CN105474379B - 用于半导体晶片调平、力平衡和接触感测的装置和方法 - Google Patents
用于半导体晶片调平、力平衡和接触感测的装置和方法 Download PDFInfo
- Publication number
- CN105474379B CN105474379B CN201480040582.4A CN201480040582A CN105474379B CN 105474379 B CN105474379 B CN 105474379B CN 201480040582 A CN201480040582 A CN 201480040582A CN 105474379 B CN105474379 B CN 105474379B
- Authority
- CN
- China
- Prior art keywords
- upper chuck
- chuck
- chip
- contact
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361847118P | 2013-07-17 | 2013-07-17 | |
US61/847,118 | 2013-07-17 | ||
US14/330,536 | 2014-07-14 | ||
US14/330,536 US9837295B2 (en) | 2010-04-15 | 2014-07-14 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
PCT/EP2014/065315 WO2015007803A2 (en) | 2013-07-17 | 2014-07-16 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105474379A CN105474379A (zh) | 2016-04-06 |
CN105474379B true CN105474379B (zh) | 2018-06-22 |
Family
ID=51390092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480040582.4A Active CN105474379B (zh) | 2013-07-17 | 2014-07-16 | 用于半导体晶片调平、力平衡和接触感测的装置和方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9837295B2 (de) |
JP (1) | JP6337108B2 (de) |
KR (1) | KR102186211B1 (de) |
CN (1) | CN105474379B (de) |
AT (1) | AT517895B1 (de) |
DE (1) | DE112014003320B4 (de) |
WO (1) | WO2015007803A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017103212B4 (de) * | 2016-02-24 | 2024-01-25 | Suss Microtec Lithography Gmbh | Halbleiterstruktur-Bondungsvorrichtung und zugehörige Techniken |
KR102395194B1 (ko) | 2017-06-21 | 2022-05-06 | 삼성전자주식회사 | 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템 |
CN107598802B (zh) * | 2017-08-25 | 2019-04-09 | 北京理工大学 | 一种用于精密装配的柔性保护夹具 |
CN107984328A (zh) * | 2017-12-27 | 2018-05-04 | 常州市好利莱光电科技有限公司 | 一种倒角工装及倒角机 |
KR102068639B1 (ko) * | 2018-11-15 | 2020-01-21 | 무진전자 주식회사 | 웨이퍼 가압력 사전 측정 장치 |
KR102218347B1 (ko) * | 2019-08-20 | 2021-02-22 | 주식회사 씨이텍 | 척 레벨링 시스템 |
CN110729219B (zh) * | 2019-10-25 | 2021-12-07 | 江苏佳晟精密设备科技有限公司 | 一种半导体研磨机组件 |
CN114334700A (zh) * | 2020-09-29 | 2022-04-12 | 长鑫存储技术有限公司 | 半导体设备电极板的安装治具 |
CN112309916B (zh) * | 2020-10-28 | 2024-01-26 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 芯片拼接基版调平方法 |
CN115816264B (zh) * | 2022-12-20 | 2023-07-28 | 杭州天桴光电技术有限公司 | 氟化物晶体锭圆柱体端面快速抛光加工装置 |
Citations (4)
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US20020180466A1 (en) * | 2000-05-26 | 2002-12-05 | Yasuji Hiramatsu | Semiconductor manufacturing and inspecting device |
TW200846133A (en) * | 2007-03-15 | 2008-12-01 | Applied Materials Inc | Polishing head testing with movable pedestal |
US20090141418A1 (en) * | 2007-12-03 | 2009-06-04 | Jae Seok Hwang | Electrostatic chuck and apparatus having the same |
CN102460677A (zh) * | 2009-04-16 | 2012-05-16 | 休斯微技术股份有限公司 | 用于临时晶片接合和剥离的改进装置 |
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-
2014
- 2014-07-14 US US14/330,536 patent/US9837295B2/en active Active
- 2014-07-16 KR KR1020167003932A patent/KR102186211B1/ko active IP Right Grant
- 2014-07-16 DE DE112014003320.0T patent/DE112014003320B4/de active Active
- 2014-07-16 JP JP2016526613A patent/JP6337108B2/ja active Active
- 2014-07-16 WO PCT/EP2014/065315 patent/WO2015007803A2/en active Application Filing
- 2014-07-16 AT ATA9278/2014A patent/AT517895B1/de active
- 2014-07-16 CN CN201480040582.4A patent/CN105474379B/zh active Active
-
2017
- 2017-11-02 US US15/801,813 patent/US10580678B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020180466A1 (en) * | 2000-05-26 | 2002-12-05 | Yasuji Hiramatsu | Semiconductor manufacturing and inspecting device |
TW200846133A (en) * | 2007-03-15 | 2008-12-01 | Applied Materials Inc | Polishing head testing with movable pedestal |
US20090141418A1 (en) * | 2007-12-03 | 2009-06-04 | Jae Seok Hwang | Electrostatic chuck and apparatus having the same |
CN102460677A (zh) * | 2009-04-16 | 2012-05-16 | 休斯微技术股份有限公司 | 用于临时晶片接合和剥离的改进装置 |
US8267143B2 (en) * | 2009-04-16 | 2012-09-18 | Suss Microtec Lithography, Gmbh | Apparatus for mechanically debonding temporary bonded semiconductor wafers |
Also Published As
Publication number | Publication date |
---|---|
CN105474379A (zh) | 2016-04-06 |
AT517895A1 (de) | 2017-05-15 |
DE112014003320T5 (de) | 2016-03-31 |
JP6337108B2 (ja) | 2018-06-06 |
US9837295B2 (en) | 2017-12-05 |
US20140318683A1 (en) | 2014-10-30 |
AT517895B1 (de) | 2019-07-15 |
KR102186211B1 (ko) | 2020-12-04 |
DE112014003320B4 (de) | 2021-12-16 |
WO2015007803A2 (en) | 2015-01-22 |
KR20160032208A (ko) | 2016-03-23 |
US20180102270A1 (en) | 2018-04-12 |
JP2016525285A (ja) | 2016-08-22 |
WO2015007803A3 (en) | 2015-03-19 |
US10580678B2 (en) | 2020-03-03 |
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