CN105277574B - Multi-exposure image mixing detection method applying repeated exposure - Google Patents
Multi-exposure image mixing detection method applying repeated exposure Download PDFInfo
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- CN105277574B CN105277574B CN201410406034.0A CN201410406034A CN105277574B CN 105277574 B CN105277574 B CN 105277574B CN 201410406034 A CN201410406034 A CN 201410406034A CN 105277574 B CN105277574 B CN 105277574B
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- 238000001514 detection method Methods 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000004458 analytical method Methods 0.000 claims abstract description 11
- 238000012360 testing method Methods 0.000 claims description 32
- 230000007547 defect Effects 0.000 claims description 28
- 230000003287 optical effect Effects 0.000 claims description 15
- 239000003973 paint Substances 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000010191 image analysis Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 10
- 238000005286 illumination Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000004904 shortening Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention discloses a multi-exposure image mixing detection method applying repeated exposure, which comprises the following steps: step S100: setting respective exposure time values of a plurality of light source devices with at least one of different wavelength bands and illumination angles in a first configuration; step S200: repeatedly exposing to sequentially turn on and turn off the light source devices after corresponding exposure time values are turned on so that the light source devices sequentially irradiate the circuit substrate to be detected and the image capturing equipment generates detection images mixed in the exposure time values; and step S300: outputting the detection image for analysis and inspection. Therefore, the invention records the image information mixed under different irradiation light rays in one detection image, can avoid each light source device from respectively capturing images, and can obtain a plurality of images in the same time, thereby simplifying the process and effectively shortening the detection time.
Description
Technical field
It is used to detect the optical detecting method of circuit the present invention relates to a kind of, more particularly to it is a kind of using the more of repeated exposure
The detection method of exposed image mixing.
Background technology
Optical identification system such as automatic optical detector (Automated Optical Inspection, AOI) and outward appearance
The detection such as inspection machine (Automatic Final Inspection, AFI) board eventually, has nowadays been commonly utilized in electronics industry
In the testing process of circuit board group assembling production lines, to substitute conventional artificial range estimation to inspect operation, it utilizes image technology ratio
It is whether variant to determinand and standard video to judge that determinand whether meets standard.
Therefore, detection of the optical identification system on circuit plays very important role, and this also causes electronic product
Manufacturing cost in testing cost depend on optical identification system quality and speed.Optical identification system is except accurate
Outside basic demand, it is often more important that the accurate inspection of circuit specification needed for being reached with the most short time.Therefore, even if optics
Identification system has the screening ability of high precision, once detection speed, which can not be lifted effectively, will increase testing cost, Jin Erying
Ring overall output.
Prior art such as U.S. Publication US7355692 patents of invention, it discloses a kind of light for being divided into two measuring stations
Detection program, the analysis result of the image (reflection image) captured by first stop are learned, then is directed to the analysis in the second station
As a result another image (fluoroscopic image) is captured, in this way, carrying out electricity according to the two images captured under two different operating stations
The analysis of road defect.Not only testing process is complicated (must operate on first work station and the second work respectively for such detection mode
Stand), also the time needed for detection is significantly increased (because capturing two width respectively at different operating station with different time intervals
Image), it is such configuration and method be can produce cause output not effectively improve because detection speed can not be lifted lack
Point.
The content of the invention
It is an object of the present invention to simplify the flow of optical detection and shorten the detection required time.
Another object of the present invention is to provide a kind of detection method for being available for detecting a variety of configuration and settings of board progress.
For the above-mentioned purpose and other purposes, the present invention propose the inspection that a kind of more exposed images using repeated exposure mix
Survey method, comprising：Step S100：Set tool different wave length section under the first configuration and irradiating angle both this at least within it
The one respective exposure time values of multiple light sources device, these exposure time values composition total exposure time；Step S200：Carry out weight
Multiple exposure and sequentially make these light supply apparatuses open corresponding to close after exposure time values so that these light supply apparatuses sequentially irradiate
On to circuit under test substrate and by image capturing device produce in these exposure time values by different wave length section and irradiating angle this
Detection image mixed by least one of light of the two；And step S300：The detection image is exported so that analysis is examined
Look into.
In one embodiment of the invention, step S210 is also included after step S200：Determine whether there is other configurations
Light supply apparatus, step S300 is entered when "No", the multiple light sources under another configuration are carried out into step S220 when "Yes"
The setting of the respective exposure time values of device returns step S200 and checked with producing another detection image for analysis.
In one embodiment of the invention, the light supply apparatus of first configuration includes visible light wave range light-emitting device and invisible
Optical band light-emitting device.
In one embodiment of the invention, under the judgement whether metallic circuit on the circuit under test substrate disconnects, this
The light supply apparatus of one configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, the visible light wave range light-emitting device
Exposure time values account for the total exposure time ratio be less than the ultraviolet light wave band light-emitting device exposure time values account for total exposure
Ratio between light time.Further, the ratio that the exposure time values of the visible light wave range light-emitting device account for the total exposure time is
30%, the ratio that the exposure time values of the ultraviolet light wave band light-emitting device account for the total exposure time is 70%.
, should under whether the metallic circuit on the circuit under test substrate has the judgement of protrusion in one embodiment of the invention
The light supply apparatus of first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and the visible light wave range is luminous to be filled
The ratio that the exposure time values put account for the total exposure time is equal to the exposure time values of the ultraviolet light wave band light-emitting device to account for this total
The ratio of time for exposure.
, should under the whether defective judgement in green paint surface on the circuit under test substrate in one embodiment of the invention
The light supply apparatus of first configuration is that side-view light emitting device and positive light light-emitting device, the exposure time values of the side-view light emitting device account for this
The ratio of total exposure time accounts for the ratio of the total exposure time equal to the exposure time values of the positive light light-emitting device.
Whereby, repeated exposure of the present invention by camera device to circuit under test substrate, allows the circuit under test substrate not
Together it is recorded on width detection image with the image presented under irradiation light so that can be direct in follow-up analysis inspection
The defects of circuit under test substrate is quickly determined that by the detection image, and without the comparison between image and several images again
The defects of place looking for and positioning, the flow of optical detection can be simplified and effectively shorten time needed for detection.
Brief description of the drawings
Fig. 1 is the configuration schematic diagram of detecting system in one embodiment of the invention.
Fig. 2 is the flow chart of detection method in one embodiment of the invention.
Fig. 3 a, Fig. 3 b, Fig. 3 c are the image the schematic diagram whether metallic circuit in a Surface scan embodiment of the invention disconnects.
Fig. 4 a, Fig. 4 b, Fig. 4 c are that the image whether metallic circuit in a Surface scan embodiment of the invention has protrusion is illustrated
Figure.
Fig. 5 a, Fig. 5 b, Fig. 5 c are the whether defective shadow in circuit board green paint surface in line scanning embodiment of the invention
As schematic diagram.
Critical piece reference：
100 detection platforms
110 circuit under test substrates
The light supply apparatus of 210 first configurations
The light supply apparatus of 220 other configurations
310 image capturing devices
330 computing hosts
S100~S300 steps
Embodiment
To be fully understood by the purpose of the present invention, feature and technique effect, hereby by following specific embodiments, and with reference to accompanying drawing,
The present invention is elaborated, is described as follows：
Fig. 1 is refer to first, and it is the configuration schematic diagram of detecting system in one embodiment of the invention.Systems for optical inspection bag
Contain：Multiple light sources device 210,220, detection platform 100, circuit under test substrate 110, image capturing device 310 and computing host
330.Wherein the group number of these light supply apparatuses makees corresponding set according to actual demand.The circuit under test substrate 110 can be soft
The plate body of circuit board, rigid circuit board or other tool circuit structures.The image capturing device 310 is visually most preferably inspected angle and given
Corresponding adjustment, not it is limited with the surface of circuit under test substrate 110 shown in Fig. 1.The computing host 330 is to next according to setting
Corresponding running and the unlatching/shut-in time for manipulating these light supply apparatuses 210,220.
In optical detection, shone by the light source of the light supply apparatus 210 of the first configuration or the light supply apparatus 220 of other configurations
Penetrate, reflected light, scattering light or exciting light can be generated on the circuit under test substrate 110, it is of the invention by the institute of circuit under test substrate 110
Each light source of running is recorded in same width image in the detection project needed, and its operation method flow is described below.
Fig. 2 is refer to, it is the flow chart of detection method in one embodiment of the invention.The present invention using repeated exposure
The detection method of more exposed image mixing, comprising：
Step S100：Tool different wave length section different wave length section under the first configuration and irradiating angle are set both this at least
The respective exposure time values of multiple light sources device of one of them, these exposure time values composition total exposure time；
Step S200：Carry out repeated exposure and sequentially make these light supply apparatuses open corresponding to close after exposure time values,
So that these light supply apparatuses are sequentially exposed on circuit under test substrate and produced by image capturing device in these exposure time values
As the detection image mixed by least one of light of different wave length section and irradiating angle both this；And
Step S300：The detection image is exported so that analysis checks.
Above-mentioned steps are the flows in a kind of light source configuration, when there is detecting system the light source of multigroup configuration to configure then
Same after next light source configuration is switched it can carry out above-mentioned steps flow.The illumination of different light source configurations of the present invention refers to
For the light supply apparatus configured corresponding to the species of circuit defect to be detected, such as：The vertical light irradiation of some defects, has
It is a little then be with the lit sideways for having angle of inclination, so can is divided into two kinds of illumination configurations in the angle of illumination, furthermore,
Some defects need to use special wavelength illumination, such as：Usually excite fluorescence using ultraviolet light, strengthen gold with feux rouges
The reflection that belongs to copper face, the reflection for strengthening with green glow green paint, strengthen near infrared light wireline inspection under green paint etc., so
Two or more illumination configurations is segmented on the wavelength of illumination again.Therefore, for different light source configurations of the present invention, its
Defect analysis simultaneously is not required to take the different images captured between different light source configurations, and the present invention can be complete under single irradiation configuration
Into the detection of species the defects of correspondence, the switching between different configuration provided by the invention is used to make when detecting the defects of different
With.
It is the image whether metallic circuit in a Surface scan embodiment of the invention disconnects as shown in Fig. 3 a, Fig. 3 b, Fig. 3 c
Schematic diagram.Fig. 3 a are to illuminate the result that configuration list uses visible ray；Fig. 3 b are to illuminate the result that configuration list uses ultraviolet light；Fig. 3 c
It is to illuminate under repeated exposure of the configuration based on the present invention while using visible ray and the ratio of the result, simply two kinds of light sources of ultraviolet light
Example is different.It is noted that Fig. 3 a and Fig. 3 b can also be implemented using the illumination configuration of the repeated exposure of the present invention, example
The combination using the visible ray (99%) of more ratio and the ultraviolet light (1%) of less ratio can be revised as such as Fig. 3 a；Fig. 3 b
The combination using the visible ray (1%) of less ratio and the ultraviolet light (99%) of more ratio can be then revised as.It is described above
It is to be directed to multiwave mode, if being illustrated with follow-up Fig. 5 of the present invention, aiming at the mode of multi-angle.Accordingly, only
Multiband is combined with multi-angle, you can the single width figure with multi information is obtained under the scanning of same time interval
Picture, so that detection judges.
Step S210 is also included after step S200：The light supply apparatus of other configurations is determined whether there is, is entered when "No"
Enter step S300, when "Yes" into step S220 and carry out under another configuration tool different wave length section multiple light sources device it is each
From exposure time values setting return step S200 with produce it is another detection image for analysis check.
Wherein, the light supply apparatus of first configuration includes visible light wave range light-emitting device and the luminous dress of black light wave band
Put.Accompanying drawing of the present invention is refer to, it is single that there is metallic circuit with doubtful seen by radiation of visible light circuit under test substrate in Fig. 3 a
The grayscale image of defect (at dashed circle) is disconnected, Fig. 3 b are mono- with this black light irradiation circuit under test substrate finding of ultraviolet light
There is the grayscale image that metallic circuit disconnects defect (at dashed circle), need to obtain respectively in the past after two images again by operating
Member determines whether defect, after the mode of operation of the present invention acquired image as shown in Figure 3 c, by can directly be regarded in accompanying drawing
" do not have " the defects of metallic circuit disconnection at dashed circle because the base material part of nonmetallic line can absorb it is ultraviolet
Light simultaneously produces exciting light, therefore the image of the part can be made to brighten, and under the operation of the present invention, because the doubtful metallic circuits of Fig. 3 c break
It is not approximate with the gray value of base material to open the gray value of fault location, therefore can detect image by this single width can directly judge dotted line
Circled " does not have " the defects of metallic circuit disconnection.
Refer to Fig. 3 a, Fig. 3 b, Fig. 3 c, it is worth mentioning at this point that, the judgement whether disconnected based on above-mentioned metallic circuit, in compared with
Under good configuration, except the light supply apparatus of first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, enter
One step, the exposure time values of the visible light wave range light-emitting device account for the ratio of the total exposure time less than ultraviolet light wave band hair
The exposure time values of electro-optical device account for the ratio of the total exposure time.For example, during the exposure of the visible light wave range light-emitting device
Between value account for the total exposure time ratio be 30%, the exposure time values of the ultraviolet light wave band light-emitting device account for the total exposure time
Ratio be 70%.But the present invention is not limited thereto, it is total to account for this in the exposure time values of the visible light wave range light-emitting device
The ratio of time for exposure accounts for the condition of the ratio of the total exposure time less than the exposure time values of the ultraviolet light wave band light-emitting device
Under can all have preferable display effect.
Then Fig. 4 a, Fig. 4 b, Fig. 4 c are refer to, whether has protrusion for the metallic circuit in a Surface scan embodiment of the invention
Image schematic diagram.It is single with doubtful seen by radiation of visible light circuit under test substrate to there is metallic circuit to have protrusion in Fig. 4 a
The grayscale image of defect (at arrow), Fig. 4 b are mono- golden to have seen by this black light irradiation circuit under test substrate of ultraviolet light
Belong to the grayscale image of circuit protrusion defect (at arrow), determined whether again by operator after need to obtaining two images respectively in the past
Defect, after the mode of operation of the present invention acquired image as illustrated in fig. 4 c, by accompanying drawing can directly depending on arrow " does not have
Have " metallic circuit protrusion (its present in indent) the defects of because the base material part of nonmetallic line can absorb ultraviolet light simultaneously
Exciting light is produced, therefore the image of the part can be made to brighten, and under the operation of the present invention, because the doubtful metallic circuit protrusions of Fig. 4 c lack
It is not approximate with the gray value of metal to fall into the gray value at place, therefore can detect image by this single width can directly judge arrow
The defects of " not having " metallic circuit protrudes.
It refer to Fig. 4 a, Fig. 4 b, Fig. 4 c, it is worth mentioning at this point that, whether there is the judgement of protrusion based on above-mentioned metallic circuit,
Under advantageous configurations, except the light supply apparatus of first configuration is visible light wave range light-emitting device and the luminous dress of ultraviolet light wave band
Put, further, the ratio that the exposure time values of the visible light wave range light-emitting device account for the total exposure time is equal to the ultraviolet light
The exposure time values of wave band light-emitting device account for the ratio of the total exposure time.For example, the visible light wave range light-emitting device
The ratio that exposure time values account for the total exposure time is 50%, and the exposure time values of the ultraviolet light wave band light-emitting device account for total exposure
Ratio between light time is 50%, with up to preferable display effect.
Then Fig. 5 a, Fig. 5 b, Fig. 5 c are refer to, whether circuit board green paint surface in embodiment is scanned for an of the invention line
Defective image schematic diagram.Difference of the line scanning with Surface scan operationally is only that the image of aobvious scanning is relatively sharp, smart
Really, but existing scanning needs to move whole optical system to carry out the inspection of line scan-type one by one.
It is single that there is electricity with doubtful seen by the radiation of visible light circuit under test base board green paint surface of white sidelight in Fig. 5 a
The grayscale image of roadbed board defect (at arrow), Fig. 5 b are mono- with white positive light (forward entrance) radiation of visible light circuit under test substrate
The seen grayscale image with circuit substrate defect in green paint surface (at arrow).Need to obtain respectively in the past after two images again by
Operator determines whether defect, after the mode of operation of the present invention acquired image as shown in Figure 5 c, by can be straight in accompanying drawing
Connect depending on " there is " at arrow the defects of circuit substrate green paint surface, and the contrast degree of overall image is also better than single with white side
Image (such as Fig. 5 a) seen by light irradiation circuit under test substrate, under the operation of the present invention, because of the green paint of the doubtful circuit substrates of Fig. 5 c
Gray value at the defects of surface is not approximate with the gray value on just evergreen paint surface, therefore can be by singly this width detection image can be straight
Connect judge at arrow " having " circuit substrate it is green paint surface the defects of.
It refer to Fig. 5 a, Fig. 5 b, Fig. 5 c, it is worth mentioning at this point that, whether defective judgement is had based on foregoing circuit substrate,
Under advantageous configurations, except the light supply apparatus of first configuration is side-view light emitting device and positive light light-emitting device, further, it is somebody's turn to do
The ratio that the exposure time values of side-view light emitting device account for the total exposure time accounts for equal to the exposure time values of the positive light light-emitting device
The ratio of the total exposure time.For example, the ratio that the exposure time values of the side-view light emitting device account for the total exposure time is
50%, the ratio that the exposure time values of the positive light light-emitting device account for the total exposure time is 50%, with up to preferable display effect.
In other words, Fig. 5 a are illustrated under conditions of no repeated exposure, after only being irradiated with white sidelight (incident with about 45 degree), although
Detection defect is easier to for the metal in the area that opens a window, but can not clearly be detected for the scratch on green paint surface；Figure
5b is illustrated under conditions of no repeated exposure, after only being irradiated with white positive (~90 degree) of light, although for the area that opens a window
Metal for contrast do not have to come must well shown in Fig. 5 a, but for it is green paint surface on scratch can clearly detect；Figure
5c is to illustrate under conditions of the repeated exposure of the present invention, as long as carrying out the scale parameter adjustment of positive light and sidelight, you can with
Single width image is obtained in same detection time section.In this width image, though contrast does not have for the metal in the area that opens a window
Have that Fig. 5 a are good, but be an advantage over Fig. 5 b；For the scratch on green paint surface, though contrast is good without Fig. 5 b, figure is an advantage over
5a, one of this that is, the advantage of repeated exposure technology of the present invention.
Summary, repeated exposure of the present invention by camera device to circuit under test substrate allow the circuit under test substrate
The image presented under different irradiation lights be together recorded in a width detection image on, can simplify optical detection flow and
Effectively shorten the time needed for detection.
The present invention has hereinbefore been disclosed with preferred embodiment, but it will be understood by those skilled in the art that the implementation
Example is only used for describing the present invention, and is not construed as limiting the scope of the present invention.It is it should be noted that every equivalent with the embodiment
Change and displacement, be regarded as being covered by scope of the invention.Therefore, protection scope of the present invention is when with claims
The content limited is defined.
Claims (7)
1. the detection method that a kind of more exposed images using repeated exposure mix, it is characterised in that include：
Step S100：Set tool different wave length section under the first configuration and irradiating angle is at least one of multiple both this
The respective exposure time values of light supply apparatus, these exposure time values composition total exposure time；
Step S200：Carry out repeated exposure and sequentially make these light supply apparatuses open corresponding to close after exposure time values so that
These light supply apparatuses are sequentially exposed on circuit under test substrate and produced by image capturing device in these exposure time values by not
Detection image mixed by least one of light of co-wavelength section and irradiating angle both this；And
Step S300：The detection image is exported so that analysis checks, and the circuit under test base is directly judged by the detection image
The defects of plate.
2. detection method as claimed in claim 1, it is characterised in that step S210 is also included after step S200：Judge
Whether there is the light supply apparatus of other configurations, step S300 is entered when "No", enter step S220 when "Yes" and carry out another
The setting of the respective exposure time values of multiple light sources device under configuration returns step S200 and supplied with producing another detection image
Analysis checks.
3. detection method as claimed in claim 1, it is characterised in that the light supply apparatus of first configuration includes visible light wave range
Light-emitting device and black light wave band light-emitting device.
4. detection method as claimed in claim 1, it is characterised in that whether the metallic circuit on the circuit under test substrate breaks
Under the judgement opened, the light supply apparatus of first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and this can
See that the exposure time values of optical band light-emitting device account for exposure of the ratio less than the ultraviolet light wave band light-emitting device of the total exposure time
Light time value accounts for the ratio of the total exposure time.
5. detection method as claimed in claim 4, it is characterised in that the exposure time values of the visible light wave range light-emitting device account for
The ratio of the total exposure time is 30%, and the exposure time values of the ultraviolet light wave band light-emitting device account for the ratio of the total exposure time
For 70%.
6. detection method as claimed in claim 1, it is characterised in that whether the metallic circuit on the circuit under test substrate has
Under the judgement of protrusion, the light supply apparatus of first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, is somebody's turn to do
The ratio that the exposure time values of visible light wave range light-emitting device account for the total exposure time is equal to the ultraviolet light wave band light-emitting device
Exposure time values account for the ratio of the total exposure time.
7. detection method as claimed in claim 1, it is characterised in that whether the green paint surface on the circuit under test substrate has
Under the judgement of defect, the light supply apparatus of first configuration is side-view light emitting device and positive light light-emitting device, the side-view light emitting device
Exposure time values account for the total exposure time ratio be equal to the positive light light-emitting device exposure time values account for the total exposure time
Ratio.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125041A TWI495867B (en) | 2014-07-22 | 2014-07-22 | Application of repeated exposure to multiple exposure image blending detection method |
| TW103125041 | 2014-07-22 |
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| Publication Number | Publication Date |
|---|---|
| CN105277574A CN105277574A (en) | 2016-01-27 |
| CN105277574B true CN105277574B (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410406034.0A Active CN105277574B (en) | 2014-07-22 | 2014-08-18 | Multi-exposure image mixing detection method applying repeated exposure |
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|---|---|
| JP (1) | JP6034343B2 (en) |
| KR (1) | KR101679314B1 (en) |
| CN (1) | CN105277574B (en) |
| TW (1) | TWI495867B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017141611A1 (en) * | 2016-02-19 | 2017-08-24 | 株式会社Ｓｃｒｅｅｎホールディングス | Defect detection apparatus, defect detection method, and program |
| CN110146519A (en) * | 2018-02-12 | 2019-08-20 | 志圣工业股份有限公司 | Circuit board detecting method and circuit board exposure method |
| CN108414530A (en) * | 2018-03-13 | 2018-08-17 | 昆山国显光电有限公司 | Automated optical detection equipment |
| CN110006919A (en) * | 2018-12-10 | 2019-07-12 | 浙江大学台州研究院 | A kind of apparatus and method polishing the shallow scratch detection of quartz wafer |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201604536A (en) | 2016-02-01 |
| TWI495867B (en) | 2015-08-11 |
| KR20160011556A (en) | 2016-02-01 |
| JP6034343B2 (en) | 2016-11-30 |
| KR101679314B1 (en) | 2016-11-24 |
| CN105277574A (en) | 2016-01-27 |
| JP2016024185A (en) | 2016-02-08 |
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