CN105499069B - 膜形成装置及膜形成方法 - Google Patents

膜形成装置及膜形成方法 Download PDF

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Publication number
CN105499069B
CN105499069B CN201510450812.0A CN201510450812A CN105499069B CN 105499069 B CN105499069 B CN 105499069B CN 201510450812 A CN201510450812 A CN 201510450812A CN 105499069 B CN105499069 B CN 105499069B
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film
film thickness
substrate
instruction value
nozzle head
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Chinese (zh)
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CN105499069A (zh
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冈本裕司
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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  • Coating Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Plasma Technology (AREA)
CN201510450812.0A 2014-10-10 2015-07-28 膜形成装置及膜形成方法 Active CN105499069B (zh)

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JP2014-208562 2014-10-10
JP2014208562 2014-10-10

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CN105499069A CN105499069A (zh) 2016-04-20
CN105499069B true CN105499069B (zh) 2019-03-08

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JP (1) JP6632300B2 (ja)
KR (1) KR101753471B1 (ja)
CN (1) CN105499069B (ja)
TW (1) TWI575002B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6862041B2 (ja) * 2016-08-10 2021-04-21 住友重機械工業株式会社 膜形成方法及び膜形成装置
JP6925746B2 (ja) * 2017-12-15 2021-08-25 住友重機械工業株式会社 膜形成装置及び膜形成方法
JP7071231B2 (ja) * 2018-06-28 2022-05-18 キヤノン株式会社 平坦化装置、平坦化方法、物品製造方法及び液滴配置パターンデータの作成方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4121658B2 (ja) * 1999-02-22 2008-07-23 大日本印刷株式会社 有機絶縁樹脂層の加工方法
KR100701359B1 (ko) * 2002-07-30 2007-03-28 동경 엘렉트론 주식회사 절연막의 형성 방법 및 처리 장치
US6858542B2 (en) * 2003-01-17 2005-02-22 Freescale Semiconductor, Inc. Semiconductor fabrication method for making small features
JP4815765B2 (ja) * 2004-07-29 2011-11-16 ソニー株式会社 有機半導体装置の製造方法
KR100632545B1 (ko) * 2004-12-20 2006-10-09 삼성전기주식회사 신뢰성 향상을 위한 볼패드 형상을 구비한 볼 그리드어레이 기판의 제조방법
JP2006202961A (ja) * 2005-01-20 2006-08-03 Nec Lcd Technologies Ltd 印刷パターンを用いた処理方法及び印刷パターンの製造装置
KR100636345B1 (ko) * 2005-03-15 2006-10-18 (주) 플라즈닉스 플라즈마를 이용한 테이프형 반도체 장치의 표면처리방법
JP2009088085A (ja) * 2007-09-28 2009-04-23 Tokyo Electron Ltd 半導体装置の製造方法、半導体装置の製造装置、制御プログラム及びプログラム記憶媒体
JP5377940B2 (ja) * 2007-12-03 2013-12-25 株式会社半導体エネルギー研究所 半導体装置
CN102378690B (zh) * 2009-04-01 2014-12-17 惠普开发有限公司 硬成像设备和硬成像方法
TW201103379A (en) * 2009-07-13 2011-01-16 Sumitomo Heavy Industries plasma processing method and processing device
JP2011134879A (ja) * 2009-12-24 2011-07-07 Seiko Epson Corp ビルドアップ基板の製造方法
JP5214696B2 (ja) * 2010-09-27 2013-06-19 富士フイルム株式会社 パタン形成方法、基板製造方法、及びモールド製造方法
JP2012096286A (ja) * 2010-10-07 2012-05-24 Sumitomo Heavy Ind Ltd レーザ照射装置、レーザ照射方法、及び絶縁膜形成装置
JP5714357B2 (ja) * 2011-02-28 2015-05-07 三菱商事株式会社 光酸発生剤が連結したフラーレン誘導体を含有するレジスト組成物並びにこれを用いたレジストパターン形成方法
KR101847219B1 (ko) * 2011-03-16 2018-04-09 도쿄엘렉트론가부시키가이샤 도포막 형성방법, 도포막 형성장치 및 기억 매체
TW201307470A (zh) * 2011-05-27 2013-02-16 Taiyo Ink Mfg Co Ltd 熱硬化性樹脂組成物、乾燥膜及印刷配線板
KR20140024931A (ko) * 2011-07-15 2014-03-03 스미도모쥬기가이고교 가부시키가이샤 박막형성방법 및 박막형성장치
JP5714110B2 (ja) * 2011-07-27 2015-05-07 住友重機械工業株式会社 基板製造装置及び基板製造方法
TWI511794B (zh) * 2011-08-05 2015-12-11 Sumitomo Heavy Industries A film pattern forming apparatus, a film pattern forming method, and a device adjusting method
JP6053459B2 (ja) * 2012-11-01 2016-12-27 住友重機械工業株式会社 基板製造方法及び基板製造装置
JP5934665B2 (ja) * 2013-02-22 2016-06-15 東京エレクトロン株式会社 成膜方法、プログラム、コンピュータ記憶媒体及び成膜システム

Also Published As

Publication number Publication date
TWI575002B (zh) 2017-03-21
KR20160042756A (ko) 2016-04-20
TW201627361A (zh) 2016-08-01
CN105499069A (zh) 2016-04-20
JP6632300B2 (ja) 2020-01-22
JP2016078019A (ja) 2016-05-16
KR101753471B1 (ko) 2017-07-03

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