30 is attached to the lower end of the scribe line forming mechanism 22.
The scribing tool 40 is also mounted on the lower end of the scribe line forming mechanism 22. In this way, if the scribing tools 30 and 40 are respectively attached to the scribing line forming mechanisms 22 of the corresponding scribing heads 2, the roller 402 is positioned at a position corresponding to the scribing wheel 301 and the roller 302 is positioned at a position corresponding to the scribing wheel 401 as shown in fig. 6(a) and (b). By using the scribing tools 30 and 40 having the configurations shown in fig. 8(a) and (b), the scribing wheels 301 and 401 and the rollers 402 and 302 can be opposed to each other while keeping the distance W1 between the scribing wheel 301 and the scribing wheel 401 at a specific distance simply by attaching the scribing tools 30 and 40 to the scribing forming mechanisms 22 of the corresponding scribing heads 2.
The experiment 2 was performed using the scribing tools 30 and 40 having the configurations shown in fig. 8(a) and (b). The experiment 1 was performed using the scribing tools 30 and 40 in which the grooves 303b and 403b were omitted from the holders 303 and 403, and only the scribing wheels 301 and 401 were attached to the holders 303 and 403 having only the grooves 303a and 403a, respectively.
< scribing control >
Next, scribing control by the scribing apparatus 1 will be described.
Fig. 10(a) is a block diagram showing the configuration of the scribing apparatus 1.
The scribing device 1 includes a control unit 101, a detection unit 102, a drive unit 103, an input unit 104, and a display unit 105.
The control Unit 101 includes a processor such as a CPU (Central Processing Unit) and a Memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and controls each Unit according to a control program stored in the Memory. In addition, the memory is also used as a work area when controlling each part. The detection unit 102 includes various sensors in addition to the cameras 19a and 19b shown in fig. 1 (a). The driving unit 103 includes the mechanism of the scribing apparatus 1 shown in fig. 1(a) and the driving motors 17 and 18. The input unit 104 includes a mouse and a keyboard. The input unit 104 is used for inputting various parameter values in a scribing operation, such as a start position and an end position of scribing, or a scribing interval. The display unit 105 includes a monitor, and displays a specific input screen when an input is made through the input unit 104.
Fig. 10(b) and (c) are views illustrating problems when the start positions of the scribe lines formed on the upper surface and the lower surface of the mother substrate G are not aligned when the mother substrate G is viewed in a plan view. Fig. 10(b) is a side view of a part of the mother substrate G, and fig. 10(c) is a top view of the mother substrate G.
As verified in the above-described experiments 1 and 2, it is preferable that the scribing wheel 301 on the upper side and the scribing wheel 401 on the lower side are shifted by a predetermined distance in the scribing direction when the scribing lines are simultaneously formed on both surfaces of the mother substrate G, however, if this scribing method is applied from the start timing of the scribing, a predetermined distance W is shifted between the start position SP1 of the scribing line L1 on the upper surface of the mother substrate G and the start position SP2 of the scribing line L2 on the lower surface of the mother substrate G as shown in fig. 10 (b).
If the start positions SP1, SP2 are offset in this manner, in the dividing step along the scribe lines L1, L2, as shown in fig. 10(c), a protruding piece Gb. in which burrs remain on the glass substrate G2 on the lower side of the mother substrate G can be generated, and if the dividing step along the scribe lines L1, L2 is performed after the end edge of the mother substrate G is cut off by forming a crack perpendicular to the scribe lines L1, L2 at the position of the start position SP1, the lower scribe line L2 does not extend to the end of the lower glass substrate G2, and therefore the portion of the glass substrate G2 having the distance W is not divided neatly, and if the protruding piece Gb. in which burrs remain at this portion, the contour of the liquid crystal panel after cutting does not match the desired contour, and the liquid crystal panel cannot be appropriately set in the set region on the product side.
Therefore, in the present embodiment, the start position and the end position of the scribe lines L1, L2 are controlled so as to coincide with each other in a plan view of the mother substrate G, and the upper scribing wheel 301 and the lower scribing wheel 401 are shifted by a predetermined distance in the scribing direction between the start position and the end position, and in this control, the lower scribing wheel 401 is controlled so as to advance in the scribing direction with respect to the upper scribing wheel 301.
Fig. 11 is a flowchart showing scribing control. The scribing control shown in fig. 11 is a control for forming a scribe line on both surfaces of the mother substrate G by moving the scribing tools 30 and 40 without moving the conveyor belt 11 of fig. 1 (a). Unlike the scribing control shown in fig. 11, the conveyor 11 is moved without moving the scribing tools 30 and 40 to form the scribing lines on both surfaces of the mother substrate G.
The scribing control shown in fig. 11 is performed by the control unit 101 in fig. 10 (a). Fig. 12(a) to 14(b) are diagrams schematically showing the positions of the scribing tools 30 and 40 at a specific control sequence. Here, the scribing tools 30 and 40 shown in fig. 8(a) and (b) are used. Instead of this, the scribing tools 30 and 40 in which the rollers 302 and 402 are omitted may be used.
Referring to fig. 11, the control unit 101 processes the captured images of the cameras 19a and 19b to detect the position of the mother substrate G (S11). Based on the detection result, the control unit 101 sets the initial position of the scribing head 2 (scribing tools 30 and 40) above and below each scribe line and the switching timing of the feeding control for each scribing head 2 (S12).
Next, the control unit 101 moves the upper and lower scribing heads 2 to the starting positions (S13) of the scribe lines L1, L2 to be formed, fig. 12(a) is a diagram showing the states of the scribing tools 30, 40 at this time, in which the positions of the scribing wheels 301, 401 are matched in the X axis direction, in which the control unit 101 drives the servo motors 28 of the upper and lower scribing heads 2 to press the scribing tools 30, 40 against the upper and lower surfaces of the mother substrate G, respectively, with a specific load (S14), fig. 12(b) is a diagram showing the states of the scribing tools 30, 40 at this time, in which the scribing wheels 301, 401 are pressed against the positions of the upper surface of the mother substrate G facing the sealing material S L and the positions of the lower surface of the mother substrate G facing the sealing material S L, respectively, so that the positions of the scribing wheels 301, 401 are matched with each other, in a plan view of the mother substrate G.
In a state where the scribing tools 30 and 40 are pressed against both surfaces of the mother substrate G in this manner, the control unit 101 drives the driving motors 17 and 18 to move the upper and lower scribing heads 2 at the velocities Vs and Vn, respectively (S15). The speed Vs is set slower than the speed Vn. Therefore, the upper scribing tool 30 is gradually retracted from the lower scribing tool 40, and a space is left between the scribing tools 30 and 40 in the scribing direction. Fig. 13(a) is a diagram showing the state of the scribing tools 30 and 40 at this time.
Then, the control unit 101 waits for the time T1 to elapse from the start of the movement of the upper and lower scribe heads 2 (S16). Then, when the time T1 elapses (S16: yes), the control section 101 increases the moving speed of the upper scribing head 2 from the speed Vs to the speed Vn (S17).
Fig. 13(b) is a diagram showing the state of the scribing tools 30 and 40 at this time. At a timing when the time T1 has elapsed since the movement of the upper and lower scribing heads 2 (S16: yes), the rollers 402 and 302 are opposed to the scribing wheels 301 and 401 with a desired gap therebetween. In this state, by increasing the moving speed of the upper scribing head 2 to the same speed Vn as the upper scribing head 2, the upper and lower scribing wheels 301 and 401 are moved in the scribing direction while maintaining the interval between the upper and lower scribing wheels 301 and 401 at a desired interval.
Then, the control unit 101 waits for the time T2 to elapse from the start of the movement of the upper and lower scribing heads 2(T2 > T1) (S18). Then, when the time T2 elapses (S18: yes), the control unit 101 decreases the moving speed of the lower scribing head 2 from the speed Vn to the speed Vs (S19). Thereby, the lower scribing wheel 401 gradually approaches the upper scribing wheel 301. Fig. 14(a) is a diagram showing the state of the scribing tools 30 and 40 at this time.
Further, the control unit 101 waits for the time T3 to elapse from the start of the movement of the upper and lower scribing heads 2 (T3 > T2) (S20). At the timing of the elapsed time T3 (S20: yes), the upper scribing wheel 301 overtakes the lower scribing wheel 401 in the scribing direction. Fig. 14(b) is a diagram showing the state of the scribing tools 30 and 40 at this time.
When the time T3 has elapsed (S20: yes), the control unit 101 ends the feeding of the upper and lower scribing heads 2 and stops the upper and lower scribing heads 2 (S21). Then, the control unit 101 drives the servo motors 28 of the upper and lower scribing heads 2 to separate the scribing tools 30 and 40 from the upper and lower surfaces of the mother substrate G, respectively (S22). The control unit 101 determines whether or not the processing of moving the upper and lower scribe heads 2 is completed for all the scribe lines set in advance (S23). If the processing for all scribe lines has not been completed (no in S23), control unit 101 returns the processing to S13 and executes the processing for the next scribe line. When the processing for all the drawn lines is finished in this manner (yes in S23), the control unit 101 ends the processing.
Fig. 15 is a timing chart showing the scribing control. In the lower part of fig. 15, a drive signal for the upper scribe head 2 and a drive signal for the lower scribe head 2 are shown. These drive signals are applied to the drive motors 17 and 18 shown in fig. 1(a), respectively. In the upper part of fig. 15, the relative positions of the scribing wheels 301 and 401 and the position on the mother substrate G in the scribing direction are shown. Positions P0 and P3 are the start position and the end position of the scribe line, respectively.
At the scribing start timing T0, the driving signal for the upper scribe head 2 and the driving signal for the lower scribe head 2 are set to the levels Ds and Dn, respectively. Thereby, the scribing wheel 301 on the upper side and the scribing wheel 401 on the lower side move at the speeds Vs and Vn, respectively. Then, when the time T1 elapses, the drive signal of the scribe head 2 on the upper side is increased to the level Dn. Thereby, the scribing wheel 301 on the upper side and the scribing wheel 401 on the lower side move at the same speed Vn.
When the time T2 elapses from the scribe start timing T0, the drive signal of the scribe head 2 on the lower side is lowered to the level Ds. Thereby, the speed of the scribing wheel 401 on the lower side is reduced to the speed Vs. When the time T2 elapses from the scribing start timing T0, the driving signal of the upper scribing head 2 and the driving signal of the lower scribing head 2 are set to 0 level, respectively. Thereby, the scribing wheel 301 on the upper side and the scribing wheel 401 on the lower side are stopped.
According to the scribing control, the lower scribing wheel 401 gradually advances with respect to the upper scribing wheel 301 in the range R1 from the position P0 to the position P1. In a range R2 from the position P1 to the position P2, the distance between the lower scribing wheel 401 and the upper scribing wheel 301 is kept at a predetermined distance. Then, in a range R3 from the position P2 to the position P3, the upper scribing wheel 301 gradually approaches the lower scribing wheel 401. In the scribing end position P3, the upper scribing wheel 301 catches up with the lower scribing wheel 401, and the positions of the two coincide with each other. In this manner, the control of the scribe line is ended.
< effects of the embodiment >
According to the present embodiment, the following effects are exhibited.
As shown in experiments 1 and 2, a scribe line can be formed with a deep crack at a position directly above the sealing material S L, and in particular, as in the scribing method 2, by pressing the opposite side of the scribing wheels 301 and 401 with the rollers 302 and 402, the amount of penetration of the crack can be increased and the crack can be stably formed.
Further, since the start positions of the scribe lines formed on the both surfaces of the mother substrate G are aligned with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate G at the start positions of the scribe lines in the dividing step. Similarly, since the end positions of the scribe lines formed on the both surfaces of the mother substrate G coincide with each other in a plan view, the burr-like protruding pieces are prevented from remaining on the mother substrate G at the end positions of the scribe lines in the dividing step. Therefore, the shape of the cut liquid crystal panel can be adjusted to an appropriate shape.
In a range R1 in fig. 15, the scribing wheel 301 is delayed from the scribing wheel 401 by making the moving speed of the scribing wheel 301 slower than the moving speed of the scribing wheel 401. Accordingly, cracks may be formed on both surfaces of the mother substrate G, and a space may be left between the scribing wheel 301 and the scribing wheel 401.
In a range R2 in fig. 15, the delay of the scribing wheel 301 with respect to the scribing wheel 401 is maintained at a specific distance by setting the moving speed of the scribing wheel 301 to be the same as the moving speed of the scribing wheel 401. Therefore, cracks can be formed satisfactorily in the mother substrate G without unevenness.
In a range R3 in fig. 15, the scribing wheel 301 moves faster than the scribing wheel 401, and thus the scribing wheel 301 catches up with the scribing wheel 401 at the scribing end position. Therefore, cracks are formed on both surfaces of the mother substrate G, and the scribing wheel 301 can catch up with the scribing wheel 401.
< modification >
While the embodiments of the present invention have been described above, the present invention is not limited to the embodiments, and various modifications other than the above-described modifications may be made to the embodiments of the present invention.
For example, the method of displacing the scribing wheel 301 relative to the scribing wheel 401 is not limited to the method described in the above embodiment, and other methods may be used.
For example, as shown in fig. 16(a), the timing of starting the movement of the upper scribing head 2 may be delayed by Δ T from the lower scribing head 2, so that the lower scribing wheel 401 advances by a certain distance from the upper scribing wheel 301, and the timing of ending the movement of the upper scribing head 2 may be advanced by Δ T from the lower scribing head 2, so that the upper scribing wheel 301 overtakes the lower scribing wheel 401. In this case, the drive signals for the upper scribing head 2 and the lower scribing head are both at the level Dn, and the moving speeds of the scribing wheels 301 and 401 are the same. Accordingly, the range in which the interval between the upper scribing wheel 301 and the lower scribing wheel 401 is maintained at a specific distance can be expanded as compared with the above embodiment.
However, in this modification, since the movement start timings of the upper and lower scribing wheels 301 and 401 are different from each other, the scribing wheel 301 may have a higher generation rate of the defective start at the time of starting the movement of the subsequent scribing wheel 301. Therefore, in order to suppress the subsequent defective start of the scribing wheel 301, it is preferable to perform control such that the timing of starting the movement of the upper and lower scribing wheels 301 and 401 is the same and the interval between the upper and lower scribing wheels 301 and 401 is gradually increased after the start of the movement, as in the above-described embodiment.
As shown in fig. 16(b), the drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 may be set to Ds and Dn, respectively, from time T0 to time Tc corresponding to the middle position of the scribe line, and the drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 may be set to Dn and Ds, respectively, from time Tc to time T3. Then, during the time period T0 to Tc, the lower scribing wheel 401 gradually advances with respect to the upper scribing wheel 301, and during the time period Tc to T3, the upper scribing wheel 301 gradually catches up with respect to the lower scribing wheel 401.
However, in this modification, the rib amount varies over the entire scribe line. In contrast, in the above embodiment, in the range R2 in fig. 15, the interval between the upper and lower scribing wheels 301 and 401 is kept at a specific distance, and therefore the rib amount is substantially constant. Therefore, from the viewpoint of making the rib amount as uniform as possible to stabilize the dividing step, it is preferable to make the speeds of the upper and lower scribing wheels 301 and 401 different only in the vicinity of the start position and the vicinity of the end position of the scribing as described in the above embodiment, and make the speeds of the upper and lower scribing wheels 301 and 401 uniform in the remaining range.
The feed speed of the upper and lower scribing heads 2 in the period from time T0 to time T3. Various modifications can be made on the condition that the scribing wheel 301 on the upper side substantially overtakes the scribing wheel 401 on the lower side at the scribing end position.
In the control shown in fig. 11, the load of pressing the upper and lower scribing wheels 301 and 401 against the upper and lower surfaces of the mother substrate G is constant over the entire length of the scribing line. However, the load of pressing the upper and lower scribing wheels 301 and 401 against the upper and lower surfaces of the mother substrate G may be controlled to vary depending on the position of the scribing line. For example, the control can be performed as follows: at the start position of scribing, the pressure contact load of the upper and lower scribing wheels 301 and 401 is set low, and then the pressure contact load gradually approaches the desired load in accordance with the movement of the upper and lower scribing wheels 301 and 401.
Fig. 17 is an example of a control flowchart when the pressure contact load is changed. In the flowchart of fig. 17, S14 in fig. 11 is replaced with S31, and S32 to S35 are added. The other steps are the same as in fig. 11.
In S13, when the upper and lower scribing heads 2 move to the initial positions of the scribe lines to be formed, the control unit 101 drives the servo motors 28 of the upper and lower scribing heads 2 to press the scribing tools 30 and 40 against the upper and lower surfaces of the mother substrate G with the load N0, respectively (S31). Then, before the time T1 elapses, the control unit 101 gradually increases the pressing load of the scribing tools 30 and 40 against the mother substrate G while moving the upper and lower scribing heads 2 at the speeds Vs and Vn, respectively (S15) (S32). In this way, when the time T1 has elapsed (S16: yes), the control unit 101 ends the increase in the pressure contact load of the scribing tools 30 and 40 with respect to the mother substrate G, and maintains the pressure contact load at the time T1 has elapsed (S33). Then, the control unit 101 increases the speed of the upper scribing head 2 to the speed Vn to advance the scribing operation (S17).
When the elapsed time reaches time T2 (S18: yes), the control unit 101 changes the moving speed of the lower scribing head 2 to Vs (S18) and gradually reduces the pressing load of the scribing tools 30 and 40 against the mother substrate G (S34). When the elapsed time reaches the time T3 (S20: yes), the control unit 101 ends the reduction of the pressing load of the scribing tools 30 and 40 against the mother substrate G (S35), and stops the movement of the upper and lower scribing heads 2. Then, in S22, the control unit 101 separates the scribing tools 30 and 40 from the mother substrate G to end the scribing line forming operation.
By adjusting the pressing load of the scribing tools 30 and 40 in this manner, excessive load is prevented from being applied to the mother substrate G at the start position and the end position of scribing. Since the scribing wheels 301 and 401 are positioned at the start position and the end position of scribing, the mother substrates G are directly held by the scribing wheels 301 and 401. Therefore, the mother substrates G receive a larger force from the scribing wheels 301 and 401 than in the case where the scribing wheels 301 and 401 are displaced from each other in the scribing direction. By the control of fig. 17, the load is reduced at the start position and the end position of scribing, thereby preventing the mother substrates G from receiving excessive force from the scribing wheels 301 and 401. Therefore, a crack of an appropriate depth can be formed in the mother substrate G at the start position and the end position of the scribing line without breaking. Further, the load of S33 is adjusted so that a crack of a desired depth is formed when the distance between the scribing wheels 301 and 401 is a specific distance.
In the above embodiment, the scribing wheel having the grooves formed at the ridge line of the cutting edge at fixed intervals is used, but it is conceivable that the same effect can be obtained even when the scribing wheel having no grooves formed at the ridge line is used. The size and shape of the scribing wheel (cutting edge) are not limited to those described in the above embodiments, and other cutting edges of different sizes, shapes, and kinds may be used as appropriate.
In the control shown in fig. 11, the scribing wheel 401 on the lower side of the mother substrate G is advanced in the scribing direction with respect to the scribing wheel 301 on the upper side, but the scribing wheel 301 on the upper side of the mother substrate G may be advanced in the scribing direction with respect to the scribing wheel 401 on the lower side.
In the control shown in fig. 11, the moving speeds of the upper and lower scribing heads 2 are switched by the elapsed time from the start timing T0 of the scribing operation, but in the case where a mechanism for detecting the positions of the upper and lower scribing heads 2 is provided, the control may be executed by the positions of the upper and lower scribing heads 2. For example, the speed of the upper scribing head 2 may be increased to Vn by detecting that the upper scribing head 2 reaches the position P1 in fig. 15, or the speed of the lower scribing head 2 may be decreased to Vs by detecting that the lower scribing head 2 reaches the position P2 in fig. 15. Further, the upper and lower scribe heads 2 may be stopped when the upper and lower scribe heads 2 reach the position P3.
In the configuration of fig. 6(a) and (b) and fig. 8(a) and (b), the center positions of the axes 301a and 401a of the scribing wheels 301 and 401 are respectively aligned with the center positions of the axes 302a and 402a of the rollers 302 and 402 in the Z-axis direction, and the diameters of the scribing wheels 301 and 401 are respectively identical with the diameters of the rollers 302 and 402. However, the relationship between the scribing wheels 301 and 401 and the rollers 302 and 402 is not limited to this, and various other modifications may be made.
In the configuration of fig. 6(a), (b) and fig. 8(a), (b), a pair of rollers 302, 402 are disposed on both sides of the scribing wheels 301, 401, but a configuration may be conceived in which only one roller 302, 402 is disposed on one side of the scribing wheels 301, 401.
The configuration, thickness, material, and the like of the mother substrate G are not limited to those shown in the above embodiments, and the scribing methods 1 and 2 and the scribing apparatus described above may be used to cut the mother substrate G having another configuration.
The embodiments of the present invention can be modified in various ways within the scope of the technical idea shown in the claims.
[ description of symbols ]
1 scribing device
2 scribing head
30. 40 marking tool
101 control unit
301. 401 line marking wheel
302. 402 roller
G mother substrate
G1, G2 glass substrate
Claims (10)
1. A scribing method, characterized by: forming a scribe line on a mother substrate obtained by bonding a first substrate and a second substrate with a sealing material, and
the mother substrate is formed by bonding the first substrate and the second substrate with the sealing material interposed therebetween,
pressing a first blade and a second blade against a position of the surface of the first substrate facing the sealing material and a position of the surface of the second substrate facing the sealing material so that a start position of scribing of the first substrate and a start position of scribing of the second substrate coincide with each other in a plan view,
moving the first blade and the second blade in a scribing direction along the sealing material, respectively, in such a manner that the first blade is displaced in the scribing direction with respect to the second blade, thereby forming scribing lines on the surface of the first substrate and the surface of the second substrate, respectively,
the first and second blades are moved in such a manner that displacement of the first and second blades is eliminated, and the end positions of the scribe lines of the first substrate and the end positions of the scribe lines of the second substrate are made to coincide with each other in a plan view.
2. The scribing method according to claim 1, wherein:
displacing the first blade relative to the second blade by causing a speed of movement of the first blade to be different from a speed of movement of the second blade.
3. The scribing method according to claim 1 or 2, wherein:
the scribing line is formed on the surface of the first substrate and the surface of the second substrate by maintaining the displacement of the first knife relative to the second knife at a certain distance by making the moving speed of the first knife the same as the moving speed of the second knife.
4. The scribing method according to claim 1 or 2, wherein:
the displacement of the first and second blades is eliminated at the end position by making the moving speed of the first blade different from the moving speed of the second blade.
5. The scribing method according to claim 1 or 2, wherein:
moving a first blade and a first pressing member in the scribing direction along the sealing material while pressing the first pressing member against a position corresponding to the second blade on the surface of the first substrate,
the second blade and the second pressing member are moved in the scribing direction along the sealing material while the second pressing member is pressed against a position corresponding to the first blade on the surface of the second substrate.
6. A line marking apparatus characterized by: a scribe line is formed on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material, and the scribe line forming apparatus includes:
a first scribe head that forms a scribe line on a surface of the first substrate;
a second scribe head that forms a scribe line on a surface of the second substrate;
a driving unit which moves the first scribing head and the second scribing head in parallel with the mother substrate; and
a control unit for controlling the first scribing head, the second scribing head, and the driving unit; and is
The mother substrate is formed by bonding the first substrate and the second substrate with the sealing material interposed therebetween,
the control unit:
pressing the first blade of the first scribing head and the second blade of the second scribing head against a position of the surface of the first substrate facing the sealing material and a position of the surface of the second substrate facing the sealing material so that a start position of scribing of the first substrate and a start position of scribing of the second substrate coincide with each other in a plan view,
moving the first blade and the second blade in a scribing direction along the sealing material, respectively, in such a manner that the first blade is displaced in the scribing direction with respect to the second blade, thereby forming scribing lines on the surface of the first substrate and the surface of the second substrate, respectively,
the first and second blades are moved in such a manner that displacement of the first and second blades is eliminated, and the end positions of the scribe lines of the first substrate and the end positions of the scribe lines of the second substrate are made to coincide with each other in a plan view.
7. The scribing apparatus according to claim 6, wherein:
displacing the first blade relative to the second blade by causing a speed of movement of the first blade to be different from a speed of movement of the second blade.
8. The scribing apparatus according to claim 6 or 7, wherein:
the control section maintains a displacement of the first blade with respect to the second blade at a specific distance by making a moving speed of the first blade the same as a moving speed of the second blade, the scribe lines being formed on the surface of the first substrate and the surface of the second substrate.
9. The scribing apparatus according to claim 6 or 7, wherein:
the control portion cancels the displacement of the first blade and the second blade at the end position by making a moving speed of the first blade different from a moving speed of the second blade.
10. The scribing apparatus according to claim 6 or 7, wherein:
the first scribing head has a first pressing member that presses a pressure contact position of the second blade from a surface of the first substrate in a state where the first blade is displaced in the scribing direction along the sealing material with respect to the second blade,
the second scribing head has a second pressing member that presses a press contact position of the first blade from a surface of the second substrate in a state where the second blade is displaced in the scribing direction along the sealing material with respect to the first blade.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014214062A JP6384265B2 (en) | 2014-10-20 | 2014-10-20 | Scribing method and scribing apparatus |
| JP2014-214062 | 2014-10-20 |
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| Publication Number | Publication Date |
|---|---|
| CN105523710A CN105523710A (en) | 2016-04-27 |
| CN105523710B true CN105523710B (en) | 2020-07-10 |
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| CN201510578090.7A Active CN105523710B (en) | 2014-10-20 | 2015-09-11 | Scribing method and scribing device |
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| Country | Link |
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| JP (1) | JP6384265B2 (en) |
| KR (1) | KR102329902B1 (en) |
| CN (1) | CN105523710B (en) |
| TW (1) | TWI672279B (en) |
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| KR102027136B1 (en) * | 2017-09-27 | 2019-10-01 | 주식회사 탑 엔지니어링 | Scribing apparatus |
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| CN102067017A (en) * | 2008-09-12 | 2011-05-18 | 夏普株式会社 | Method of manufacturing display panel |
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| KR101447577B1 (en) * | 2012-12-27 | 2014-10-08 | 한국미쯔보시다이아몬드공업(주) | Apparatus for removing cullet generated when scribing brittle material substrate |
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| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN102067017A (en) * | 2008-09-12 | 2011-05-18 | 夏普株式会社 | Method of manufacturing display panel |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
| CN102515493A (en) * | 2011-11-28 | 2012-06-27 | 深圳市华星光电技术有限公司 | Cutting device and cutting method of liquid crystal panel |
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| KR20160046283A (en) | 2016-04-28 |
| TWI672279B (en) | 2019-09-21 |
| KR102329902B1 (en) | 2021-11-22 |
| JP2016079076A (en) | 2016-05-16 |
| TW201615578A (en) | 2016-05-01 |
| JP6384265B2 (en) | 2018-09-05 |
| CN105523710A (en) | 2016-04-27 |
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