CN105523710A - Scribing method and scribing apparatus - Google Patents
Scribing method and scribing apparatus Download PDFInfo
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- CN105523710A CN105523710A CN201510578090.7A CN201510578090A CN105523710A CN 105523710 A CN105523710 A CN 105523710A CN 201510578090 A CN201510578090 A CN 201510578090A CN 105523710 A CN105523710 A CN 105523710A
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
The invention relates to a scribing method and a scribing apparatus. Even if scribed lines are formed right above and right below sealing materials, overall lengths of the scribed lines can be covered and grooves with sufficient depths can be smoothly formed in a substrate. In a way that starting positions of scribed lines on two surfaces of a mother substrate (G) are mutually consistent when being overlooked, line scribing wheels (301, 401) are respectively pressed in a position, opposite to a sealing material, of the upper surface of the mother substrate and in a position, opposite to the sealing material, of the lower surface of the mother substrate (G). In a way that the line scribing wheel (301) delays relative to the line scribing wheel (401), the line scribing wheels (301, 401) are allowed to move separately, thereby forming scribed lines. Movement of the line scribing wheel (301) is propelled relative to the line scribing wheel (401) so that positions of the line scribing wheels (301, 401) are consistent in finishing positions of the scribed lines.
Description
Technical field
The present invention relates to a kind of scribble method and chalker in order to form line at substrate.
Background technology
In the past, the disjunction of the brittle substrate such as glass substrate was scribe step by forming line at substrate surface, carried out with adding the cut-out step of specific power along formed line to substrate surface.In scribe step, the point of a knife of tracing wheel one side is pressed against substrate surface, and one side moves along specific line.The chalker with scribe head is used in the formation of line.
The method in order to cut out liquid crystal panel from mother substrate is recorded in following patent documentation 1.In the method, form mother substrate by being fitted across sealing material with the substrate being formed with colored filter (CF) by the substrate being formed with thin film transistor (TFT).By this mother substrate disjunction is obtained each liquid crystal panel.
Sealing material configures in the mode remaining in the space becoming Liquid crystal pour region under the state of 2 baseplate-laminatings.
When the mother substrate disjunction by described formation, use 2 scribe heads can be utilized on two surfaces of mother substrate to form the method (for example, referring to patent documentation 2) of line simultaneously.In this case, 2 scribe heads configure in the mode clamping mother substrate.2 tracing wheels are positioned at same position when overlooking mother substrate.In this condition, 2 tracing wheels move to equidirectional simultaneously and form line on each surface of mother substrate.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2006-137641 publication
[patent documentation 2] Japanese Patent Laid-Open 2012-240902 publication
Summary of the invention
[inventing problem to be solved]
Also as described in shown in patent documentation 1, mother substrate in the past exists not to be situated between adjacent Liquid crystal pour region puts the region of sealing material.Therefore, as mentioned above, when utilizing 2 scribe heads to form line on two surfaces of mother substrate simultaneously, line can be formed in the region of putting sealing material that is not situated between.So, rule and by mother substrate disjunction, then liquid crystal panel can remain the frame region of specific width around Liquid crystal pour region if formed.
But in recent years, especially in the liquid crystal panel of mobile phone, making described frame region extremely narrow becomes main flow.In order to meet this requirement, and omit not to be situated between in mother substrate and put the region of sealing material, adjacent Liquid crystal pour region must be configured to separate by means of only sealing material.In this case, line to be formed in directly over sealing material and immediately below.
But, confirm following problem by this case inventors: if so directly over sealing material and immediately below position form line, then slight crack does not enter to 2 glass substrates fully.Cut off step if performed under the state that slight crack is insufficient as so, then the ora terminalis of substrate after severance may produce trickle be full of cracks or breakage, thus the intensity of glass substrate reduces.
In view of this problem, the object of the present invention is to provide a kind of to be namely convenient to directly over sealing material and immediately below position when forming line, also can form scribble method and the chalker of the slight crack of the abundant degree of depth at substrate throughout the total length of line.
[technique means of dealing with problems]
First aspect of the present invention is related to a kind of mother substrate first substrate and second substrate being fitted by sealing material and forms the scribble method of ruling.In the scribble method of this aspect, lower mode consistent with each other is overlooked with the starting position of the line of the starting position of the line of described first substrate and described second substrate, that respectively the first cutter and the second cutter are pressed on the surface of described first substrate with position that is described sealing material subtend, and the surface of described second substrate with the position of described sealing material subtend, and with described first cutter relative to the mode of described second cutter to the displacement of line direction, described first cutter and described second cutter are moved along described sealing material respectively, thus form line respectively on the surface of the surface of described first substrate and described second substrate, in the mode displacement of described first cutter and described second cutter eliminated, described first cutter and described second cutter are moved, and make the end position of the end position of the described line of described first substrate and the described line of described second substrate overlook lower consistent with each other.
According to the scribble method of this aspect, directly over sealing material and immediately below position formed line, the slight crack of the abundant degree of depth can be formed at mother substrate.In addition, the starting position being respectively formed at the line of first substrate and second substrate is overlooked lower consistent with each other, therefore when disjunction step, in the starting position of line, suppresses the tab at mother substrate residual burr shape.Similarly, the end position being formed in the line of each substrate is overlooked lower consistent with each other, therefore when disjunction step, at the end position of line, suppresses the tab at mother substrate residual burr shape.Therefore, can be suitable shape by the shape adjustments of the substrate part after cutting out.
In the scribble method of this aspect, such as, by the translational speed of the translational speed and the second cutter that adjust the first cutter, the first cutter can be made to be shifted relative to the second cutter.Such as when making the first cutter and the second cutter moves along sealing element from each starting position, making the translational speed of the second cutter slower than the translational speed of the first cutter, thus, the first cutter can be made to be shifted relative to the second cutter.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the first cutter be shifted relative to the second cutter.
In addition, comparatively ideal, when line action, by making the translational speed of the first cutter identical with the translational speed of the second cutter, and the first cutter being maintained specific range relative to the displacement of the second cutter, being formed on the surface of the surface of first substrate and second substrate and ruling.So, slight crack can be formed at mother substrate well without inequality.
In addition, in the scribble method of this aspect, by making the translational speed of the first cutter different from the translational speed of the second cutter, the displacement of the first cutter and the second cutter can be eliminated at end position.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the displacement of the first cutter and the second cutter eliminate.
In addition, in the scribble method of this aspect, comparatively ideally be, one side makes the first pressing component be pressed on the position corresponding with the second cutter on the surface of first substrate, one side makes the first cutter and the first pressing component move along sealing material, and one side makes the second pressing component be pressed on the position corresponding with the first cutter on the surface of second substrate, one side makes the second cutter and the second pressing component move along sealing material.So, suppress pressing force because of the first cutter and the second cutter and mother substrate is out of shape, therefore can the degree of depth of slight crack be maintained darker, and more stably can form slight crack.
Second aspect of the present invention is related to a kind of mother substrate first substrate and second substrate being fitted by sealing material and forms the chalker of ruling.The chalker of this aspect possesses: the first scribe head, forms line on the surface of described first substrate; Second scribe head, forms line on the surface of described second substrate; Driving part, makes described first scribe head and described second scribe head and described mother substrate move abreast; And control part, control described first scribe head, described second scribe head and described driving part.Described control part overlooks lower mode consistent with each other with the starting position of the line of the starting position of the line of described first substrate and described second substrate, respectively the second cutter of the first cutter of described first scribe head and described second scribe head is pressed on the surface of described first substrate with the position of described sealing material subtend and the surface of described second substrate with the position of described sealing material subtend.And, the mode that control part is shifted to line direction relative to described second cutter with described first cutter, described first cutter and described second cutter are moved along described sealing material respectively, thus form line respectively on the surface of the surface of described first substrate and described second substrate, in the mode of the displacement eliminating described first cutter and described second cutter, described first cutter and described second cutter are moved, and make the end position of the end position of the described line of described first substrate and the described line of described second substrate overlook lower consistent with each other.
According to the chalker of this aspect, in the same manner as the scribble method of described first aspect, directly over sealing material and immediately below position formed line, the slight crack of the abundant degree of depth can be formed at mother substrate.In addition, the starting position being respectively formed at the line of first substrate and second substrate is overlooked lower consistent with each other, therefore when disjunction step, in the starting position of line, suppresses the tab at mother substrate residual burr shape.Similarly, the end position being formed in the line of each substrate is overlooked lower consistent with each other, therefore when disjunction step, at the end position of line, suppresses the tab at mother substrate residual burr shape.Therefore, the shape of the substrate part after cutting out can be made to be suitable shape.
In the chalker of this aspect, control part can be configured to by making the translational speed of the first cutter different from the translational speed of the second cutter, and the first cutter is shifted relative to the second cutter.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the second cutter postpone relative to the first cutter.
In addition, control part can be configured to by making the translational speed of the first cutter identical with the translational speed of the second cutter, and the first cutter is maintained specific range relative to the displacement of the second cutter, is formed rule on the surface of the surface of first substrate and second substrate.So, slight crack can be formed at mother substrate well without inequality.
In addition, control part can be configured to by making the translational speed of the first cutter different from the translational speed of the second cutter, and at end position, the displacement of the first cutter and the second cutter is eliminated.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the second cutter catch up with the first cutter.
In addition, comparatively ideally be, under first scribe head has the state be shifted along sealing material relative to the second cutter at the first cutter, the first pressing component of the crimping position of the second cutter is pressed from the surface of first substrate, in addition, comparatively ideal, the second scribe head presses the second pressing component of the crimping position of the first cutter under having the state be shifted along sealing material relative to the first cutter at the second cutter from the surface of second substrate.So, suppress pressing force because of the first cutter and the second cutter and mother substrate is out of shape, therefore can the degree of depth of slight crack be maintained darker, and more stably can form slight crack.
[effect of invention]
As previously discussed, according to the present invention, can provide a kind of to be namely convenient to directly over sealing material and immediately below position when forming line, also can form scribble method and the chalker of the slight crack of the abundant degree of depth at substrate throughout the total length of line.
Effect of the present invention or meaning clearer and more definite by the explanation of embodiment shown below.
But a during the invention process only illustrates by embodiment shown below, the present invention is not by the following any restriction of the content described in embodiment.
Accompanying drawing explanation
Fig. 1 (a), (b) are the figure of the formation of the chalker schematically showing embodiment.
Fig. 2 is the exploded perspective view of the formation of the scribe head representing embodiment.
Fig. 3 is the stereographic map of the formation of the scribe head representing embodiment.
Fig. 4 (a) ~ (c) is the figure of the scribble method that embodiment is described.
Fig. 5 (a) ~ (e) is the figure of the experimental result of the scribble method representing embodiment.
Fig. 6 (a), (b) are the figure of other scribble methods that embodiment is described.
Fig. 7 (a) ~ (e) is the figure of the experimental result of other scribble methods representing embodiment.
Fig. 8 (a), (b) are the stereographic maps of the formation of the marking tool representing embodiment.
Fig. 9 (a), (b) are the figure of the installation method of the marking tool schematically showing embodiment.
Figure 10 (a) ~ (c) is the block diagram of the formation of the chalker representing embodiment and the figure of the problem of explanation when the upper surface of mother substrate is different from the starting position that lower surface is rule.
Figure 11 is the schema representing that the line of embodiment controls.
Figure 12 (a), (b) are the figure of the line action representing embodiment.
Figure 13 (a), (b) are the figure of the line action representing embodiment.
Figure 14 (a), (b) are the figure of the line action representing embodiment.
Figure 15 is the sequential chart representing that the line of embodiment controls.
Figure 16 (a), (b) are the sequential charts representing that the line of modification controls.
Figure 17 is the schema representing that the line of other modifications controls.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.In addition, in the various figures, for simplicity, remarks has mutually orthogonal X-axis, Y-axis and Z axis.X-Y plane and plane-parallel, Z-direction is vertical.
The formation > of < chalker
Fig. 1 (a), (b) are the figure of the formation schematically showing chalker 1.Fig. 1 (a) is the figure observing chalker 1 from the positive side of Y-axis, Fig. 1 (b) is the figure observing a part for chalker 1 from the positive side of X-axis.
With reference to Fig. 1 (a), chalker 1 possess conveying belt 11, pillar 12a, 12b, guiding element 13,14, sliding unit 15,16, drivingmotor 17,18, camera 19a, 19b and 2 scribe heads 2.
As shown in Fig. 1 (b), conveying belt 11, except the position of configuration scribe head 2, is arranged in the mode extended to Y direction.The handle 11a of fixing mother substrate G is provided with at conveying belt 11.On conveying belt 11, under the state of handle 11a fixing ora terminalis, load mother substrate G.Mother substrate G has base plate structure bonded to each other for a pair glass substrate.Mother substrate G, under the state by handle 11a fixing, is carried to Y direction by conveying belt 11.
Pillar 12a, 12b are vertically arranged on the pedestal of chalker 1 across conveying belt 11.Guiding element 13,14 is erected between pillar 12a, 12b in the mode parallel with X-direction respectively.Sliding unit 15,16 is arranged on guiding element 13,14 respectively sliding freely.Be respectively arranged with drivingmotor 17,18 at guiding element 13,14, by these drivingmotors 17,18, and sliding unit 15,16 driven to X-direction.
Scribe head 2 is separately installed with at sliding unit 15,16.At the scribe head 2 of the positive side of Z axis and the scribe head 2 of Z axis minus side, respectively to be provided with marking tool 30,40 with the mode of mother substrate G subtend.Under the state that the tracing wheel remaining on marking tool 30,40 is pressed against the surface of mother substrate G, scribe head 2 is moved to X-direction.Thus, line is formed on the surface of mother substrate G.
Camera 19a, 19b are configured in the top of guiding element 13, and certification mark is at the alignment mark of mother substrate G.By the photographed images from camera 19a, 19b, and detect the allocation position of mother substrate G relative to conveying belt 11.Based on this detected result, determine the line starting position of scribe head 2 or each operating position of the scribe head 2 in the line actions such as end position of ruling.
< scribe head >
Fig. 2 is the exploded partial perspective view of the formation representing scribe head 2, and Fig. 3 is the stereographic map of the formation representing scribe head 2.
With reference to Fig. 2, scribe head 2 possesses hoisting appliance 21, line formation mechanism 22, foundation plate 23, top board 24, base plate 25, rubber frame 26, outer cover 27 and servosystem 28.
Hoisting appliance 21 possesses: druum cam 21a, is attached at the drive shaft of servosystem 28; And cam follower 21c, be formed in the upper surface of lifting unit 21b.Lifting unit 21b can be supported in foundation plate 23 at above-below direction movably via slide block (not shown), and is suppressed to Z axis positive dirction by spring 21d.By suppressing of spring 21d, and cam follower 21c is pressed against the lower surface of druum cam 21a.Lifting unit 21b is attached at line formation mechanism 22.When being made druum cam 21a turn by servosystem 28, by the camming action of druum cam 21a, lifting unit 21b is elevated, with this, line formation mechanism 22 is elevated.In the lower end of line formation mechanism 22, marking tool 30,40 is installed.
Rubber frame 26 is the elastomeric element not making air pass through.Rubber frame 26 has the shape of the groove 25a being embedded in the groove 23a of foundation plate 23, the groove 24a of top board 24 and base plate 25.Under the state that rubber frame 26 is arranged on groove 23a, 24a, 25a, the surface of rubber frame 26 is to slightly protruding outside compared with the side of foundation plate 23, top board 24 and base plate 25.
Outer cover 27 has the shape of 3 plate portion bendings of front face 27a, right side face 27b and left side face 27c.2 hole 27f are formed at the ora terminalis up and down of front face 27a.
Under the state that rubber frame 26 is embedded in groove 23a, 24a, 25a, right side face 27b and the left side face 27c of outer cover 27 are out of shape in mode bending laterally, and outer cover 27 is arranged on foundation plate 23, top board 24 and base plate 25.In this condition, via 2 the hole 27f of ora terminalis being up and down formed in front face 27a, and screw is screwed in top board 24 and base plate 25.And then, screw is screwed in the screw hole in the slightly outside of groove 23a, 24a, the 25a being formed in foundation plate 23, top board 24 and base plate 25.Thus, sandwich outer cover 27 by foundation plate 23, top board 24 and base plate 25 and the head of screw, the circumference of right side face 27b and left side face 27c is pressed against rubber frame 26.So, scribe head 2 is assembled as shown in Figure 3.
As shown in Fig. 1 (a), 2 scribe heads 2 are configured in the upper and lower of mother substrate G respectively.2 scribe heads 2 are identical formation.The marking tool 30,40 being arranged on 2 scribe heads 2 changes according to scribble method.The marking tool 30,40 only keeping tracing wheel 301,401 is used in scribble method 1 in shown below 2 scribble methods.In addition, in scribble method 2, use the marking tool 30,40 keeping tracing wheel 301,401 and roller 302,402.
Below, these 2 scribble methods are described.
< scribble method 1 >
Fig. 4 (a) ~ (c) is the figure of the scribble method that present embodiment is described.Schematic diagram when Fig. 4 (a) is near Y-axis minus side observation scribing position, schematic diagram when Fig. 4 (b) is near X-axis positive side observation scribing position, schematic diagram when Fig. 4 (c) is near Z axis positive side observation scribing position.
As shown in Fig. 4 (a), in this scribble method, than the mode of tracing wheel 401 first row distance W1 to direction (X-axis positive dirction) of ruling of the scribe head 2 of downside (Z axis minus side), 2 tracing wheels 301,401 are moved with the tracing wheel 301 of the scribe head 2 of upside (the positive side of Z axis).In contrast, also can be tracing wheel 401 leading relative to tracing wheel 301.2 tracing wheels 301,401 respectively can with axle 301a, 401a for turning axle be arranged on marking tool 30,40 rotatably.
With reference to Fig. 4 (b), 2 glass substrate G1, G2 laminatings form across sealing material SL by mother substrate G.Be formed with colored filter (CF) at glass substrate G1, be formed with thin film transistor (TFT) at glass substrate G2.Form Liquid crystal pour region R by sealing material SL and 2 glass substrate G1, G2, liquid crystal is injected to this Liquid crystal pour region R.2 tracing wheels 301,401 can not be located in Y direction with offsetting from each other.The position of tracing wheel 301 directly over sealing material SL is pressed against the surface of glass substrate G1, and the position of tracing wheel 401 immediately below sealing material SL is pressed against the surface of glass substrate G2.
As shown in Fig. 4 (c), sealing material SL is configured to reticulation.2 tracing wheels 301,401 move along sealing material SL to X-axis positive dirction.Thus, as shown in Fig. 4 (b), (c), form line L1, L2 respectively on the surface of glass substrate G1, G2.
In scribble method shown in Fig. 4 (a) ~ (c), not arranging pressing with tracing wheel 301 is the roller on the surface of the mother substrate G of opposition side (Z axis minus side), in addition, also not arranging pressing with tracing wheel 401 is the roller on the surface of the mother substrate G of opposition side (the positive side of Z axis).
< tests 1 >
This case inventors carry out according to the scribble method shown in Fig. 4 (a) ~ (c) experiment forming line at mother substrate G.Below, this experiment and experimental result are described.
In experiment, use the substrate (mother substrate) that glass substrate G1, G2 of thickness being respectively 0.2mm fit across sealing material SL.Adhesive substrates (mother substrate) is of a size of 118mm × 500mm.Tracing wheel 301,401 uses Samsung Diamond Industry joint-stock company MicroPenett (registered trademark of Samsung Diamond Industry stock company).Tracing wheel 301,401 is respectively the point of a knife that forms V shape in the periphery of plectane and has the structure of groove at the crestal line of point of a knife with specific interval.The diameter of tracing wheel 301,401 is 3mm, and point of a knife angle is 110 °, and groove number is 550, and groove depth is 3 μm.
The tracing wheel 301,401 of this formation is made one to look like that to be pressed against glass substrate G1, G2 one side shown in Fig. 4 (a) ~ (c) mobile and carry out line action respectively.Be 6.5N by the spatial load forecasting given tracing wheel 301,401 when line action.In addition, the translational speed of tracing wheel 301,401 is set to fixing (200mm/sec).
Based on above condition, one side makes the distance W1 between 2 tracing wheels 301,401 change, the infiltration capacity of the slight crack of planar survey glass substrate G1, a G2.As comparative example, the infiltration capacity of slight crack when also the distance W1 measured between tracing wheel 301,401 is 0.In each mensuration, except the infiltration capacity of slight crack, also measure ripple mark (ribmark) amount in the lump.
Fig. 5 (a) ~ (e) represents experimental result.Fig. 5 (a) is the figure with the infiltration capacity of numeric representation slight crack and ripple mark amount, Fig. 5 (b) ~ (e) is the cross-section photograph of mother substrate G in line, cross-section photograph when be distance W1 being respectively 0.4mm, 0.6mm, 0.8mm, 1.0mm.In Fig. 5 (b) ~ (e), D1, D3 represent ripple mark amount, and D2, D4 represent the infiltration capacity of slight crack.
When with reference to Fig. 5 (a), if distance W1 is more than 0.6mm, then compared with when being 0mm with distance W1, the infiltration quantitative change of the slight crack of glass substrate G1 is large.If slight crack enters to any one in glass substrate G1, G2 with larger infiltration capacity, then in cut-out step, can by mother substrate G suitably disjunction.
Such as, as comparative example (W1=0mm), if about the slight crack amount of glass substrate G1, G2 is the half of thickness (0.2mm) of glass substrate G1, G2, then, in cut-out step, from the both sides of mother substrate G, glass substrate G1, G2 must be cut off respectively.If so carry out action glass substrate G1, G2 cut off respectively from the both sides of mother substrate G, then may produce trickle be full of cracks or breakage at the ora terminalis of glass substrate G1, G2, thus the intensity of glass substrate G1, G2 reduces.
In contrast, when distance W1 is 0.6mm ~ 1.4mm, although the infiltration capacity of the slight crack of glass substrate G2 is less, the infiltration capacity of the slight crack of glass substrate G1 is larger.So when the infiltration capacity of the slight crack of glass substrate G1 is larger, in cut-out step, as long as carry out glass substrate G2 less for the infiltration capacity of slight crack only from the action that the side of mother substrate G cuts off, during this cut-out action, the glass substrate G1 that slight crack enters deeper is also simultaneously broken along slight crack.If so only glass substrate G1, G2 cut off from the side of mother substrate G, then the ora terminalis of glass substrate G1, G2 can not produce trickle be full of cracks or breakage, and remains higher by the intensity of glass substrate G1, G2.
According to above reason, comparatively ideal, in the disjunction of mother substrate G, slight crack enters to any one of glass substrate G1, G2 with larger infiltration capacity.In this experiment, as shown in Fig. 5 (a), if the distance W1 between 2 tracing wheels 301,401 is more than 0.6mm, then, compared with comparative example (W1=0mm), the infiltration quantitative change of the slight crack of glass substrate G1 is large.According to this situation, can say that comparatively ideal be distance W1 between 2 tracing wheels 301,401 is more than 0.6mm.By so setting the distance W1 between 2 tracing wheels 301,401, the cut-out of mother substrate G suitably can be carried out.
< scribble method 2 >
In the scribble method (scribble method 1) shown in Fig. 4 (a) ~ (c), the surface being the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 is not pressed by roller, in addition, be that the surface of mother substrate G of opposition side (the positive side of Z axis) is not also pressed by roller with tracing wheel 401.In contrast, in this scribble method, be the surface of the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 and press by roller respectively with the surface that tracing wheel 401 is the mother substrate G of opposition side (the positive side of Z axis).In addition, be the pressing component in the face of opposition side as pressing and tracing wheel 301,401, also can use the miscellaneous part except roller.
Fig. 6 (a), (b) are the figure that scribble method 2 is described.Schematic diagram when Fig. 6 (a) is near Y-axis minus side observation scribing position, schematic diagram when Fig. 6 (b) is near X-axis positive side observation scribing position.
As shown in Fig. 6 (a), in this scribble method, the surface being the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 is pressed by 2 rollers 402, and in addition, the surface being the mother substrate G of opposition side (the positive side of Z axis) with tracing wheel 401 is also pressed by 2 rollers 302.2 rollers 302 configure in the mode clamping tracing wheel 301, and can with axle 302a for turning axle rotates.In addition, 2 rollers 402 configure in the mode clamping tracing wheel 401, and can with axle 402a for turning axle rotates.
Identical with scribble method 1,2 tracing wheels 301,401 are to line direction (X-direction) departure distance W1.When scribble method 2, the tracing wheel 401 that also can be downside is leading relative to the tracing wheel 301 of upside.2 tracing wheels 301,401 one side is pressed against glass substrate G1, G2 respectively, and one side moves along sealing material SL.Between tracing wheel 301 and 2 rollers 302, there is the gap of Y direction, between tracing wheel 401 and 2 rollers 402, also there is the gap of Y direction.Therefore, roller 302,402 is to move to X-axis positive dirction across the mode of line L1, L2 of being formed by tracing wheel 301,401.
< tests 2 >
This case inventors carry out according to the scribble method shown in Fig. 6 (a), (b) experiment forming line at mother substrate G.Below, this experiment and experimental result are described.
The mother substrate G used in this experiment and tracing wheel 301,401 identical with described experiment 1.In this experiment, the distance W1 between tracing wheel 301,401 is set as 2.2mm.In addition, the translational speed of tracing wheel 301,401 is set to fixing (200mm/sec).Tracing wheel 301 is 1.0mm relative to the offset of the load center of the scribe head 2 of upside, and tracing wheel 401 is 3.2mm relative to the offset of the load center of the scribe head 2 of downside.
The central position of axle 301a, 401a of tracing wheel 301,401 is consistent in the Z-axis direction with the central position of axle 302a, 402a of roller 302,402 respectively, and the diameter of roller 302,402 is 3mm with the diameter same settings of tracing wheel 301,401 respectively.
Based on above condition, one side makes the load variations of giving marking tool 30,40, the infiltration capacity of the slight crack of planar survey glass substrate G1, a G2.
Fig. 7 (a) ~ (e) represents experimental result.The cross-section photograph that the cross-section photograph of the mother substrate G in Fig. 7 (a) to be the figure with the infiltration capacity of numeric representation slight crack and ripple mark amount, Fig. 7 (b) ~ (e) be line is load respectively when being 6N, 7N, 8N, 9N.In Fig. 5 (b) ~ (e), D1, D3 represent ripple mark amount, and D2, D4 represent the infiltration capacity of slight crack.
When with reference to Fig. 7 (a), if known load is changed to 6N from 5N, then the infiltration capacity of the slight crack of glass substrate G1 sharply increases.In addition, if load is more than 6N, then the infiltration capacity of the slight crack of glass substrate G1 exceedes 80% of the thickness (0.2mm) of glass substrate G1, and slight crack enters to glass substrate G1 with larger infiltration capacity.As mentioned above, if slight crack enters to any one in glass substrate G1, G2 with larger infiltration capacity, then in cut-out step, can by mother substrate G suitably disjunction.Therefore, can say that comparatively ideal is in scribble method 2, be more than 6N by the load setting given marking tool 30,40.
In addition, in this experiment, compared with described experiment 1, larger to the infiltration capacity of the slight crack of glass substrate G1.In addition, in this experiment, the downside of tracing wheel 301 is supported by roller 402, and in addition, the upside of tracing wheel 401 is supported by roller 302, therefore suppresses because of the pressing force of the cutter of tracing wheel 301,401 that mother substrate G is out of shape.Therefore, can say comparatively ideal, in order to make the infiltration capacity of slight crack more greatly and stably form slight crack, and as scribble method 2, what utilize roller 402,302 to press mother substrate G is the face of opposition side with tracing wheel 301,401.
< marking tool >
Fig. 8 (a), (b) are the stereographic maps of the configuration example representing the marking tool 30,40 used in described scribble method 2 respectively.
Marking tool 30,40 possesses identical formation except the putting in order of tracing wheel 301,401 and roller 302,402.Marking tool 30,40 possesses the retainer 303,403 keeping tracing wheel 301,401 and roller 302,402 respectively.Retainer 303,403 possesses for the groove 303a, the 403a that install tracing wheel 301,401, for groove 303b, 403b and scarp 303c, 403c of installing roller 302,402.Tracing wheel 301,401 is installed by axle 301a, 401a are embedded in the hole of retainer 303,403.Roller 302,402 is installed by axle 302a, 402a are embedded in the hole of retainer 303,403.
Fig. 9 (a), (b) schematically show figure line formation mechanism 22 being installed to the method for marking tool 30.In Fig. 9 (a), (b), represent the state of the inside of perspective line formation mechanism 22.
In the lower end of line formation mechanism 22, be provided with the maintaining part 221 keeping marking tool 30, be formed with the hole 222 can inserting marking tool 30 in this maintaining part 221.The end in hole 222, is provided with magnet 224, the mid-way in hole 222 is provided with pin 223.The retainer 303 of marking tool 30 comprises ferromagnetic.In addition, maintaining part 221 by not shown bearing can in the horizontal direction 360 degree be supported in rotatably line formation mechanism 22.
When marking tool 30 being arranged on line formation mechanism 22, the retainer 303 of marking tool 30 is inserted into the hole 222 of maintaining part 221.If the upper end of retainer 303 is close to magnet 224, retainer 303 is adsorbed in magnet 224.Now, the scarp 303c of retainer 303 is connected to pin 223, and retainer 303 is positioned at its normal orientation.So, as shown in Fig. 9 (b), marking tool 30 is arranged on the lower end of line formation mechanism 22.
Marking tool 40 is arranged on the lower end of line formation mechanism 22 too.So, if marking tool 30,40 is arranged on the line formation mechanism 22 of corresponding scribe head 2 respectively, then as shown in Fig. 6 (a), (b), roller 402 is positioned at the position corresponding with tracing wheel 301, and roller 302 is positioned at the position corresponding with tracing wheel 401.If use the marking tool 30,40 of Fig. 8 (a), the formation shown in (b), then by means of only the line formation mechanism 22 marking tool 30,40 being arranged on respectively corresponding scribe head 2, tracing wheel 301 and the distance W1 of tracing wheel 401 specific distance be can be remained, and tracing wheel 301,401 and the mutual subtend of roller 402,302 made.
In addition, described experiment 2 uses the marking tool 30,40 of the formation shown in Fig. 8 (a), (b) and carries out.In addition, described experiment 1 uses omits groove 303b, 403b from retainer 303,403, and only installs the marking tool 30,40 of tracing wheel 301,401 respectively at the retainer 303,403 only with groove 303a, 403a and carry out.
< line control >
Secondly, control to be described to the line of chalker 1.
Figure 10 (a) is the block diagram of the formation representing chalker 1.
Chalker 1 possesses control part 101, test section 102, driving part 103, input part 104 and display part 105.
Control part 101 possesses CPU (CentralProcessingUnit, central processing unit) etc. treater and ROM (ReadOnlyMemory, read-only storage), RAM (RandomAccessMemory, random access memory) etc. storer, and control each portion according to the sequence of control being stored in storer.In addition, storer is also used as work area when controlling each portion.Test section 102, except comprising camera 19a, the 19b shown in Fig. 1 (a), also comprises various sensor.Driving part 103 comprises mechanism part and the drivingmotor 17,18 of the chalker 1 shown in Fig. 1 (a).Input part 104 possesses mouse and keyboard.Input part 104 is for the input of the various parameter values in the line action such as interval of the starting position of ruling and end position or line.Display part 105 comprises monitor, and when being inputted by input part 104, display specifically inputs picture.
Figure 10 (b), (c) be illustrate be respectively formed at the starting position of the upper surface of mother substrate G and the line of lower surface inconsistent when overlooking mother substrate G time the figure of problem points.Figure 10 (b) is the figure of a part of observing mother substrate G from side, and Figure 10 (c) is the figure of the part from top view mother substrate G.
As described in experiment 1,2 verify as, comparatively ideal, when two surfaces of mother substrate G form line simultaneously, make the tracing wheel 301 of upside offset specific range with the tracing wheel 401 of downside to direction of ruling.But, if this scribble method of used in cycle time from line, then as shown in Figure 10 (b), between the starting position SP1 of the line L1 of mother substrate G upper surface and the starting position SP2 of the line L2 of mother substrate G lower surface, produce the skew of specific range W.
If starting position SP1, SP2 so offset, then, in the disjunction step along line L1, L2, as shown in Figure 10 (c), the tab Gb of the glass substrate G2 residual burr shape in the downside of mother substrate G can be produced.Such as, if after the ora terminalis of mother substrate G being cut in forming the slight crack vertical with line L1, L2 in the position of starting position SP1, carry out the disjunction step along line L1, L2, then the line L2 of downside can not extend to the end of the glass substrate G2 of downside, therefore the part of the distance W of glass substrate G2 can not by fitly disjunction, and can at the tab Gb of this part residual burr shape.If like this, then profile and the desired profile of the liquid crystal panel after cutting out are inconsistent, cause the setting area that liquid crystal panel suitably cannot be arranged on product side.This problem produces similarly at the end position of line.
Therefore, in the present embodiment, to make the starting position of line L1, L2 consistent when overlooking mother substrate G with end position, and the mode that tracing wheel 301 on the upside of the chien shih of starting position and end position and the tracing wheel 401 of downside offset specific range to direction of ruling controls.In addition, in this control, control to the mode that line direction is leading relative to the tracing wheel 301 of upside to make the tracing wheel 401 of downside.
Figure 11 is the schema representing that line controls.In addition, it is do not make the conveying belt 11 of Fig. 1 (a) move that the line shown in Figure 11 controls, and makes marking tool 30,40 move the next controls when the two surface formation line of mother substrate G.Control different from the line shown in Figure 11, do not make marking tool 30,40 move, and make conveying belt 11 move the control forming line on two surfaces of mother substrate G.
It is undertaken by the control part 101 of Figure 10 (a) that line shown in Figure 11 controls.Figure 12 (a) ~ Figure 14 (b) is the figure of the position of the marking tool 30,40 schematically showing specific Control timing sequence.Herein, Fig. 8 (a), the marking tool 30,40 shown in (b) is used.Also can replace this, use roller 302,402 elliptical marking tool 30,40.
With reference to Figure 11, control part 101 processes the photographed images of camera 19a, 19b and detects the position (S11) of mother substrate G.Based on this detected result, control part 101 sets starting position relative to the upper and lower scribe head 2 (marking tool 30,40) of each line and the switching sequence (S12) to control relative to the feeding of each scribe head 2.
Secondly, control part 101 makes upper and lower scribe head 2 move to the starting position (S13) of line L1, the L2 forming object.Figure 12 (a) is the figure of the state of the marking tool 30,40 represented now.In this condition, in X-direction, the position consistency of tracing wheel 301,401.In this condition, control part 101 drives the servosystem 28 of upper and lower scribe head 2, makes marking tool 30,40 be crimped on upper surface and the lower surface (S14) of mother substrate G respectively with specific load.Figure 12 (b) is the figure of the state of the marking tool 30,40 represented now.In this condition, when overlooking mother substrate G, in the mode that the position of tracing wheel 301,401 is consistent with each other, that respectively tracing wheel 301,401 is crimped on mother substrate G upper surface with position that is sealing material SL subtend and mother substrate G lower surface with the position of sealing material SL subtend.
Under the state on two surfaces so making marking tool 30,40 be crimped on mother substrate G, control part 101 drives drivingmotor 17,18, and upper and lower scribe head 2 is moved (S15) with speed Vs, Vn respectively.Speed Vs sets specific rate Vn is slow.Therefore, the marking tool 30 of upside slowly retreats relative to the marking tool 40 of downside, line direction, between marking tool 30,40 the empty standard width of a room in an old-style house every.Figure 13 (a) is the figure of the state of the marking tool 30,40 represented now.
Then, control part 101 waits for elapsed time T1 (S16) from the movement of upper and lower scribe head 2.And as elapsed time T1 (S16: yes), the translational speed of the scribe head 2 of upside is increased to speed Vn (S17) from speed Vs by control part 101.
Figure 13 (b) is the figure of the state of the marking tool 30,40 represented now.The sequential (S16: yes) of elapsed time T1 the movement from upper and lower scribe head 2, emptyly between upper and lower tracing wheel 301,401 opens desired interval, and roller 402,302 is roughly subtend relative to these tracing wheels 301,401.In this condition, the speed Vn identical with the scribe head 2 of upside is increased to by the translational speed of the scribe head 2 by upside, and under the state by the distance maintaining of upper and lower tracing wheel 301,401 being desired interval, upper and lower tracing wheel 301,401 is moved in line direction.
Then, control part 101 is waited for from the movement of upper and lower scribe head 2 elapsed time T2 (T2 > T1) (S18).And as elapsed time T2 (S18: yes), control part 101 makes the translational speed of the scribe head 2 of downside be reduced to speed Vs (S19) from speed Vn.Thus, the tracing wheel 401 of downside is slowly close to the tracing wheel 301 of upside.Figure 14 (a) is the figure of the state of the marking tool 30,40 represented now.
And then control part 101 is waited for from the movement of upper and lower scribe head 2 elapsed time T3 (T3 > T2) (S20).In the sequential (S20: yes) of elapsed time T3, in line direction, the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside.Figure 14 (b) is the figure of the state of the marking tool 30,40 represented now.
So, as elapsed time T3 (S20: yes), control part 101 makes the feeding of upper and lower scribe head 2 terminate, and upper and lower scribe head 2 is stopped (S21).Then, control part 101 drives the servosystem 28 of upper and lower scribe head 2, and marking tool 30,40 is left (S22) from the upper surface of mother substrate G and lower surface respectively.Control part 101 judges the process (S23) whether terminating by making upper and lower scribe head 2 movement to all line preset.To (S23: no) in the unclosed situation of the process of all line, control part 101 makes process be back to S13 and performs the process to next line.So, when terminating (S23: yes) to the process of all line, control part 101 end treatment.
Figure 15 is the sequential chart representing that line controls.At the hypomere of Figure 15, represent the actuate signal of the actuate signal relative to the scribe head 2 of upside and the scribe head 2 relative to downside.These actuate signals are applied to the drivingmotor 17,18 shown in Fig. 1 (a) respectively.In addition, at the epimere of Figure 15, the position on the mother substrate G in expression line direction and the relative position of tracing wheel 301,401.Position P0, P3 are starting position and the end position of line respectively.
Start sequential T0 in line, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside is set as level Ds, Dn respectively.Thus, the tracing wheel 301 of upside moves with speed Vs, Vn respectively with the tracing wheel 401 of downside.Then, as elapsed time T1, the actuate signal of the scribe head 2 of upside is increased to level Dn.Thus, the tracing wheel 301 of upside moves with identical speed Vn respectively with the tracing wheel 401 of downside.
When during sequential T0 elapsed time T2, the actuate signal of the scribe head 2 of downside being reduced to level Ds from line.Thus, the speed of the tracing wheel 401 of downside is reduced to speed Vs.And, when during sequential T0 elapsed time T2, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside being set to 0 level respectively from line.Thus, the tracing wheel 301 of upside stops with the tracing wheel 401 of downside.
Control according to described line, in the scope R1 of position P0 ~ position P1, the tracing wheel 401 of downside is slowly leading relative to the tracing wheel 301 of upside.In addition, in the scope R2 of position P1 ~ position P2, the interval of the tracing wheel 401 of downside and the tracing wheel 301 of upside remains specific range.Then, in the scope R3 of position P2 ~ position P3, the tracing wheel 301 of upside is slowly close to the tracing wheel 401 of downside.And in the end position P3 of line, the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside and both position consistency.So, the control for this line is terminated.
The effect > of < embodiment
According to the present embodiment, following effect is played.
As tested shown in 1,2, line can be formed with darker slight crack in the position directly over sealing material SL.Especially, as scribble method 2, by the opposition side utilizing roller 302,402 to press tracing wheel 301,401, can make the infiltration capacity of slight crack more greatly and stably form slight crack.
In addition, the starting position being respectively formed at the line on two surfaces of mother substrate G is overlooked lower consistent with each other, therefore when disjunction step, in the starting position of line, suppresses the tab at mother substrate G residual burr shape.Similarly, the end position being respectively formed at the line on two surfaces of mother substrate G is overlooked lower consistent with each other, therefore when disjunction step, at the end position of line, suppresses the tab at mother substrate G residual burr shape.Therefore, can be suitable shape by the shape adjustments of the liquid crystal panel after cutting out.
In addition, in the scope R1 of Figure 15, by making the translational speed of tracing wheel 301 slower than the translational speed of tracing wheel 401, and tracing wheel 301 is postponed relative to tracing wheel 401.Therefore, can mother substrate G two surface formed slight cracks, and between tracing wheel 301 and tracing wheel 401 the empty standard width of a room in an old-style house every.
In addition, in the scope R2 of Figure 15, by making the translational speed of tracing wheel 301 identical with the translational speed of tracing wheel 401, and tracing wheel 301 is maintained specific range relative to the delay of tracing wheel 401.Therefore, slight crack can be formed at mother substrate G well without inequality.
In addition, in the scope R3 of Figure 15, by making the translational speed of tracing wheel 301 faster than the translational speed of tracing wheel 401, at the end position of line, tracing wheel 301 catch up with tracing wheel 401.Therefore, slight crack can be formed on two surfaces of mother substrate G, and make tracing wheel 301 catch up with tracing wheel 401.
< modification >
Above, be illustrated embodiments of the present invention, but the present invention is not by any restriction of described embodiment, in addition, embodiments of the present invention also can carry out various change except described.
Such as, the method that tracing wheel 301 is shifted relative to tracing wheel 401 is not limited to the method shown in described embodiment, also can be set to additive method.
Such as, as shown in Figure 16 (a), also by making the mobile sequential that starts of the scribe head 2 of upside only postpone Δ T relative to the scribe head 2 of downside, and make the tracing wheel 301 only leading specific range of tracing wheel 401 relative to upside of downside, in addition, by making the mobile end sequential of the scribe head 2 of upside only shift to an earlier date Δ T relative to the scribe head 2 of downside, and the tracing wheel 301 of upside is made to catch up with the tracing wheel 401 of downside.In this case, the scribe head 2 of upside is all set to level Dn with the actuate signal of the scribe head of downside, and the translational speed of tracing wheel 301,401 is identical.So can expand the distance maintaining of the tracing wheel 301 of upside and the tracing wheel 401 of downside compared with described embodiment is the scope of specific range.
But, in this modification, because the mobile sequential that starts of upper and lower tracing wheel 301,401 is not identical, therefore when the mobile beginning of follow-up tracing wheel 301, in this tracing wheel 301, there are the misgivings that the production rate of poor starting improves.Therefore, in order to suppress the poor starting of follow-up tracing wheel 301, as described in embodiment, comparatively ideally be, to make the mobile sequential that starts of upper and lower tracing wheel 301,401 identical, and after mobile beginning, the mode that the interval of upper and lower tracing wheel 301,401 is slowly expanded controls.
In addition, as shown in Figure 16 (b), also can from time T0 to during with the time Tc corresponding to mid-way of line, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside is set as Ds, Dn respectively, during time Tc ~ time T3, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside is set as Dn, Ds respectively.So during time T0 ~ Tc, the tracing wheel 401 of downside is slowly leading relative to the tracing wheel 301 of upside, and during time Tc ~ T3, the tracing wheel 301 of upside slowly catch up with relative to the tracing wheel 401 of downside.
But, in this modification, ripple mark amount change in line entirety.In contrast, in said embodiment, in the scope R2 of Figure 15, because the interval of upper and lower tracing wheel 301,401 remains specific range, therefore ripple mark amount is roughly fixing.Therefore, to try one's best homogenizing and make the viewpoint of disjunction step stabilization from making ripple mark amount, comparatively ideally be, as as described in embodiment, only different from making the speed of upper and lower tracing wheel 301,401 near end position near the starting position of line, in remaining scope, make the speed homogenizing of upper and lower tracing wheel 301,401.
In addition, the speed of feed of the upper and lower scribe head 2 during time T0 ~ time T3.The tracing wheel 401 of downside can be roughly caught up with for condition and carry out various change to make at the end position of line the tracing wheel 301 of upside.
In addition, in the control shown in Figure 11, upper and lower tracing wheel 301,401 is crimped on the upper surface of mother substrate G and the load of lower surface is set to constant in the total length of line.But, also can be crimped on the mode that the upper surface of mother substrate G and the load of lower surface change according to the position of line with upper and lower tracing wheel 301,401 and control.Such as, also can control as follows: in the starting position of line, must be lower by the crimping load setting of upper and lower tracing wheel 301,401, then, move according to upper and lower tracing wheel 301,401 and make crimping load slowly close to desired load.
Figure 17 is an example of the control flow chart represented when making crimping load variations.In the schema of Figure 17, the S14 of Figure 11 is replaced with S31, and then, add S32 ~ S35.Other steps are identical with Figure 11.
In S13, when upper and lower scribe head 2 moves to the starting position of the line forming object, control part 101 drives the servosystem 28 of upper and lower scribe head 2, makes marking tool 30,40 be crimped on upper surface and the lower surface (S31) of mother substrate G respectively with load N0.Then, control part 101 is before elapsed time T1, and one side makes upper and lower scribe head 2 move (S15) with speed Vs, Vn respectively, and one side makes marking tool 30,40 slowly increase (S32) relative to the crimping load of mother substrate G.So, as elapsed time T1 (S16: yes), control part 101 makes marking tool 30,40 terminate relative to the increase of the crimping load of mother substrate G, these crimping loads is maintained the load (S33) during elapsed time T1.Then, control part 101 makes the speed of the scribe head 2 of upside be increased to speed Vn and advance line action (S17).
Then, as time of arrival in elapsed time T2 (S18: yes), the translational speed of the scribe head 2 of downside is changed to Vs (S18) by control part 101, and marking tool 30,40 is slowly reduced (S34) relative to the crimping load of mother substrate G.So, as time of arrival in elapsed time T3 (S20: yes), control part 101 makes marking tool 30,40 terminate (S35) relative to the minimizing of the crimping load of mother substrate G, and the mobile of upper and lower scribe head 2 is stopped.Then, in S22, control part 101 makes marking tool 30,40 leave from mother substrate G and terminate the formation action of this line.
By so adjusting the crimping load of marking tool 30,40, and at the starting position of line and end position, excessive load is avoided to be applied to mother substrate G.At starting position and the end position of line, due to the position consistency of tracing wheel 301,401, therefore mother substrate G is directly clamped by tracing wheel 301,401.Therefore, compared with situation about being mutually shifted to direction of ruling with tracing wheel 301,401, mother substrate G is subject to larger power from tracing wheel 301,401.By the control of Figure 17, at starting position and the end position of line, mother substrate G is avoided to be subject to excessive power from tracing wheel 301,401 by weakening load.Therefore, at starting position and the end position of line, the slight crack of appropriate depth can be formed to mother substrate G without breakage.In addition, the mode forming the slight crack of the desired degree of depth when being in specific distance with the interval of tracing wheel 301,401 adjusts the load of S33.
In addition, in said embodiment, the crestal line being used in point of a knife is formed with the tracing wheel of groove with fixed intervals, even if but can imagine to use and do not form the tracing wheel of groove at crestal line and also do not obtain identical effect.The size of tracing wheel (point of a knife) or shape are not limited to the situation described in described embodiment, suitably can use the point of a knife of other sizes or shape, kind.
In addition, in the control shown in Figure 11, make the tracing wheel 401 of the downside of mother substrate G leading to line direction relative to the tracing wheel 301 of upside, but the tracing wheel 301 of the upside of mother substrate G also can be made leading to line direction relative to the tracing wheel 401 of downside.
In addition, in the control shown in Figure 11, by the elapsed time from the beginning sequential T0 of line action, and switch the translational speed of upper and lower scribe head 2, but when being provided with the mechanism of the position detecting upper and lower scribe head 2, also perform control by the position of upper and lower scribe head 2.Such as, also the speed of the scribe head 2 of upside can be made to be increased to Vn according to detecting the scribe head 2 of upside to arrive the position P1 of Figure 15, in addition, also the speed of the scribe head 2 of downside can be made to be reduced to Vs according to detecting the scribe head 2 of downside to arrive the position P2 of Figure 15.And then, also upper and lower scribe head 2 can be stopped according to detecting upper and lower scribe head 2 in-position P3.
In addition, in the formation of Fig. 6 (a), (b) and Fig. 8 (a), (b), the central position of axle 301a, 401a of tracing wheel 301,401 is consistent in Z-direction with the central position of axle 302a, 402a of roller 302,402 respectively, and the diameter of tracing wheel 301,401 is identical with the diameter of roller 302,402 respectively.But the relation of tracing wheel 301,401 and roller 302,402 is not limited thereto, other various changes can be carried out.
In addition, in the formation of Fig. 6 (a), (b) and Fig. 8 (a), (b), be configured with pair of rolls 302,402 in the both sides of tracing wheel 301,401, but also can imagine the formation only configuring a roller 302,402 in the side of tracing wheel 301,401.
In addition, the formation, thickness, material etc. of mother substrate G are not limited to shown in described embodiment, and the cut-out of other mother substrate G formed also can use described scribble method 1,2 and chalker.
Embodiments of the present invention suitably can carry out various change in the scope of the technical thought shown in claims.
[explanation of symbol]
1 chalker
2 scribe heads
30,40 marking tools
101 control parts
301,401 tracing wheels
302,402 rollers
G mother substrate
G1, G2 glass substrate
Claims (10)
1. a scribble method, is characterized in that: rule first substrate and second substrate being formed by the mother substrate that sealing material is fitted, and
Lower mode consistent with each other is overlooked with the starting position of the line of the starting position of the line of described first substrate and described second substrate, respectively the first cutter and the second cutter are pressed on the surface of described first substrate with the position of described sealing material subtend and the surface of described second substrate with the position of described sealing material subtend
With described first cutter relative to the mode of described second cutter to the displacement of line direction, described first cutter and described second cutter are moved along described sealing material respectively, thus form line respectively on the surface of the surface of described first substrate and described second substrate,
In the mode displacement of described first cutter and described second cutter eliminated, described first cutter and described second cutter are moved, and make the end position of the end position of the described line of described first substrate and the described line of described second substrate overlook lower consistent with each other.
2. scribble method according to claim 1, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and make described first cutter relative to described second cutter displacement.
3. scribble method according to claim 1 and 2, is characterized in that:
By making the translational speed of described first cutter identical with the translational speed of described second cutter, and described first cutter being maintained specific range relative to the displacement of described second cutter, forming described line on the surface of the surface of described first substrate and described second substrate.
4. scribble method according to claim 1 and 2, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and at described end position, the displacement of described first cutter and described second cutter is eliminated.
5. scribble method according to claim 1 and 2, is characterized in that:
One side makes the first pressing component be pressed on the position corresponding with described second cutter on the surface of described first substrate, and one side makes described first cutter and described first pressing component move along described sealing material,
One side makes the second pressing component be pressed on the position corresponding with described first cutter on the surface of described second substrate, and one side makes described second cutter and described second pressing component move along described sealing material.
6. a chalker, is characterized in that: it is rule first substrate and second substrate being formed by the mother substrate that sealing material is fitted, and possess:
First scribe head, forms line on the surface of described first substrate;
Second scribe head, forms line on the surface of described second substrate;
Driving part, makes described first scribe head and described second scribe head and described mother substrate move abreast; And
Control part, controls described first scribe head, described second scribe head and described driving part; And
Described control part:
Lower mode consistent with each other is overlooked with the starting position of the line of the starting position of the line of described first substrate and described second substrate, respectively the second cutter of the first cutter of described first scribe head and described second scribe head is pressed on the surface of described first substrate with the position of described sealing material subtend and the surface of described second substrate with the position of described sealing material subtend
With described first cutter relative to the mode of described second cutter to the displacement of line direction, described first cutter and described second cutter are moved along described sealing material respectively, thus form line respectively on the surface of the surface of described first substrate and described second substrate,
In the mode displacement of described first cutter and described second cutter eliminated, described first cutter and described second cutter are moved, and make the end position of the end position of the described line of described first substrate and the described line of described second substrate overlook lower consistent with each other.
7. chalker according to claim 6, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and make described first cutter relative to described second cutter displacement.
8. the chalker according to claim 6 or 7, is characterized in that:
Described control part is by making the translational speed of described first cutter identical with the translational speed of described second cutter, and described first cutter is maintained specific range relative to the displacement of described second cutter, form described line on the surface of the surface of described first substrate and described second substrate.
9. the chalker according to claim 6 or 7, is characterized in that:
Described control part by making the translational speed of described first cutter different from the translational speed of described second cutter, and makes the displacement of described first cutter and described second cutter eliminate at described end position.
10. the chalker according to claim 6 or 7, is characterized in that:
Under described first scribe head has the state be shifted along described sealing material relative to described second cutter at described first cutter, from the first pressing component of the crimping position of described second cutter of surface pressing of described first substrate,
Under described second scribe head has the state be shifted along described sealing material relative to described first cutter at described second cutter, from the second pressing component of the crimping position of described first cutter of surface pressing of described second substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2014214062A JP6384265B2 (en) | 2014-10-20 | 2014-10-20 | Scribing method and scribing apparatus |
| JP2014-214062 | 2014-10-20 |
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| JP (1) | JP6384265B2 (en) |
| KR (1) | KR102329902B1 (en) |
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| CN109553286A (en) * | 2017-09-27 | 2019-04-02 | 塔工程有限公司 | Scribing equipment |
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| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| US20060285064A1 (en) * | 2005-06-20 | 2006-12-21 | Lee Jeong J | Liquid crystal display panel cutting system and method and liquid crystal display device fabricating method using the same |
| CN102067017A (en) * | 2008-09-12 | 2011-05-18 | 夏普株式会社 | Method of manufacturing display panel |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
| CN102515493A (en) * | 2011-11-28 | 2012-06-27 | 深圳市华星光电技术有限公司 | Cutting device and cutting method of liquid crystal panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109553286A (en) * | 2017-09-27 | 2019-04-02 | 塔工程有限公司 | Scribing equipment |
| CN109553286B (en) * | 2017-09-27 | 2022-12-23 | 塔工程有限公司 | Scribing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016079076A (en) | 2016-05-16 |
| TW201615578A (en) | 2016-05-01 |
| JP6384265B2 (en) | 2018-09-05 |
| TWI672279B (en) | 2019-09-21 |
| CN105523710B (en) | 2020-07-10 |
| KR102329902B1 (en) | 2021-11-22 |
| KR20160046283A (en) | 2016-04-28 |
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