CN105277574B - 应用重复曝光的多曝光影像混合的检测方法 - Google Patents

应用重复曝光的多曝光影像混合的检测方法 Download PDF

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Publication number
CN105277574B
CN105277574B CN201410406034.0A CN201410406034A CN105277574B CN 105277574 B CN105277574 B CN 105277574B CN 201410406034 A CN201410406034 A CN 201410406034A CN 105277574 B CN105277574 B CN 105277574B
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light
exposure time
emitting device
time values
image
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CN201410406034.0A
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Chinese (zh)
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CN105277574A (zh
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汪光夏
陈辉毓
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Machvision Inc
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Machvision Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

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  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN201410406034.0A 2014-07-22 2014-08-18 应用重复曝光的多曝光影像混合的检测方法 Active CN105277574B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103125041 2014-07-22
TW103125041A TWI495867B (zh) 2014-07-22 2014-07-22 Application of repeated exposure to multiple exposure image blending detection method

Publications (2)

Publication Number Publication Date
CN105277574A CN105277574A (zh) 2016-01-27
CN105277574B true CN105277574B (zh) 2018-04-03

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Country Link
JP (1) JP6034343B2 (ko)
KR (1) KR101679314B1 (ko)
CN (1) CN105277574B (ko)
TW (1) TWI495867B (ko)

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* Cited by examiner, † Cited by third party
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EP3418726A4 (en) 2016-02-19 2019-03-20 SCREEN Holdings Co., Ltd. DEFECT DETECTION DEVICE, DEFECT DETECTION METHOD AND PROGRAM
CN110146519A (zh) * 2018-02-12 2019-08-20 志圣工业股份有限公司 电路板检测方法及电路板曝光方法
CN108414530A (zh) * 2018-03-13 2018-08-17 昆山国显光电有限公司 自动光学检测设备
CN110006919A (zh) * 2018-12-10 2019-07-12 浙江大学台州研究院 一种抛光石英晶片浅划痕检测的装置与方法
CN110702031B (zh) * 2019-11-19 2021-08-27 四川长虹电器股份有限公司 适用于深色表面的三维扫描装置及扫描方法
CN111542218B (zh) * 2020-04-23 2021-07-20 国网浙江省电力有限公司营销服务中心 一种电能表可信生产贴片环节采集验证方法及系统

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US6552783B1 (en) * 2000-06-28 2003-04-22 Teradyne, Inc. Optical system
CN1431482A (zh) * 2002-01-10 2003-07-23 欧姆龙株式会社 表面状态检查方法及电路板检查装置
CN1717171A (zh) * 2004-06-30 2006-01-04 欧姆龙株式会社 图像产生方法和用于检查基板的照明装置
CN1945203A (zh) * 2005-10-04 2007-04-11 雅马哈发动机株式会社 安装基板的检查装置及印刷装置
CN101221122A (zh) * 2007-01-08 2008-07-16 牧德科技股份有限公司 可调式光源装置和具有该光源装置的自动光学检测系统
CN201396645Y (zh) * 2009-04-10 2010-02-03 厦门福信光电集成有限公司 自动光学检测设备的光源组合装置
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统
CN102435610A (zh) * 2010-09-16 2012-05-02 日东电工株式会社 检查装置和布线电路基板的制造方法
TWM443197U (en) * 2011-12-07 2012-12-11 Zealtek Electronic Co Ltd Dual lens photographic module capable of obtaining high resolution images
CN102959385A (zh) * 2011-11-08 2013-03-06 玛机统丽公司 印刷电路板的检查装置

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US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
JP3012602B2 (ja) * 1998-08-06 2000-02-28 大分日本電気株式会社 表面欠陥検査装置
JP2004150885A (ja) 2002-10-29 2004-05-27 Toppan Printing Co Ltd ホログラムの検査装置および検査方法
US7355692B2 (en) 2004-03-05 2008-04-08 Orbotech Ltd System and method for inspecting electrical circuits utilizing reflective and fluorescent imagery
JP2006047290A (ja) * 2004-06-30 2006-02-16 Omron Corp 基板検査用の画像生成方法、基板検査装置、および基板検査用の照明装置
JP2006220578A (ja) * 2005-02-14 2006-08-24 Nikon Corp 表面検査装置
JP2006295036A (ja) * 2005-04-14 2006-10-26 World Techno:Kk プリント配線板の検査方法
JP2009042202A (ja) * 2007-08-08 2009-02-26 Taniguchi Consulting Engineers Co Ltd ウエハ検査装置およびウエハ検査方法
JP2010281580A (ja) * 2009-06-02 2010-12-16 Rexxam Co Ltd 基板検査装置、照射装置、及び基板検査方法
JP5760371B2 (ja) * 2010-10-13 2015-08-12 富士通株式会社 塗装表面欠陥検査方法
KR101361537B1 (ko) * 2011-11-25 2014-02-13 주식회사 미르기술 적외선패턴조사부를 구비하는 비전검사장치

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0459489A2 (en) * 1990-05-30 1991-12-04 Dainippon Screen Mfg. Co., Ltd. Method of reading optical image of inspected surface and image reading system employable therein
US6552783B1 (en) * 2000-06-28 2003-04-22 Teradyne, Inc. Optical system
CN1431482A (zh) * 2002-01-10 2003-07-23 欧姆龙株式会社 表面状态检查方法及电路板检查装置
CN1717171A (zh) * 2004-06-30 2006-01-04 欧姆龙株式会社 图像产生方法和用于检查基板的照明装置
CN1945203A (zh) * 2005-10-04 2007-04-11 雅马哈发动机株式会社 安装基板的检查装置及印刷装置
CN101221122A (zh) * 2007-01-08 2008-07-16 牧德科技股份有限公司 可调式光源装置和具有该光源装置的自动光学检测系统
CN201396645Y (zh) * 2009-04-10 2010-02-03 厦门福信光电集成有限公司 自动光学检测设备的光源组合装置
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统
CN102435610A (zh) * 2010-09-16 2012-05-02 日东电工株式会社 检查装置和布线电路基板的制造方法
CN102959385A (zh) * 2011-11-08 2013-03-06 玛机统丽公司 印刷电路板的检查装置
TWM443197U (en) * 2011-12-07 2012-12-11 Zealtek Electronic Co Ltd Dual lens photographic module capable of obtaining high resolution images

Also Published As

Publication number Publication date
CN105277574A (zh) 2016-01-27
TWI495867B (zh) 2015-08-11
KR101679314B1 (ko) 2016-11-24
JP2016024185A (ja) 2016-02-08
JP6034343B2 (ja) 2016-11-30
TW201604536A (zh) 2016-02-01
KR20160011556A (ko) 2016-02-01

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