CN105304601A - 引线框及其制造方法 - Google Patents
引线框及其制造方法 Download PDFInfo
- Publication number
- CN105304601A CN105304601A CN201510431451.5A CN201510431451A CN105304601A CN 105304601 A CN105304601 A CN 105304601A CN 201510431451 A CN201510431451 A CN 201510431451A CN 105304601 A CN105304601 A CN 105304601A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- coating
- film
- manufacture method
- leadframe pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 50
- 239000011248 coating agent Substances 0.000 claims description 93
- 238000000576 coating method Methods 0.000 claims description 93
- 238000000034 method Methods 0.000 claims description 59
- 238000007747 plating Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229910052763 palladium Inorganic materials 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000011247 coating layer Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 24
- 238000009713 electroplating Methods 0.000 description 11
- 239000002390 adhesive tape Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 5
- 206010034960 Photophobia Diseases 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 208000013469 light sensitivity Diseases 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000002716 delivery method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014149026A JP6414669B2 (ja) | 2014-07-22 | 2014-07-22 | リードフレーム及びその製造方法 |
JP2014-149026 | 2014-07-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105304601A true CN105304601A (zh) | 2016-02-03 |
CN105304601B CN105304601B (zh) | 2018-02-13 |
Family
ID=55201658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510431451.5A Active CN105304601B (zh) | 2014-07-22 | 2015-07-21 | 引线框及其制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6414669B2 (zh) |
KR (2) | KR20160011583A (zh) |
CN (1) | CN105304601B (zh) |
TW (1) | TWI606556B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109075150B (zh) * | 2016-03-11 | 2022-03-01 | 德国艾托特克公司 | 引线框结构,引线框式表面粘着型电子装置及其制造方法 |
KR101870244B1 (ko) | 2017-04-19 | 2018-06-22 | 서울시립대학교 산학협력단 | 초박형 실리콘 스트레인 게이지 제조 방법 |
KR102102034B1 (ko) * | 2018-02-06 | 2020-04-22 | 주식회사 바른전자 | Qfn 반도체 패키지의 제조방법 |
KR102005178B1 (ko) | 2018-02-07 | 2019-07-29 | 서울시립대학교 산학협력단 | 포토레지스트 보호막을 활용한 실리콘 스트레인 게이지 제조 방법 |
JP6657331B2 (ja) * | 2018-07-26 | 2020-03-04 | 大口マテリアル株式会社 | リードフレーム、樹脂付きリードフレーム及び光半導体装置、並びにリードフレームの製造方法 |
JP7292776B2 (ja) * | 2020-01-30 | 2023-06-19 | 大口マテリアル株式会社 | リードフレーム |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142940A (ja) * | 1984-08-07 | 1986-03-01 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS6214452A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
CN1516252A (zh) * | 2000-02-18 | 2004-07-28 | ������������ʽ���� | 制造半导体集成电路器件的方法 |
CN101164165A (zh) * | 2005-04-26 | 2008-04-16 | 大日本印刷株式会社 | 电路部件、电路部件的制造方法、半导体器件及电路部件表面的叠层结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149450A (ja) * | 1984-08-17 | 1986-03-11 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS62204558A (ja) * | 1986-03-05 | 1987-09-09 | Shinko Electric Ind Co Ltd | リ−ドフレ−ム |
JP2524645B2 (ja) * | 1990-03-30 | 1996-08-14 | 株式会社三井ハイテック | リ―ドフレ―ムおよびその製造方法 |
JP2003124421A (ja) * | 2001-10-15 | 2003-04-25 | Shinko Electric Ind Co Ltd | リードフレーム及びその製造方法並びに該リードフレームを用いた半導体装置の製造方法 |
JP2005079524A (ja) | 2003-09-03 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 半導体装置用リードフレーム |
-
2014
- 2014-07-22 JP JP2014149026A patent/JP6414669B2/ja active Active
-
2015
- 2015-07-17 TW TW104123156A patent/TWI606556B/zh active
- 2015-07-20 KR KR1020150102528A patent/KR20160011583A/ko active Search and Examination
- 2015-07-21 CN CN201510431451.5A patent/CN105304601B/zh active Active
-
2017
- 2017-02-13 KR KR1020170019464A patent/KR20170020712A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6142940A (ja) * | 1984-08-07 | 1986-03-01 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
JPS6214452A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ム |
CN1516252A (zh) * | 2000-02-18 | 2004-07-28 | ������������ʽ���� | 制造半导体集成电路器件的方法 |
CN101164165A (zh) * | 2005-04-26 | 2008-04-16 | 大日本印刷株式会社 | 电路部件、电路部件的制造方法、半导体器件及电路部件表面的叠层结构 |
Also Published As
Publication number | Publication date |
---|---|
TW201604998A (zh) | 2016-02-01 |
CN105304601B (zh) | 2018-02-13 |
TWI606556B (zh) | 2017-11-21 |
JP6414669B2 (ja) | 2018-10-31 |
KR20170020712A (ko) | 2017-02-23 |
KR20160011583A (ko) | 2016-02-01 |
JP2016025244A (ja) | 2016-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180730 Address after: Kagoshima County, Japan Patentee after: Oguchi Electric Materials Co.,Ltd. Address before: Tokyo, Japan Patentee before: SH MATERIALS CO.,LTD. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231121 Address after: The road development processing zone Kaohsiung city Taiwan China No. 24 Patentee after: CHANG WAH TECHNOLOGY Co.,Ltd. Address before: Kagoshima County, Japan Patentee before: Oguchi Electric Materials Co.,Ltd. |