JP2016121037A - Scribe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribe device capable of forming crack with sufficient depth for performing break process on a mother substrate.SOLUTION: A scribe device includes: a scribing tool 30 for forming a scribe line L1 on a mother substrate G by moving a scribing wheel 31 while pressing the scribing wheel 31 on the mother substrate G; and crack penetration tools 50 and 60 disposed at a downstream side of a scribe direction from the scribing tool 30, which gives stress in an opening direction of the scribe line L1 formed by the scribing tool 30, on the mother substrate G. The crack formed by the scribing tool 30 of the scribe line L1 is penetrated by making the crack penetrating tools 50 and 60 follow after the scribing tool 30.SELECTED DRAWING: Figure 13

Description

  The present invention relates to a scribing apparatus for forming a scribe line on a substrate.

  Conventionally, a brittle material substrate such as a glass substrate is divided by a scribe process for forming a scribe line on the substrate surface and a break process for applying a predetermined force to the substrate surface along the formed scribe line. In the scribing step, the cutting edge of the scribing wheel is moved along a predetermined line while being pressed against the substrate surface. A scribe device equipped with a scribe head is used to form the scribe line.

  Patent Document 1 below describes a method for cutting out a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed through a sealing material. Individual liquid crystal panels are obtained by dividing the mother substrate. The sealing material is arranged so that a space serving as a liquid crystal injection region remains in a state where the two substrates are bonded to each other.

  When the mother substrate having the above configuration is divided, a method of simultaneously forming scribe lines on both surfaces of the mother substrate using two scribe heads can be used (for example, see Patent Document 2). In this case, the two scribe heads are arranged so as to sandwich the mother substrate. The two scribing wheels are positioned at the same position when the mother board is viewed in plan. In this state, the two scribing wheels are simultaneously moved in the same direction, and a scribe line is formed on each surface of the mother substrate.

JP 2006-137441 A JP 2012-240902 A

  As shown in the above-mentioned Patent Document 1, a conventional mother substrate has a region where no sealing material is interposed between adjacent liquid crystal injection regions. Therefore, when the scribe lines are simultaneously formed on both surfaces of the mother substrate by the two scribe heads as described above, the scribe lines can be formed in the region where the sealing material is not interposed. When the scribe line is formed in this way and the mother substrate is divided, a frame region having a predetermined width remains around the liquid crystal injection region in the liquid crystal panel.

  However, in recent years, particularly in mobile liquid crystal panels, it has become mainstream to narrow the frame area to the limit. In order to meet this requirement, it is necessary to omit the region where the sealing material is not interposed in the mother substrate, and to configure the adjacent liquid crystal injection regions to be separated only by the sealing material. In this case, the scribe lines are formed at positions immediately above and below the seal material.

  However, when scribe lines are formed at positions immediately above and below the sealing material in this way, a problem has been confirmed that cracks do not sufficiently enter the two glass substrates. If the break process is performed in such a state where cracks are insufficient, fine cracks or breakage may occur at the edge of the substrate after the break, and the strength of the glass substrate may be reduced.

  In view of such a problem, an object of the present invention is to provide a scribing device capable of forming a crack having a sufficient depth on a mother substrate to perform a breaking process.

  A first aspect of the present invention relates to a scribing apparatus that forms a scribe line on a mother substrate. The scribing apparatus according to this aspect is disposed on the downstream side of the scribing direction with respect to the scribing tool, a scribing tool that moves the blade while pressing the blade against the mother substrate to form a scribing line on the mother substrate, A crack penetration tool that applies stress to the mother substrate in a direction to open the scribe line formed by the scribing tool. Here, the scribing device causes the cracking tool to follow the scribing tool to infiltrate cracks in the scribe line formed by the scribing tool.

  According to this aspect, the crack in the scribe line penetrates when the crack penetration tool follows the scribing tool. Thereby, the crack of sufficient depth for execution of a breaking process can be formed in a mother board | substrate. Therefore, the mother substrate can be smoothly divided along the scribe line.

  In the scribing apparatus according to the first aspect, the crack penetration tool includes a first crack penetration tool that presses a position corresponding to the scribe line on a surface opposite to the surface on which the scribe line is formed, and the scribe device. A second crack penetration tool for pressing a position on the surface on which the line is formed sandwiching the scribe line may be included. According to this configuration, stress in the direction of opening the scribe line can be effectively applied to the mother substrate.

  In this case, the pressing position of the first crack penetration tool and the pressing position of the second crack penetration tool may coincide with each other in the scribe direction, or the pressing position of the first crack penetration tool and the second crack penetration tool. The pressing positions of the tools may be displaced from each other in the scribe direction. In the latter case, it is desirable that the pressing position of the first crack penetration tool precedes the pressing position of the second crack penetration tool in the scribe direction. If it carries out like this, since the stress which bends in a scribe direction is further provided to a mother board | substrate, a crack can be infiltrated more effectively.

  A second aspect of the present invention relates to a scribing apparatus that forms a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material. The scribing apparatus according to this aspect forms the first scribe line on the one surface by moving the first blade along the sealing material while pressing the first blade against one surface of the mother substrate. A second scribing line is formed on the other surface by moving the second blade along the sealing material while pressing the second blade against the other surface of the mother substrate. A second scribing tool that is disposed downstream of the first scribing tool with respect to the first scribing tool, and stress in a direction to open the first scribing line formed by the first scribing tool. A crack penetration tool applied to the substrate. Here, the scribing device moves the first scribing tool and the second scribing tool while displacing the first blade in the scribing direction with respect to the second blade, thereby moving the first scribing tool. A line and the second scribe line are formed on the mother substrate. In addition, the scribing device causes the first scribing tool to follow the crack infiltration tool to infiltrate cracks in the first scribe line formed by the first scribing tool.

  According to this aspect, the crack of the scribe line formed by the blade that precedes the scribe direction among the first blade and the second blade can be deeply penetrated. Moreover, the crack of a 1st scribe line can be osmose | permeated because a crack penetration tool follows a 1st scribing tool. Thereby, a scribe line can be formed with cracks having a sufficient depth at positions immediately above and below the sealant. Therefore, the mother substrate can be smoothly divided along the sealing material in the breaking step.

  In the scribing apparatus according to the second aspect, the crack penetration tool includes a first crack penetration tool that presses a position corresponding to the first scribe line on the other surface of the mother substrate, and the mother substrate. A second crack penetration tool that presses a position of the one surface across the first scribe line may be included. According to this configuration, stress in the direction of opening the first scribe line can be effectively applied to the mother substrate.

  In the scribing apparatus according to the second aspect, the first and second scribing tools can be moved such that the second blade precedes the first blade in the scribing direction. If it carries out like this, the crack of the 2nd scribe line formed with the 2nd blade will become deep, while the crack of the 1st scribe line formed with the 1st blade will become shallow. And the crack of the 1st scribe line with a shallow penetration is further penetrated by the crack penetration tool. Therefore, the crack penetration amount of both scribe lines can be increased, and the mother substrate can be smoothly divided along the sealing material in the breaking process.

  In the scribing apparatus according to the second aspect, the first and second scribing tools can be moved such that the first blade precedes the second blade in the scribe direction. If it carries out like this, the crack of the 1st scribe line formed with the 1st blade will become deep, while the crack of the 2nd scribe line formed with the 2nd blade will become shallow. And the crack of a 1st scribe line is further osmose | permeated with a crack penetration tool. Thus, even when the crack penetration amount of the first scribe line formed by the first blade is not stable to a sufficient size, the crack penetration tool allows the crack of the first scribe line to be sufficiently deep. Can penetrate.

  In the scribing apparatus according to the second aspect, the first scribing tool includes a first pressing portion that presses a position corresponding to the second blade of the second scribing tool on the one surface. It can be configured. If it carries out like this, the crack of the 2nd scribe line formed by the 2nd blade can be penetrated more deeply. Therefore, the mother substrate can be more smoothly divided in the breaking process.

  In the scribing apparatus according to the second aspect, the second scribing tool includes a second pressing portion that presses a position corresponding to the first blade of the first scribing tool on the other surface. Can be. If it carries out like this, the crack of the 1st scribe line formed with the 1st blade can be penetrated more deeply. Therefore, the mother substrate can be more smoothly divided in the breaking process.

  As described above, according to the present invention, it is possible to provide a scribing apparatus capable of forming a crack having a sufficient depth on the mother substrate to perform the breaking process.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

It is a figure which shows typically the structure of the scribing apparatus which concerns on embodiment. It is a disassembled perspective view which shows the structure of the scribe head which concerns on embodiment. It is a perspective view which shows the structure of the scribe head which concerns on embodiment. It is a figure which shows typically the scribe operation | movement by the scribing tool which concerns on embodiment. It is a figure which shows the experimental result at the time of performing scribing operation | movement using the scribing tool which concerns on embodiment. It is a figure which shows the effect | action of the crack penetration tool which concerns on embodiment. It is a disassembled perspective view which shows the structure of the crack penetration tool which concerns on embodiment. It is a disassembled perspective view which shows the structure of the crack penetration tool which concerns on embodiment. It is a perspective view which shows the structure of the crack penetration tool which concerns on embodiment. It is a side view which shows the structure of the crack penetration tool which concerns on embodiment. It is a side view which shows the structure of the crack penetration tool which concerns on embodiment. It is a figure which shows typically the mounting method of the crack penetration tool which concerns on embodiment. It is a figure which shows typically the scribe operation | movement which concerns on embodiment. It is a figure which shows typically the structure of the scribing apparatus which concerns on other embodiment. It is the disassembled perspective view and perspective view which show the structure of the scribe head which concerns on other embodiment. It is a figure which shows typically the structure and scribing operation | movement of the scribing apparatus which concern on the example of a change. It is a perspective view which shows the structure of the scribing tool which concerns on the other modification. It is a figure which shows typically the structure and scribing operation | movement of the scribing apparatus which concern on the other modification. It is a figure which shows typically the structure of the scribing apparatus which concerns on another example of a change.

  Embodiments of the present invention will be described below with reference to the drawings. In each figure, an X axis, a Y axis, and a Z axis that are orthogonal to each other are added for convenience. The XY plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

<Scribe device>
FIGS. 1A and 1B are diagrams schematically showing a configuration of the scribe device 1. FIG. 1A is a view of the scribe device 1 viewed from the Y axis positive side, and FIG. 1B is a view of the scribe device 1 viewed from the X axis positive side.

  Referring to FIG. 1A, a scribing device 1 includes a conveyor 11, struts 12a and 12b, guides 13a and 13b, guides 14a and 14b, sliding units 15 and 16, and two scribe heads 2a. And two scribe heads 2b.

  As shown in FIG.1 (b), the conveyor 11 is provided so that it may extend in a Y-axis direction except the location where the scribe heads 2a and 2b are arrange | positioned. On the conveyor 11, a mother substrate G is placed. The mother substrate G has a structure in which a pair of glass substrates are bonded to each other. The mother board G is sent in the Y-axis direction by the conveyor 11.

  The support columns 12 a and 12 b are provided perpendicular to the base of the scribe device 1. The guides 13a and 13b and the guides 14a and 14b are respectively installed between the columns 12a and 12b so as to be parallel to the X-axis direction. The sliding units 15 and 16 are slidably provided on the guides 13a and 13b and the guides 14a and 14b, respectively. Each of the guides 13a and 13b and the guides 14a and 14b is provided with a predetermined driving mechanism, and the sliding units 15 and 16 are moved in the X-axis direction by the driving mechanism.

  Scribe heads 2a and 2b are mounted on the sliding units 15 and 16, respectively. Therefore, the scribe heads 2a and 2b move simultaneously with the movement of the sliding units 15 and 16. In addition, a sliding unit may be separately provided with respect to the scribe heads 2a and 2b. In the case of this configuration, driving of the scribe heads 2a and 2b can be individually controlled.

  The scribing tools 30 and 40 are attached to the upper scribe head 2a and the lower scribe head 2a so as to face the mother substrate G, respectively. The upper and lower scribe heads 2a move in the X-axis direction in a state where the scribing wheels held by the scribing tools 30 and 40 are pressed against the surface of the mother substrate G. Thereby, scribe lines are formed on the upper and lower surfaces of the mother substrate G.

  Further, the upper scribe head 2b and the lower scribe head 2b are respectively provided with crack penetration tools 50, 60 for applying stress in the direction of opening the scribe line formed by the upper scribing tool 30 to the mother substrate G. Is attached. As the crack penetration tools 50 and 60 follow the scribing tool 30, cracks in the scribe line formed by the scribing tool 30 penetrate. The configuration of the crack penetration tools 50 and 60 will be described later with reference to FIGS.

<Scribe head>
FIG. 2 is a partially exploded perspective view showing the configuration of the scribe head 2a, and FIGS. 3A and 3B are perspective views showing the configuration of the scribe heads 2a and 2b, respectively.

  Referring to FIG. 2, the scribe head 2 a includes an elevating mechanism 21, a scribe line forming mechanism 22 a, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28. With.

  The elevating mechanism 21 includes a cylindrical cam 21a connected to the drive shaft of the servo motor 28, and a cam follower 21c formed on the upper surface of the elevating part 21b. The elevating part 21b is supported by the base plate 23 so as to be movable in the vertical direction via a slider (not shown), and is urged in the positive direction of the Z axis by a spring 21d. The cam follower 21c is pressed against the lower surface of the cylindrical cam 21a by the bias of the spring 21d. The elevating part 21b is connected to a scribe line forming mechanism 22a. When the cylindrical cam 21a is rotated by the servo motor 28, the elevating part 21b is raised and lowered by the cam action of the cylindrical cam 21a, and accordingly, the scribe line forming mechanism 22a is raised and lowered. The scribing tool 30 or the scribing tool 40 is attached to the lower end of the scribe line forming mechanism 22a.

  The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape that fits into the groove 23 a of the base plate 23, the groove 24 a of the top plate 24, and the groove 25 a of the bottom plate 25. In a state where the rubber frame 26 is mounted in the grooves 23 a, 24 a, and 25 a, the surface of the rubber frame 26 protrudes slightly outward from the side surfaces of the base plate 23, the top plate 24, and the bottom plate 25.

  The cover 27 has a shape in which three plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. Two holes 27f are formed in the upper and lower edges of the front surface portion 27a.

  In a state where the rubber frame 26 is fitted in the grooves 23 a, 24 a, 25 a, the right side surface portion 27 b and the left side surface portion 27 c of the cover 27 are deformed so as to bend outward, and the cover 27 is transformed into the base plate 23, the top plate 24 and the bottom plate 25. It is attached. In this state, screws are screwed to the top plate 24 and the bottom plate 25 through two holes 27f formed at the upper and lower end edges of the front surface portion 27a. Further, screws are screwed into screw holes formed slightly outside the grooves 23a, 24a, and 25a of the base plate 23, the top plate 24, and the bottom plate 25. Thus, the cover 27 is sandwiched between the base plate 23, the top plate 24, the bottom plate 25, and the screw heads, and the peripheral portions of the right side surface portion 27b and the left side surface portion 27c are pressed against the rubber frame 26. In this way, the scribe head 2a is assembled as shown in FIG.

  The scribe head 2b has the same configuration as the scribe head 2a except for the configuration of the scribe line forming mechanism 22b. As shown in FIG. 3A, in the scribe head 2a, the holding portion 221 that holds the scribing tools 30 and 40 is disposed at a position displaced to the X-axis negative side, and in the scribe head 2b, the crack penetration tool 50, A holding portion 221 that holds 60 is disposed at a position displaced to the X-axis positive side. By adjusting the arrangement of the holding portions 221 in this manner, the scribing tools 30 and 40 and the crack penetration tool 50 are obtained in a state where the two heads 2a and 2b are arranged in the X-axis direction as shown in FIG. , 60 can be reduced.

  In the present embodiment, the scribing tools 30, 40 are individually held by the two scribe heads 2a, and the crack penetration tools 50, 60 are individually held by the two scribe heads 2b. In addition, the load applied to the crack penetration tools 50 and 60 can be individually controlled. Thereby, an optimal load can be given to each tool.

<Scribe method>
In the present embodiment, the scribing wheels respectively held by the scribing tools 30 and 40 are shifted from each other in the scribe direction and moved along the seal material, so that scribe lines are formed on both surfaces of the mother substrate G.

  4A is a schematic view when the vicinity of the scribe position is seen from the Y axis positive side, FIG. 4B is a schematic view when the vicinity of the scribe position is seen from the X axis positive side, and FIG. It is a schematic diagram when the scribe position vicinity is seen from the Z-axis positive side.

  As shown in FIG. 4A, in this scribing method, the scribing wheel 41 of the lower (Z-axis negative side) scribe head 2a is more than the scribing wheel 31 of the upper (Z-axis positive side) scribe head 2a. The two scribing wheels 31 and 41 are moved so as to advance by a distance W1 in the scribe direction (X-axis positive direction). The two scribing wheels 31 and 41 are respectively supported by the scribing tools 30 and 40 so as to be rotatable about an axis parallel to the Y axis.

  Referring to FIG. 4B, the mother substrate G is configured by bonding two glass substrates G1 and G2 through a sealing material SL. A color filter (CF) is formed on the glass substrate G1, and a thin film transistor (TFT) is formed on the glass substrate G2. A liquid crystal injection region R is formed by the sealing material SL and the two glass substrates G1 and G2, and liquid crystal is injected into the liquid crystal injection region R. The two scribing wheels 31 and 41 are positioned without being displaced from each other in the Y-axis direction. The scribing wheel 31 is pressed against the surface of the glass substrate G1 at a position directly above the sealing material SL, and the scribing wheel 41 is pressed against the surface of the glass substrate G2 at a position directly below the sealing material SL.

  As shown in FIG.4 (c), the sealing material SL is arrange | positioned at the grid | lattice form. The two scribing wheels 31 and 41 are moved in the positive direction of the X axis along the seal material SL. Thereby, as shown in FIGS. 4B and 4C, scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

<Experiment>
The inventors of the present application conducted an experiment to form a scribe line on the mother substrate G in accordance with the scribe method shown in FIGS. Hereinafter, the experiment and the experimental result will be described.

  In the experiment, a substrate (mother substrate G) in which glass substrates G1 and G2 each having a thickness of 0.2 mm were bonded together with a sealant SL was used. The size of the bonded substrate (mother substrate G) is 118 mm × 500 mm. For the scribing wheels 31 and 41, a micro penet (registered trademark of Samsung Diamond Industrial Co., Ltd.) manufactured by Samsung Diamond Industrial Co., Ltd. was used. Each of the scribing wheels 31 and 41 has a structure in which a V-shaped cutting edge is formed on the outer periphery of the disk and grooves are formed at predetermined intervals on the edge line of the cutting edge. The scribing wheels 31 and 41 have a diameter of 3 mm, a blade edge angle of 110 °, a groove number of 550, and a groove depth of 3 μm.

  The scribing wheels 31 and 41 having this configuration were moved while being pressed against the glass substrates G1 and G2, respectively, to perform a scribing operation. In this experiment, unlike FIG. 4A, the upper scribing wheel 31 was preceded in the scribe direction with respect to the lower scribing wheel 41. The load applied to the scribing wheels 31 and 41 during the scribing operation was controlled to 6.5N. The moving speed of the scribing wheels 31 and 41 was constant (200 mm / sec).

  Under the above conditions, the penetration amount of cracks in the glass substrates G1 and G2 was measured while changing the distance W1 between the two scribing wheels 31 and 41. As a comparative example, the amount of crack penetration was measured when the distance W1 between the scribing wheels 31 and 41 was zero. In each measurement, in addition to the amount of crack penetration, the amount of rib marks was also measured.

  5A to 5E show the experimental results. FIG. 5A is a diagram showing the amount of crack penetration and the amount of rib marks, and FIGS. 5B to 5E are cross-sectional photographs of the mother substrate G on the scribe line, each having a distance W1 of 0. .4 mm, 0.6 mm, 0.8 mm, and 1.0 mm. 5B to 5E, D1 and D3 indicate rib mark amounts, and D2 and D4 indicate crack penetration amounts.

  Referring to FIG. 5A, when the distance W1 exceeds 0.6 mm, the amount of crack penetration of the glass substrate G1 is larger than when the distance W1 is 0 mm. If any one of the glass substrates G1 and G2 is cracked with a large amount of penetration, the mother substrate G can be divided smoothly in the breaking step.

  For example, as in the comparative example (W1 = 0 mm), if the amount of cracks in the glass substrates G1, G2 is about half the thickness (0.2 mm) of the glass substrates G1, G2, It is necessary to break the glass substrates G1 and G2 from both sides. When the operation of breaking the glass substrates G1 and G2 from both sides of the mother substrate G is performed in this way, fine cracks and breakage occur at the edges of the glass substrates G1 and G2, and the strength of the glass substrates G1 and G2 decreases. There is a fear.

  On the other hand, when the distance W1 is 0.6 mm to 1.4 mm, the amount of crack penetration in the glass substrate G1 is large. Thus, when the penetration amount of cracks in the glass substrate G1 is large, in the breaking step, by performing an operation of breaking the glass substrate G2 having a small crack penetration amount from one side of the mother substrate G, The glass substrate G1 having a deep crack is also cut along the crack. Thus, when the glass substrates G1 and G2 are broken only from one side of the mother substrate G, the edges of the glass substrates G1 and G2 are not cracked or broken, and the strength of the glass substrates G1 and G2 is kept high. It is.

  For the above reasons, in dividing the mother substrate G, it is desirable that either one of the glass substrates G1 and G2 is cracked with a large amount of penetration. In this experiment, as shown in FIG. 5 (a), when the distance W1 between the two scribing wheels 31 and 41 exceeds 0.6 mm, the crack of the glass substrate G1 is compared with the comparative example (W1 = 0 mm). The amount of penetration has increased. From this, it can be said that the distance W1 between the two scribing wheels 31, 41 is desirably 0.6 mm or more. Thus, by setting the distance W1 between the two scribing wheels 31, 41, the mother substrate G can be smoothly broken.

  In this experiment, since the upper scribing wheel 31 was advanced in the scribing direction with respect to the lower scribing wheel 41, the amount of crack penetration into the upper glass substrate G1 increased, but as shown in FIG. Thus, when the lower scribing wheel 41 is advanced in the scribing direction with respect to the upper scribing wheel 31, the amount of crack penetration in the glass substrate G2 increases.

  By the way, by shifting the scribing wheels 31 and 41 in the scribe direction as described above, the penetration amount of one crack of the glass substrates G1 and G2 can be deepened. On the other hand, the other of the glass substrates G1 and G2 is penetrated by cracks. The amount becomes shallower. As described above, in the breaking process, the operation of breaking the glass substrate with the shallower crack penetration is performed, but if the crack penetration is too shallow at this time, the glass substrate with the shallow crack may not be properly broken. Can happen.

  Therefore, in the present embodiment, the crack penetration tools 50 and 60 are attached to the two upper and lower scribe heads 2b, respectively, and the scribing tools 50 and 60 are followed up in the scribe process. As a result, stress is applied to the mother substrate G in the direction in which the upper scribe line L1 where the amount of crack penetration is shallower opens.

  FIGS. 6A and 6B are diagrams illustrating the operation of the crack penetration tools 50 and 60. FIG. 6A is a schematic diagram when the vicinity of the scribe position is viewed from the Y axis positive side, and FIG. 6B is a schematic diagram when the vicinity of the crack penetration tools 50 and 60 is viewed from the X axis positive side.

  As shown in FIGS. 6A and 6B, the crack penetration tool 50 includes two bearings 51 and 52, and the crack penetration tool 60 includes one bearing 61. The two bearings 51 and 52 are arranged at a distance of the distance W2, and the bearing 61 is arranged at an intermediate position between the two bearings 51 and 52. That is, the distance W3 between the bearing 51 and the bearing 61 in the Y-axis direction is half of the distance W2.

  In the scribe operation, the bearing 61 is positioned immediately below the sealing material SL, and is moved along the sealing material SL while pressing the lower surface of the glass substrate G2 upward. Further, the two bearings 51 and 52 are positioned at positions sandwiching the sealing material SL, and are moved in parallel to the sealing material SL while pressing the upper surface of the glass substrate G1 downward. As a result, as shown in FIG. 6B, stress is applied to the mother substrate G in the direction in which the upper scribe line L1 where the amount of crack penetration is shallow opens. Due to this stress, cracks in the scribe line L1 penetrate more deeply. As a result, as shown in FIG. 6A, the cracks in the scribe line L1 after the crack penetration tools 50 and 60 have passed deeply penetrate.

<Crack penetration tool>
FIG. 7 is an exploded perspective view showing the configuration of the crack penetration tool 50.

  The crack penetration tool 50 includes bearings 51 and 52, a spacer 53, a holder 54, and a shaft 55.

  The bearing 51 has a configuration in which an outer ring 51a is assembled to the outside of the inner ring 51b. The outer ring 51a of the bearing 51 is made of a metal material and has a cylindrical shape. A ball 51c and a cage 51d are held between the outer ring 51a and the inner ring 51b. A roller made of a metal material or a material other than the metal material may be provided outside the outer ring 51a. The shaft 55 is fitted into the hole of the inner ring 51b. The shaft 55 is made of a highly rigid metal material. Similarly to the bearing 51, the bearing 52 has a configuration in which a ball 52c and a cage 52d are held between an outer ring 52a and an inner ring 52b. In the present embodiment, the bearings 51 and 52 are the same.

  The spacer 53 is for maintaining the distance between the bearings 51 and 52 at a distance W2 (see FIG. 6B). The spacer 53 is made of a metal material and has a cylindrical shape. The shaft 55 is passed through the hole of the spacer 53. For smooth rotation of the bearing outer ring 52a, the spacers 53 are brought into contact only with the bearing inner ring 52b.

  The holder 54 is made of a ferromagnetic material. The holder 54 includes a cylindrical body portion 54a and a leg portion 54b that continues integrally with the lower end of the body portion 54a. An inclined surface 54c is formed on the body portion 54a by cutting out the side surface. The inclined surface 54c is inclined by a predetermined angle from the horizontal direction in an in-plane direction parallel to the scribe direction and the vertical direction.

  A rectangular recess 541 is formed in the leg 54b. The concave portion 541 is formed at the center position in the width direction of the leg portion 54b. A hole 542 communicating with the recess 541 is formed on one side surface of the leg portion 54b. Further, a hole 543 is formed in the leg portion 54 b at a position coaxial with the hole 542. The diameter of the hole 542 is the same as the diameter of the shaft 55. The diameter of the inlet of the hole 543 is the same as the diameter of the shaft 55, and the diameter of the outlet of the hole 543 is small so as to receive one end of the pointed shape of the shaft 55.

  When the crack penetration tool 50 is assembled, the bearings 51 and 52 and the spacer 53 are inserted into the recess 541 so that the spacer 53 is sandwiched between the two bearings 51 and 52. At this time, the holes of the inner rings 51 b and 52 b of the bearings 51 and 52 and the hole of the spacer 53 are aligned with the hole 542 of the recess 541. In this state, the shaft 55 is passed through the hole 542. The shaft 55 is sequentially inserted into the hole of the inner ring 51b, the hole of the spacer 53, and the hole of the inner ring 52b, and is further inserted into the hole 543 of the leg portion 54b. The shaft 55 is pushed in until the tip comes into contact with the inner surface of the hole 543. Thereby, the assembly of the crack penetration tool 50 is completed.

  FIG. 8 is an exploded perspective view showing the configuration of the crack penetration tool 60.

  The crack penetration tool 60 includes a bearing 61, two spacers 62 and 63, a holder 64, and a shaft 65.

  The bearing 61 is configured such that a ball 61c and a retainer 61d are held between an outer ring 61a and an inner ring 61b, like the bearing 51 of FIG. In the present embodiment, the bearing 61 is the same as the bearing 51 of FIG. The spacers 62 and 63 are for positioning the bearing 61 at the center position of the holder 64. The holder 64 includes a body portion 64a, leg portions 64b, and an inclined surface 64c, like the holder 54 of FIG. A recess 641 and two holes 642 and 643 are formed in the leg 64b. The holder 64 is the same as the holder 64 of FIG.

  When the crack penetration tool 60 is assembled, the spacers 62 and 63 and the bearing 61 are inserted into the recess 641 so that the bearing 61 is sandwiched between the two spacers 62 and 63. At this time, the holes of the spacers 62 and 63 and the hole of the inner ring 61 b of the bearing 61 are aligned with the hole 642 of the recess 641. In this state, the shaft 65 is passed through the hole 642. The shaft 65 is sequentially inserted into the hole of the spacer 62, the hole of the inner ring 51b, and the hole of the spacer 63, and further inserted into the hole 643 of the leg portion 64b. The shaft 65 is pushed in until the tip comes into contact with the inner surface of the hole 643. Thereby, the assembly of the crack penetration tool 60 is completed.

  FIGS. 9A and 9B are perspective views showing the appearance of the crack penetration tools 50 and 60 after assembly, respectively. FIGS. 10A and 10B are a left side view and a front view showing the configuration of the crack penetration tool 50. 11A and 11B are a left side view and a front view showing the configuration of the crack penetration tool 60. FIG.

  Referring to FIG. 10B, when the crack penetration tool 50 is viewed from the front side, the two bearings 51 and 52 are supported by the shaft 55 so as to sandwich the spacer 53. The spacer 53 is supported by the shaft 55 at the center position in the left-right direction of the holder 54. The thickness of the spacer 53 is D2, and the thicknesses of the two bearings 51 and 52 are both D3. The sum of the thickness D2 and the two thicknesses D3 is slightly smaller than the distance between the inner surfaces of the recess 541.

  Referring to FIG. 10A, when the crack penetration tool 50 is viewed in a direction parallel to the shaft 55, the bearings 51 and 52 protrude from the lower surface of the holder 54 by D1. D1 is the distance from the lower surface of the holder 54 to the lower ends of the bearings 51 and 52. The lower ends of the bearings 51 and 52 are substantially at the center position of the leg portion 54b in the scribe direction.

  Referring to FIG. 11B, when the crack penetration tool 60 is viewed from the front side, the bearing 61 is supported by the shaft 65 so as to be sandwiched between the two spacers 62 and 63. The thickness of the bearing 61 is D5, and the thicknesses of the two spacers 62 and 63 are both D6. The sum of the thickness D5 and the two thicknesses D6 is slightly smaller than the distance between the inner surfaces of the recess 641. Therefore, the bearing 61 is positioned at the center position of the holder 64 in the left-right direction.

  In the present embodiment, the thickness D5 of the bearing 61 is the same as the thickness D3 of the bearings 51 and 52 shown in FIG. Instead, the thickness D5 of the bearing 61 and the thickness D3 of the bearings 51 and 52 shown in FIG. 10B may be different from each other.

  In the crack penetration tool 50, the width D2 of the spacer 53 may be reduced, and spacers may be further provided on the left and right sides of the bearings 51 and 52. In this case as well, the sum of the thickness of the bearing and the thickness of the spacer may be made slightly smaller than the distance between the inner surfaces of the recess 541.

  With reference to FIG. 11A, when the crack penetration tool 60 is viewed in a direction parallel to the shaft 65, the bearing 61 protrudes from the lower surface of the holder 64 by D 4. D4 is the distance from the lower surface of the holder 64 to the lower end of the bearing 61. The lower end of the bearing 61 is at a substantially central position of the leg portion 64b in the scribe direction.

  FIGS. 12A and 12B are diagrams schematically illustrating a method of attaching the crack penetration tool 50 to the scribe line forming mechanism 22b. 12A and 12B show a state in which the inside of the scribe line forming mechanism 22b is seen through.

  A holding portion 221 that holds the crack penetration tool 50 is provided at the lower end of the scribe line forming mechanism 22b, and a hole 222 into which the crack penetration tool 50 can be inserted is formed in the holding portion 221. A magnet 224 is installed at the bottom of the hole 222, and a pin 223 is provided at an intermediate position of the hole 222. As described above, the holder 54 of the crack penetration tool 50 is made of a ferromagnetic material.

  When attaching the crack penetration tool 50 to the scribe line forming mechanism 22 b, the holder 54 of the crack penetration tool 50 is inserted into the hole 222 of the holding portion 221. When the upper end of the holder 54 approaches the magnet 224, the holder 54 is attracted to the magnet 224. At this time, the inclined surface 54c of the holder 54 comes into contact with the pin 223, and the holder 54 is positioned at a proper position. Thus, as shown in FIG. 12B, the crack penetration tool 50 is attached to the lower end of the scribe line forming mechanism 22b.

  Similarly, the crack penetration tool 60 is attached to the lower end of the scribe line forming mechanism 22b. Similarly, the scribing tools 30 and 40 are attached to the lower end of the scribe line forming mechanism 22a. The holding part of the scribe line forming mechanism 22a has the same configuration as the holding part 221 of the scribe line forming mechanism 22b.

  FIG. 13A is a side view of a main part schematically showing a state in which the scribing tools 30 and 40 and the crack penetration tool 50 are mounted on the scribe line forming mechanisms 22a and 22b, respectively. FIG. 52 and the vicinity of the bearing 61 are viewed from the X-axis negative side.

  As shown in FIG. 13A, the scribing wheels 31 and 41 are rotatably supported by holders 33 and 43 by shafts 32 and 42. Like the holder 54, the holders 33 and 43 are provided with inclined surfaces 33c and 43c. The inclined surfaces 33c and 43c come into contact with the pins 223 of the scribe line forming mechanism 22a, thereby forming a lower end of the scribe line forming mechanism 22a. Installed.

  In the present embodiment, as shown in FIG. 13A, the position of the shaft 32 in the upper holder 33 is shifted to the opposite side to the scribe direction. Accordingly, the lower scribing wheel 41 precedes the upper scribing wheel 31 in the scribe direction. Instead of the method of adjusting the position of the shaft 32 in this way, the position of the upper scribe line forming mechanism 22a is shifted to the opposite side of the scribe direction with respect to the position of the lower scribe line forming mechanism 22a. Thus, the lower scribing wheel 41 may precede the upper scribing wheel 31 in the scribing direction. Thus, the upper holder 33 and the lower holder 43 can be shared.

  Further, as shown in FIG. 13A, in the present embodiment, the upper bearings 51 and 52 and the lower bearing 61 are positioned at the same position in the scribe direction (X-axis positive direction). Further, as shown in FIG. 13B, the lower bearing 61 is positioned at an intermediate position between the two upper bearings 51 and 52.

  During the scribe operation, the upper and lower scribe heads 2a and 2b are moved in the scribe direction (X-axis positive direction) while maintaining the positional relationship between the scribing wheels 31 and 41 and the positional relationship between the bearings 51 and 52 and the bearing 61. The At this time, the scribing wheels 31 and 41 are positioned at positions immediately above and below the seal material SL. Thus, scribe lines L1 and L2 are formed on the upper and lower surfaces of the mother substrate G.

  In this scribing operation, as described with reference to FIG. 6A, the lower scribing wheel 41 precedes the upper scribing wheel 31 in the scribing direction, and thus is formed by these scribing wheels 31, 41. Immediately after the scribe line L1, L2, the crack on the upper scribe line L1 becomes shallower and the crack on the lower scribe line L2 becomes deeper. However, as the bearings 51 and 52 and the bearing 61 follow the scribing wheel 31, a stress in the direction of opening the upper scribe line L1 is applied to the mother substrate G as described with reference to FIG. Thus, cracks in the scribe line L1 further penetrate. Thereby, after the bearings 51 and 52 and the bearing 61 pass, the crack of the scribe line L1 becomes deep. In this way, the upper scribe line L1 is also secured to a sufficient depth so that the break operation can be performed properly.

<Effect of embodiment>
According to the present embodiment, the following effects are exhibited.

  As the crack penetration tools 50, 60 follow the scribing tools 30, 40, cracks in the scribe line L1 penetrate. As a result, a sufficiently deep crack can be formed in the mother substrate G. Therefore, the mother substrate G can be smoothly divided along the scribe line.

  Crack penetration tool 60 that presses a position corresponding to the scribe line L1 on the surface opposite to the surface on which the scribe line L1 is formed, and crack penetration that presses a position on the surface on which the scribe line L1 is sandwiched between the scribe lines L1 Stress is applied to the mother substrate G using the tool 50. For this reason, the stress in the direction of opening the scribe line L1 can be effectively applied to the mother substrate G.

  The scribing operation is performed by causing the lower scribing wheel 41 to precede the upper scribing wheel 31. For this reason, the crack of the lower scribe line L2 can be deeply penetrated. Moreover, the crack penetration tools 50 and 60 can follow the scribing tool 30 to further penetrate the cracks in the scribe line L1. Thereby, the scribe lines L1 and L2 can be formed with cracks having a sufficient depth at positions immediately above and directly below the sealing material SL. Therefore, the mother substrate G can be smoothly divided along the sealing material SL in the breaking process.

<Other embodiments>
In the above embodiment, the scribing head 2a to which the scribing tools 30 and 40 are mounted and the scribing head 2b to which the crack penetration tools 50 and 60 are mounted are separately prepared. An infiltration tool may be attached.

  FIGS. 14A and 14B are diagrams schematically illustrating a configuration of a scribing apparatus 1 according to another embodiment. FIG. 14A is a view of the scribe device 1 viewed from the Y axis positive side, and FIG. 14B is a view of the scribe device 1 viewed from the X axis positive side.

  As shown in FIG. 14A, in another embodiment, one scribe head 2 is arranged on each of the upper side and the lower side of the mother substrate G. The scribing tool 30 and the crack penetration tool 50 are attached to the upper scribe head 2, and the scribing tool 40 and the crack penetration tool 60 are attached to the lower scribe head 2. The upper scribe head 2 and the lower scribe head 2 have the same configuration.

  FIGS. 15A and 15B are an exploded perspective view and a perspective view showing a configuration of a scribe head 2 according to another embodiment. In FIG. 15A, the configuration relating to the rubber frame 26 and the cover 27 is not shown.

  As shown to Fig.15 (a), in other embodiment, the scribe line formation mechanisms 22a and 22b are connected with the raising / lowering part 21b. The scribe line forming mechanisms 22a and 22b are arranged in the X-axis direction (scribe direction), and the scribe line forming mechanism 22a precedes the scribe line forming mechanism 22b in the scribe direction. The other configuration of the scribe head 2 is the same as that of the scribe head 2a shown in FIG. 15A and 15B, the same components as those of the scribe head 2a are denoted by the same reference numerals.

  When the cylindrical cam 21a is rotated by the servo motor 28, the elevating part 21b is moved up and down by the cam action of the cylindrical cam 21a, and accordingly, the scribe line forming mechanisms 22a and 22b are moved up and down. The scribing tool 30 or the scribing tool 40 is attached to the lower end of the scribe line forming mechanism 22a, and the crack penetration tool 50 or the crack penetration tool 60 is attached to the lower end of the scribe line forming mechanism 22b. Thereby, the scribing wheels 31 and 41, the bearings 51 and 52, and the bearing 61 are positioned similarly to FIG. 13 (a), (b). The operation at the time of scribing is the same as in the above embodiment.

  In other embodiments, since the scribing tool 30 (or the scribing tool 40) and the crack penetration tool 50 (or the crack penetration tool 60) are attached to the same head 2, the load of each tool is applied during the scribing operation. It cannot be controlled individually. However, in other embodiments, in the same head 2, the mother board is adjusted by adjusting the protruding amount of the scribing wheel 31 (or the scribing wheel 41) and the protruding amount of the bearings 51 and 52 (or the bearing 61). The load of the scribing wheel 31 (or the scribing wheel 41) and the bearings 51 and 52 (or the bearing 61) with respect to G can be adjusted. Thereby, the amount of cutting with respect to the mother board | substrate G and the stress of a bending direction can be adjusted, and the effect of the break along a scribe line can be heightened.

<Example of change>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made to the embodiments of the present invention other than the above.

  For example, in the above embodiment, the bearings 51 and 52 and the bearing 61 are provided as the configuration for applying the stress in the direction of opening the scribe line L1 to the mother substrate G. However, the configuration for applying the stress is as follows. It is not limited to this. For example, a roller may be used instead of the bearings 51 and 52 and the bearing 61, or stress is applied to the mother substrate G by pressing the protrusions formed of an elastic member against the surface of the mother substrate G while sliding. May be given.

  In the above embodiment, the lower bearing 61 is positioned directly below the sealing material SL. For example, even if the lower bearing 61 is positioned slightly below the sealing material SL, If the distance between the bearings 51 and 52 is wide, stress in the direction in which the scribe line L1 opens can be applied to the mother substrate G. In this way, it is possible to avoid the lower bearing 61 from stepping on the lower scribe line L2. In this case, two lower bearings 61 are arranged so as to sandwich the scribe line L2, and the interval between the upper bearings 51 and 52 is set larger than the interval between the two lower bearings 61, so that the scribe line Stress in the direction in which L1 opens can also be applied to the mother substrate G.

  In the above embodiment, the upper bearings 51 and 52 and the lower bearing 61 are positioned at the same position in the scribe direction. However, the upper bearings 51 and 52 and the lower bearing 61 are displaced from each other in the scribe direction. It may be positioned at a different position.

  FIGS. 16A and 16B are diagrams schematically illustrating the configuration and the scribing operation of the scribing apparatus 1 according to the modification.

  In this modification, the position of the scribe line forming mechanism 22b in the upper scribe head 2b is shifted in the scribe direction with respect to the position of the scribe line forming mechanism 22b in the lower scribe head 2b. Accordingly, the upper bearings 51 and 52 precede the lower bearing 61 in the scribe direction.

  Also with this configuration, stress in the direction of opening the scribe line L1 is applied to the mother substrate G as in the above embodiment. Further, along with this stress, a stress that bends the mother substrate G in the scribe direction is further applied to the mother substrate G, so that the cracks in the scribe line L1 can be more effectively permeated.

  In the above-described embodiment, the penetration amount of the scribe lines L1 and L2 can be further deepened by pressing the surface of the mother substrate G opposite to the scribing wheels 31 and 41 during the scribe operation.

  FIGS. 17A and 17B are diagrams showing a configuration example of the scribing tools 30 and 40 that can be used in this case.

  The scribing tools 30 and 40 include scribing wheels 31 and 41, shafts 32 and 42, holders 33 and 43, bearings 34 and 44, shafts 35 and 45, and covers 36 and 46. The holders 33 and 43 include trunk portions 33a and 43a, leg portions 33b and 43b, and inclined surfaces 33c and 43c. In the body portions 33a and 43a, grooves 331 and 431 parallel to the scribe direction are formed at the center in the width direction, and grooves 332 and 432 are formed so as to sandwich the grooves 331 and 431 therebetween. When the covers 36 and 46 are removed, the holes for inserting the shafts 32 and 42 and the holes for inserting the shafts 35 and 45 are exposed. These holes penetrate to the side surface opposite to the leg portions 33b and 43b.

  The scribing wheels 31 and 41 are rotatably supported by the shafts 32 and 42 while being inserted into the grooves 331 and 431, respectively. The two bearings 34 are respectively supported by the shaft 35 while being inserted into the two grooves 332, and the two bearings 44 are also respectively supported by the shaft 45 while being inserted into the two grooves 432. .

  In the scribing tool 30, the two bearings 34 are positioned in the vicinity of the approximate center position in the scribe direction, and the scribing wheel 31 is positioned downstream of the two bearings 34 in the scribe direction. In the scribing tool 40, the scribing wheel 41 is positioned in the vicinity of the approximate center position in the scribing direction, and the two bearings 44 are positioned downstream in the scribing direction with respect to the scribing wheel 41. The shift amount of the scribing wheel 31 with respect to the two bearings 34 is the same as the shift amount of the two bearings 44 with respect to the scribing wheel 41.

  FIG. 18A is a side view of a main part schematically showing a state in which the scribing tools 30 and 40 and the crack penetration tool 50 are mounted on the scribe line forming mechanisms 22a and 22b, respectively, and FIG. , 40 is a view of the vicinity of the lower end portion of 40, viewed from the X-axis negative side.

  As shown in FIG. 18A, also in this configuration, the lower scribing wheel 41 precedes the upper scribing wheel 31 in the scribe direction. In this configuration, the surface of the mother substrate G opposite to the scribing wheel 41 is pressed by the bearing 34, and the surface of the mother substrate G opposite to the scribing wheel 31 is pressed by the bearing 44. The arrangement of the crack penetration tools 50 and 60 is the same as in the modified example of FIG.

  In this configuration, the penetration amount of the scribe lines L1 and L2 is deeper than that in the above embodiment. Also in this case, the crack penetration amount of the upper scribe line L1 is shallower than the crack penetration amount of the lower scribe line L2, but the lower scribe line L2 is caused by the action of the crack penetration tools 50 and 60. Cracks penetrate further. Thereby, the crack of scribe line L1 can be deepened and a break process can be advanced appropriately.

  By the way, in the said embodiment, although crack penetration was made | formed with the crack penetration tools 50 and 60 with respect to the scribe line L1 with a shallow crack penetration, the penetration amount of the crack of the lower scribe line L2 is. If the depth is not stable enough to execute the breaking step, crack penetration may be performed by the crack penetration tools 50 and 60 with respect to the lower scribe line L2.

  FIGS. 19A and 19B are diagrams illustrating the configuration and operation of the crack penetration tools 50 and 60 in this case. 19A is a schematic diagram when the vicinity of the scribe position is viewed from the Y axis positive side, and FIG. 19B is a schematic diagram when the vicinity of the crack penetration tools 50 and 60 is viewed from the X axis positive side.

  As shown in FIGS. 19A and 19B, in this configuration, a crack penetration tool 60 that supports only one bearing 61 is attached to the upper scribe head 2b (see FIG. 1A). A crack penetration tool 50 that supports the two bearings 51 and 52 is attached to the side scribe head 2b. The upper bearing 61 presses the upper surface of the mother substrate G1 directly above the scribe line L2, and the lower bearings 51 and 52 press the lower surface of the mother substrate G at a position sandwiching the scribe line L2. Thereby, a stress that opens the lower scribe line L2 is applied to the mother substrate G.

  In this configuration, as shown in FIG. 19A, since the lower scribing wheel 41 precedes the upper scribing wheel 31 in the scribe direction, the lower scribe line L2 of the lower scribe line L2 is similar to the above embodiment. However, the crack becomes deeper than the upper scribe line L1. And the crack of the scribe line L2 formed in the lower surface of the mother board | substrate G penetrate | infiltrates further by the effect | action of the crack penetration tools 50 and 60. FIG. Accordingly, even when the amount of crack penetration of the lower scribe line L2 is not stable at a sufficient depth for breaking, the crack of the lower scribe line L2 is penetrated to a depth sufficient for execution of the breaking process. be able to.

  In the configuration of FIG. 19A, if a crack penetration tool that acts on the scribe line L1 is further arranged on the downstream side, it is possible to penetrate the crack deeper into the shallow scribe line L1.

  In the above embodiment, the lower scribing wheel 41 precedes the upper scribing wheel 31, but the upper scribing wheel 31 precedes the lower scribing wheel 41 so that the upper scribing wheel 41 precedes. You may form the crack of the line L1 deeply. In this case, the crack penetration tool 50, 60 may be applied to the lower scribe line L2 in which the shallow crack is formed, or the crack penetration tool is applied to the upper scribe line L1 in which the deep crack is formed. 50 and 60 may be applied. Depending on the breaking method executed in the breaking process following the scribing process, it is possible to select which scribe line is appropriate for the crack penetration tools 50 and 60 to act.

  In the above-described embodiment, the scribing wheels 31 and 41 are displaced from each other in the scribe direction. However, the scribing operation may be performed by positioning the scribing wheels 31 and 41 at substantially the same position in the scribe direction. In this configuration, as shown in FIG. 5, scribe lines L1 and L2 are formed on the upper and lower surfaces of the mother substrate G with cracks having substantially the same depth. Similar to the above embodiment, by causing the crack penetration tools 50 and 60 to act on the scribe line L1, the cracks in the scribe line L1 can be deeply penetrated.

  In the above embodiment, the scribe lines L1 and L2 are formed in parallel on both surfaces of the mother substrate G. However, the scribe lines are formed for each surface of the mother substrate G, and the scribe lines are formed on the respective surfaces. At this time, a crack penetration tool may be applied to deeply penetrate the cracks in the scribe line.

  Moreover, in the said embodiment, although the scribing hole by which the groove | channel was formed in the ridgeline of the blade edge at fixed intervals was used, it is also possible to use the scribing wheel in which the groove | channel is not formed in the ridgeline. The size and shape of the scribing wheel (blade) are not limited to those described in the above experiment, and other sizes, shapes, and types of cutting edges can be used as appropriate.

  In addition, the configuration, thickness, material, and the like of the mother substrate G are not limited to those shown in the above embodiment, and the scribing tools 30 and 40 and crack penetration are used for cutting the mother substrate G of other configurations. Tools 50, 60 can be used. The shapes of the holders 33 and 43 and the holders 54 and 64 are not limited to those shown above.

  In addition, the embodiment of the present invention can be variously modified as appropriate within the scope of the technical idea shown in the claims.

30, 40 ... scribing tool 31, 41 ... scribing wheel (blade)
50, 60 ... Crack penetration tool 32, 42 ... Bearing (first and second pressing parts)

Claims (11)

In a scribing device for forming a scribe line on a mother substrate,
A scribing tool that moves the blade while pressing the blade against the mother substrate to form a scribe line on the mother substrate;
A crack penetration tool that is disposed downstream of the scribing tool in the scribing direction and applies stress to the mother substrate in the direction of opening the scribing line formed by the scribing tool,
Allowing the crack penetration tool to follow the scribing tool to infiltrate cracks in the scribe line formed by the scribing tool;
A scribing device characterized by that. The scribing device according to claim 1,
The crack penetration tool includes a first crack penetration tool that presses a position corresponding to the scribe line on a surface opposite to the surface on which the scribe line is formed, and the scribe line on the surface on which the scribe line is formed. Including a second crack penetration tool for pressing a position sandwiching
A scribing device characterized by that. The scribing device according to claim 2,
The pressing position of the first crack penetration tool and the pressing position of the second crack penetration tool coincide in the scribe direction;
A scribing device characterized by that. The scribing device according to claim 2,
The pressing position of the first crack penetration tool and the pressing position of the second crack penetration tool are displaced from each other in the scribe direction,
A scribing device characterized by that. The scribing device according to claim 4, wherein
The pressing position of the first crack penetration tool precedes the pressing position of the second crack penetration tool in the scribe direction,
A scribing device characterized by that. In a scribing apparatus for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material,
A first scribing tool that moves the first blade along the sealing material while pressing the first blade against one surface of the mother substrate to form a first scribe line on the one surface;
A second scribing tool for forming a second scribe line on the other surface by moving the second blade along the sealing material while pressing the second blade against the other surface of the mother substrate;
A crack penetration tool that is disposed downstream of the first scribing tool in the scribing direction and applies stress to the mother substrate in a direction of opening the first scribing line formed by the first scribing tool; With
The first scribe line and the second scribe line are moved by moving the first scribe tool and the second scribe tool while displacing the first blade in the scribe direction with respect to the second blade. Is formed on the mother substrate,
Allowing the crack penetrating tool to follow the first scribing tool to infiltrate cracks in the first scribe line formed by the first scribing tool;
A scribing device characterized by that. The scribing device according to claim 6,
The crack penetration tool includes: a first crack penetration tool that presses a position corresponding to the first scribe line on the other surface of the mother substrate; and the first scribe on the one surface of the mother substrate. Including a second crack penetration tool for pressing a position sandwiching the line;
A scribing device characterized by that. The scribing device according to claim 6 or 7,
The first and second scribing tools are moved so that the second blade precedes the first blade in the scribe direction;
A scribing device characterized by that. The scribing device according to claim 6 or 7,
The first and second scribing tools are moved so that the first blade precedes the second blade in the scribe direction;
A scribing device characterized by that. The scribing device according to any one of claims 6 to 9,
The first scribing tool includes a first pressing portion that presses a position corresponding to the second blade of the second scribing tool on the one surface.
A scribing device characterized by that. The scribing device according to any one of claims 6 to 10,
The second scribing tool includes a second pressing portion that presses a position corresponding to the first blade of the first scribing tool on the other surface.
A scribing device characterized by that.