CN105379409B - Ehf安全通信设备 - Google Patents
Ehf安全通信设备 Download PDFInfo
- Publication number
- CN105379409B CN105379409B CN201380076188.1A CN201380076188A CN105379409B CN 105379409 B CN105379409 B CN 105379409B CN 201380076188 A CN201380076188 A CN 201380076188A CN 105379409 B CN105379409 B CN 105379409B
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- ehf
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/40—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by components specially adapted for near-field transmission
- H04B5/48—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L63/00—Network architectures or network communication protocols for network security
- H04L63/04—Network architectures or network communication protocols for network security for providing a confidential data exchange among entities communicating through data packet networks
- H04L63/0428—Network architectures or network communication protocols for network security for providing a confidential data exchange among entities communicating through data packet networks wherein the data content is protected, e.g. by encrypting or encapsulating the payload
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L63/00—Network architectures or network communication protocols for network security
- H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
- H04L63/0876—Network architectures or network communication protocols for network security for authentication of entities based on the identity of the terminal or configuration, e.g. MAC address, hardware or software configuration or device fingerprint
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L63/00—Network architectures or network communication protocols for network security
- H04L63/10—Network architectures or network communication protocols for network security for controlling access to devices or network resources
- H04L63/107—Network architectures or network communication protocols for network security for controlling access to devices or network resources wherein the security policies are location-dependent, e.g. entities privileges depend on current location or allowing specific operations only from locally connected terminals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W12/00—Security arrangements; Authentication; Protecting privacy or anonymity
- H04W12/08—Access security
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W76/00—Connection management
- H04W76/10—Connection setup
- H04W76/14—Direct-mode setup
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W76/00—Connection management
- H04W76/20—Manipulation of established connections
- H04W76/28—Discontinuous transmission [DTX]; Discontinuous reception [DRX]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Computer Security & Cryptography (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361799510P | 2013-03-15 | 2013-03-15 | |
US201361799579P | 2013-03-15 | 2013-03-15 | |
US61/799,579 | 2013-03-15 | ||
US61/799,510 | 2013-03-15 | ||
PCT/US2013/076687 WO2014149107A1 (en) | 2013-03-15 | 2013-12-19 | Ehf secure communication device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105379409A CN105379409A (zh) | 2016-03-02 |
CN105379409B true CN105379409B (zh) | 2019-09-27 |
Family
ID=51534059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380076188.1A Active CN105379409B (zh) | 2013-03-15 | 2013-12-19 | Ehf安全通信设备 |
Country Status (5)
Country | Link |
---|---|
US (4) | US9426660B2 (zh) |
EP (1) | EP2974504B1 (zh) |
KR (1) | KR20150132459A (zh) |
CN (1) | CN105379409B (zh) |
WO (1) | WO2014149107A1 (zh) |
Families Citing this family (27)
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US9191263B2 (en) * | 2008-12-23 | 2015-11-17 | Keyssa, Inc. | Contactless replacement for cabled standards-based interfaces |
US10170933B2 (en) * | 2013-11-20 | 2019-01-01 | Samsung Electro-Mechanics Co., Ltd. | Non-contact type power supplying apparatus and non-contact type power supplying method |
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US9819560B2 (en) * | 2014-12-24 | 2017-11-14 | Mediatek Inc. | Dynamic data distribution method in private network and associated electronic device |
WO2016137518A1 (en) * | 2015-02-27 | 2016-09-01 | Hewlett-Packard Development Company, L.P. | Waveguides in a computing device |
US9906292B2 (en) * | 2016-05-23 | 2018-02-27 | Keyssa Systems, Inc. | Multiple order connectors for contactless communication devices and methods for using the same |
US10402559B2 (en) * | 2016-06-03 | 2019-09-03 | Honeywell International Inc. | System and method supporting secure data transfer into and out of protected systems using removable media |
US10614219B2 (en) * | 2016-06-03 | 2020-04-07 | Honeywell International Inc. | Apparatus and method for locking and unlocking removable media for use inside and outside protected systems |
US10250418B2 (en) | 2016-08-02 | 2019-04-02 | Keyssa Systems, Inc. | EHF receiver architecture with dynamically adjustable discrimination threshold |
WO2018039474A1 (en) * | 2016-08-24 | 2018-03-01 | Keyssa Systems, Inc. | Mechanical connectors for contactless communication units |
EP3306576B1 (fr) * | 2016-10-05 | 2023-03-15 | The Swatch Group Research and Development Ltd | Procédé et système d'accès securisé à un espace déterminé au moyen d'un objet portable |
EP3554150B1 (en) * | 2017-01-16 | 2022-03-09 | Huawei Technologies Co., Ltd. | Method for determining transmit power, and wireless communication device |
EP3370082B1 (en) * | 2017-03-02 | 2020-12-09 | Nxp B.V. | Processing module and associated method |
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US10419878B1 (en) | 2017-07-24 | 2019-09-17 | BlueOwl, LLC | Technology for capturing and analyzing sensor data to facilitate alternative transportation |
US10880293B2 (en) * | 2017-08-25 | 2020-12-29 | Ford Global Technologies, Llc | Authentication of vehicle-to-vehicle communications |
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CN110351692B (zh) * | 2018-04-04 | 2023-08-29 | Oppo广东移动通信有限公司 | 数据传输方法、装置、存储介质及车载终端 |
US11167836B2 (en) | 2018-06-21 | 2021-11-09 | Sierra Nevada Corporation | Devices and methods to attach composite core to a surrounding structure |
US11076018B1 (en) | 2018-09-04 | 2021-07-27 | Amazon Technologies, Inc. | Account association for voice-enabled devices |
US11368458B2 (en) * | 2018-09-27 | 2022-06-21 | Arm Ip Limited | Methods and systems for verifying a source of a message or call |
US11425170B2 (en) | 2018-10-11 | 2022-08-23 | Honeywell International Inc. | System and method for deploying and configuring cyber-security protection solution using portable storage device |
DE102019220096B4 (de) * | 2019-12-18 | 2021-09-16 | Continental Automotive Gmbh | Verfahren zur Absicherung der Zeitsynchronisation eines Ethernet-Bordnetzes |
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US20140281534A1 (en) | 2014-09-18 |
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US20200120508A1 (en) | 2020-04-16 |
US10925111B2 (en) | 2021-02-16 |
US9894524B2 (en) | 2018-02-13 |
US9426660B2 (en) | 2016-08-23 |
EP2974504A1 (en) | 2016-01-20 |
CN105379409A (zh) | 2016-03-02 |
US10602363B2 (en) | 2020-03-24 |
EP2974504A4 (en) | 2016-11-16 |
US20160066188A1 (en) | 2016-03-03 |
WO2014149107A1 (en) | 2014-09-25 |
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