CN105523711A - Scribing method and scribing apparatus - Google Patents
Scribing method and scribing apparatus Download PDFInfo
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- CN105523711A CN105523711A CN201510582200.7A CN201510582200A CN105523711A CN 105523711 A CN105523711 A CN 105523711A CN 201510582200 A CN201510582200 A CN 201510582200A CN 105523711 A CN105523711 A CN 105523711A
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
The invention relates to a scribing method and a scribing apparatus. Even if scribed lines are formed right above and right below sealing materials, overall lengths of the scribed lines can be covered and grooves with sufficient depths can be smoothly formed in a substrate. Upper and lower line scribing wheels (301, 401) are allowed to mutually move towards the direction of the scribed lines and move along the sealing materials (SL), thereby forming scribed lines on upper and lower surfaces of a mother substrate (G). Movement of the line scribing wheels (301, 401) is adjusted in a way that the line scribing wheels (301, 401) simultaneously pass other scribed lines (LV1, LV2) roughly. After the line scribing wheels (301, 401) pass the scribed lines (LV1, LV2), the line scribing wheels (301, 401) are allowed to mutually move towards the directions of the scribed lines and move along the sealing materials, thereby forming the scribed lines on the upper and lower surfaces of the mother substrate (G).
Description
Technical field
The present invention relates to a kind of scribble method and chalker in order to form line at substrate.
Background technology
In the past, the disjunction of the brittle substrate such as glass substrate was scribe step by forming line at substrate surface, carried out with adding the cut-out step of specific power along formed line to substrate surface.In scribe step, the point of a knife of tracing wheel one side is pressed against substrate surface, and one side moves along specific line.The chalker with scribe head is used in the formation of line.
The method in order to cut out liquid crystal panel from mother substrate is recorded in following patent documentation 1.In the method, form mother substrate by being fitted across sealing material with the substrate being formed with colored filter (CF) by the substrate being formed with thin film transistor (TFT).By this mother substrate disjunction is obtained each liquid crystal panel.
Sealing material configures in the mode remaining in the space becoming Liquid crystal pour region under the state of 2 baseplate-laminatings.
When the mother substrate disjunction by described formation, use 2 scribe heads can be utilized on two surfaces of mother substrate to form the method (for example, referring to patent documentation 2) of line simultaneously.In this case, 2 scribe heads configure in the mode clamping mother substrate.2 tracing wheels are positioned at same position when overlooking mother substrate.In this condition, 2 tracing wheels move to equidirectional simultaneously and form line on each surface of mother substrate.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2006-137641 publication
[patent documentation 2] Japanese Patent Laid-Open 2012-240902 publication
Summary of the invention
[inventing problem to be solved]
Also as described in shown in patent documentation 1, mother substrate in the past exists not to be situated between adjacent Liquid crystal pour region puts the region of sealing material.Therefore, as mentioned above, when utilizing 2 scribe heads to form line on two surfaces of mother substrate simultaneously, line can be formed in the region of putting sealing material that is not situated between.So, rule and by mother substrate disjunction, then liquid crystal panel can remain the frame region of specific width around Liquid crystal pour region if formed.
But in recent years, especially in the liquid crystal panel of mobile phone, making described frame region extremely narrow becomes main flow.In order to meet this requirement, and omit not to be situated between in mother substrate and put the region of sealing material, adjacent Liquid crystal pour region must be configured to separate by means of only sealing material.In this case, line to be formed in directly over sealing material and immediately below.
But, confirm following problem by this case inventors: if so directly over sealing material and immediately below position form line, then slight crack does not enter to 2 glass substrates fully.Cut off step if performed under the state that slight crack is insufficient as so, then the ora terminalis of substrate after severance may produce trickle be full of cracks or breakage, thus the intensity of glass substrate reduces.
In view of this problem, the object of the present invention is to provide a kind of to be namely convenient to directly over sealing material and immediately below position when forming line, also successfully can form scribble method and the chalker of the slight crack of the abundant degree of depth at substrate throughout the total length of line.
[technique means of dealing with problems]
First aspect of the present invention is related to a kind of mother substrate first substrate and second substrate being fitted by sealing material and forms the scribble method of ruling.In the scribble method of this aspect, the first cutter and the second cutter is made mutually to be shifted to direction of ruling and described first cutter and described second cutter are moved along described sealing material, thus form the first line and second respectively on the surface of the surface of described first substrate and described second substrate and rule, with described first cutter and described second cutter roughly simultaneously by with described first and second rule intersect other rule on mode, adjust the movement of described first cutter and described second cutter, after by other line described, described first cutter and described second cutter is made mutually to be shifted to described line direction and described first cutter and described second cutter are moved along described sealing material respectively, thus form described first and second respectively on the surface of the surface of described first substrate and described second substrate and rule.
According to the scribble method of this aspect, directly over sealing material and immediately below position formed first and second line, the slight crack of the abundant degree of depth can be formed at mother substrate.In addition, with the first cutter and the second cutter roughly simultaneously by adjusting the movement of the first cutter and the second cutter with other modes of ruling that first and second rules orthogonal, therefore avoid applying rightabout power from the first cutter and the second cutter to the position of ruling across other.Thus, when the first cutter and the second cutter are rule by other, be full of cracks can not be produced from other line, suitably can carry out the disjunction utilizing other to rule.
Such as, in the scribble method of this aspect, by making the translational speed of the first cutter different from the translational speed of the second cutter, the first cutter and the second cutter can be made mutually to be shifted.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the first cutter and the second cutter mutually be shifted.
In addition, comparatively ideal, when line action, by making the translational speed of the first cutter identical with the translational speed of the second cutter, and the displacement between the first cutter and the second cutter is maintained specific range, form first and second on the surface of first substrate and the surface of second substrate and rule.So, the formation of the slight crack on ruling can be suppressed uneven.
In addition, in the scribble method of this aspect, by making the translational speed of the first cutter different from the translational speed of the second cutter, the first cutter and the second cutter can be made to be rule by other roughly simultaneously.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the first cutter and the second cutter be rule by other roughly simultaneously.
In addition, in the scribble method of this aspect, comparatively ideally be, one side makes the first pressing component be pressed on the position corresponding with the second cutter on the surface of first substrate, one side makes the first cutter and the first pressing component move along sealing material, and one side makes the second pressing component be pressed on the position corresponding with the first cutter on the surface of second substrate, one side makes the second cutter and the second pressing component move along sealing material.So, suppress pressing force because of the first cutter and the second cutter and mother substrate is out of shape, therefore can the degree of depth of slight crack be maintained darker, and more stably can form slight crack.
Second aspect of the present invention is related to a kind of mother substrate first substrate and second substrate being fitted by sealing material and forms the chalker of ruling.The chalker of this aspect possesses: the first scribe head, forms line on the surface of described first substrate; Second scribe head, forms line on the surface of described second substrate; Driving part, makes described first scribe head and described second scribe head and described mother substrate move abreast; And control part, control described first scribe head, described second scribe head and described driving part.Described control part makes the second cutter of the first cutter of described first scribe head and described second scribe head mutually be shifted to direction of ruling and described first cutter and described second cutter are moved along described sealing material, thus form the first line and second respectively on the surface of the surface of described first substrate and described second substrate and rule, with described first cutter and described second cutter roughly simultaneously by with described first and second rule intersect other rule on mode, adjust the movement of described first cutter and described second cutter, after by other line described, described first cutter and described second cutter is made mutually to be shifted to described line direction and described first cutter and described second cutter are moved along described sealing material respectively, thus form described first and second respectively on the surface of the surface of described first substrate and described second substrate and rule.
According to the chalker of this aspect, identical with the scribble method of described first aspect, directly over sealing material and immediately below position formed first and second line, the slight crack of the abundant degree of depth can be formed at mother substrate.In addition, with the first cutter and the second cutter roughly simultaneously by adjusting the movement of the first cutter and the second cutter with other modes of ruling that first and second rules orthogonal, therefore avoid applying rightabout power from the first cutter and the second cutter to the position of ruling across other.Thus, when the first cutter and the second cutter are rule by other, be full of cracks can not be produced from other line, suitably can carry out the disjunction utilizing other to rule.
In the chalker of this aspect, control part can be configured to by making the translational speed of the first cutter different from the translational speed of the second cutter, and the first cutter and the second cutter are shifted mutually.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the first cutter and the second cutter mutually be shifted.
In addition, control part can be configured to by making the translational speed of the first cutter identical with the translational speed of the second cutter, and the displacement between the first cutter and the second cutter is maintained specific range, forms first and second rule on the surface of first substrate and the surface of second substrate.So, the formation of the slight crack on ruling can be suppressed uneven.
In addition, control part can be configured to by making the translational speed of the first cutter different from the translational speed of the second cutter, and the first cutter and the second cutter are rule by other roughly simultaneously.So simultaneously can advance the formation of the slight crack for two substrates, one side makes the first cutter and the second cutter be rule by other roughly simultaneously.
In addition, comparatively ideally be, under first scribe head has the state be shifted along sealing material relative to the second cutter at the first cutter, the first pressing component of the crimping position of the second cutter is pressed from the surface of first substrate, in addition, comparatively ideal, the second scribe head presses the second pressing component of the crimping position of the first cutter under having the state be shifted along sealing material relative to the first cutter at the second cutter from the surface of second substrate.So, suppress pressing force because of the first cutter and the second cutter and mother substrate is out of shape, therefore can the degree of depth of slight crack be maintained darker, and more stably can form slight crack.
[effect of invention]
As previously discussed, according to the present invention, can provide a kind of to be namely convenient to directly over sealing material and immediately below position when forming line, also can form scribble method and the chalker of the slight crack of the abundant degree of depth at substrate throughout the total length of line.
Effect of the present invention or meaning clearer and more definite by the explanation of embodiment shown below.
But a during the invention process only illustrates by embodiment shown below, the present invention is not by the following any restriction of the content described in embodiment.
Accompanying drawing explanation
Fig. 1 (a), (b) are the figure of the formation of the chalker schematically showing embodiment.
Fig. 2 is the exploded perspective view of the formation of the scribe head representing embodiment.
Fig. 3 is the stereographic map of the formation of the scribe head representing embodiment.
Fig. 4 (a) ~ (c) is the figure of the scribble method that embodiment is described.
Fig. 5 (a) ~ (e) is the figure of the experimental result of the scribble method representing embodiment.
Fig. 6 (a), (b) are the figure of other scribble methods that embodiment is described.
Fig. 7 (a) ~ (e) is the figure of the experimental result of other scribble methods representing embodiment.
Fig. 8 (a), (b) are the stereographic maps of the formation of the marking tool representing embodiment.
Fig. 9 (a), (b) are the figure of the installation method of the marking tool schematically showing embodiment.
Figure 10 (a) ~ (c) be the block diagram of the formation of the chalker representing embodiment and illustrate that upper and lower tracing wheel is rule by other under the state to the displacement of line direction when the figure of problem.
Figure 11 is the schema representing that the line of embodiment controls.
Figure 12 (a), (b) are the figure of the line action representing embodiment.
Figure 13 (a), (b) are the figure of the line action representing embodiment.
Figure 14 (a), (b) are the figure of the line action representing embodiment.
Figure 15 is the sequential chart representing that the line of embodiment controls.
Figure 16 is the sequential chart representing that the line of modification 1 controls.
Figure 17 is the schema representing that the line of modification 2 controls.
Figure 18 is the schema representing that the line of modification 3 controls.
Figure 19 is the schema representing that the line of modification 4 controls.
Figure 20 is the schema representing that the line of modification 5 controls.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.In addition, in the various figures, for simplicity, remarks has mutually orthogonal X-axis, Y-axis and Z axis.X-Y plane and plane-parallel, Z-direction is vertical.
The formation > of < chalker
Fig. 1 (a), (b) are the figure of the formation schematically showing chalker 1.Fig. 1 (a) is the figure observing chalker 1 from the positive side of Y-axis, Fig. 1 (b) is the figure observing a part for chalker 1 from the positive side of X-axis.
With reference to Fig. 1 (a), chalker 1 possess conveying belt 11, pillar 12a, 12b, guiding element 13,14, sliding unit 15,16, drivingmotor 17,18, camera 19a, 19b and 2 scribe heads 2.
As shown in Fig. 1 (b), conveying belt 11, except the position of configuration scribe head 2, is arranged in the mode extended to Y direction.The handle 11a of fixing mother substrate G is provided with at conveying belt 11.On conveying belt 11, under the state of handle 11a fixing ora terminalis, load mother substrate G.Mother substrate G has base plate structure bonded to each other for a pair glass substrate.Mother substrate G, under the state by handle 11a fixing, is carried to Y direction by conveying belt 11.
Pillar 12a, 12b are vertically arranged on the pedestal of chalker 1 across conveying belt 11.Guiding element 13,14 is erected between pillar 12a, 12b in the mode parallel with X-direction respectively.Sliding unit 15,16 is arranged on guiding element 13,14 respectively sliding freely.Be respectively arranged with drivingmotor 17,18 at guiding element 13,14, by these drivingmotors 17,18, and sliding unit 15,16 driven to X-direction.
Scribe head 2 is separately installed with at sliding unit 15,16.At the scribe head 2 of the positive side of Z axis and the scribe head 2 of Z axis minus side, respectively to be provided with marking tool 30,40 with the mode of mother substrate G subtend.Under the state that the tracing wheel remaining on marking tool 30,40 is pressed against the surface of mother substrate G, scribe head 2 is moved to X-direction.Thus, line is formed on the surface of mother substrate G.
Camera 19a, 19b are configured in the top of guiding element 13, and certification mark is at the alignment mark of mother substrate G.By the photographed images from camera 19a, 19b, and detect the allocation position of mother substrate G relative to conveying belt 11.Based on this detected result, determine the line starting position of scribe head 2 or each operating position of the scribe head 2 in the line actions such as end position of ruling.
< scribe head >
Fig. 2 is the exploded partial perspective view of the formation representing scribe head 2, and Fig. 3 is the stereographic map of the formation representing scribe head 2.
With reference to Fig. 2, scribe head 2 possesses hoisting appliance 21, line formation mechanism 22, foundation plate 23, top board 24, base plate 25, rubber frame 26, outer cover 27 and servosystem 28.
Hoisting appliance 21 possesses: druum cam 21a, is attached at the drive shaft of servosystem 28; And cam follower 21c, be formed in the upper surface of lifting unit 21b.Lifting unit 21b can be supported in foundation plate 23 at above-below direction movably via slide block (not shown), and is suppressed to Z axis positive dirction by spring 21d.By suppressing of spring 21d, and cam follower 21c is pressed against the lower surface of druum cam 21a.Lifting unit 21b is attached at line formation mechanism 22.When being made druum cam 21a turn by servosystem 28, by the camming action of druum cam 21a, lifting unit 21b is elevated, with this, line formation mechanism 22 is elevated.In the lower end of line formation mechanism 22, marking tool 30,40 is installed.
Rubber frame 26 is the elastomeric element not making air pass through.Rubber frame 26 has the shape of the groove 25a being embedded in the groove 23a of foundation plate 23, the groove 24a of top board 24 and base plate 25.Under the state that rubber frame 26 is arranged on groove 23a, 24a, 25a, the surface of rubber frame 26 is to slightly protruding outside compared with the side of foundation plate 23, top board 24 and base plate 25.
Outer cover 27 has the shape of 3 plate portion bendings of front face 27a, right side face 27b and left side face 27c.2 hole 27f are formed at the ora terminalis up and down of front face 27a.
Under the state that rubber frame 26 is embedded in groove 23a, 24a, 25a, right side face 27b and the left side face 27c of outer cover 27 are out of shape in mode bending laterally, and outer cover 27 is arranged on foundation plate 23, top board 24 and base plate 25.In this condition, via 2 the hole 27f of ora terminalis being up and down formed in front face 27a, and screw is screwed in top board 24 and base plate 25.And then, screw is screwed in the screw hole in the slightly outside of groove 23a, 24a, the 25a being formed in foundation plate 23, top board 24 and base plate 25.Thus, sandwich outer cover 27 by foundation plate 23, top board 24 and base plate 25 and the head of screw, the circumference of right side face 27b and left side face 27c is pressed against rubber frame 26.So, scribe head 2 is assembled as shown in Figure 3.
As shown in Fig. 1 (a), 2 scribe heads 2 are configured in the upper and lower of mother substrate G respectively.2 scribe heads 2 are identical formation.The marking tool 30,40 being arranged on 2 scribe heads 2 changes according to scribble method.The marking tool 30,40 only keeping tracing wheel 301,401 is used in scribble method 1 in shown below 2 scribble methods.In addition, in scribble method 2, use the marking tool 30,40 keeping tracing wheel 301,401 and roller 302,402.
Below, these 2 scribble methods are described.
< scribble method 1 >
Fig. 4 (a) ~ (c) is the figure of the scribble method that present embodiment is described.Schematic diagram when Fig. 4 (a) is near Y-axis minus side observation scribing position, schematic diagram when Fig. 4 (b) is near X-axis positive side observation scribing position, schematic diagram when Fig. 4 (c) is near Z axis positive side observation scribing position.
As shown in Fig. 4 (a), in this scribble method, than the mode of tracing wheel 401 first row distance W1 to direction (X-axis positive dirction) of ruling of the scribe head 2 of downside (Z axis minus side), 2 tracing wheels 301,401 are moved with the tracing wheel 301 of the scribe head 2 of upside (the positive side of Z axis).In contrast, also can be tracing wheel 401 leading relative to tracing wheel 301.2 tracing wheels 301,401 respectively can with axle 301a, 401a for turning axle be arranged on marking tool 30,40 rotatably.
With reference to Fig. 4 (b), 2 glass substrate G1, G2 laminatings form across sealing material SL by mother substrate G.Be formed with colored filter (CF) at glass substrate G1, be formed with thin film transistor (TFT) at glass substrate G2.Form Liquid crystal pour region R by sealing material SL and 2 glass substrate G1, G2, liquid crystal is injected to this Liquid crystal pour region R.2 tracing wheels 301,401 can not be located in Y direction with offsetting from each other.The position of tracing wheel 301 directly over sealing material SL is pressed against the surface of glass substrate G1, and the position of tracing wheel 401 immediately below sealing material SL is pressed against the surface of glass substrate G2.
As shown in Fig. 4 (c), sealing material SL is configured to reticulation.2 tracing wheels 301,401 move along sealing material SL to X-axis positive dirction.Thus, as shown in Fig. 4 (b), (c), form line L1, L2 respectively on the surface of glass substrate G1, G2.
In scribble method shown in Fig. 4 (a) ~ (c), not arranging pressing with tracing wheel 301 is the roller on the surface of the mother substrate G of opposition side (Z axis minus side), in addition, also not arranging pressing with tracing wheel 401 is the roller on the surface of the mother substrate G of opposition side (the positive side of Z axis).
< tests 1 >
This case inventors carry out according to the scribble method shown in Fig. 4 (a) ~ (c) experiment forming line at mother substrate G.Below, this experiment and experimental result are described.
In experiment, use the substrate (mother substrate) that glass substrate G1, G2 of thickness being respectively 0.2mm fit across sealing material SL.Adhesive substrates (mother substrate) is of a size of 118mm × 500mm.Tracing wheel 301,401 uses Samsung Diamond Industry joint-stock company MicroPenett (registered trademark of Samsung Diamond Industry stock company).Tracing wheel 301,401 is respectively the point of a knife that forms V shape in the periphery of plectane and has the structure of groove at the crestal line of point of a knife with specific interval.The diameter of tracing wheel 301,401 is 3mm, and point of a knife angle is 110 °, and groove number is 550, and groove depth is 3 μm.
The tracing wheel 301,401 of this formation is made one to look like that to be pressed against glass substrate G1, G2 one side shown in Fig. 4 (a) ~ (c) mobile and carry out line action respectively.Be 6.5N by the spatial load forecasting given tracing wheel 301,401 when line action.In addition, the translational speed of tracing wheel 301,401 is set to fixing (200mm/sec).
Based on above condition, one side makes the distance W1 between 2 tracing wheels 301,401 change, the infiltration capacity of the slight crack of planar survey glass substrate G1, a G2.As comparative example, the infiltration capacity of slight crack when also the distance W1 measured between tracing wheel 301,401 is 0.In each mensuration, except the infiltration capacity of slight crack, also measure ripple mark (ribmark) amount in the lump.
Fig. 5 (a) ~ (e) represents experimental result.Fig. 5 (a) is the figure with the infiltration capacity of numeric representation slight crack and ripple mark amount, Fig. 5 (b) ~ (e) is the cross-section photograph of mother substrate G in line, cross-section photograph when be distance W1 being respectively 0.4mm, 0.6mm, 0.8mm, 1.0mm.In Fig. 5 (b) ~ (e), D1, D3 represent ripple mark amount, and D2, D4 represent the infiltration capacity of slight crack.
When with reference to Fig. 5 (a), if distance W1 is more than 0.6mm, then compared with when being 0mm with distance W1, the infiltration quantitative change of the slight crack of glass substrate G1 is large.If slight crack enters to any one in glass substrate G1, G2 with larger infiltration capacity, then in cut-out step, can by mother substrate G suitably disjunction.
Such as, as comparative example (W1=0mm), if about the slight crack amount of glass substrate G1, G2 is the half of thickness (0.2mm) of glass substrate G1, G2, then, in cut-out step, from the both sides of mother substrate G, glass substrate G1, G2 must be cut off respectively.If so carry out action glass substrate G1, G2 cut off respectively from the both sides of mother substrate G, then may produce trickle be full of cracks or breakage at the ora terminalis of glass substrate G1, G2, thus the intensity of glass substrate G1, G2 reduces.
In contrast, when distance W1 is 0.6mm ~ 1.4mm, although the infiltration capacity of the slight crack of glass substrate G2 is less, the infiltration capacity of the slight crack of glass substrate G1 is larger.So when the infiltration capacity of the slight crack of glass substrate G1 is larger, in cut-out step, as long as carry out glass substrate G2 less for the infiltration capacity of slight crack only from the action that the side of mother substrate G cuts off, during this cut-out action, the glass substrate G1 that slight crack enters deeper is also simultaneously broken along slight crack.If so only glass substrate G1, G2 cut off from the side of mother substrate G, then the ora terminalis of glass substrate G1, G2 can not produce trickle be full of cracks or breakage, and remains higher by the intensity of glass substrate G1, G2.
According to above reason, comparatively ideal, in the disjunction of mother substrate G, slight crack enters to any one of glass substrate G1, G2 with larger infiltration capacity.In this experiment, as shown in Fig. 5 (a), if the distance W1 between 2 tracing wheels 301,401 is more than 0.6mm, then, compared with comparative example (W1=0mm), the infiltration quantitative change of the slight crack of glass substrate G1 is large.According to this situation, can say that comparatively ideal be distance W1 between 2 tracing wheels 301,401 is more than 0.6mm.By so setting the distance W1 between 2 tracing wheels 301,401, the cut-out of mother substrate G suitably can be carried out.
< scribble method 2 >
In the scribble method (scribble method 1) shown in Fig. 4 (a) ~ (c), the surface being the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 is not pressed by roller, in addition, be that the surface of mother substrate G of opposition side (the positive side of Z axis) is not also pressed by roller with tracing wheel 401.In contrast, in this scribble method, be the surface of the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 and press by roller respectively with the surface that tracing wheel 401 is the mother substrate G of opposition side (the positive side of Z axis).In addition, be the pressing component in the face of opposition side as pressing and tracing wheel 301,401, also can use the miscellaneous part except roller.
Fig. 6 (a), (b) are the figure that scribble method 2 is described.Schematic diagram when Fig. 6 (a) is near Y-axis minus side observation scribing position, schematic diagram when Fig. 6 (b) is near X-axis positive side observation scribing position.
As shown in Fig. 6 (a), in this scribble method, the surface being the mother substrate G of opposition side (Z axis minus side) with tracing wheel 301 is pressed by 2 rollers 402, and in addition, the surface being the mother substrate G of opposition side (the positive side of Z axis) with tracing wheel 401 is also pressed by 2 rollers 302.2 rollers 302 configure in the mode clamping tracing wheel 301, and can with axle 302a for turning axle rotates.In addition, 2 rollers 402 configure in the mode clamping tracing wheel 401, and can with axle 402a for turning axle rotates.
Identical with scribble method 1,2 tracing wheels 301,401 are to line direction (X-direction) departure distance W1.When scribble method 2, the tracing wheel 401 that also can be downside is leading relative to the tracing wheel 301 of upside.2 tracing wheels 301,401 one side is pressed against glass substrate G1, G2 respectively, and one side moves along sealing material SL.Between tracing wheel 301 and 2 rollers 302, there is the gap of Y direction, between tracing wheel 401 and 2 rollers 402, also there is the gap of Y direction.Therefore, roller 302,402 is to move to X-axis positive dirction across the mode of line L1, L2 of being formed by tracing wheel 301,401.
< tests 2 >
This case inventors carry out according to the scribble method shown in Fig. 6 (a), (b) experiment forming line at mother substrate G.Below, this experiment and experimental result are described.
The mother substrate G used in this experiment and tracing wheel 301,401 identical with described experiment 1.In this experiment, the distance W1 between tracing wheel 301,401 is set as 2.2mm.In addition, the translational speed of tracing wheel 301,401 is set to fixing (200mm/sec).Tracing wheel 301 is 1.0mm relative to the offset of the load center of the scribe head 2 of upside, and tracing wheel 401 is 3.2mm relative to the offset of the load center of the scribe head 2 of downside.
The central position of axle 301a, 401a of tracing wheel 301,401 is consistent in the Z-axis direction with the central position of axle 302a, 402a of roller 302,402 respectively, and the diameter of roller 302,402 is 3mm with the diameter same settings of tracing wheel 301,401 respectively.
Based on above condition, one side makes the load variations of giving marking tool 30,40, the infiltration capacity of the slight crack of planar survey glass substrate G1, a G2.
Fig. 7 (a) ~ (e) represents experimental result.The cross-section photograph that the cross-section photograph of the mother substrate G in Fig. 7 (a) to be the figure with the infiltration capacity of numeric representation slight crack and ripple mark amount, Fig. 7 (b) ~ (e) be line is load respectively when being 6N, 7N, 8N, 9N.In Fig. 5 (b) ~ (e), D1, D3 represent ripple mark amount, and D2, D4 represent the infiltration capacity of slight crack.
When with reference to Fig. 7 (a), if known load is changed to 6N from 5N, then the infiltration capacity of the slight crack of glass substrate G1 sharply increases.In addition, if load is more than 6N, then the infiltration capacity of the slight crack of glass substrate G1 exceedes 80% of the thickness (0.2mm) of glass substrate G1, and slight crack enters to glass substrate G1 with larger infiltration capacity.As mentioned above, if slight crack enters to any one in glass substrate G1, G2 with larger infiltration capacity, then in cut-out step, can by mother substrate G suitably disjunction.Therefore, can say that comparatively ideal is in scribble method 2, be more than 6N by the load setting given marking tool 30,40.
In addition, in this experiment, compared with described experiment 1, larger to the infiltration capacity of the slight crack of glass substrate G1.In addition, in this experiment, the downside of tracing wheel 301 is supported by roller 402, and in addition, the upside of tracing wheel 401 is supported by roller 302, therefore suppresses because of the pressing force of the cutter of tracing wheel 301,401 that mother substrate G is out of shape.Therefore, can say comparatively ideal, in order to make the infiltration capacity of slight crack more greatly and stably form slight crack, and as scribble method 2, what utilize roller 402,302 to press mother substrate G is the face of opposition side with tracing wheel 301,401.
< marking tool >
Fig. 8 (a), (b) are the stereographic maps of the configuration example representing the marking tool 30,40 used in described scribble method 2 respectively.
Marking tool 30,40 possesses identical formation except the putting in order of tracing wheel 301,401 and roller 302,402.Marking tool 30,40 possesses the retainer 303,403 keeping tracing wheel 301,401 and roller 302,402 respectively.Retainer 303,403 possesses for the groove 303a, the 403a that install tracing wheel 301,401, for groove 303b, 403b and scarp 303c, 403c of installing roller 302,402.Tracing wheel 301,401 is installed by axle 301a, 401a are embedded in the hole of retainer 303,403.Roller 302,402 is installed by axle 302a, 402a are embedded in the hole of retainer 303,403.
Fig. 9 (a), (b) schematically show figure line formation mechanism 22 being installed to the method for marking tool 30.In Fig. 9 (a), (b), represent the state of the inside of perspective line formation mechanism 22.
In the lower end of line formation mechanism 22, be provided with the maintaining part 221 keeping marking tool 30, be formed with the hole 222 can inserting marking tool 30 in this maintaining part 221.The end in hole 222, is provided with magnet 224, the mid-way in hole 222 is provided with pin 223.The retainer 303 of marking tool 30 comprises ferromagnetic.In addition, maintaining part 221 by not shown bearing can in the horizontal direction 360 degree be supported in rotatably line formation mechanism 22.
When marking tool 30 being arranged on line formation mechanism 22, the retainer 303 of marking tool 30 is inserted into the hole 222 of maintaining part 221.If the upper end of retainer 303 is close to magnet 224, retainer 303 is adsorbed in magnet 224.Now, the scarp 303c of retainer 303 is connected to pin 223, and retainer 303 is positioned at its normal orientation.So, as shown in Fig. 9 (b), marking tool 30 is arranged on the lower end of line formation mechanism 22.
Marking tool 40 is arranged on the lower end of line formation mechanism 22 too.So, if marking tool 30,40 is arranged on the line formation mechanism 22 of corresponding scribe head 2 respectively, then as shown in Fig. 6 (a), (b), roller 402 is positioned at the position corresponding with tracing wheel 301, and roller 302 is positioned at the position corresponding with tracing wheel 401.If use the marking tool 30,40 of Fig. 8 (a), the formation shown in (b), then by means of only the line formation mechanism 22 marking tool 30,40 being arranged on respectively corresponding scribe head 2, tracing wheel 301 and the distance W1 of tracing wheel 401 specific distance be can be remained, and tracing wheel 301,401 and the mutual subtend of roller 402,302 made.
In addition, described experiment 2 uses the marking tool 30,40 of the formation shown in Fig. 8 (a), (b) and carries out.In addition, described experiment 1 uses omits groove 303b, 403b from retainer 303,403, and only installs the marking tool 30,40 of tracing wheel 301,401 respectively at the retainer 303,403 only with groove 303a, 403a and carry out.
< line control >
Secondly, control to be described to the line of chalker 1.
Figure 10 (a) is the block diagram of the formation representing chalker 1.
Chalker 1 possesses control part 101, test section 102, driving part 103, input part 104 and display part 105.
Control part 101 possesses CPU (CentralProcessingUnit, central processing unit) etc. treater and ROM (ReadOnlyMemory, read-only storage), RAM (RandomAccessMemory, random access memory) etc. storer, and control each portion according to the sequence of control being stored in storer.In addition, storer is also used as work area when controlling each portion.Test section 102, except comprising camera 19a, the 19b shown in Fig. 1 (a), also comprises various sensor.Driving part 103 comprises mechanism part and the drivingmotor 17,18 of the chalker 1 shown in Fig. 1 (a).Input part 104 possesses mouse and keyboard.Input part 104 is for the input of the various parameter values in the line action such as interval of the starting position of ruling and end position or line.Display part 105 comprises monitor, and when being inputted by input part 104, display specifically inputs picture.
Figure 10 (b), (c) illustrate upper and lower tracing wheel 301,401 figure by problem when other line LV1, LV2 under the state to the displacement of line direction.Figure 10 (b) is the figure that the figure of a part of observing mother substrate G from side, Figure 10 (c) will amplify near other line LV1, LV2.
Other line LV1, LV2 shown in Figure 10 (b), (c) are formed in the following way: in the formation of Fig. 1 (a), (b), under the state of mother substrate G by handle 11a fixing, conveying belt 11 is utilized to move to Y direction.Now, the mode that upper and lower tracing wheel 301,401 walks abreast with crestal line and Y direction, from the state 90-degree rotation in the horizontal direction shown in Fig. 4 (a) or Fig. 6 (a).As mentioned above, Fig. 9 maintaining part 221 by not shown bearing can in the horizontal direction 360 degree support rotatably.Therefore, when under the state that upper and lower tracing wheel 301,401 is pressed against the upper and lower surface of mother substrate G, when mother substrate G is moved to Y direction by conveying belt 11, maintaining part 221 rotates, and is located by tracing wheel 301,401 in the mode that crestal line is parallel with Y direction.
Now, upper and lower tracing wheel 301,401 is in Y direction and is mutually shifted the state of specific range.In addition, upper and lower tracing wheel 301,401 to be positioned at respectively directly over the sealing material SL shown in Fig. 4 (c) and immediately below position.So, by under the state that upper and lower tracing wheel 301,401 is pressed against the upper and lower surface of mother substrate G, mother substrate G is moved to Y direction by conveying belt 11, and forms line LV1, the LV2 parallel with Y direction in the upper and lower surface of mother substrate G.Line LV1, LV2 are formed with the quantity of the sealing material SL along X-direction arrangement.
So, after formation line LV1, LV2, scribe head 2 is moved to X-direction, forms line L1, the L2 parallel with X-direction.Therefore, in the formation action of line L1, L2, upper and lower tracing wheel 301,401 can by line LV1, the LV2 with line L1, L2 square crossing.
As described in experiment 1,2 verify as, comparatively ideal, when forming line on two surfaces of mother substrate G, make the tracing wheel 301 of upside offset specific range with the tracing wheel 401 of downside to direction of ruling simultaneously.But, if when also this scribble method being applied to tracing wheel 301,401 upper and lower as Suo Shi Figure 10 (b) by line LV1, LV2, then as shown in Figure 10 (c), rightabout power F1, F2 can be applied from tracing wheel 301,401 to the position across line LV1, LV2.Thus, when tracing wheel 301,401 is by line LV1, LV2, the problem that be full of cracks C1, C2 enter from line LV2, LV2 is produced.
This problem not only can when as described in do not configure roller 302,402 as scribble method 1 produce, and also can to produce equally when such as scribble method 2 general configuration roller 302,402.Namely, when such as arranging roller 302,402 as scribble method 2, also utilize the position adjustment relative to the tracing wheel 301,401 of load center or the adjustment of the tracing wheel 301,401 of above-below direction (Z-direction) and the relative position of roller 302,402, and tracing wheel 301,401 is pressed against securely the surface of mother substrate G.Now, roller 302,402 only suppresses bending of mother substrate G from the opposition side of tracing wheel 301,401, can not be pressed against the surface of mother substrate G securely.Therefore, when such as arranging roller 302,402 as scribble method 2, also as shown in Figure 10 (c), from tracing wheel 301,401, rightabout power F1, F2 are applied to the position across line LV1, LV2, when tracing wheel 301,401 is by line LV1, LV2, produce the problem that be full of cracks C1, C2 enter from line LV2, LV2.
Therefore, in the present embodiment, upper and lower tracing wheel 301,401 is carried out roughly simultaneously by the control of other line LV1, LV2.In addition, herein, in the scope passed through except position except other line LV1, LV2, control to the mode that line direction is leading with the tracing wheel 301 of the tracing wheel 401 of downside relative to upside.
Figure 11 is the schema representing that line controls.In addition, it is do not make the conveying belt 11 of Fig. 1 (a) move that the line shown in Figure 11 controls, and marking tool 30,40 is moved, and forms control during line on two surfaces of mother substrate G.Before performing the control of the line shown in Figure 11, as mentioned above, do not make marking tool 30,40 move, and make conveying belt 11 move the controls forming line LV1, LV2 on two surfaces of mother substrate G.
It is undertaken by the control part 101 of Figure 10 (a) that line shown in Figure 11 controls.Figure 12 (a) ~ Figure 14 (b) is the figure of the position of the marking tool 30,40 schematically showing specific Control timing sequence.Herein, Fig. 8 (a), the marking tool 30,40 shown in (b) is used.Also can replace this, use roller 302,402 elliptical marking tool 30,40.
With reference to Figure 11, control part 101 processes the photographed images of camera 19a, 19b, detects the position (S11) of mother substrate G.Based on this detected result, control part 101 sets starting position relative to the upper and lower scribe head 2 (marking tool 30,40) of each line and the switching sequence (S12) to control relative to the feeding of each scribe head 2.In addition, in the formation action of line LV1, LV2 that control part 101 formerly carries out, the position of line LV1, LV2 is prestored.Control part 101, based on the position of line LV1, LV2, sets the switching sequence controlled relative to the feeding of each scribe head 2.
Secondly, control part 101 makes upper and lower scribe head 2 move to the starting position (S13) of line L1, the L2 forming object.Figure 12 (a) is the figure of the state of the marking tool 30,40 represented now.In this condition, in X-direction, the position consistency of tracing wheel 301 and roller 402, in addition, the position consistency of tracing wheel 401 and roller 302.
In this condition, control part 101 drives the servosystem 28 of upper and lower scribe head 2, makes marking tool 30,40 be crimped on upper surface and the lower surface (S14) of mother substrate G respectively with specific load.Figure 12 (b) is the figure of the state of the marking tool 30,40 represented now.In this condition, under the state be mutually shifted in X-direction in the position of tracing wheel 301,401, tracing wheel 301,401 be crimped on mother substrate G upper surface respectively with the position of sealing material SL subtend and mother substrate G lower surface with the position of sealing material SL subtend.
Under the state on two surfaces so making marking tool 30,40 be crimped on mother substrate G, control part 101 drives drivingmotor 17,18, and upper and lower scribe head 2 is moved (S15) with identical speed Vn respectively.Therefore, under the state at interval keeping tracing wheel 301,401, the line action on two surfaces to mother substrate G is carried out.
Then, control part 101 is waited for by front sequential Tb arrival (S16).So-called by front sequential Tb, refer to that the tracing wheel 401 of leading downside arrives the sequential of the position Pp only position Pb nearby of specific range of to rule apart from other next arrival LV1, LV2.When by front sequential Tb arrival (S16: yes), control part 101 makes the translational speed of the scribe head 2 of downside be reduced to speed Vs (S17) from speed Vn.Thus, the tracing wheel 301 of upside is slowly close to the tracing wheel 401 of downside.Figure 13 (a) is the figure of the state of the marking tool 30,40 represented now.
Then, control part 101 is waited for by sequential Tp arrival (S18).So-called by sequential Tp, refer to that the tracing wheel 401 of leading downside arrives the sequential of the position Pp of other line LV1, LV2 of next arriving.When by sequential Tp arrival (S18: yes), control part 101 makes the translational speed of the scribe head 2 of downside be increased to speed Vf (S19) from speed Vs.
Figure 13 (b) is the figure of the state of the marking tool 30,40 represented now.As shown in Figure 13 (b), passing through sequential Tp, the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside, and upper and lower tracing wheel 301,401 is roughly simultaneously by other line LV1, LV2.So, passing through sequential Tp, the mode catching up with the tracing wheel 401 of downside with the tracing wheel 301 of upside adjusts the speed Vs of the S17 of Figure 11.
So, when upper and lower tracing wheel 301,401 is by other line LV1, LV2, in S19, the translational speed of the scribe head 2 of downside is increased to speed Vf from speed Vs.Herein, speed Vf sets specific rate Vn is high.Therefore, after by other line LV1, LV2, the tracing wheel 401 of downside is slowly leading relative to the tracing wheel 301 of upside.Figure 14 (a) is the figure of the state of the marking tool 30,40 represented now.
Then, control part 101 is waited for by rear sequential Ta arrival (S20).So-called by rear sequential Ta, refer to that the tracing wheel 401 of leading downside arrives the sequential of position Pa of the specific range that only to advance from other the position Pp ruling LV1, LV2 just passed through.When by rear sequential Ta arrival (S20: yes), control part 101 makes the translational speed of the scribe head 2 of downside be reduced to speed Vn (S21) from speed Vf.Thus, the translational speed of upper and lower tracing wheel 301,401 is identical.
Figure 14 (b) is the figure of the state of the marking tool 30,40 represented now.As shown in Figure 14 (b), by rear sequential Ta, the tracing wheel 301 of upside and roller 402 subtend of downside, the tracing wheel 401 of downside and roller 302 subtend of upside.So, be desired interval by the distance maintaining of upper and lower tracing wheel 301,401.So, by rear sequential Ta, the mode becoming desired interval with the interval of the tracing wheel 401 of the tracing wheel 301 of upside and downside adjusts the speed Vf of the S19 of Figure 11.
Then, control part 101 judges whether terminate (S22) the line action of this line.That is, control part 101 judges that whether scribing position is close to the end position of ruling, and other line LV1, LV2 can not and then arrive.In the unclosed situation of line action (S22: no), control part 101 makes process be back to S16 and continue line action.When ruling release (S22: no), till control part 101 makes line action proceed to the end position of this line, drive the servosystem 28 of upper and lower scribe head 2 and marking tool 30,40 is left (S23) from the upper surface of mother substrate G and lower surface respectively.
Then, control part 101 judges whether terminate to utilize to all line preset the process (S24) making upper and lower scribe head 2 movement.To (S24: no) in the unclosed situation of the process of all line, control part 101 makes process be back to S13, performs the process to next line.So, when terminating (S24: yes) to the process of all line, control part 101 end treatment.
Figure 15 is the sequential chart representing that line controls.At the hypomere of Figure 15, represent the actuate signal of the actuate signal relative to the scribe head 2 of upside and the scribe head 2 relative to downside.These actuate signals are applied to the drivingmotor 17,18 shown in Fig. 1 (a) respectively.In addition, at the epimere of Figure 15, the position on the mother substrate G in expression line direction and the relative position of tracing wheel 301,401.
Position Pp is the position being formed with line LV1, LV2 as mentioned above, position Pa, Pb be respectively from position Pp only advance specific range position and only apart from the position nearby of specific range.In addition, as mentioned above, by sequential Tp, be the sequential corresponding with position Pp, Pa, Pb respectively by rear sequential Ta and by front sequential Tb.
Upside scribe head 2 actuate signal throughout line action whole period and be maintained level Dn.The actuate signal of the scribe head 2 of downside from by front sequential Pb to by being set as level Ds sequential Pp, from by sequential Pp to by being set as level Df rear sequential Pa, be set as level Dn during other.Therefore, in scope Rc, the translational speed of upper and lower tracing wheel 301,401 is Vn, and the distance maintaining of tracing wheel 301,401 is specific interval.In addition, in scope Rb, the translational speed of upper and lower tracing wheel 301,401 is respectively Vn, Vs (Vn > Vs), and the interval of tracing wheel 301,401 slowly reduces.And then in scope Ra, the translational speed of upper and lower tracing wheel 301,401 is respectively Vn, Vf (Vn < Vf), and the interval of tracing wheel 301,401 slowly expands.
By this control, passing through sequential Pp, the position consistency of upper and lower tracing wheel 301,401, upper and lower tracing wheel 301,401 is roughly simultaneously by other line LV1, LV2.When other line LV1, LV2 arrive, similarly repeat this control.Therefore, at every other line LV1, LV2 by sequential Pp, the position consistency of upper and lower tracing wheel 301,401.In addition, in scope Rc, be that specific range performs line action by the distance maintaining of upper and lower tracing wheel 301,401.Therefore, accounting in the most scope Rc in line, as described in shown in experiment 1,2, form the slight crack of the good degree of depth.
The effect > of < embodiment
According to the present embodiment, following effect is played.
As tested shown in 1,2, line can be formed with darker slight crack in the position directly over sealing material SL.Especially, as scribble method 2, by the opposition side utilizing roller 302,402 to press tracing wheel 301,401, can make the infiltration capacity of slight crack more greatly and stably form slight crack.
In addition, adjusted the movement of tracing wheel 301,401 with tracing wheel 301,401 roughly simultaneously by other modes of ruling LV1, LV2 orthogonal with line L1, L2, therefore avoid applying rightabout power F1, F2 from tracing wheel 301,401 to the position across other line LV1, LV2.Thus, when tracing wheel 301,401 is by other line LV1, LV2, be full of cracks can not be produced from other rule LV1, LV2, suitably can carry out the disjunction of other line LV1, LV2.
In addition, in the scope Ra of Figure 15, by making the translational speed of tracing wheel 401 faster than the translational speed of tracing wheel 301, and make tracing wheel 401 leading relative to tracing wheel 301.Therefore, can mother substrate G two surface formed slight cracks, and between tracing wheel 401 and tracing wheel 301 the empty standard width of a room in an old-style house every.
In addition, in the scope Rc of Figure 15, by making the translational speed of tracing wheel 301 identical with the translational speed of tracing wheel 401, and the interval of tracing wheel 401 and tracing wheel 301 is maintained specific range.Therefore, slight crack can be formed at mother substrate G well without inequality.
In addition, in the scope Rc of Figure 15, by making the translational speed of tracing wheel 401 slower than the translational speed of tracing wheel 301, and be formed with the position Pp of other line LV1, LV2, tracing wheel 301 catch up with tracing wheel 401.Therefore, slight crack can be formed on two surfaces of mother substrate G, and make tracing wheel 301,401 roughly simultaneously by other line LV1, LV2.
Above, be illustrated embodiments of the present invention, but the present invention is not by any restriction of described embodiment, in addition, embodiments of the present invention also can carry out various change except described.
< modification 1 >
Such as, the method that tracing wheel 301 is shifted relative to tracing wheel 401 is not limited to the method shown in described embodiment, also can be set to additive method.
Figure 16 is the sequential chart representing that the line of modification 1 controls.The sequential chart of Figure 16 is corresponding with the sequential chart of Figure 15.
In described embodiment, at position Pp, the mode catching up with the tracing wheel 401 of downside with the tracing wheel 301 of upside controls, in modification 1, then with at the position Pb1 nearby apart from position Pp only specific range, the mode that the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside controls.
That is, in modification 1, at the sequential Tb2 corresponding with position Pb2, the actuate signal of the scribe head 2 of downside is set as level Ds, the translational speed of the tracing wheel 401 of downside is slowed down as speed Vs.Thus, in scope Rb2, the interval of upper and lower tracing wheel 301,401 slowly reduces, and at position Pb1, the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside.
In addition, at the sequential Tb1 corresponding with position Pb1, the actuate signal of the scribe head 2 of downside is back to level Dn, the translational speed of the tracing wheel 401 of downside is increased to speed Vn.Thus, in scope Rb1 and scope Ra1, upper and lower tracing wheel 301,401 is without moving to line direction with speed Vn in succession.Therefore, upper and lower tracing wheel 301,401 is roughly simultaneously by other line LV1, LV2.
And then, at the sequential Ta1 corresponding with position Pa1, the actuate signal of the scribe head 2 of downside is increased to level Df, and the translational speed of the tracing wheel 401 of downside is increased to speed Vf.Thus, in scope Ra2, the interval of upper and lower tracing wheel 301,401 slowly expands, at position Pa2, and the tracing wheel 401 only leading specific range of downside relative to the tracing wheel 301 of upside.At position Pa2, upper and lower tracing wheel 301,401 is located as Figure 14 (b).
Then, at the sequential Ta2 corresponding with position Pa2, the actuate signal of the scribe head 2 of downside is back to level Dn, and the translational speed of the tracing wheel 401 of downside is slowed down as speed Vn.Thus, in scope Rc, the distance maintaining of upper and lower tracing wheel 301,401 is specific range, and upper and lower tracing wheel 301,401 moves.When other line LV1, LV2 arrive, repeat above control.
According to modification 1, at scope Rb1, the Ra1 of the front and back across position Pp, the position consistency of upper and lower tracing wheel 301,401.Therefore, compared with described embodiment, easily make upper and lower tracing wheel 301,401 more effectively roughly simultaneously by other line LV1, LV2.In addition, in scope Rb1, Ra1, upper and lower tracing wheel 301,401 can not carry out line action in front and back displacement, therefore as described in shown in experiment 1,2, the depth shallower of slight crack.If consider this aspect, then can say that comparatively ideal is set as far as possible narrow by scope Rb1, Ra1.
< modification 2 >
In described embodiment and modification 1, only change the translational speed of the scribe head 2 of downside, but also only can change the translational speed of the scribe head 2 of upside, in addition, also the translational speed of upper and lower scribe head 2 all can be changed.
Figure 17 is the sequential chart representing that the line of modification 2 controls.In modification 2, in the scope Rb2 of described modification 1, replace the scribe head 2 of downside to slow down, and improve the translational speed of the scribe head 2 of upside.Specifically, in scope Rb2, the actuate signal of the scribe head 2 of upside is set as level Df.Thus, the translational speed of the scribe head 2 of upside is increased to speed Vf, and at position Pb1, the tracing wheel 301 of upside catch up with the tracing wheel 401 of downside.According to modification 2, also the effect identical with modification 1 can be played.
In addition, when only changing the translational speed of scribe head 2 of upside, in the sequential chart of Figure 17, the actuate signal of the scribe head 2 of the upside of scope Ra2 being set as level Df, the actuate signal of the scribe head 2 of the downside of scope Ra2 is set as level Dn.Similarly, in the sequential chart of Figure 15, also only can change the control of the translational speed of the scribe head 2 of upside, in addition, also can carry out the control of the translational speed of upper and lower scribe head 2 all being changed.
< modification 3 >
Figure 18 is the sequential chart representing that the line of modification 3 controls.In modification 3, from during the sequential Ta1 corresponding with position Pa1 is to the sequential Tc corresponding with position Pc, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside is set as Dn, Df respectively, from during the sequential Tc corresponding with position Pc is to the sequential Tb1 corresponding with position Pb1, the actuate signal of the actuate signal of the scribe head 2 of upside and the scribe head 2 of downside is set as Df, Dn respectively.Herein, position Pc is the mid-way between position Pa1 and position Pb1.
So in scope Rc1, the tracing wheel 401 of downside is slowly leading relative to the tracing wheel 301 of upside, and in scope Rc2, the tracing wheel 301 of upside slowly catch up with relative to the tracing wheel 401 of downside.At position Pb1, the position of upper and lower tracing wheel 301,401 is consistent in line direction, and then, upper and lower tracing wheel 301,401 moves to line direction with identical translational speed Vn.Therefore, in modification 3, upper and lower tracing wheel 301,401 is also roughly simultaneously by other line LV1, LV2.According to modification 3, the effect identical with described embodiment and modification 1 ~ 3 also can be played.
In addition, in described embodiment and modification 1 ~ 3, when between upper and lower tracing wheel 301,401 the empty standard width of a room in an old-style house every, all the time make the tracing wheel 401 of downside leading, but also can replace this, and make the tracing wheel 301 of upside leading all the time, or, also can switch leading tracing wheel in specific sequential.Such as, also whenever by other line LV1, LV2, leading tracing wheel can be switched.
< modification 4 >
In described embodiment and modification 1 ~ 3, the load of upper surface and lower surface that upper and lower tracing wheel 301,401 is crimped on mother substrate G is set in the total length of line constant.But, also can be crimped on the mode that the upper surface of mother substrate G and the load of lower surface change according to the position of line with upper and lower tracing wheel 301,401 and control.
Figure 19 is the sequential chart representing that the line of modification 4 controls.In the sequential chart of Figure 19, add the sequential chart to the load that upper and lower marking tool 30,40 is given at the hypomere of the sequential chart of Figure 15.As shown in figure 19, in modification 4, near the Pp of position, that is, upper and lower tracing wheel 301,401 be spaced apart in 0 or quite narrow scope, the load given upper and lower marking tool 30,40 is weakened to NL from N0.
By so adjusting the crimping load of marking tool 30,40, and avoid near the Pp of position, excessive load is applied to mother substrate G.Near the Pp of position, the position of tracing wheel 301,401 is roughly consistent, and therefore mother substrate G is directly clamped by tracing wheel 301,401.Therefore, compared with when being mutually shifted to direction of ruling with tracing wheel 301,401, mother substrate G is subject to larger power from tracing wheel 301,401.By the control of Figure 19, near the Pp of position, weaken load, thus, avoid mother substrate G to be subject to excessive power from tracing wheel 301,401.Therefore, near the Pp of position, the slight crack of the suitable degree of depth can be formed to mother substrate G without breakage.
In addition, to form the crimping load N0 of the mode setting range Rc of the slight crack of the desired degree of depth when the interval of tracing wheel 301,401 is in specific distance.
< modification 5 >
Figure 20 is the sequential chart representing that the line of modification 5 controls.Modification 5 is the adjustment control control of modification 2 being added to crimping load.In the sequential chart of Figure 20, at the hypomere of the sequential chart of Figure 17, add the sequential chart had the load that upper and lower marking tool 30,40 is given.
As shown in figure 20, in modification 5, in the scope Rb1 and scope Ra1 of position Pp, the load given upper and lower marking tool 30,40 is weakened to NL from N0.According to modification 5, also the effect identical with modification 4 can be obtained.In addition, comparatively ideal, in modification 1,3, similarly, regulate the load that upper and lower marking tool 30,40 is given.
Other modification > of <
In said embodiment, the crestal line being used in point of a knife is formed with the tracing wheel of groove with fixed intervals, even if but can imagine to use and do not form the tracing wheel of groove at crestal line and also do not obtain identical effect.The size of tracing wheel (point of a knife) or shape are not limited to the situation described in described embodiment, suitably can use the point of a knife of other sizes or shape, kind.
In addition, in said embodiment, as shown in Figure 12 (a), in the starting position of line, the interval of tracing wheel 301,401 is set as desired interval, but the interval of tracing wheel 301,401 is set as that the method at desired interval is not limited thereto, also can from line starting position make line action only advance specific range time, the interval of carrying out tracing wheel 301,401 becomes the control at desired interval.
In addition, in the formation of Fig. 6 (a), (b) and Fig. 8 (a), (b), the central position of axle 301a, 401a of tracing wheel 301,401 is consistent in Z-direction with the central position of axle 302a, 402a of roller 302,402 respectively, and the diameter of tracing wheel 301,401 is identical with the diameter of roller 302,402 respectively.But the relation of tracing wheel 301,401 and roller 302,402 is not limited thereto, other various changes can be carried out.
In addition, in the formation of Fig. 6 (a), (b) and Fig. 8 (a), (b), be configured with pair of rolls 302,402 in the both sides of tracing wheel 301,401, but also can imagine the formation only configuring a roller 302,402 in the side of tracing wheel 301,401.
In addition, the formation, thickness, material etc. of mother substrate G are not limited to shown in described embodiment, and the cut-out of other mother substrate G formed also can use described scribble method 1,2 and chalker.
Embodiments of the present invention suitably can carry out various change in the scope of the technical thought shown in claims.
[explanation of symbol]
1 chalker
2 scribe heads
30,40 marking tools
101 control parts
301,401 tracing wheels
302,402 rollers
G mother substrate
G1, G2 glass substrate
L1, L2 rule
Other line of LV1, LV2
Claims (10)
1. a scribble method, is characterized in that: rule first substrate and second substrate being formed by the mother substrate that sealing material is fitted, and
Make the first cutter and the second cutter mutually be shifted to direction of ruling and described first cutter and described second cutter are moved along described sealing material, thus form the first line and second respectively on the surface of the surface of described first substrate and described second substrate and rule,
With described first cutter and described second cutter roughly simultaneously by with described first and second rule intersect other rule on mode, adjust the movement of described first cutter and described second cutter,
After by other line described, make described first cutter and described second cutter mutually be shifted to described line direction and described first cutter and described second cutter are moved along described sealing material respectively, thus form described first and second respectively on the surface of the surface of described first substrate and described second substrate and rule.
2. scribble method according to claim 1, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and described first cutter and described second cutter are shifted mutually.
3. scribble method according to claim 1 and 2, is characterized in that:
By making the translational speed of described first cutter identical with the translational speed of described second cutter, and the displacement between described first cutter and described second cutter is maintained specific range, form described first and second on the surface of the surface of described first substrate and described second substrate and rule.
4. scribble method according to claim 1 and 2, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and described first cutter and described second cutter are rule roughly simultaneously by described other.
5. scribble method according to claim 1 and 2, is characterized in that:
One side makes the first pressing component be pressed on the position corresponding with described second cutter on the surface of described first substrate, and one side makes described first cutter and described first pressing component move along described sealing material, and
One side makes the second pressing component be pressed on the position corresponding with described first cutter on the surface of described second substrate, and one side makes described second cutter and described second pressing component move along described sealing material.
6. a chalker, is characterized in that: it is rule first substrate and second substrate being formed by the mother substrate that sealing material is fitted, and possess:
First scribe head, forms line on the surface of described first substrate;
Second scribe head, forms line on the surface of described second substrate;
Driving part, makes described first scribe head and described second scribe head and described mother substrate move abreast; And
Control part, controls described first scribe head, described second scribe head and described driving part;
Described control part:
The second cutter of the first cutter of described first scribe head and described second scribe head is made mutually to be shifted to direction of ruling and described first cutter and described second cutter are moved along described sealing material, thus form the first line and second respectively on the surface of the surface of described first substrate and described second substrate and rule
With described first cutter and described second cutter roughly simultaneously by with described first and second rule intersect other rule on mode, adjust the movement of described first cutter and described second cutter,
After by other line described, make described first cutter and described second cutter mutually be shifted to described line direction and described first cutter and described second cutter are moved along described sealing material respectively, thus form described first and second respectively on the surface of the surface of described first substrate and described second substrate and rule.
7. chalker according to claim 6, is characterized in that:
By making the translational speed of described first cutter different from the translational speed of described second cutter, and described first cutter and described second cutter are shifted mutually.
8. the chalker according to claim 6 or 7, is characterized in that:
Described control part is by making the translational speed of described first cutter identical with the translational speed of described second cutter, and the displacement between described first cutter and described second cutter is maintained specific range, form described first and second on the surface of the surface of described first substrate and described second substrate and rule.
9. the chalker according to claim 6 or 7, is characterized in that:
Described control part by making the translational speed of described first cutter different from the translational speed of described second cutter, and makes described first cutter and described second cutter be rule by described other roughly simultaneously.
10. the chalker according to claim 6 or 7, is characterized in that:
Under described first scribe head has the state be shifted along described sealing material relative to described second cutter at described first cutter, from the first pressing component of the crimping position of described second cutter of surface pressing of described first substrate,
Under described second scribe head has the state be shifted along described sealing material relative to described first cutter at described second cutter, from the second pressing component of the crimping position of described first cutter of surface pressing of described second substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014214061A JP6384264B2 (en) | 2014-10-20 | 2014-10-20 | Scribing method and scribing apparatus |
| JP2014-214061 | 2014-10-20 |
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| Publication Number | Publication Date |
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| CN105523711A true CN105523711A (en) | 2016-04-27 |
| CN105523711B CN105523711B (en) | 2020-07-07 |
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| CN201510582200.7A Expired - Fee Related CN105523711B (en) | 2014-10-20 | 2015-09-14 | Scribing method and scribing device |
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| JP (1) | JP6384264B2 (en) |
| KR (1) | KR102365099B1 (en) |
| CN (1) | CN105523711B (en) |
| TW (1) | TWI660921B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109553286A (en) * | 2017-09-27 | 2019-04-02 | 塔工程有限公司 | Scribing equipment |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6967275B2 (en) * | 2017-12-26 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | Scribe method and scribe device |
| TWI774883B (en) * | 2017-12-26 | 2022-08-21 | 日商三星鑽石工業股份有限公司 | Scribing method and scribing device for bonding substrates |
| KR102457343B1 (en) * | 2020-12-14 | 2022-10-21 | 한국미쯔보시다이아몬드공업(주) | Scribing method for bonded brittle substrate with terminal |
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| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| US20060285064A1 (en) * | 2005-06-20 | 2006-12-21 | Lee Jeong J | Liquid crystal display panel cutting system and method and liquid crystal display device fabricating method using the same |
| CN102515493A (en) * | 2011-11-28 | 2012-06-27 | 深圳市华星光电技术有限公司 | Cutting device and cutting method of liquid crystal panel |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
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| JP2003114420A (en) * | 2001-10-03 | 2003-04-18 | Matsushita Electric Ind Co Ltd | Method for manufacturing liquid crystal display panel |
| KR100817129B1 (en) * | 2002-02-07 | 2008-03-27 | 엘지.필립스 엘시디 주식회사 | Cutter of liquid crystal panel and cutting method thereof |
| JP2003255362A (en) * | 2002-03-05 | 2003-09-10 | Citizen Watch Co Ltd | Cell and its production method and liquid crystal optical element using the cell |
| JP2003313036A (en) * | 2002-04-17 | 2003-11-06 | Sharp Corp | Method for dividing glass and apparatus for the same |
| JP2006137641A (en) | 2004-11-12 | 2006-06-01 | Sanyo Electric Co Ltd | Cutting method of glass substrate |
| JP2010052995A (en) * | 2008-08-29 | 2010-03-11 | Mitsuboshi Diamond Industrial Co Ltd | Method for scribing mother substrate |
| KR100978858B1 (en) * | 2008-09-01 | 2010-08-31 | 세메스 주식회사 | Apparatus for and method of scribing panel |
| WO2010029660A1 (en) * | 2008-09-12 | 2010-03-18 | シャープ株式会社 | Method of manufacturing display panel |
| JP5767595B2 (en) * | 2012-02-23 | 2015-08-19 | 三星ダイヤモンド工業株式会社 | Scribing device for brittle material substrate |
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2014
- 2014-10-20 JP JP2014214061A patent/JP6384264B2/en not_active Expired - Fee Related
-
2015
- 2015-06-12 KR KR1020150083708A patent/KR102365099B1/en active IP Right Grant
- 2015-07-14 TW TW104122815A patent/TWI660921B/en not_active IP Right Cessation
- 2015-09-14 CN CN201510582200.7A patent/CN105523711B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| US20060285064A1 (en) * | 2005-06-20 | 2006-12-21 | Lee Jeong J | Liquid crystal display panel cutting system and method and liquid crystal display device fabricating method using the same |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
| CN102515493A (en) * | 2011-11-28 | 2012-06-27 | 深圳市华星光电技术有限公司 | Cutting device and cutting method of liquid crystal panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109553286A (en) * | 2017-09-27 | 2019-04-02 | 塔工程有限公司 | Scribing equipment |
| CN109553286B (en) * | 2017-09-27 | 2022-12-23 | 塔工程有限公司 | Scribing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160046282A (en) | 2016-04-28 |
| JP6384264B2 (en) | 2018-09-05 |
| TWI660921B (en) | 2019-06-01 |
| CN105523711B (en) | 2020-07-07 |
| TW201615577A (en) | 2016-05-01 |
| JP2016079075A (en) | 2016-05-16 |
| KR102365099B1 (en) | 2022-02-18 |
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