TW201615578A - Scribing method and scribing device - Google Patents

Abstract

The present invention is capable of reaching the entire length of scribing lines to form a full-depth crack on a substrate even when the scribing lines are formed on the upper and lower surfaces of a sealed material. The present invention provides a scribing method, comprising the steps: when the starting positions of scribing lines on the two surfaces of a mother substrate G are at the same position in top view, scribing wheels 301 and 401 respectively abut against the position on the upper surface of the mother substrate G relative to a sealed material and the position on the lower surface of the mother substrate G relative to the sealed material. Also, the scribing wheel 301 is delayed relative to the scribing wheel 401 to enable scribing wheels 301 and 401 to move respectively in order to form scribing lines. Then the scribing wheel 301 moves relative to the scribing wheel 401, and at the ending positions of the scribing lines, the scribing wheel 301 is at the same position as the scribing wheel 401.

Description

Scribing method and scribing device

The present invention relates to a scribing method for forming a scribe line on a substrate and a scribing device.

Conventionally, the breaking of a brittle material substrate such as a glass substrate is performed by a step of scribing a line on the surface of the substrate, and a step of cutting a specific force on the surface of the substrate along the formed scribe line. In the scribing step, the blade tip of the scribing wheel is pressed against the surface of the substrate while moving along a specific line. A scribing device having a scribing head is used in the formation of the scribing line.

Patent Document 1 below discloses a method for cutting out a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed via a sealing material. Each liquid crystal panel is obtained by dividing the mother substrate.

The sealing material is disposed so as to remain in the space to be the liquid crystal injection region in a state in which the two substrates are bonded together.

In the case where the mother substrate having the above configuration is divided, a method of forming a scribe line on both surfaces of the mother substrate by using two scribe heads can be used (for example, refer to Patent Document 2). In this case, the two scribing heads are arranged to sandwich the mother substrate. The two scribing wheels are positioned at the same position when the mother substrate is viewed from above. In this state, the two scribing wheels move simultaneously in the same direction to form a scribe line on each surface of the mother substrate.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-137641

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-240902

As also described in the above Patent Document 1, the prior mother substrate has a region where the sealing material is not interposed between adjacent liquid crystal injection regions. Therefore, as described above, when two scribe lines are used to simultaneously form a scribe line on both surfaces of the mother substrate, a scribe line can be formed in a region where the sealing material is not interposed. As described above, when the scribe line is formed and the mother substrate is divided, the liquid crystal panel leaves a frame region of a specific width around the liquid crystal injection region.

However, in recent years, particularly in liquid crystal panels for mobile phones, it has become a mainstream to make the above-mentioned frame area extremely narrow. In order to satisfy this requirement, the region where the sealing material is not interposed is omitted in the mother substrate, and the adjacent liquid crystal injection regions must be configured to be separated only by the sealing material. In this case, the scribe line is formed directly above and below the sealing material.

However, the inventors of the present invention have found that if a scribe line is formed at a position directly above and below the sealing material, the crack does not sufficiently enter the two glass substrates. If the cutting step is performed in such a state that the crack is insufficient, fine cracking or breakage may occur at the edge of the substrate after the cutting, and the strength of the glass substrate may be lowered.

In view of the above problems, an object of the present invention is to provide a scribing method for forming a crack of a sufficient depth over a whole length of a scribing line even when a scribing line is formed at a position directly above and below the sealing material. And scribing device.

A first aspect of the present invention relates to a scribing method in which a mother substrate in which a first substrate and a second substrate are bonded together by a sealing material is formed. In the scribe method of the aspect, the first blade and the second blade are pressed against each other such that the start position of the scribe line of the first substrate and the start position of the scribe line of the second substrate coincide with each other in plan view. Table of the above first substrate a position at which the surface faces the sealing material and a position of the surface of the second substrate facing the sealing material, and the first blade is displaced in the direction of the scribe line with respect to the second blade The first blade and the second blade move along the sealing material, respectively, and a scribe line is formed on a surface of the first substrate and a surface of the second substrate to move the first blade and the second blade In the bit elimination mode, the first blade and the second blade are moved, and the end position of the scribe line of the first substrate and the end position of the scribe line of the second substrate are aligned with each other in plan view.

According to the scribing method of the present aspect, when a scribe line is formed at a position directly above and below the sealing material, a crack of a sufficient depth can be formed on the mother substrate. Further, since the start positions of the scribe lines formed in the first substrate and the second substrate are respectively aligned in the plan view, the burrs are prevented from remaining on the mother substrate at the start position of the scribe line. Similarly, since the end positions of the scribe lines formed on the respective substrates coincide with each other in plan view, the burrs are prevented from remaining on the mother substrate at the end of the scribe line. Therefore, the shape of the cut substrate piece can be adjusted to an appropriate shape.

In the scribing method of this aspect, for example, by adjusting the moving speed of the first blade and the moving speed of the second blade, the first blade can be displaced relative to the second blade. For example, when the first blade and the second blade are moved along the sealing member from the respective starting positions, the moving speed of the second blade is made slower than the moving speed of the first blade, whereby the first blade can be moved relative to the second blade. Bit. Therefore, the first blade can be displaced relative to the second blade while the formation of cracks in the two substrates is advanced.

Further, it is preferable that the shift of the first blade to the second blade is maintained at a specific distance by the same movement speed of the first blade and the second blade during the scribing operation. A scribe line is formed on the surface of the first substrate and the surface of the second substrate. Therefore, cracks can be favorably formed on the mother substrate without unevenness.

Further, in the scribing method of the present aspect, by shifting the moving speed of the first blade from the moving speed of the second blade, the displacement of the first blade and the second blade can be eliminated at the end position. Therefore, the formation of the cracks on the two substrates can be promoted while the first blade and the second blade are displaced. except.

Further, in the scribe method of the aspect, it is preferable that the first pressing member is pressed along with the first blade while the first pressing member is pressed against the surface of the first substrate corresponding to the second blade. While the sealing material is moved, the second pressing member is moved along the sealing material together with the second blade while pressing the second pressing member against the surface of the second substrate corresponding to the first blade. Therefore, since the mother substrate is deformed by the pressing force of the first blade and the second blade, the depth of the crack can be maintained deep, and the crack can be formed more stably.

According to a second aspect of the present invention, a scribing device for forming a scribe line on a mother substrate in which a first substrate and a second substrate are bonded together by a sealing material is used. The scribing apparatus of the aspect includes: a first scribing head having a scribe line formed on a surface of the first substrate; a second scribing head forming a scribe line on a surface of the second substrate; and a driving unit that causes the scribe line The first scribing head and the second scribing head move in parallel with the mother substrate, and the control unit controls the first scribing head, the second scribing head, and the driving unit. The control unit respectively sets the first blade and the second row of the first scribing head so that the start position of the scribing line of the first substrate and the start position of the scribing line of the second substrate coincide with each other in plan view The second blade of the wire end is pressed against a position of the surface of the first substrate facing the sealing material and a position of the surface of the second substrate facing the sealing material. Further, the control unit moves the first blade and the second blade along the sealing material so as to be displaced in the scribe line direction with respect to the second blade, so as to be on the surface of the first substrate Forming a scribe line on the surface of the second substrate, and moving the first blade and the second blade so as to cancel the displacement of the first blade and the second blade, and the scribe line of the first substrate The end position and the end position of the scribe line of the second substrate coincide with each other in plan view.

According to the scribing apparatus of the present aspect, in the case where the scribing is formed at a position directly above and below the sealing material in the same manner as the scribing method of the first aspect, a crack of a sufficient depth can be formed on the mother substrate. Further, since the start positions of the scribe lines formed on the first substrate and the second substrate are respectively coincident with each other in plan view, at the start of the scribe line at the start step of the scribe line, Suppresses the burr-like tabs on the mother substrate. Similarly, since the end positions of the scribe lines formed on the respective substrates coincide with each other in plan view, the burrs are prevented from remaining on the mother substrate at the end of the scribe line. Therefore, the shape of the cut substrate piece can be made into an appropriate shape.

In the scribing apparatus of the present aspect, the control unit may be configured to displace the first blade from the second blade by changing the moving speed of the first blade from the moving speed of the second blade. Therefore, the second blade can be delayed with respect to the first blade while the formation of cracks in the two substrates is promoted.

Further, the control unit may be configured to maintain the displacement of the first blade with respect to the second blade at a specific distance by making the moving speed of the first blade the same as the moving speed of the second blade, on the surface of the first substrate and The surface of the second substrate is formed with a scribe line. Therefore, cracks can be favorably formed on the mother substrate without unevenness.

Further, the control unit may be configured to cancel the displacement of the first blade and the second blade at the end position by making the moving speed of the first blade different from the moving speed of the second blade. Therefore, the second blade can be caught up to the first blade while the formation of cracks on the two substrates is advanced.

Furthermore, it is preferable that the first scribing head has the first pressing position of the second blade from the surface of the first substrate in a state where the first blade is displaced along the sealing material with respect to the second blade. In the pressing member, it is preferable that the second scribing head presses the crimping position of the first blade from the surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade. The second pressing member. Therefore, since the mother substrate is deformed by the pressing force of the first blade and the second blade, the depth of the crack can be maintained deep, and the crack can be formed more stably.

As described above, according to the present invention, it is possible to provide a scribe line which can form a sufficient depth on the substrate over the entire length of the scribe line even when a scribe line is formed at a position directly above and below the sealing material. Method and scribing device.

The effects or significance of the present invention will be more apparent by the description of the embodiments shown below. Indeed.

However, the embodiments described below are merely illustrative of the embodiments of the present invention, and the present invention is not limited by the contents described in the following embodiments.

1‧‧‧ scribe device

2‧‧‧Drawing head

11‧‧‧Conveyor belt

12a, 12b‧‧ ‧ pillar

13, 14 ‧ ‧ guides

15, 16‧‧‧ sliding unit

17, 18‧‧‧ drive motor

19a, 19b‧‧‧ camera

21‧‧‧ Lifting mechanism

21a‧‧‧Cylinder cam

21b‧‧‧ Lifting Department

21c‧‧‧Cam followers

22‧‧‧ scribing formation mechanism

23‧‧‧Base plate

23a, 24a, 25a‧‧‧ slots

24‧‧‧ top board

25‧‧‧floor

26‧‧‧Rubber frame

27‧‧‧ Cover

27a‧‧‧Front

27b‧‧‧ right side face

27c‧‧‧left side face

27f‧‧‧ hole

28‧‧‧Servo motor

30, 40‧‧‧ scribe tool

101‧‧‧Control Department

102‧‧‧Detection Department

103‧‧‧ Drive Department

104‧‧‧ Input Department

105‧‧‧Display Department

221‧‧‧ Keeping Department

222‧‧‧ hole

223‧‧ ‧ sales

224‧‧‧ magnet

301, 401‧‧‧ scribe wheel

301a, 401a‧‧

302, 402‧‧‧ Roll

302a, 402a‧‧‧ axis

303, 403‧‧‧ keeper

303a, 403a‧‧ slot

303b, 403b‧‧‧ slots

303c, 403c‧‧‧ sloped surface

Dn‧‧‧

Ds‧‧‧

G‧‧‧ mother substrate

G1, G2‧‧‧ glass substrate

Gb‧‧‧1

L1, L2‧‧‧

P0‧‧‧ position

P1‧‧‧ position

P2‧‧‧ position

P3‧‧‧ position

R‧‧‧LCD injection area

R1‧‧‧ range

R2‧‧‧ range

R3‧‧‧ range

SL‧‧‧ sealing material

Starting position of SP1‧‧‧

SP2‧‧‧ starting position

T0‧‧‧ scribing start timing

T1‧‧‧ time

T2‧‧‧ time

T3‧‧‧Time

Vn‧‧‧ speed

Vs‧‧‧ speed

W‧‧‧ distance

W1‧‧‧ distance

1(a) and 1(b) are diagrams schematically showing the configuration of a scribing apparatus of an embodiment.

Fig. 2 is an exploded perspective view showing the configuration of a scribing head of the embodiment.

Fig. 3 is a perspective view showing the configuration of a scribing head of the embodiment.

4(a) to 4(c) are views showing a scribing method of the embodiment.

5(a) to 5(e) are diagrams showing experimental results of the scribing method of the embodiment.

6(a) and 6(b) are views showing another scribing method in the embodiment.

7(a) to 7(e) are diagrams showing experimental results of other scribing methods in the embodiment.

8(a) and 8(b) are perspective views showing the configuration of the scribing tool of the embodiment.

9(a) and 9(b) are diagrams schematically showing a method of mounting the scribing tool of the embodiment.

Figs. 10(a) to 10(c) are a block diagram showing the configuration of the scribing device of the embodiment, and a view for explaining a problem in a case where the upper surface of the mother substrate and the lower surface are different from each other.

Fig. 11 is a flow chart showing the scribing control of the embodiment.

Fig. 12 (a) and (b) are views showing the scribing operation of the embodiment.

Fig. 13 (a) and (b) are views showing the scribing operation of the embodiment.

14(a) and 14(b) are diagrams showing the scribing operation of the embodiment.

Fig. 15 is a timing chart showing the scribing control of the embodiment.

16(a) and 16(b) are timing charts showing the scribing control of the modified example.

Fig. 17 is a flow chart showing the scribing control of another modified example.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Furthermore, in each figure For the sake of convenience, the X-axis, the Y-axis, and the Z-axis are orthogonal to each other. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

<Composition of the scribing device>

1(a) and 1(b) are diagrams schematically showing the configuration of the scribing device 1. Fig. 1(a) is a view of the scribing device 1 viewed from the positive side of the Y-axis, and Fig. 1(b) is a view of a portion of the scribing device 1 viewed from the positive side of the X-axis.

Referring to Fig. 1(a), the scribing apparatus 1 includes a conveyor belt 11, pillars 12a and 12b, guides 13, 14, slide units 15, 16, drive motors 17, 18, cameras 19a, 19b, and two scribing heads. 2.

As shown in Fig. 1(b), the conveyor belt 11 is provided to extend in the Y-axis direction except for the portion where the scribing head 2 is disposed. The conveyor belt 11 is provided with a handle 11a for holding the mother substrate G. On the conveyor belt 11, the mother substrate G is downloaded in a state in which the handle 11a holds the end edge. The mother substrate G has a substrate structure in which a pair of glass substrates are bonded to each other. The mother substrate G is conveyed in the Y-axis direction by the conveyor belt 11 in a state of being held by the handle 11a.

The pillars 12a and 12b are vertically provided on the base of the scribing device 1 via the conveyor belt 11. The guides 13 and 14 are respectively spanned between the pillars 12a and 12b so as to be parallel to the X-axis direction. The slide units 15 and 16 are slidably provided to the guides 13 and 14, respectively. The guides 13 and 14 are respectively provided with drive motors 17, 18, and the slide motors 15, 16 are driven in the X-axis direction by the drive motors 17, 18.

A scribing head 2 is attached to each of the sliding units 15 and 16, respectively. The scribing heads 2 on the positive side of the Z-axis and the scribing heads 2 on the negative side of the Z-axis are attached to the mother substrate G so as to be attached to the scribing tools 30 and 40, respectively. The scribing head 2 is moved in the X-axis direction while the scribing wheels held by the scribing tools 30 and 40 are pressed against the surface of the mother substrate G. Thereby, a scribe line is formed on the surface of the mother substrate G.

The cameras 19a and 19b are disposed above the guides 13, and detect alignment marks marked on the mother substrate G. The mother substrate G is detected relative to the input by the captured images from the cameras 19a, 19b. The position of the belt 11 is configured. Based on the detection result, each operation position of the scribing head 2 in the scribing operation such as the scribing start position or the scribing end position of the scribing head 2 is determined.

<scribe head>

2 is a partially exploded perspective view showing the configuration of the scribing head 2, and FIG. 3 is a perspective view showing the configuration of the scribing head 2.

Referring to Fig. 2, the scribing head 2 includes an elevating mechanism 21, a scribing line forming mechanism 22, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28.

The elevating mechanism 21 includes a cylindrical cam 21a coupled to a drive shaft of the servo motor 28, and a cam follower 21c formed on an upper surface of the elevating portion 21b. The lifter 21b is supported by the base plate 23 so as to be movable in the vertical direction via a slider (not shown), and is biased in the positive direction of the Z-axis by the spring 21d. The cam follower 21c is pressed against the lower surface of the cylindrical cam 21a by the spring force of the spring 21d. The lifting portion 21b is coupled to the scribing line forming mechanism 22. When the cylindrical cam 21a is rotated by the servo motor 28, the lifting portion 21b is moved up and down by the cam action of the cylindrical cam 21a, and the scribing line forming mechanism 22 ascends and descends. The scribing tools 30, 40 are attached to the lower end of the scribing forming mechanism 22.

The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape that is fitted into the groove 23a of the base plate 23, the groove 24a of the top plate 24, and the groove 25a of the bottom plate 25. In a state where the rubber frame 26 is attached to the grooves 23a, 24a, and 25a, the surface of the rubber frame 26 protrudes slightly outward from the side faces of the base plate 23, the top plate 24, and the bottom plate 25.

The cover 27 has a shape in which three plate portions of the front portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. Two holes 27f are formed in the lower end edge of the front surface portion 27a.

In a state in which the rubber frame 26 is fitted into the grooves 23a, 24a, and 25a, the right side surface portion 27b and the left side surface portion 27c of the outer cover 27 are deformed so as to be bent outward, and the outer cover 27 is attached to the base plate 23, the top plate 24, and the bottom plate 25. . In this state, the screw is screwed to the top plate 24 and the bottom plate 25 via the two holes 27f formed in the lower end edge of the front surface portion 27a. Further, the screw is screwed to the slots 23a, 24a, 25a formed on the base plate 23, the top plate 24, and the bottom plate 25. Screw holes on the side. Thereby, the outer cover 27 is sandwiched by the base plate 23, the top plate 24, the bottom plate 25, and the head of the screw, and the peripheral edge portions of the right side surface portion 27b and the left side surface portion 27c are pressed against the rubber frame 26. Thus, the scribing head 2 is assembled as shown in FIG.

As shown in FIG. 1(a), the two scribing heads 2 are disposed above and below the mother substrate G, respectively. The two scribing heads 2 have the same configuration. The scribing tools 30 and 40 attached to the two scribing heads 2 are changed in accordance with the scribing method. Among the two scribing methods shown below, the scribing tools 30 and 40 that hold only the scribing wheels 301 and 401 are used in the scribing method 1. Further, in the scribing method 2, the scribing tools 30 and 40 that hold the scribing wheels 301 and 401 and the rollers 302 and 402 are used.

Hereinafter, the two scribing methods will be described.

<Line Method 1>

4(a) to 4(c) are views for explaining the scribing method of the embodiment. Fig. 4(a) is a schematic view when the vicinity of the scribing position is observed from the negative side of the Y-axis, and Fig. 4(b) is a pattern diagram when the vicinity of the scribing position is observed from the positive side of the X-axis, and Fig. 4(c) is from Z. The pattern diagram when the positive side of the axis is near the position of the scribe line.

As shown in Fig. 4(a), in the scribing method, the scribing wheel 301 of the scribing head 2 on the upper side (the positive side of the Z-axis) is scribed to the scribing head 2 of the lower side (the negative side of the Z-axis). The wheel 401 moves the two scribing wheels 301 and 401 so that the scribe line direction (the positive X-axis direction) is longer than the distance W1. Contrary to this, the scribing wheel 401 can also be advanced with respect to the scribing wheel 301. The two scribing wheels 301 and 401 can be attached to the scribing tools 30 and 40 so as to be rotatable about the shafts 301a and 401a.

Referring to Fig. 4(b), the mother substrate G is formed by bonding two glass substrates G1 and G2 via a sealing material SL. A color filter (CF) is formed on the glass substrate G1, and a thin film transistor (TFT) is formed on the glass substrate G2. The liquid crystal injection region R is formed by the sealing material SL and the two glass substrates G1 and G2, and the liquid crystal injection region R is injected with liquid crystal. The two scribing wheels 301 and 401 are not positioned to be offset from each other in the Y-axis direction. The scribing wheel 301 is pressed against the surface of the glass substrate G1 at a position directly above the sealing material SL, and the scribing wheel 401 is pressed against the surface of the glass substrate G2 at a position directly below the sealing material SL.

As shown in FIG. 4(c), the sealing material SL is arranged in a lattice shape. The two scribing wheels 301 and 401 move in the positive X-axis direction along the sealing material SL. Thereby, as shown in FIGS. 4(b) and 4(c), the scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

In the scribing method shown in Figs. 4(a) to 4(c), the roller that presses the surface of the mother substrate G opposite to the scribing wheel 301 (the negative side of the Z-axis) is not provided, and the pressing is not provided. The scribing wheel 401 is a roller of the surface of the mother substrate G on the opposite side (positive side of the Z-axis).

<Experiment 1>

The inventors of the present invention conducted an experiment of forming a scribe line on the mother substrate G in accordance with the scribing method shown in Figs. 4(a) to 4(c). Hereinafter, the experiment and experimental results will be described.

In the experiment, a substrate (mother substrate) obtained by laminating glass substrates G1 and G2 each having a thickness of 0.2 mm via a sealing material SL was used. The size of the bonded substrate (mother substrate) was 118 mm × 500 mm. The scribing wheels 301 and 401 use Micro Penett (registered trademark of Samsung Diamond Industry Co., Ltd.) manufactured by Samsung Diamond Industry Co., Ltd. Each of the scribing wheels 301 and 401 has a V-shaped blade tip on the outer circumference of the disk and has a groove at a specific interval on the ridge line of the blade edge. The scribing wheels 301 and 401 have a diameter of 3 mm, a blade tip angle of 110°, a groove number of 550, and a groove depth of 3 μm.

Each of the scribing wheels 301 and 401 having the configuration is moved to the glass substrates G1 and G2 as shown in Figs. 4(a) to 4(c) to perform a scribing operation. The load control applied to the scribing wheels 301 and 401 at the time of the scribing operation is 6.5 N. Further, the moving speed of the scribing wheels 301 and 401 is set to be fixed (200 mm/sec).

Based on the above conditions, the amount of penetration of the cracks of the glass substrates G1 and G2 was measured while changing the distance W1 between the two scribing wheels 301 and 401. As a comparative example, the amount of penetration of the crack when the distance W1 between the scribing wheels 301 and 401 is 0 is also measured. In each measurement, the amount of rib mark was measured in addition to the amount of penetration of the crack.

Figures 5(a) to (e) show the experimental results. Fig. 5(a) is a numerical diagram showing the amount of penetration of the crack and the amount of ribbed grain, and Figs. 5(b) to (e) are cross-sectional photographs of the mother substrate G on the scribe line, respectively A cross-sectional photograph of the distance W1 of 0.4 mm, 0.6 mm, 0.8 mm, and 1.0 mm. In Figs. 5(b) to (e), D1 and D3 indicate the amount of rib-like grain, and D2 and D4 indicate the amount of penetration of the crack.

Referring to Fig. 5(a), when the distance W1 exceeds 0.6 mm, the amount of penetration of the crack of the glass substrate G1 becomes larger than when the distance W1 is 0 mm. If the crack enters any one of the glass substrates G1 and G2 with a large amount of penetration, the mother substrate G can be appropriately separated in the cutting step.

For example, as in the comparative example (W1 = 0 mm), if the amount of cracks in the glass substrates G1 and G2 is about one-half of the thickness (0.2 mm) of the glass substrates G1 and G2, it is necessary to be self-mother substrate G in the cutting step. The glass substrates G1 and G2 are cut off on both sides. When the glass substrates G1 and G2 are respectively cut from both sides of the mother substrate G in this manner, fine cracks or breakage may occur at the edge edges of the glass substrates G1 and G2, and the strength of the glass substrates G1 and G2 may occur. reduce.

On the other hand, when the distance W1 is 0.6 mm to 1.4 mm, although the amount of penetration of cracks in the glass substrate G2 is small, the amount of penetration of cracks in the glass substrate G1 is large. When the amount of penetration of the crack in the glass substrate G1 is large, in the cutting step, the glass substrate G2 having a small amount of penetration of the crack can be cut only from one side of the mother substrate G. At the time of the cutting operation, the glass substrate G1 which has entered the crack deeper is also broken along the crack. When the glass substrates G1 and G2 are cut only from one side of the mother substrate G, the edges of the glass substrates G1 and G2 are not cracked or broken, and the strength of the glass substrates G1 and G2 is kept high. .

For the above reasons, it is preferable that the crack enters any one of the glass substrates G1 and G2 with a large amount of penetration in the division of the mother substrate G. In the present experiment, as shown in FIG. 5(a), when the distance W1 between the two scribing wheels 301 and 401 exceeds 0.6 mm, the penetration of the crack of the glass substrate G1 is compared with the comparative example (W1 = 0 mm). The amount becomes larger. In view of this, it can be said that the distance W1 between the two scribing wheels 301 and 401 is preferably 0.6 mm or more. By setting the distance W1 between the two scribing wheels 301 and 401 in this manner, the mother substrate G can be appropriately performed. Cut off.

<Line Method 2>

In the scribing method (the scribing method 1) shown in FIGS. 4(a) to 4(c), the surface of the mother substrate G opposite to the scribing wheel 301 (the negative side of the Z-axis) is not pressed by the roller, and The surface of the mother substrate G on the opposite side (the positive side of the Z axis) from the scribing wheel 401 is also not pressed by the roller. On the other hand, in the present scribing method, the surface of the mother substrate G on the opposite side (the negative side of the Z axis) from the scribing wheel 301 and the mother substrate on the opposite side (the positive side of the Z axis) from the scribing wheel 401 are used. The surface of G is pressed by a roller, respectively. Further, as the pressing member that presses the surface opposite to the scribing wheels 301 and 401, other members than the roller may be used.

6(a) and 6(b) are diagrams showing the scribing method 2. Fig. 6(a) is a schematic view when the vicinity of the scribing position is observed from the negative side of the Y-axis, and Fig. 6(b) is a schematic view when the vicinity of the scribing position is observed from the positive side of the X-axis.

As shown in FIG. 6(a), in the scribing method, the surface of the mother substrate G on the opposite side (the negative side of the Z-axis) from the scribing wheel 301 is pressed by the two rollers 402, and the scribing wheel 401. The surface of the mother substrate G on the opposite side (positive side of the Z axis) is also pressed by the two rolls 302. The two rollers 302 are disposed to sandwich the scribing wheel 301 and are rotatable about the shaft 302a. Further, the two rollers 402 are disposed to sandwich the scribing wheel 401, and are rotatable about the shaft 402a.

Similarly to the scribing method 1, the two scribing wheels 301 and 401 are shifted by a distance W1 in the scribing direction (X-axis direction). In the case of the scribing method 2, the scribing wheel 401 on the lower side may be advanced with respect to the scribing wheel 301 on the upper side. The two scribing wheels 301 and 401 are pressed against the glass substrates G1 and G2 and moved along the sealing material SL. There is a gap in the Y-axis direction between the scribing wheel 301 and the two rolls 302, and a gap in the Y-axis direction exists between the scribing wheel 401 and the two rolls 402. Therefore, the rollers 302 and 402 move in the positive X-axis direction so as to straddle the scribe lines L1 and L2 formed by the scribing wheels 301 and 401.

<Experiment 2>

The inventors of the present invention performed the G-shape on the mother substrate in accordance with the scribing method shown in Figs. 6(a) and 6(b). An experiment of scribing. Hereinafter, the experiment and experimental results will be described.

The mother substrate G and the scribing wheels 301 and 401 used in this experiment were the same as those in Experiment 1. In the present experiment, the distance W1 between the scribing wheels 301 and 401 was set to 2.2 mm. Further, the moving speed of the scribing wheels 301 and 401 is set to be fixed (200 mm/sec). The eccentric amount of the scribing wheel 301 with respect to the load center of the upper scribing head 2 was 1.0 mm, and the eccentric amount of the scribing wheel 401 with respect to the load center of the lower scribing head 2 was 3.2 mm.

The center positions of the axes 301a, 401a of the scribing wheels 301, 401 coincide with the center positions of the shafts 302a, 402a of the rolls 302, 402, respectively, in the Z-axis direction, and the diameters of the rolls 302, 402 and the scribing wheels 301, 401, respectively. The same diameter is set to 3mm.

Based on the above conditions, the amount of penetration of the cracks of the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.

Figures 7(a) to (e) show the experimental results. Fig. 7(a) is a numerical diagram showing the amount of penetration of the crack and the amount of ribbed grain, and Figs. 7(b) to (e) are photographs of the cross section of the mother substrate G on the scribe line, respectively, with loads of 6N, 7N, 8N. Cross-section photo at 9N. In Figs. 5(b) to (e), D1 and D3 indicate the amount of rib-like grain, and D2 and D4 indicate the amount of penetration of the crack.

Referring to Fig. 7(a), it is understood that when the load is changed from 5N to 6N, the amount of penetration of cracks in the glass substrate G1 is rapidly increased. When the load exceeds 6 N, the amount of penetration of the crack of the glass substrate G1 exceeds 80% of the thickness (0.2 mm) of the glass substrate G1, and the crack enters the glass substrate G1 with a large penetration amount. As described above, if the crack enters any of the glass substrates G1 and G2 with a large amount of penetration, the mother substrate G can be appropriately separated in the cutting step. Therefore, it can be said that it is preferable to set the load applied to the scribing tools 30 and 40 to 6 N or more in the scribing method 2.

Further, in this experiment, the amount of penetration into the crack of the glass substrate G1 was larger than that of the above experiment 1. Further, in the present experiment, the lower side of the scribing wheel 301 is supported by the roller 402, and the upper side of the scribing wheel 401 is supported by the roller 302, thereby suppressing the pressing force of the blade of the scribing wheel 301, 401. The substrate G is deformed. Therefore, it can be said that it is desirable to make cracks The amount of penetration is large and the crack is formed stably, and as the scribing method 2, the surfaces of the mother substrate G and the scribing wheels 301 and 401 are pressed by the rollers 402 and 302.

<Line tool>

8(a) and 8(b) are perspective views each showing a configuration example of the scribing tools 30 and 40 used in the scribing method 2.

The scribing tools 30 and 40 have the same configuration except for the arrangement order of the scribing wheels 301 and 401 and the rollers 302 and 402. Each of the scribing tools 30 and 40 is provided with holders 303 and 403 for holding the scribing wheels 301 and 401 and the rollers 302 and 402, respectively. The holders 303 and 403 are provided with grooves 303a and 403a for attaching the scribing wheels 301 and 401, grooves 303b and 403b for mounting rollers 302 and 402, and inclined surfaces 303c and 403c. The scribing wheels 301, 401 are mounted by fitting the shafts 301a, 401a into the holes of the holders 303, 403. The rollers 302, 402 are mounted by inserting the shafts 302a, 402a into the holes of the holders 303, 403.

9(a) and 9(b) are diagrams schematically showing a method of attaching the scribing tool 30 to the scribing line forming mechanism 22. In Figs. 9(a) and 9(b), the state of the inside of the see-through line forming mechanism 22 is shown.

At a lower end of the scribing forming mechanism 22, a holding portion 221 for holding the scribing tool 30 is provided, and a hole 222 into which the scribing tool 30 can be inserted is formed in the holding portion 221. A magnet 224 is disposed at the bottom of the hole 222, and a pin 223 is disposed at a position intermediate the hole 222. The holder 303 of the scribing tool 30 contains a ferromagnetic body. Further, the holding portion 221 is supported by the scribing line forming mechanism 22 so as to be rotatable in the horizontal direction by 360 degrees by a bearing (not shown).

When the scribing tool 30 is attached to the scribing forming mechanism 22, the retainer 303 of the scribing tool 30 is inserted into the hole 222 of the holding portion 221. If the upper end of the holder 303 is close to the magnet 224, the holder 303 is attracted to the magnet 224. At this time, the inclined surface 303c of the holder 303 abuts against the pin 223, and the holder 303 is positioned at the normal position. Thus, as shown in FIG. 9(b), the scribing tool 30 is attached to the lower end of the scribing line forming mechanism 22.

The scribing tool 40 is also attached to the lower end of the scribing forming mechanism 22. So, if The wire tools 30, 40 are respectively attached to the corresponding scribing head forming mechanism 22 of the scribing head 2, and as shown in Figs. 6(a) and (b), the roller 402 is positioned at a position corresponding to the scribing wheel 301, and the roller 302 is positioned at a position corresponding to the scribing wheel 401. When the scribing tools 30 and 40 having the configurations shown in FIGS. 8( a ) and 8 ( b ) are used, only the scribing tools 30 and 40 are attached to the corresponding scribing head 2 scribing forming mechanism 22 . The distance W1 between the scribing wheel 301 and the scribing wheel 401 can be maintained at a specific distance, and the scribing wheels 301, 401 and the rollers 402, 302 are opposed to each other.

Further, the above experiment 2 was carried out using the scribing tools 30 and 40 having the configurations shown in Figs. 8(a) and 8(b). Further, in the above experiment 1, the grooves 303b and 403b were omitted from the holders 303 and 403, and the holders 303 and 403 having only the grooves 303a and 403a were attached to the scribing tools 30 and 40 of the scribing wheels 301 and 401, respectively. .

<Line Control>

Next, the scribing control of the scribing device 1 will be described.

Fig. 10 (a) is a block diagram showing the configuration of the scribing device 1.

The scribing device 1 includes a control unit 101, a detecting unit 102, a driving unit 103, an input unit 104, and a display unit 105.

The control unit 101 includes a processor such as a CPU (Central Processing Unit), a memory such as a ROM (Read Only Memory), and a RAM (Random Access Memory), and is based on the memory. Control each part in the memory control program. Moreover, the memory is also used as a work area for controlling each part. The detecting unit 102 includes various sensors in addition to the cameras 19a and 19b shown in Fig. 1(a). The drive unit 103 includes the mechanism unit and the drive motors 17 and 18 of the scribing device 1 shown in Fig. 1(a). The input unit 104 is provided with a mouse and a keyboard. The input unit 104 is used to input various parameter values in the scribing operation such as the start position and the end position of the scribing or the interval of the scribing. The display unit 105 includes a monitor, and when input is input through the input unit 104, a specific input screen is displayed.

FIGS. 10(b) and 10(c) are diagrams showing the problem points when the start positions of the scribe lines formed on the upper surface and the lower surface of the mother substrate G do not coincide with each other when the mother substrate G is viewed from the top. Figure 10 (b) is from A view of one portion of the mother substrate G is observed from the side, and FIG. 10(c) is a view of a portion of the mother substrate G viewed from above.

As verified in the above experiments 1 and 2, it is preferable that the upper scribing wheel 301 and the lower scribing wheel 401 are scribed to each other when the two surfaces of the mother substrate G are simultaneously formed with a scribe line. The direction is offset by a certain distance. However, if the scribing method is applied from the start timing of the scribing, as shown in FIG. 10(b), the starting position SP1 of the scribe line L1 on the upper surface of the mother substrate G and the scribe line L2 of the lower surface of the mother substrate G are An offset of a specific distance W is generated between the start positions SP2.

When the start positions SP1 and SP2 are shifted in this manner, in the step of dividing along the scribe lines L1 and L2, as shown in FIG. 10(c), the glass substrate G2 which is generated on the lower side of the mother substrate G has a burr shape. The tab Gb. For example, if a crack perpendicular to the scribe lines L1 and L2 is formed at a position at the start position SP1 and the edge of the mother substrate G is cut off, the step of dividing along the scribe lines L1 and L2 is performed, and the lower side is drawn. The line L2 does not extend to the end of the lower glass substrate G2, so that the portion of the distance W of the glass substrate G2 is not neatly divided, and the burr-like projection Gb remains in this portion. If so, the outline of the cut-out liquid crystal panel does not coincide with the desired outline, and the liquid crystal panel cannot be appropriately disposed in the installation area on the product side. This problem is similarly generated at the end of the scribe line.

Therefore, in the present embodiment, the start position and the end position of the scribe lines L1 and L2 coincide with each other in the plan view of the mother substrate G, and the upper side scribing wheel 301 and the lower side are formed between the start position and the end position. The wire wheel 401 is controlled to be offset by a specific distance in the direction of the scribe line. Further, in this control, the lower scribing wheel 401 is controlled so as to advance in the scribing direction with respect to the upper scribing wheel 301.

Figure 11 is a flow chart showing the scribing control. Further, the scribing control shown in Fig. 11 does not move the conveyor belt 11 of Fig. 1(a), but moves the scribing tools 30, 40 to control the scribing on both surfaces of the mother substrate G. Unlike the scribing control shown in FIG. 11, the transporting belt 11 is moved to form the stroke on both surfaces of the mother substrate G without moving the scribing tools 30 and 40. Control of the line.

The scribing control shown in Fig. 11 is performed by the control unit 101 of Fig. 10(a). 12(a) to 14(b) are diagrams schematically showing the positions of the scribing tools 30 and 40 of a specific control timing. Here, the scribing tools 30 and 40 shown in Figs. 8(a) and 8(b) are used. Instead of this, a scribing tool 30, 40 in which the rollers 302, 402 are omitted may be used.

Referring to Fig. 11, control unit 101 processes the captured images of cameras 19a and 19b to detect the position of mother substrate G (S11). Based on the detection result, the control unit 101 sets the switching timing between the initial position of the scribing head 2 (the scribing tools 30, 40) and the feeding control with respect to each scribing head 2 (S12). .

Next, the control unit 101 moves the upper and lower scribe heads 2 to the start positions of the scribe lines L1 and L2 on which the objects are formed (S13). Fig. 12 (a) is a view showing the state of the scribing tools 30 and 40 at this time. In this state, the positions of the scribing wheels 301 and 401 are identical in the X-axis direction. In this state, the control unit 101 drives the servo motor 28 of the upper and lower scribing heads 2, and the scribing tools 30 and 40 are respectively pressed against the upper surface and the lower surface of the mother substrate G with a specific load (S14). Fig. 12 (b) is a view showing the state of the scribing tools 30 and 40 at this time. In this state, when the mother substrate G is viewed from the top, the scribing wheels 301 and 401 are pressed against the upper surface of the mother substrate G and the sealing material SL is opposed to each other so that the positions of the scribing wheels 301 and 401 coincide with each other. The position and the position of the lower surface of the mother substrate G opposite to the sealing material SL.

In a state where the scribing tools 30 and 40 are pressed against both surfaces of the mother substrate G in this manner, the control unit 101 drives the drive motors 17 and 18 to move the upper and lower scribing heads 2 at the speeds Vs and Vn (S15). The speed Vs is set to be slower than the speed Vn. Therefore, the scribing tool 30 on the upper side is gradually retracted with respect to the scribing tool 40 on the lower side, and is spaced apart from the scribing tools 30 and 40 in the scribing direction. Fig. 13 (a) is a view showing the state of the scribing tools 30 and 40 at this time.

Then, the control unit 101 waits for the elapse of the time T1 from the movement of the upper and lower scribing heads 2 (S16). When the time T1 elapses (S16: YES), the control unit 101 increases the moving speed of the upper scribing head 2 from the speed Vs to the speed Vn (S17).

Fig. 13 (b) is a view showing the state of the scribing tools 30 and 40 at this time. The timing of the elapse of the time T1 from the movement of the upper and lower scribing heads 2 (S16: YES), the desired interval is opened between the upper and lower scribing wheels 301, 401, and the rollers 402, 302 are opposed to the scribing wheels. 301, 401 and roughly opposite. In this state, the interval between the upper and lower scribing wheels 301 and 401 is maintained at a desired interval by increasing the moving speed of the upper scribing head 2 to the same speed Vn as that of the upper scribing head 2. In the state, the upper and lower scribing wheels 301 and 401 are moved in the scribing direction.

Then, the control unit 101 waits for the elapse of the time T2 (T2>T1) from the movement of the upper and lower scribing heads 2 (S18). When the time T2 elapses (S18: YES), the control unit 101 lowers the moving speed of the lower scribing head 2 from the speed Vn to the speed Vs (S19). Thereby, the lower scribing wheel 401 gradually approaches the upper scribing wheel 301. Fig. 14 (a) is a view showing the state of the scribing tools 30 and 40 at this time.

Further, the control unit 101 waits for the elapsed time T3 (T3>T2) from the movement of the upper and lower scribing heads 2 (S20). At the timing of the elapsed time T3 (S20: YES), in the scribing direction, the upper scribing wheel 301 follows the scribing wheel 401 on the upper and lower sides. Fig. 14 (b) is a view showing the state of the scribing tools 30 and 40 at this time.

As described above, when the time T3 elapses (S20: YES), the control unit 101 ends the feeding of the upper and lower scribing heads 2, and stops the upper and lower scribing heads 2 (S21). Then, the control unit 101 drives the servo motor 28 of the upper and lower scribing heads 2 to separate the scribing tools 30 and 40 from the upper surface and the lower surface of the mother substrate G (S22). The control unit 101 determines whether or not the processing of moving the upper and lower scribing heads 2 is completed for all the scribe lines set in advance (S23). When the processing of all the scribe lines is not completed (S23: NO), the control unit 101 returns the processing to S13 to execute the processing for the next scribe line. As described above, when the processing for all the scribe lines is completed (S23: YES), the control unit 101 ends the processing.

Fig. 15 is a timing chart showing the scribing control. In the lower part of Fig. 15, the drive signal for the scribing head 2 on the upper side and the drive signal for the scribing head 2 on the lower side are shown. Such drive letters The numbers are applied to the drive motors 17, 18 shown in Fig. 1(a), respectively. Further, in the upper part of Fig. 15, the position on the mother substrate G in the scribe direction and the position of the scribing wheels 301 and 401 are shown. The positions P0 and P3 are the start position and the end position of the scribe line, respectively.

At the scribing start timing T0, the drive signal of the upper scribing head 2 and the drive signal of the lower scribing head 2 are set to the levels Ds and Dn, respectively. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 move at the speeds Vs and Vn, respectively. Then, when the time T1 elapses, the drive signal of the upper scribing head 2 is raised to the level Dn. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 move at the same speed Vn.

When the time T2 elapses from the start timing of the scribe line T2, the drive signal of the lower scribe head 2 is lowered to the level Ds. Thereby, the speed of the scribing wheel 401 on the lower side is lowered to the speed Vs. When the time T2 elapses from the start timing of the scribe line T0, the drive signal of the upper scribe head 2 and the drive signal of the lower scribe head 2 are respectively set to the 0 level. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 are stopped.

According to the above-described scribing control, in the range R1 from the position P0 to the position P1, the lower scribing wheel 401 is gradually advanced with respect to the upper scribing wheel 301. Further, in the range R2 from the position P1 to the position P2, the interval between the lower scribing wheel 401 and the upper scribing wheel 301 is maintained at a specific distance. Then, in the range R3 from the position P2 to the position P3, the upper scribing wheel 301 gradually approaches the lower scribing wheel 401. Further, at the end position P3 of the scribing line, the upper scribing wheel 301 follows the scribing wheel 401 on the upper and lower sides, and the positions of the scribing wheels 401 coincide with each other. In this way, the control of the scribe line is ended.

<Effects of Embodiments>

According to this embodiment, the following effects are exhibited.

As shown in Experiments 1 and 2, a scribe line may be formed with a deep crack at a position directly above the sealing material SL. In particular, as in the scribing method 2, by pressing the opposite sides of the scribing wheels 301 and 401 by the rollers 302 and 402, the amount of penetration of the cracks can be made larger and the cracks can be stably formed.

Moreover, the starting positions of the scribe lines formed on the two surfaces of the mother substrate G are respectively in the plan view. Since they are mutually coincident, at the start of the scribe line, the burr-like tabs are prevented from remaining on the mother substrate G. Similarly, the end positions of the scribe lines formed on the both surfaces of the mother substrate G are aligned with each other in plan view. Therefore, at the end of the scribe line, the protruding portion of the mother substrate G remains in the burr-like shape. Therefore, the shape of the liquid crystal panel after cutting can be adjusted to an appropriate shape.

Further, in the range R1 of Fig. 15, the scribing wheel 301 is delayed with respect to the scribing wheel 401 by making the moving speed of the scribing wheel 301 slower than the moving speed of the scribing wheel 401. Therefore, cracks can be formed on both surfaces of the mother substrate G, and a gap is formed between the scribing wheel 301 and the scribing wheel 401.

Further, in the range R2 of Fig. 15, the delay of the scribing wheel 301 with respect to the scribing wheel 401 is maintained at a specific distance by making the moving speed of the scribing wheel 301 the same as the moving speed of the scribing wheel 401. Therefore, cracks can be favorably formed on the mother substrate G without unevenness.

Further, in the range R3 of Fig. 15, by moving the scribing wheel 301 faster than the moving speed of the scribing wheel 401, the scribing wheel 301 catches up with the scribing wheel 401 at the end position of the scribing line. Therefore, cracks can be formed on both surfaces of the mother substrate G, and the scribing wheel 301 can be caught by the scribing wheel 401.

<Modification>

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and the embodiments of the present invention can be variously modified in addition to the above.

For example, the method of displacing the scribing wheel 301 with respect to the scribing wheel 401 is not limited to the method described in the above embodiment, and may be another method.

For example, as shown in FIG. 16(a), the lower scribing wheel 401 may be made to be opposite to the lower scribing head 2 by delaying the movement start timing of the upper scribing head 2 by ΔT. The scribing wheel 301 on the upper side only advances a certain distance, and the upper end scribing wheel 301 is caught up by the advance end timing of the scribing head 2 of the upper side with respect to the scribing head 2 of the lower side only by ΔT. The scribing wheel 401 on the lower side. In this case, the driving signals of the upper scribing head 2 and the lower scribing head are both set to the level Dn, and the moving speeds of the scribing wheels 301 and 401 are the same. Therefore, the interval between the upper scribing wheel 301 and the lower scribing wheel 401 can be increased to a specific distance as compared with the above embodiment.

However, in this modified example, since the movement start timings of the upper and lower scribing wheels 301 and 401 are different, there is a startup failure in the scribing wheel 301 at the start of the movement of the subsequent scribing wheel 301. The rate raises concerns. Therefore, in order to suppress the start failure of the subsequent scribing wheel 301, as in the above embodiment, it is preferable that the movement start timings of the upper and lower scribing wheels 301 and 401 are the same, and after the movement starts, the upper and lower strokes are made. The interval between the reels 301 and 401 is gradually increased to control.

Further, as shown in FIG. 16(b), the driving signal of the upper scribing head 2 and the lower scribing head 2 may be used during the period from the time T0 to the time Tc corresponding to the intermediate position of the scribing line. The drive signals are set to Ds and Dn, respectively, and the drive signals of the upper scribing head 2 and the drive signals of the lower scribing head 2 are set to Dn and Ds, respectively, during the period from time Tc to time T3. Therefore, during the period from time T0 to Tc, the lower scribing wheel 401 is gradually advanced with respect to the upper scribing wheel 301, and the upper scribing wheel 301 is opposed to the lower scribing wheel during the period of time Tc to T3. 401 slowly catch up.

However, in this modified example, the amount of rib-like grain changes in the entire scribe line. On the other hand, in the above-described embodiment, in the range R2 of Fig. 15, since the interval between the upper and lower scribing wheels 301 and 401 is maintained at a specific distance, the rib-like amount is substantially fixed. Therefore, from the viewpoint of stabilizing the rib-like amount as much as possible and stabilizing the breaking step, it is preferable that, as in the above embodiment, the upper and lower scribe lines are provided only in the vicinity of the start position of the scribe line and the vicinity of the end position. The speeds of the wheels 301, 401 are different, and in the remaining range, the speeds of the upper and lower scribing wheels 301, 401 are made uniform.

Further, the feed speed of the scribing head 2 above and below the period from the time T0 to the time T3 can cause the scribing wheel 301 of the upper side to substantially follow the scribing wheel 401 of the upper and lower sides at the end position of the scribing line. Various changes are made for the conditions.

Further, in the control shown in Fig. 11, the load of the upper and lower scribing wheels 301 and 401 pressed against the upper surface and the lower surface of the mother substrate G is set to be constant over the entire length of the scribe line. However, it is also possible to control the load on the upper surface and the lower surface of the mother substrate G which is pressed against the scribing wheels 301 and 401 in the above manner in accordance with the position of the scribe line. For example, it is also possible to control the pressure load of the upper and lower scribing wheels 301 and 401 to be lower at the start position of the scribing, and then press the movement of the upper and lower scribing wheels 301 and 401. The load is slowly approaching the desired load.

Fig. 17 is a view showing an example of a control flow chart when the pressure contact load is changed. In the flowchart of Fig. 17, S14 of Fig. 11 is replaced with S31, and further, S32 to S35 are added. The other steps are the same as in FIG.

In S13, when the upper and lower scribing heads 2 are moved to the initial position of the scribing line forming the object, the control unit 101 drives the servo motor 28 of the upper and lower scribing heads 2, so that the scribing tools 30 and 40 are respectively pressed by the load N0. It is connected to the upper surface and the lower surface of the mother substrate G (S31). Then, before the elapse of time T1, the control unit 101 moves the upper and lower scribing heads 2 at the speeds Vs and Vn (S15), and gradually increases the crimping load of the scribing tools 30 and 40 with respect to the mother substrate G. (S32). When the time T1 is elapsed (S16: YES), the control unit 101 ends the increase of the crimping load of the scribing tools 30 and 40 with respect to the mother substrate G, and maintains the crimping load as the load at the elapse of time T1. (S33). Then, the control unit 101 increases the speed of the upper scribing head 2 to the speed Vn and advances the scribing operation (S17).

Then, when the elapsed time arrival time T2 (S18: YES), the control unit 101 changes the moving speed of the lower scribing head 2 to Vs (S18), and causes the scribing tools 30 and 40 to be pressed against the mother substrate G. The load is gradually reduced (S34). As described above, when the elapsed time arrival time T3 (S20: YES), the control unit 101 ends the reduction of the crimping load of the scribing tools 30 and 40 with respect to the mother substrate G (S35), and moves the upper and lower scribing heads 2 stop. Then, in S22, the control unit 101 causes the scribing tools 30 and 40 to move away from the mother substrate G, and ends the formation operation of the scribing line.

By adjusting the crimping load of the scribing tools 30, 40 in this manner, excessive load is applied to the mother substrate G at the start position and the end position of the scribing line. Since the positions of the scribing wheels 301 and 401 coincide with each other at the start position and the end position of the scribing, the mother substrate G is directly sandwiched by the scribing wheels 301 and 401. Therefore, the mother substrate G receives a large force from the scribing wheels 301 and 401 as compared with the case where the scribing wheels 301 and 401 are displaced from each other in the scribing direction. By the control of Fig. 17, at the start position and the end position of the scribing, the mother substrate G is prevented from being excessively applied from the scribing wheels 301, 401 by weakening the load. Therefore, at the start position and the end position of the scribe line, a crack of an appropriate depth can be formed without damage to the mother substrate G. Further, the load of S33 is adjusted in such a manner that a crack of a desired depth is formed at a certain distance between the scribing wheels 301 and 401.

Further, in the above embodiment, the scribing wheel in which the groove is formed at a fixed interval is used for the ridge line of the blade edge. However, it is conceivable that the same effect can be obtained even if the scribing wheel which does not form the groove in the ridge line is used. The size or shape of the scribing wheel (knife tip) is not limited to the case described in the above embodiment, and other sizes, shapes, and types of blade tips can be suitably used.

Further, in the control shown in FIG. 11, the scribing wheel 401 on the lower side of the mother substrate G is advanced in the scribing direction with respect to the scribing wheel 301 on the upper side, but the scribing wheel on the upper side of the mother substrate G may be used. 301 advances in the scribing direction with respect to the scribing wheel 401 on the lower side.

Further, in the control shown in FIG. 11, the moving speed of the upper and lower scribing heads 2 is switched by the elapsed time from the start timing T0 of the scribing operation, but the scribing head 2 for detecting the upper and lower sides is provided. In the case of a positional mechanism, the control can also be performed by the position of the upper and lower scribing heads 2. For example, the speed of the upper side of the scribing head 2 may be increased to Vn according to the position where the upper scribing head 2 is detected to reach the position P1 of FIG. 15, or the scribing head 2 of the lower side may be detected according to the detection of the scribing head 2 of the lower side. At the position P2, the speed of the scribing head 2 on the lower side is lowered to Vs. Further, the upper and lower scribing heads 2 may be stopped by detecting that the upper and lower scribing heads 2 have reached the position P3.

Further, in the configurations of Figs. 6(a) and (b) and Figs. 8(a) and (b), the axes of the scribing wheels 301 and 401 The center positions of the axes 301a and 401a coincide with the center positions of the axes 302a and 402a of the rolls 302 and 402 in the Z-axis direction, and the diameters of the scribing wheels 301 and 401 are the same as the diameters of the rolls 302 and 402, respectively. However, the relationship between the scribing wheels 301 and 401 and the rollers 302 and 402 is not limited thereto, and various other modifications are possible.

Further, in the configuration of Figs. 6(a) and 6(b) and Figs. 8(a) and 8(b), a pair of rollers 302 and 402 are disposed on both sides of the scribing wheels 301 and 401, but it is also conceivable that only One roller 302, 401 is disposed on one side of the scribing wheels 301, 401.

In addition, the configuration, the thickness, the material, and the like of the mother substrate G are not limited to those described in the above embodiment, and the scribing methods 1 and 2 and the scribing device may be used for cutting the mother substrate G of another configuration.

The embodiments of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.

301, 401‧‧‧ scribe wheel

Dn‧‧‧

Ds‧‧‧

P0‧‧‧ position

P1‧‧‧ position

P2‧‧‧ position

P3‧‧‧ position

R1‧‧‧ range

R2‧‧‧ range

R3‧‧‧ range

T0‧‧‧ scribing start timing

T1‧‧‧ time

T2‧‧‧ time

T3‧‧‧Time

Vn‧‧‧ speed

Vs‧‧‧ speed

Claims (10)

A scribing method for forming a scribing line on a mother substrate in which a first substrate and a second substrate are bonded together by a sealing material, and a starting position of the scribing of the first substrate and the above The first blade and the second blade are pressed against the position of the surface of the first substrate facing the sealing material and the second substrate, respectively, in a position where the starting position of the second substrate is aligned with each other in a plan view. The surface of the surface facing the sealing material is moved along the sealing material by the first blade and the second blade so that the first blade is displaced in the scribe line direction with respect to the second blade. And forming a scribe line on a surface of the first substrate and a surface of the second substrate, and moving the first blade and the second blade so that the displacement of the first blade and the second blade is eliminated; The end position of the scribe line of the first substrate and the end position of the scribe line of the second substrate are aligned with each other in plan view. The scribing method of claim 1, wherein the first blade is displaced relative to the second blade by causing the moving speed of the first blade to be different from the moving speed of the second blade. The method of scribing the item 1 or 2, wherein the displacement of the first blade with respect to the second blade is maintained at a specific distance by causing the moving speed of the first blade to be the same as the moving speed of the second blade The scribe line is formed on the surface of the first substrate and the surface of the second substrate. The method of scribing the item 1 or 2, wherein the first knife and the second knife are displaced at the end position by differentiating the moving speed of the first blade from the moving speed of the second blade eliminate. The method of scribing the item 1 or 2, wherein the first pressing member is pressed against the surface of the first substrate and the second knife In the corresponding position, the first pressing member is moved along the sealing material together with the first blade, and the second pressing member is pressed against the surface of the second substrate corresponding to the first blade. The second pressing member is moved along the sealing material together with the second blade. A scribing device for forming a scribing line on a mother substrate in which a first substrate and a second substrate are bonded together by a sealing material, and comprising: a first scribing head, wherein the first scribing head a surface of the substrate is formed with a scribe line; a second scribe line having a scribe line formed on a surface of the second substrate; and a driving portion for moving the first scribe line and the second scribe line in parallel with the mother substrate And a control unit that controls the first scribing head, the second scribing head, and the driving unit; and the control unit: a starting position of the scribing line of the first substrate and a scribing line of the second substrate The first blade of the first scribing head and the second blade of the second scribing head are pressed against the surface of the first substrate and opposed to the sealing material, respectively, in a manner that they coincide with each other in a plan view. a position and a position of the surface of the second substrate opposite to the sealing material, wherein the first blade and the second blade are respectively displaced by the first blade being displaced in a scribe line direction with respect to the second blade Moving along the sealing material to face the surface of the first substrate and the second Forming a scribe line on the surface of the plate to move the first blade and the second blade so as to cancel the displacement of the first blade and the second blade, and to end the scribe line of the first substrate The end positions of the scribe lines on the second substrate coincide with each other in plan view. A scribing device as claimed in claim 6, wherein The first blade is displaced relative to the second blade by causing the moving speed of the first blade to be different from the moving speed of the second blade. The scribing device according to claim 6 or 7, wherein the control unit shifts the first blade relative to the second blade by causing the moving speed of the first blade to be the same as the moving speed of the second blade The scribe line is formed on the surface of the first substrate and the surface of the second substrate while maintaining a specific distance. The scribe apparatus of claim 6 or 7, wherein the control unit causes the first knife and the second knife to be at the end position by differentiating a moving speed of the first blade from a moving speed of the second blade The shift is eliminated. The scribing device according to claim 6 or 7, wherein the first scribing head has the above-described first blade pressed against the sealing material in a state in which the first blade is displaced along the sealing material, and the surface is pressed from the surface of the first substrate a first pressing member at a pressure contact position of the second blade, wherein the second scribing head is pressed from a surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade The second pressing member of the pressure contact position of the first blade.