JP2016079076A - Scribing method and scribing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a crack having a sufficient depth in a substrate over the full length of scribe line even when the scribe line is formed at a positions right above and right under a sealant.SOLUTION: A scribing method comprises: pressing scribing wheels 301 and 401 at a position of the upper surface of a mother substrate G facing a sealant and a position of the lower surface of the mother substrate G facing the sealant, respectively, so as to match the starting positions of scribe lines on both surfaces of the mother substrate G with each other in a plane view; moving the scribing wheels 301 and 401 so as to delay the scribing wheel 301 to the scribing wheel 401 to form scribe lines; and moving the scribing wheel 301 to the scribing wheel 401 to match the positions of the scribing wheels 301 and 401 with the end positions of the scribe lines.SELECTED DRAWING: Figure 15

Description

  The present invention relates to a scribing method and a scribing apparatus for forming a scribe line on a substrate.

  Conventionally, a brittle material substrate such as a glass substrate is divided by a scribe process for forming a scribe line on the substrate surface and a break process for applying a predetermined force to the substrate surface along the formed scribe line. In the scribing step, the cutting edge of the scribing wheel is moved along a predetermined line while being pressed against the substrate surface. A scribe device equipped with a scribe head is used to form the scribe line.

  Patent Document 1 below describes a method for cutting out a liquid crystal panel from a mother substrate. In this method, a mother substrate is formed by bonding a substrate on which a thin film transistor (TFT) is formed and a substrate on which a color filter (CF) is formed through a sealing material. Individual liquid crystal panels are obtained by dividing the mother substrate. The sealing material is arranged so that a space serving as a liquid crystal injection region remains in a state where the two substrates are bonded to each other.

  When the mother substrate having the above configuration is divided, a method of simultaneously forming scribe lines on both surfaces of the mother substrate using two scribe heads can be used (for example, see Patent Document 2). In this case, the two scribe heads are arranged so as to sandwich the mother substrate. The two scribing wheels are positioned at the same position when the mother board is viewed in plan. In this state, the two scribing wheels are simultaneously moved in the same direction, and a scribe line is formed on each surface of the mother substrate.

JP 2006-137441 A JP 2012-240902 A

  As shown in the above-mentioned Patent Document 1, a conventional mother substrate has a region where no sealing material is interposed between adjacent liquid crystal injection regions. Therefore, when the scribe lines are simultaneously formed on both surfaces of the mother substrate by the two scribe heads as described above, the scribe lines can be formed in the region where the sealing material is not interposed. When the scribe line is formed in this way and the mother substrate is divided, a frame region having a predetermined width remains around the liquid crystal injection region in the liquid crystal panel.

  However, in recent years, particularly in mobile liquid crystal panels, it has become mainstream to narrow the frame area to the limit. In order to meet this requirement, it is necessary to omit the region where the sealing material is not interposed in the mother substrate, and to configure the adjacent liquid crystal injection regions to be separated only by the sealing material. In this case, the scribe line is formed immediately above and directly below the sealing material.

  However, the inventors of the present application have confirmed that when the scribe lines are formed immediately above and below the sealing material in this way, cracks do not sufficiently enter the two glass substrates. When the break process is performed in such a state where cracks are insufficient, fine cracks and breakage may occur at the edge of the substrate after the break, and the strength of the glass substrate may be reduced.

  In view of such a problem, the present invention provides a scribe capable of forming a sufficiently deep crack on the substrate over the entire length of the scribe line even when the scribe line is formed at a position directly above and below the seal material. It is an object to provide a method and a scribing device.

  A first aspect of the present invention relates to a scribing method for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material. In the scribing method according to this aspect, the seal material on the surface of the first substrate is arranged so that the start position of the scribe line of the first substrate and the start position of the scribe line of the second substrate coincide with each other in plan view. The first blade and the second blade are pressed against the opposite position and the position facing the sealing material on the surface of the second substrate, respectively, and the first blade is against the second blade. The first blade and the second blade are moved along the sealing material so as to be displaced in the scribe direction, and scribe lines are formed on the surface of the first substrate and the surface of the second substrate, respectively. Then, the first blade and the second blade are moved so that the displacement between the first blade and the second blade is eliminated, and the end position of the scribe line of the first substrate and the The scribe line of the second substrate Match one another in a plan view of the end position.

  According to the scribing method according to this aspect, when the scribe line is formed at a position immediately above and immediately below the sealing material, a sufficiently deep crack can be formed on the mother substrate. In addition, since the starting positions of the scribe lines formed on the first substrate and the second substrate coincide with each other in a plan view, at the starting position of the scribe lines, a burr-like projecting piece is formed at the starting position of the scribe line. It is suppressed that remains. Similarly, since the end positions of the scribe lines formed on each substrate coincide with each other in a plan view, it is possible to prevent burr-like protrusions from remaining on the mother substrate at the end position of the scribe lines during the cutting process. Is done. Therefore, the shape of the cut-out substrate piece can be adjusted to an appropriate shape.

  In the scribing method according to this aspect, for example, the first blade can be displaced with respect to the second blade by adjusting the moving speed of the first blade and the moving speed of the second blade. For example, when the first blade and the second blade are moved along the seal member from each start position, the first blade is moved at a speed lower than that of the first blade. Can be displaced relative to the second blade. If it carries out like this, a 1st blade can be displaced with respect to a 2nd blade, advancing formation of the crack with respect to both board | substrates.

  In the scribing operation, the displacement speed of the first blade relative to the second blade is maintained at a predetermined distance by making the movement speed of the first blade and the movement speed of the second blade the same. It is desirable to form scribe lines on the surface of the first substrate and the surface of the second substrate. If it carries out like this, a crack can be satisfactorily formed in a mother substrate.

  Further, in the scribing method according to this aspect, the displacement of the first blade and the second blade is canceled at the end position by making the moving speed of the first blade different from the moving speed of the second blade. Can be. If it carries out like this, the displacement of a 1st blade and a 2nd blade can be eliminated, advancing the formation of the crack with respect to both board | substrates.

  In the scribing method according to this aspect, the first pressing member is moved along the sealing material together with the first blade while pressing the first pressing member to a position corresponding to the second blade on the surface of the first substrate. It is desirable to move the second pressing member along the sealing material together with the second blade while pressing the second pressing member to a position corresponding to the first blade on the surface of the second substrate. In this case, since the mother substrate is prevented from being distorted by the pressing force of the first blade and the second blade, the crack can be formed more stably while maintaining the depth of the crack deeply.

  A second aspect of the present invention relates to a scribing apparatus that forms a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material. The scribing apparatus according to this aspect includes a first scribe head that forms a scribe line on the surface of the first substrate, a second scribe head that forms a scribe line on the surface of the second substrate, and the first scribe head; A drive unit that moves the second scribe head in parallel with the mother substrate; and a control unit that controls the first scribe head, the second scribe head, and the drive unit. The control unit is a position facing the sealing material on the surface of the first substrate such that the start position of the scribe line of the first substrate and the start position of the scribe line of the second substrate coincide with each other in plan view. And the first blade of the first scribe head and the second blade of the second scribe head are pressed against the seal material on the surface of the second substrate, respectively. Then, the control unit moves the first blade and the second blade along the seal material so that the first blade is displaced in the scribe direction with respect to the second blade. The scribe line is formed on the surface of the first substrate and the surface of the second substrate, respectively, and the first blade and the second blade are removed so that the displacement between the first blade and the second blade is eliminated. The end position of the scribe line of the first substrate and the end position of the scribe line of the second substrate are made to coincide with each other in plan view.

  According to the scribing apparatus according to this aspect, as in the scribing method according to the first aspect, a crack having a sufficient depth is formed in the mother substrate when the scribe line is formed immediately above and below the sealing material. can do. In addition, since the starting positions of the scribe lines formed on the first substrate and the second substrate coincide with each other in a plan view, at the starting position of the scribe lines, a burr-like projecting piece is formed at the starting position of the scribe line. It is suppressed that remains. Similarly, since the end positions of the scribe lines formed on each substrate coincide with each other in a plan view, it is possible to prevent burr-like protrusions from remaining on the mother substrate at the end position of the scribe lines during the cutting process. Is done. Therefore, the shape of the substrate piece after cutting can be made an appropriate shape.

  In the scribing apparatus according to this aspect, the control unit is configured to displace the first blade with respect to the second blade by making the moving speed of the first blade different from the moving speed of the second blade. obtain. If it carries out like this, a 2nd blade can be delayed with respect to a 1st blade, advancing formation of the crack with respect to both board | substrates.

  Further, the control unit maintains the displacement of the first blade with respect to the second blade at a predetermined distance by making the moving speed of the first blade the same as the moving speed of the second blade. A scribe line may be formed on the surface of the substrate and the surface of the second substrate. If it carries out like this, a crack can be satisfactorily formed in a mother substrate.

  Further, the control unit can be configured to cancel the displacement of the first blade and the second blade at the end position by making the moving speed of the first blade different from the moving speed of the second blade. If it carries out like this, a 2nd blade can be made to catch up with a 1st blade, advancing formation of the crack with respect to both board | substrates.

  The first scribe head includes a first pressing member that presses the pressure contact position of the second blade from the surface of the first substrate in a state where the first blade is displaced along the sealing material with respect to the second blade. Preferably, the second scribing head presses the pressure contact position of the first blade from the surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade. It is desirable to have a second pressing member. In this case, since the mother substrate is prevented from being distorted by the pressing force of the first blade and the second blade, the crack can be formed more stably while maintaining the depth of the crack deeply.

  As described above, according to the present invention, it is possible to form a crack having a sufficient depth over the entire length of the scribe line in the substrate even when the scribe line is formed immediately above and below the sealing material. A scribing method and a scribing apparatus can be provided.

  The effects and significance of the present invention will become more apparent from the following description of embodiments. However, the embodiment described below is merely an example when the present invention is implemented, and the present invention is not limited to what is described in the following embodiment.

It is a figure which shows typically the structure of the scribing apparatus which concerns on embodiment. It is a disassembled perspective view which shows the structure of the scribe head which concerns on embodiment. It is a perspective view which shows the structure of the scribe head which concerns on embodiment. It is a figure explaining the scribing method concerning an embodiment. It is a figure which shows the experimental result by the scribe method which concerns on embodiment. It is a figure explaining the other scribing method which concerns on embodiment. It is a figure which shows the experimental result by the other scribe method which concerns on embodiment. It is a perspective view which shows the structure of the scribing tool which concerns on embodiment. It is a figure which shows typically the mounting method of the scribing tool which concerns on embodiment. It is a block diagram which shows the structure of the scribing apparatus which concerns on embodiment, and a figure explaining the problem when the starting position of a scribe line differs in the upper surface and lower surface of a mother board | substrate. It is a flowchart which shows the scribe control which concerns on embodiment. It is a figure which shows the scribe operation | movement which concerns on embodiment. It is a figure which shows the scribe operation | movement which concerns on embodiment. It is a figure which shows the scribe operation | movement which concerns on embodiment. It is a timing chart which shows scribing control concerning an embodiment. It is a timing chart which shows the scribe control which concerns on the example of a change. It is a flowchart which shows the scribe control which concerns on the other example of a change.

  Embodiments of the present invention will be described below with reference to the drawings. In each figure, an X axis, a Y axis, and a Z axis that are orthogonal to each other are added for convenience. The XY plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.

<Configuration of scribing device>
FIGS. 1A and 1B are diagrams schematically showing a configuration of the scribe device 1. 1A is a view of the scribe device 1 viewed from the Y axis positive side, and FIG. 1B is a view of a part of the scribe device 1 viewed from the X axis positive side.

  Referring to FIG. 1A, a scribing apparatus 1 includes a conveyor 11, struts 12a and 12b, guides 13 and 14, sliding units 15 and 16, drive motors 17 and 18, and cameras 19a and 19b. And two scribing heads 2.

  As shown in FIG.1 (b), the conveyor 11 is provided so that it may extend in a Y-axis direction except the location where the scribe head 2 is arrange | positioned. The conveyor 11 is provided with a hand 11 a that holds the mother board G. On the conveyor 11, the mother board | substrate G is mounted in the state by which the edge was hold | gripped by the hand 11a. The mother substrate G has a substrate structure in which a pair of glass substrates are bonded to each other. The mother board G is fed in the Y-axis direction by the conveyor 11 while being held by the hand 11a.

  The support columns 12 a and 12 b are provided vertically with the conveyor 11 interposed between the base of the scribe device 1. The guides 13 and 14 are respectively installed between the columns 12a and 12b so as to be parallel to the X-axis direction. The sliding units 15 and 16 are slidably provided on the guides 13 and 14, respectively. The guides 13 and 14 are provided with drive motors 17 and 18, respectively, and the drive motors 17 and 18 drive the sliding units 15 and 16 in the X-axis direction.

  A scribe head 2 is attached to each of the sliding units 15 and 16. The scribing tools 30 and 40 are attached to the Z-axis positive scribe head 2 and the Z-axis negative scribe head 2 so as to face the mother substrate G, respectively. The scribing head 2 moves in the X-axis direction in a state where the scribing wheel held by the scribing tools 30 and 40 is pressed against the surface of the mother substrate G. Thereby, a scribe line is formed on the surface of the mother substrate G.

  The cameras 19a and 19b are arranged above the guide 13 and detect alignment marks written on the mother board G. The arrangement position of the mother board G with respect to the conveyor 11 is detected by the captured images from the cameras 19a and 19b. Based on the detection result, each operation position of the scribe head 2 in the scribe operation such as a scribe start position and a scribe end position of the scribe head 2 is determined.

<Scribe head>
FIG. 2 is a partially exploded perspective view showing the configuration of the scribe head 2, and FIG. 3 is a perspective view showing the configuration of the scribe head 2.

  Referring to FIG. 2, the scribe head 2 includes an elevating mechanism 21, a scribe line forming mechanism 22, a base plate 23, a top plate 24, a bottom plate 25, a rubber frame 26, a cover 27, and a servo motor 28. With.

  The elevating mechanism 21 includes a cylindrical cam 21a connected to the drive shaft of the servo motor 28, and a cam follower 21c formed on the upper surface of the elevating part 21b. The elevating part 21b is supported by the base plate 23 so as to be movable in the vertical direction via a slider (not shown), and is urged in the positive direction of the Z axis by a spring 21d. The cam follower 21c is pressed against the lower surface of the cylindrical cam 21a by the bias of the spring 21d. The elevating part 21 b is connected to the scribe line forming mechanism 22. When the cylindrical cam 21a is rotated by the servo motor 28, the elevating part 21b is raised and lowered by the cam action of the cylindrical cam 21a, and accordingly, the scribe line forming mechanism 22 is raised and lowered. The scribing tools 30 and 40 are attached to the lower end of the scribe line forming mechanism 22.

  The rubber frame 26 is an elastic member that does not allow air to pass therethrough. The rubber frame 26 has a shape that fits into the groove 23 a of the base plate 23, the groove 24 a of the top plate 24, and the groove 25 a of the bottom plate 25. In a state where the rubber frame 26 is mounted in the grooves 23 a, 24 a, and 25 a, the surface of the rubber frame 26 protrudes slightly outward from the side surfaces of the base plate 23, the top plate 24, and the bottom plate 25.

  The cover 27 has a shape in which three plate portions of the front surface portion 27a, the right side surface portion 27b, and the left side surface portion 27c are bent. Two holes 27f are formed in the upper and lower edges of the front surface portion 27a.

  In a state where the rubber frame 26 is fitted in the grooves 23 a, 24 a, 25 a, the right side surface portion 27 b and the left side surface portion 27 c of the cover 27 are deformed so as to bend outward, and the cover 27 is transformed into the base plate 23, the top plate 24 and the bottom plate 25. It is attached. In this state, screws are screwed to the top plate 24 and the bottom plate 25 through two holes 27f formed at the upper and lower end edges of the front surface portion 27a. Further, screws are screwed into screw holes formed slightly outside the grooves 23a, 24a, and 25a of the base plate 23, the top plate 24, and the bottom plate 25. Thus, the cover 27 is sandwiched between the base plate 23, the top plate 24, the bottom plate 25, and the screw heads, and the peripheral portions of the right side surface portion 27b and the left side surface portion 27c are pressed against the rubber frame 26. In this way, the scribe head 2 is assembled as shown in FIG.

  As shown in FIG. 1A, two scribe heads 2 are arranged above and below the mother substrate G, respectively. The two scribe heads 2 have the same configuration. The scribing tools 30 and 40 attached to the two scribe heads 2 are changed according to the scribe method. Of the following two scribing methods, scribing method 1 uses scribing tools 30 and 40 that hold only scribing wheels 301 and 401. In scribing method 2, scribing tools 30 and 40 that hold scribing wheels 301 and 401 and rollers 302 and 402 are used.

  Hereinafter, these two scribing methods will be described.

<Scribe method 1>
4A to 4C are diagrams for explaining the scribing method according to the present embodiment. 4A is a schematic diagram when the vicinity of the scribe position is viewed from the Y-axis negative side, FIG. 4B is a schematic diagram when the vicinity of the scribe position is viewed from the X-axis positive side, and FIG. It is a schematic diagram when the scribe position vicinity is seen from the Z-axis positive side.

  As shown in FIG. 4A, in this scribing method, the scribing wheel 301 of the upper (Z-axis positive side) scribing head 2 is more than the scribing wheel 401 of the lower (Z-axis negative side) scribing head 2. The two scribing wheels 301 and 401 are moved so as to advance by a distance W1 in the scribe direction (X-axis positive direction). On the contrary, the scribing wheel 401 may precede the scribing wheel 301. The scribing tools 30 and 40 are attached to the two scribing wheels 301 and 401 so as to be rotatable about the axes 301a and 401a, respectively.

  Referring to FIG. 4B, the mother substrate G is configured by bonding two glass substrates G1 and G2 through a sealing material SL. A color filter (CF) is formed on the glass substrate G1, and a thin film transistor (TFT) is formed on the glass substrate G2. A liquid crystal injection region R is formed by the sealing material SL and the two glass substrates G1 and G2, and liquid crystal is injected into the liquid crystal injection region R. The two scribing wheels 301 and 401 are positioned without being shifted from each other in the Y-axis direction. The scribing wheel 301 is pressed against the surface of the glass substrate G1 at a position directly above the sealing material SL, and the scribing wheel 401 is pressed against the surface of the glass substrate G2 at a position directly below the sealing material SL.

  As shown in FIG.4 (c), the sealing material SL is arrange | positioned at the grid | lattice form. The two scribing wheels 301 and 401 are moved in the positive direction of the X axis along the seal material SL. Thereby, as shown in FIGS. 4B and 4C, scribe lines L1 and L2 are formed on the surfaces of the glass substrates G1 and G2, respectively.

  In the scribing method shown in FIGS. 4A to 4C, there is no roller for pressing the surface of the mother substrate G on the opposite side (Z-axis negative side) from the scribing wheel 301, and it is opposite to the scribing wheel 401. There is also no roller for pressing the surface of the mother substrate G on the side (Z-axis positive side).

<Experiment 1>
The inventors of the present application conducted an experiment to form a scribe line on the mother substrate G in accordance with the scribe method shown in FIGS. Hereinafter, the experiment and the experimental result will be described.

  In the experiment, a substrate (mother substrate) in which glass substrates G1 and G2 each having a thickness of 0.2 mm were bonded together with a sealing material SL was used. The size of the bonded substrate (mother substrate) is 118 mm × 500 mm. For the scribing wheels 301 and 401, a micro penet (registered trademark of Samsung Diamond Industrial Co., Ltd.) manufactured by Samsung Diamond Industrial Co., Ltd. was used. Each of the scribing wheels 301 and 401 has a structure in which a V-shaped cutting edge is formed on the outer periphery of the disk and grooves are formed at predetermined intervals on the ridge line of the cutting edge. The scribing wheels 301 and 401 have a diameter of 3 mm, a cutting edge angle of 110 °, a groove number of 550, and a groove depth of 3 μm.

  The scribing wheels 301 and 401 having this configuration were moved while being pressed against the glass substrates G1 and G2, respectively, as shown in FIGS. The load applied to the scribing wheels 301 and 401 during the scribing operation was controlled to 6.5N. The moving speed of the scribing wheels 301 and 401 was constant (200 mm / sec).

  Under the above conditions, the amount of crack penetration in the glass substrates G1 and G2 was measured while changing the distance W1 between the two scribing wheels 301 and 401. As a comparative example, the amount of crack penetration when the distance W1 between the scribing wheels 301 and 401 was 0 was also measured. In each measurement, in addition to the amount of crack penetration, the amount of rib marks was also measured.

  5A to 5E show the experimental results. FIG. 5A is a diagram showing the amount of crack penetration and the amount of rib marks, and FIGS. 5B to 5E are cross-sectional photographs of the mother substrate G on the scribe line, each having a distance W1 of 0. .4 mm, 0.6 mm, 0.8 mm, and 1.0 mm. 5B to 5E, D1 and D3 indicate rib mark amounts, and D2 and D4 indicate crack penetration amounts.

  Referring to FIG. 5A, when the distance W1 exceeds 0.6 mm, the amount of crack penetration of the glass substrate G1 is larger than when the distance W1 is 0 mm. If any one of the glass substrates G1 and G2 is cracked with a large amount of penetration, the mother substrate G can be appropriately divided in the breaking step.

  For example, as in the comparative example (W1 = 0 mm), if the amount of cracks in the glass substrates G1, G2 is about half the thickness (0.2 mm) of the glass substrates G1, G2, It is necessary to break the glass substrates G1 and G2 from both sides. When the operation of breaking the glass substrates G1 and G2 from both sides of the mother substrate G is performed in this way, fine cracks and breakage occur at the edges of the glass substrates G1 and G2, and the strength of the glass substrates G1 and G2 decreases. There is a fear.

  On the other hand, when the distance W1 is 0.6 mm to 1.4 mm, although the crack penetration amount in the glass substrate G2 is small, the crack penetration amount in the glass substrate G1 is large. As described above, when the amount of crack penetration in the glass substrate G1 is large, in the breaking process, it is only necessary to perform an operation of breaking the glass substrate G2 having a small crack penetration amount from only one side of the mother substrate G. At this time, the glass substrate G1 having a deep crack is also cut along the crack. Thus, when the glass substrates G1 and G2 are broken only from one side of the mother substrate G, the edges of the glass substrates G1 and G2 are not cracked or broken, and the strength of the glass substrates G1 and G2 is kept high. It is.

  For the above reasons, in dividing the mother substrate G, it is desirable that either one of the glass substrates G1 and G2 is cracked with a large amount of penetration. In this experiment, as shown in FIG. 5A, when the distance W1 between the two scribing wheels 301 and 401 exceeds 0.6 mm, the crack of the glass substrate G1 is larger than that in the comparative example (W1 = 0 mm). The amount of penetration has increased. From this, it can be said that the distance W1 between the two scribing wheels 301 and 401 is desirably 0.6 mm or more. By setting the distance W1 between the two scribing wheels 301 and 401 in this way, the mother substrate G can be properly broken.

<Scribe method 2>
In the scribing method (scribing method 1) shown in FIGS. 4A to 4C, the surface of the mother substrate G opposite to the scribing wheel 301 (Z-axis negative side) is not pressed by a roller, and scribing is performed. The surface of the mother substrate G opposite to the wheel 401 (Z-axis positive side) is not pressed by the roller. On the other hand, in this scribing method, the surface of the mother substrate G opposite to the scribe wheel 301 (Z-axis negative side) and the surface of the mother substrate G opposite to the scribe wheel 401 (Z-axis positive side) are respectively It is pressed by the roller. A member other than the roller may be used as a pressing member that presses the surface opposite to the scribing wheels 301 and 401.

  6A and 6B are diagrams for explaining the scribing method 2. FIG. 6A is a schematic diagram when the vicinity of the scribe position is viewed from the Y axis negative side, and FIG. 6B is a schematic diagram when the vicinity of the scribe position is viewed from the X axis positive side.

  As shown in FIG. 6A, in this scribing method, the surface of the mother substrate G on the opposite side (Z-axis negative side) to the scribing wheel 301 is pressed by two rollers 402, and on the opposite side to the scribing wheel 401. The surface of the mother substrate G on the (Z axis positive side) is also pressed by the two rollers 302. The two rollers 302 are disposed so as to sandwich the scribing wheel 301, and are rotatable about a shaft 302a as a rotation axis. Further, the two rollers 402 are arranged so as to sandwich the scribing wheel 401, and can be rotated about a shaft 402a as a rotation axis.

  Similar to the scribing method 1, the two scribing wheels 301 and 401 are shifted by a distance W1 in the scribing direction (X-axis direction). In the scribing method 2 as well, the lower scribing wheel 401 may precede the upper scribing wheel 301. The two scribing wheels 301 and 401 move along the sealing material SL while being pressed against the glass substrates G1 and G2, respectively. There is a gap in the Y-axis direction between the scribing wheel 301 and the two rollers 302, and there is also a gap in the Y-axis direction between the scribing wheel 401 and the two rollers 402. Therefore, the rollers 302 and 402 move in the positive direction of the X axis so as to straddle the scribe lines L1 and L2 formed by the scribing wheels 301 and 401.

<Experiment 2>
The inventors of the present application conducted an experiment to form a scribe line on the mother substrate G according to the scribe method shown in FIGS. Hereinafter, the experiment and the experimental result will be described.

  The mother substrate G and scribing wheels 301 and 401 used in this experiment were the same as in Experiment 1 above. In this experiment, the distance W1 between the scribing wheels 301 and 401 was set to 2.2 mm. The moving speed of the scribing wheels 301 and 401 was constant (200 mm / sec). The eccentric amount of the scribing wheel 301 with respect to the load center of the upper scribe head 2 was 1.0 mm, and the eccentric amount of the scribing wheel 401 with respect to the load center of the lower scribe head 2 was 3.2 mm.

  The center positions of the axes 301a and 401a of the scribing wheels 301 and 401 coincide with the center positions of the axes 302a and 402a of the rollers 302 and 402, respectively, in the Z-axis direction. The diameters of the rollers 302 and 402 are the scribing wheels, respectively. The same diameter as 301 and 401 was set to 3 mm.

  Under the above conditions, the amount of crack penetration in the glass substrates G1 and G2 was measured while changing the load applied to the scribing tools 30 and 40.

  An experimental result is shown to Fig.7 (a)-(e). FIG. 7A is a diagram showing numerical values of the amount of crack penetration and the amount of rib marks, and FIGS. 7B to 7E are cross-sectional photographs of the mother substrate G on the scribe line, each having a load of 6N, In the case of 7N, 8N, 9N. 5B to 5E, D1 and D3 indicate rib mark amounts, and D2 and D4 indicate crack penetration amounts.

  Referring to FIG. 7A, it can be seen that when the load changes from 5N to 6N, the amount of crack penetration in the glass substrate G1 increases rapidly. When the load exceeds 6 N, the amount of crack penetration of the glass substrate G1 exceeds 80% of the thickness (0.2 mm) of the glass substrate G1, and cracks enter the glass substrate G1 with a large amount of penetration. As described above, if any one of the glass substrates G1 and G2 is cracked with a large amount of penetration, the mother substrate G can be appropriately divided in the breaking step. Therefore, in the scribing method 2, it can be said that it is desirable to set the load applied to the scribing tools 30 and 40 to 6 N or more.

  In this experiment, the amount of crack penetration into the glass substrate G1 is larger than that in Experiment 1. In this experiment, since the lower side of the scribing wheel 301 is supported by the roller 402 and the upper side of the scribing wheel 401 is supported by the roller 302, the mother substrate G is distorted by the pressing force of the blades of the scribing wheels 301 and 401. It is suppressed. Therefore, to stably form a crack while increasing the amount of crack penetration, the surface opposite to the scribing wheels 301 and 401 of the mother substrate G is pressed by rollers 402 and 302 as in the scribing method 2. It can be said that it is desirable.

<Scribing tool>
FIGS. 8A and 8B are perspective views showing configuration examples of the scribing tools 30 and 40 used in the scribing method 2, respectively.

  The scribing tools 30 and 40 have the same configuration except for the arrangement order of the scribing wheels 301 and 401 and the rollers 302 and 402. The scribing tools 30 and 40 include scribing wheels 301 and 401 and holders 303 and 403 for holding the rollers 302 and 402, respectively. The holders 303 and 403 include grooves 303a and 403a in which the scribing wheels 301 and 401 are mounted, grooves 303b and 403b in which the rollers 302 and 402 are mounted, and inclined surfaces 303c and 403c. The scribing wheels 301 and 401 are mounted by fitting the shafts 301 a and 401 a into the holes of the holders 303 and 403. The rollers 302 and 402 are mounted by fitting the shafts 302a and 402a into the holes of the holders 303 and 403.

  FIGS. 9A and 9B are diagrams schematically showing a method of attaching the scribing tool 30 to the scribe line forming mechanism 22. 9A and 9B show a state where the inside of the scribe line forming mechanism 22 is seen through.

  A holding portion 221 that holds the scribing tool 30 is provided at the lower end of the scribe line forming mechanism 22, and a hole 222 into which the scribing tool 30 can be inserted is formed in the holding portion 221. A magnet 224 is installed at the bottom of the hole 222, and a pin 223 is provided at an intermediate position of the hole 222. The holder 303 of the scribing tool 30 is made of a ferromagnetic material. The holding portion 221 is supported by the scribe line forming mechanism 22 by a bearing (not shown) so as to be able to rotate 360 degrees in the horizontal direction.

  When attaching the scribing tool 30 to the scribe line forming mechanism 22, the holder 303 of the scribing tool 30 is inserted into the hole 222 of the holding portion 221. When the upper end of the holder 303 approaches the magnet 224, the holder 303 is attracted to the magnet 224. At this time, the inclined surface 303c of the holder 303 comes into contact with the pin 223, and the holder 303 is positioned at a proper position. Thus, as shown in FIG. 9B, the scribing tool 30 is attached to the lower end of the scribe line forming mechanism 22.

  The scribing tool 40 is similarly attached to the lower end of the scribe line forming mechanism 22. Thus, when the scribing tools 30 and 40 are respectively attached to the scribe line forming mechanisms 22 of the corresponding scribe heads 2, as shown in FIGS. 6 (a) and 6 (b), the scribing tools 30 and 40 are positioned at positions corresponding to the scribe wheel 301. The roller 402 is positioned, and the roller 302 is positioned at a position corresponding to the scribing wheel 401. If the scribing tools 30 and 40 having the configuration shown in FIGS. 8A and 8B are used, the scribing wheel 301 can be simply mounted on the scribing line forming mechanism 22 of the corresponding scribing head 2. The scribing wheels 301 and 401 and the rollers 402 and 302 can face each other while maintaining the distance W1 between the scribing wheel 401 and the scribing wheel 401 at a predetermined distance.

  The experiment 2 was performed using the scribing tools 30 and 40 having the configuration shown in FIGS. In Experiment 1, the scribing tools 30 and 40 in which the grooves 303b and 403b are omitted from the holders 303 and 403 and only the scribing wheels 301 and 401 are mounted on the holders 303 and 403 having only the grooves 303a and 403a, respectively. It was performed using.

<Scribe control>
Next, scribing control in the scribing apparatus 1 will be described.

  FIG. 10A is a block diagram showing the configuration of the scribe device 1.

  The scribing apparatus 1 includes a control unit 101, a detection unit 102, a drive unit 103, an input unit 104, and a display unit 105.

  The control unit 101 includes a processor such as a CPU and a memory such as a ROM and a RAM, and controls each unit according to a control program stored in the memory. The memory is also used as a work area when controlling each unit. The detection unit 102 includes various sensors in addition to the cameras 19a and 19b shown in FIG. The drive unit 103 includes a mechanism unit and drive motors 17 and 18 of the scribing apparatus 1 shown in FIG. The input unit 104 includes a mouse and a keyboard. The input unit 104 is used to input various parameter values in the scribe operation, such as the start position and end position of the scribe line, and the interval between the scribe lines. The display unit 105 includes a monitor, and a predetermined input screen is displayed upon input by the input unit 104.

  FIGS. 10B and 10C are diagrams for explaining problems when the start positions of the scribe lines formed on the upper surface and the lower surface of the mother substrate G do not coincide with each other in plan view of the mother substrate G. FIG. . FIG. 10B is a view of a part of the mother substrate G viewed from the side, and FIG. 10C is a view of a part of the mother substrate G viewed from above.

  As verified in Experiments 1 and 2 above, when scribe lines are simultaneously formed on both surfaces of the mother substrate G, it is desirable to shift the upper scribing wheel 301 and the lower scribing wheel 401 by a predetermined distance in the scribing direction. However, when this scribing method is applied from the start timing of the scribe line, as shown in FIG. 10B, the start position SP1 of the scribe line L1 on the upper surface of the mother substrate G and the start position SP2 of the scribe line L2 on the lower surface of the mother substrate G. There is a deviation of a predetermined distance W between

  If the start positions SP1 and SP2 are shifted as described above, the glass substrate G2 on the lower side of the mother substrate G has a burr-like shape in the dividing step along the scribe lines L1 and L2, as shown in FIG. It is possible that the protruding piece Gb remains. For example, after a crack perpendicular to the scribe lines L1 and L2 is formed at the position of the start position SP1 and the edge of the mother substrate G is cut off, a cutting process along the scribe lines L1 and L2 is performed. Since the scribe line L2 does not extend to the end of the lower glass substrate G2, the distance W portion of the glass substrate G2 is not clearly divided, and a burr-like protrusion Gb may remain in this portion. In this case, the contour of the cut-out liquid crystal panel does not match the intended contour, and the liquid crystal panel cannot be properly installed in the installation area on the product side. This problem can also occur at the end position of the scribe line.

  Therefore, in the present embodiment, the start position and the end position of the scribe lines L1, L2 are made to coincide with each other in plan view of the mother substrate G, and the upper scribing wheel 301 and the lower scribing wheel are between the start position and the end position. Control is performed so that 401 is shifted by a predetermined distance in the scribe direction. In this control, the lower scribing wheel 401 is controlled to precede the upper scribing wheel 301 in the scribe direction.

  FIG. 11 is a flowchart showing scribe control. Note that the scribe control shown in FIG. 11 is a control when the scribing tools 30 and 40 are moved without moving the conveyor 11 shown in FIG. 1A to form scribe lines on both sides of the mother substrate G. . In addition to the scribing control shown in FIG. 11, the conveyor 11 is moved without moving the scribing tools 30, 40, and control for forming scribe lines on both sides of the mother substrate G is performed.

  The scribe control shown in FIG. 11 is performed by the control unit 101 in FIG. FIGS. 12A to 14B are diagrams schematically illustrating the positions of the scribing tools 30 and 40 at a predetermined control timing. Here, scribing tools 30 and 40 shown in FIGS. 8A and 8B are used. Instead of this, scribing tools 30 and 40 in which the rollers 302 and 402 are omitted may be used.

  Referring to FIG. 11, the control unit 101 processes captured images of the cameras 19a and 19b, and detects the position of the mother board G (S11). Based on the detection result, the control unit 101 sets the initial position of the upper and lower scribe heads 2 (scribing tools 30 and 40) for each scribe line and the feed control switching timing for each scribe head 2 (S12).

  Next, the control unit 101 moves the upper and lower scribe heads 2 to the start positions of the scribe lines L1 and L2 to be formed (S13). FIG. 12A is a diagram showing a state of the scribing tools 30 and 40 at this time. In this state, the positions of the scribing wheels 301 and 401 coincide with each other in the X-axis direction. In this state, the control unit 101 drives the servo motors 28 of the upper and lower scribe heads 2 to bring the scribing tools 30 and 40 into pressure contact with the upper surface and the lower surface of the mother substrate G, respectively, with a predetermined load (S14). FIG. 12B is a diagram showing a state of the scribing tools 30 and 40 at this time. In this state, in a plan view of the mother substrate G, the scribing wheels 301 and 401 are opposed to the seal material SL on the upper surface of the mother substrate G and the seal material SL on the lower surface of the mother substrate G so that the positions of the scribing wheels 301 and 401 coincide with each other. The scribing wheels 301 and 401 are brought into pressure contact with the positions where they are to be moved, respectively.

  With the scribing tools 30 and 40 being in pressure contact with both surfaces of the mother substrate G, the control unit 101 drives the drive motors 17 and 18 to move the upper and lower scribe heads 2 at the speeds Vs and Vn, respectively (S15). . The speed Vs is set slower than the speed Vn. For this reason, the upper scribing tool 30 gradually retreats with respect to the lower scribing tool 40, and there is a space between the scribing tools 30 and 40 in the scribe direction. FIG. 13A is a diagram showing a state of the scribing tools 30 and 40 at this time.

  Thereafter, the control unit 101 waits for the time T1 to elapse from the start of movement of the upper and lower scribe heads 2 (S16). When the time T1 has elapsed (S16: YES), the control unit 101 increases the moving speed of the upper scribe head 2 from the speed Vs to the speed Vn (S17).

  FIG. 13B is a diagram showing the state of the scribing tools 30 and 40 at this time. At the timing when the time T1 has elapsed from the start of the movement of the upper and lower scribe heads 2 (S16: YES), there is an expected interval between the upper and lower scribing wheels 301 and 401. , 302 are substantially opposed to each other. In this state, the moving speed of the upper scribing head 2 is increased to the same speed Vn as that of the upper scribing head 2, so that the distance between the upper and lower scribing wheels 301 and 401 is maintained at the desired distance. The scribing wheels 301 and 401 are moved in the scribe direction.

  Thereafter, the control unit 101 waits for a time T2 (T2> T1) to elapse from the start of movement of the upper and lower scribe heads 2 (S18). Then, when the time T2 has elapsed (S18: YES), the control unit 101 reduces the moving speed of the lower scribe head 2 from the speed Vn to the speed Vs (S19). Thereby, the lower scribing wheel 401 gradually approaches the upper scribing wheel 301. FIG. 14A is a diagram showing a state of the scribing tools 30 and 40 at this time.

  Further, the control unit 101 waits for the elapse of time T3 (T3> T2) from the start of movement of the upper and lower scribe heads 2 (S20). At the timing when the time T3 has passed (S20: YES), the upper scribing wheel 301 catches up with the lower scribing wheel 401 in the scribe direction. FIG. 14B is a diagram showing the state of the scribing tools 30 and 40 at this time.

  Thus, when the time T3 has elapsed (S20: YES), the control unit 101 ends the feeding of the upper and lower scribe heads 2 and stops the upper and lower scribe heads 2 (S21). Then, the control unit 101 drives the servo motors 28 of the upper and lower scribe heads 2 to separate the scribing tools 30 and 40 from the upper surface and the lower surface of the mother substrate G, respectively (S22). The control unit 101 determines whether or not the processing by moving the upper and lower scribe heads 2 has been completed for all preset scribe lines (S23). When the process for all the scribe lines is not completed (S23: NO), the control unit 101 returns the process to S13 and executes the process for the next scribe line. Thus, when the process for all the scribe lines is completed (S23: YES), the control unit 101 ends the process.

  FIG. 15 is a timing chart showing scribe control. The lower part of FIG. 15 shows a drive signal for the upper scribe head 2 and a drive signal for the lower scribe head 2. These drive signals are applied to the drive motors 17 and 18 shown in FIG. 15 shows the position on the mother board G in the scribe direction and the relative positions of the scribing wheels 301 and 401. The positions P0 and P3 are the start position and the end position of the scribe line, respectively.

  At the scribe start timing T0, the drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 are set to levels Ds and Dn, respectively. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 are moved at the speeds Vs and Vn, respectively. Thereafter, when the time T1 elapses, the drive signal of the upper scribe head 2 is increased to the level Dn. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 are moved at the same speed Vn, respectively.

  When the time T2 elapses from the scribe start timing T0, the drive signal of the lower scribe head 2 is lowered to the level Ds. As a result, the speed of the lower scribing wheel 401 is reduced to the speed Vs. When the time T2 elapses from the scribe start timing T0, the drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 are each set to 0 level. Thereby, the upper scribing wheel 301 and the lower scribing wheel 401 are stopped.

  According to the scribing control, the lower scribing wheel 401 gradually precedes the upper scribing wheel 301 in the range R1 from the position P0 to the position P1. Further, in the range R2 from the position P1 to the position P2, the distance between the lower scribing wheel 401 and the upper scribing wheel 301 is kept at a predetermined distance. Thereafter, in the range R3 from the position P2 to the position P3, the upper scribing wheel 301 gradually approaches the lower scribing wheel 401. Then, at the end position P3 of the scribe line, the upper scribing wheel 301 catches up with the lower scribing wheel 401, and the positions of both coincide. Thus, the control for the scribe line is completed.

<Effect of embodiment>
According to the present embodiment, the following effects are exhibited.

  As shown in Experiments 1 and 2, a scribe line can be formed with deep cracks at a position directly above the sealing material SL. In particular, as in the scribing method 2, by pressing the opposite sides of the scribing wheels 301 and 401 with the rollers 302 and 402, it is possible to stably form the crack while further increasing the amount of crack penetration.

  In addition, since the start positions of the scribe lines formed on both surfaces of the mother substrate G coincide with each other in plan view, burr-like protrusions are formed on the mother substrate G at the start position of the scribe lines during the cutting process. It is suppressed that it remains. Similarly, since the end positions of the scribe lines respectively formed on both surfaces of the mother substrate G coincide with each other in plan view, the burr-like projecting piece on the mother substrate G at the end position of the scribe lines in the dividing step. It is suppressed that remains. Therefore, the shape of the cut-out liquid crystal panel can be adjusted to an appropriate shape.

  15, the scribing wheel 301 is delayed with respect to the scribing wheel 401 by making the moving speed of the scribing wheel 301 slower than the moving speed of the scribing wheel 401. For this reason, it is possible to leave a gap between the scribing wheel 301 and the scribing wheel 401 while forming cracks on both sides of the mother substrate G.

  Further, in the range R2 of FIG. 15, the delay of the scribing wheel 301 with respect to the scribing wheel 401 is maintained at a predetermined distance by making the moving speed of the scribing wheel 301 and the moving speed of the scribing wheel 401 the same. For this reason, the mother substrate G can be satisfactorily formed with no cracks.

  Further, in the range R3 of FIG. 15, the scribing wheel 301 catches up with the scribing wheel 401 at the end position of the scribe line by making the moving speed of the scribing wheel 301 faster than the moving speed of the scribing wheel 401. Therefore, the scribing wheel 301 can catch up with the scribing wheel 401 while forming cracks on both sides of the mother substrate G.

<Example of change>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made to the embodiments of the present invention other than the above.

  For example, the method of displacing the scribing wheel 301 with respect to the scribing wheel 401 is not limited to the method shown in the above embodiment, and may be another method.

  For example, as shown in FIG. 16A, the lower scribing wheel 401 is moved to the upper scribing wheel 301 by delaying the movement start timing of the upper scribing head 2 by ΔT relative to the lower scribing head 2. The upper scribing wheel 301 is made to catch up with the lower scribing wheel 401 by preceding the lower scribing head 2 by a predetermined distance and advancing the movement end timing of the upper scribing head 2 by ΔT relative to the lower scribing head 2. You may do it. In this case, the drive signals of the upper scribe head 2 and the lower scribe head are both set to the level Dn, and the moving speeds of the scribing wheels 301 and 401 are the same. In this way, the range in which the distance between the upper scribing wheel 301 and the lower scribing wheel 401 is maintained at a predetermined distance can be expanded compared to the above embodiment.

  However, in this modified example, since the movement start timings of the upper and lower scribing wheels 301 and 401 are not the same, there is a concern that the occurrence rate of the stake defect increases in the scribing wheel 301 when the subsequent scribing wheel 301 starts moving. Therefore, in order to suppress the stagnation failure in the subsequent scribing wheel 301, the upper and lower scribing holes 301, 401 are moved at the same timing as the upper and lower scribing holes 301, 401 as in the above embodiment. It is desirable to control so that the interval 401 is gradually increased.

  Further, as shown in FIG. 16B, during the period from time T0 to time Tc corresponding to the intermediate position of the scribe line, the drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 are respectively transmitted. The drive signal for the upper scribe head 2 and the drive signal for the lower scribe head 2 may be set to Dn and Ds, respectively, from time Tc to time T3. In this way, the lower scribing wheel 401 gradually precedes the upper scribing wheel 301 from time T0 to Tc, and the upper scribing wheel 301 is lower from time Tc to T3. Gradually catch up with the scribing wheel 401.

  However, in this modified example, the rib mark amount changes in the entire scribe line. On the other hand, in the above-described embodiment, the distance between the upper and lower scribing wheels 301 and 401 is maintained at a predetermined distance in the range R2 in FIG. Therefore, from the viewpoint of stabilizing the cutting process by making the rib mark amount as uniform as possible, the speeds of the upper and lower scribing wheels 301 and 401 are different only near the start position and the end position of the scribe line as in the above embodiment. In the remaining range, it is desirable to make the speeds of the upper and lower scribing wheels 301 and 401 uniform.

  In addition, the feed speed of the upper and lower scribe heads 2 between time T0 and time T3 can be variously changed on condition that the upper scribing wheel 301 catches up with the lower scribing wheel 401 at the end position of the scribe line. It is.

  In the control shown in FIG. 11, the load with which the upper and lower scribing wheels 301 and 401 are pressed against the upper surface and the lower surface of the mother substrate G is not changed over the entire length of the scribe line. However, the load with which the upper and lower scribing wheels 301 and 401 are pressed against the upper surface and the lower surface of the mother substrate G may be controlled so as to change according to the position of the scribe line. For example, at the start position of the scribe line, the pressure contact load of the upper and lower scribing wheels 301 and 401 is set low, and then the pressure contact load gradually approaches the intended load as the upper and lower scribing wheels 301 and 401 move. May be controlled.

  FIG. 17 is an example of a control flowchart for changing the pressure contact load. In the flowchart of FIG. 17, S14 of FIG. 11 is replaced with S31, and S32 to S35 are further added. Other steps are the same as those in FIG.

  In S13, when the upper and lower scribe heads 2 are moved to the initial positions of the scribe lines to be formed, the control unit 101 drives the servo motors 28 of the upper and lower scribe heads 2 so that the scribing tools 30 and 40 are respectively moved. Then, the upper surface and the lower surface of the mother substrate G are brought into pressure contact with the load N0 (S31). Thereafter, the control unit 101 gradually increases the pressure load of the scribing tools 30 and 40 on the mother substrate G while moving the upper and lower scribe heads 2 at the speeds Vs and Vn, respectively, until the time T1 elapses (S15). Increase (S32). Thus, when the time T1 elapses (S16: YES), the control unit 101 ends the increase of the pressure load of the scribing tools 30 and 40 on the mother board G, and maintains these pressure loads at the load at the time T1 has elapsed. (S33). Then, the control unit 101 increases the speed of the upper scribe head 2 to the speed Vn and advances the scribe operation (S17).

  Thereafter, when the elapsed time reaches time T2 (S18: YES), the control unit 101 changes the moving speed of the lower scribe head 2 to Vs (S18), and presses the scribing tools 30 and 40 against the mother substrate G. The load is gradually reduced (S34). Thus, when the elapsed time reaches time T3 (S20: YES), the control unit 101 finishes reducing the pressure contact load of the scribing tools 30 and 40 on the mother substrate G (S35), and moves the upper and lower scribe heads 2 to move. Stop. Thereafter, in S22, the control unit 101 separates the scribing tools 30 and 40 from the mother substrate G, and ends the scribe line forming operation.

  By adjusting the pressure contact load of the scribing tools 30 and 40 in this way, it is possible to avoid applying an excessive load to the mother board G at the start position and the end position of the scribe line. Since the positions of the scribing wheels 301 and 401 coincide at the start position and the end position of the scribe line, the mother substrate G is directly sandwiched between the scribing wheels 301 and 401. For this reason, the mother substrate G receives a greater force from the scribing wheels 301 and 401 than when the scribing wheels 301 and 401 are displaced from each other in the scribe direction. The control of FIG. 17 prevents the mother substrate G from receiving an excessive force from the scribing wheels 301 and 401 by reducing the load at the start position and the end position of the scribe line. Therefore, cracks with an appropriate depth can be formed on the mother substrate G without breakage at the start position and the end position of the scribe line. The load in S33 is adjusted so that a crack having a desired depth is formed when the distance between the scribing wheels 301 and 401 is a predetermined distance.

  Moreover, in the said embodiment, although the scribing wheel by which the groove | channel was formed in the ridgeline of the blade edge at regular intervals was used, even if it uses the scribing wheel in which the groove | channel is not formed in the ridgeline, the same effect is show | played Can be assumed. The size and shape of the scribing wheel (blade edge) are not limited to those described in the above embodiment, and other sizes, shapes, and types of blade edges can be used as appropriate.

  In the control shown in FIG. 11, the lower scribing wheel 401 of the mother board G is advanced in the scribing direction with respect to the upper scribing wheel 301, but the lower scribing wheel 301 of the mother board G is moved downward. The wheel 401 may be preceded in the scribe direction.

  In the control shown in FIG. 11, the moving speed of the upper and lower scribe heads 2 is switched depending on the elapsed time from the start timing T0 of the scribe operation, but a means for detecting the position of the upper and lower scribe heads 2 is provided. Alternatively, the control may be executed depending on the positions of the upper and lower scribe heads 2. For example, the speed of the upper scribe head 2 is increased to Vn in response to the detection that the upper scribe head 2 has reached the position P1 in FIG. 15, and the lower scribe head 2 is The speed of the lower scribe head 2 may be reduced to Vs in response to detecting that the position P2 has been reached. Furthermore, the upper and lower scribe heads 2 may be stopped in response to the detection that the upper and lower scribe heads 2 have reached the position P3.

  Further, in the configurations of FIGS. 6A and 6B and FIGS. 8A and 8B, the center positions of the shafts 301a and 401a of the scribing wheels 301 and 401 are the shafts 302a and 302a of the rollers 302 and 402, respectively. The center position of 402a coincides with the Z-axis direction, and the diameters of the scribing wheels 301 and 401 are the same as the diameters of the rollers 302 and 402, respectively. However, the relationship between the scribing wheels 301 and 401 and the rollers 302 and 402 is not limited to this, and various other changes are possible.

  6 (a) and 6 (b) and FIGS. 8 (a) and 8 (b), the pair of rollers 302 and 402 are arranged on both sides of the scribing wheels 301 and 401. A configuration in which one roller 302, 402 is disposed only on one side of the lens can be assumed.

  In addition, the configuration, thickness, material, and the like of the mother substrate G are not limited to those shown in the above embodiment, and the scribing methods 1 and 2 and the scribing method are also used for cutting the mother substrate G of other configurations. An apparatus can be used.

  The embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea shown in the claims.

DESCRIPTION OF SYMBOLS 1 ... Scribe device 2 ... Scribe head 30, 40 ... Scribing tool 101 ... Control part 301, 401 ... Scribing wheel 302, 402 ... Roller G ... Mother board | substrate G1, G2 ... Glass board | substrate

Claims (10)

A scribing method for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material,
A position facing the sealing material on the surface of the first substrate such that a start position of the scribe line of the first substrate and a start position of the scribe line of the second substrate coincide with each other in plan view; The first blade and the second blade are pressed against the sealing material on the surface of the substrate, respectively,
The first blade and the second blade are moved along the sealing material so that the first blade is displaced in the scribe direction with respect to the second blade, and the first substrate is moved. Forming scribe lines on the surface and the surface of the second substrate,
The first blade and the second blade are moved so that the displacement between the first blade and the second blade is eliminated, and the end position of the scribe line of the first substrate and the second blade are moved. Making the end positions of the scribe lines of the substrate coincide with each other in plan view;
A scribing method characterized by that. The scribing method according to claim 1,
A scribing method, wherein the first blade is displaced with respect to the second blade by making the moving speed of the first blade different from the moving speed of the second blade. The scribing method according to claim 1 or 2,
By making the moving speed of the first blade and the moving speed of the second blade the same, the displacement of the first blade relative to the second blade is maintained at a predetermined distance, and the first substrate The scribing method is characterized in that the scribe line is formed on the surface of the second substrate and the surface of the second substrate. In the scribing method according to any one of claims 1 to 3,
Displacement of the first blade and the second blade is eliminated at the end position by making the moving speed of the first blade different from the moving speed of the second blade. Scribe method. In the scribing method according to any one of claims 1 to 4,
Moving the first pressing member along the sealing material together with the first blade while pressing the first pressing member at a position corresponding to the second blade on the surface of the first substrate;
The second pressing member is moved along the sealing material together with the second blade while pressing the second pressing member at a position corresponding to the first blade on the surface of the second substrate. How to scribe. A scribing device for forming a scribe line on a mother substrate formed by bonding a first substrate and a second substrate with a sealing material,
A first scribe head for forming a scribe line on the surface of the first substrate;
A second scribe head for forming a scribe line on the surface of the second substrate;
A drive unit for moving the first scribe head and the second scribe head in parallel with the mother substrate;
A control unit that controls the first scribe head, the second scribe head, and the drive unit;
The controller is
A position facing the sealing material on the surface of the first substrate such that a start position of the scribe line of the first substrate and a start position of the scribe line of the second substrate coincide with each other in plan view; The first blade of the first scribe head and the second blade of the second scribe head are pressed against the sealing material on the surface of the substrate, respectively.
The first blade and the second blade are moved along the sealing material so that the first blade is displaced in the scribe direction with respect to the second blade, and the first substrate is moved. Forming scribe lines on the surface and the surface of the second substrate,
The first blade and the second blade are moved so that the displacement between the first blade and the second blade is eliminated, and the end position of the scribe line of the first substrate and the second blade are moved. Making the end positions of the scribe lines of the substrate coincide with each other in plan view;
A scribing device characterized by that. The scribing device according to claim 6,
The scribing apparatus characterized in that the first blade is displaced with respect to the second blade by making the moving speed of the first blade different from the moving speed of the second blade. The scribing device according to claim 6 or 7,
The control unit maintains the displacement of the first blade with respect to the second blade at a predetermined distance by making the moving speed of the first blade and the moving speed of the second blade the same. The scribing apparatus, wherein the scribing line is formed on the surface of the first substrate and the surface of the second substrate. In the scribing device according to any one of claims 6 to 8,
The controller cancels the displacement of the first blade and the second blade at the end position by making the moving speed of the first blade different from the moving speed of the second blade. A scribing device characterized by that. The scribing device according to any one of claims 6 to 9,
The first scribing head is configured to hold a pressure contact position of the second blade from the surface of the first substrate in a state where the first blade is displaced along the sealing material with respect to the second blade. 1 holding member,
The second scribing head is configured to hold a pressure contact position of the first blade from the surface of the second substrate in a state where the second blade is displaced along the sealing material with respect to the first blade. A scribing device having two pressing members.