CN105229446B - 以影像辨识为基础的烧蚀图案位置收回 - Google Patents

以影像辨识为基础的烧蚀图案位置收回 Download PDF

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Publication number
CN105229446B
CN105229446B CN201480015608.XA CN201480015608A CN105229446B CN 105229446 B CN105229446 B CN 105229446B CN 201480015608 A CN201480015608 A CN 201480015608A CN 105229446 B CN105229446 B CN 105229446B
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CN
China
Prior art keywords
laser
sample
image
wanted
relative
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CN201480015608.XA
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English (en)
Chinese (zh)
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CN105229446A (zh
Inventor
蕾芙·克莉丝坦·萨墨菲尔德
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Elemental Scientific Lasers LLC
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Irecto Science Industry Co ltd
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Publication of CN105229446A publication Critical patent/CN105229446A/zh
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N2001/045—Laser ablation; Microwave vaporisation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50057—Compensation error by probing test, machined piece, post or pre process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/04—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
    • H01J49/0459—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components for solid samples
    • H01J49/0463—Desorption by laser or particle beam, followed by ionisation as a separate step

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Laser Beam Processing (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Sampling And Sample Adjustment (AREA)
CN201480015608.XA 2013-03-15 2014-03-14 以影像辨识为基础的烧蚀图案位置收回 Active CN105229446B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361792016P 2013-03-15 2013-03-15
US61/792,016 2013-03-15
US14/211,976 2014-03-14
US14/211,976 US10026195B2 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall
PCT/US2014/028241 WO2014144012A1 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall

Publications (2)

Publication Number Publication Date
CN105229446A CN105229446A (zh) 2016-01-06
CN105229446B true CN105229446B (zh) 2017-10-10

Family

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Family Applications (1)

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CN201480015608.XA Active CN105229446B (zh) 2013-03-15 2014-03-14 以影像辨识为基础的烧蚀图案位置收回

Country Status (5)

Country Link
US (1) US10026195B2 (enExample)
JP (2) JP6290371B2 (enExample)
KR (2) KR102294198B1 (enExample)
CN (1) CN105229446B (enExample)
WO (1) WO2014144012A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11293872B2 (en) * 2014-09-18 2022-04-05 Universiteit Gent Laser ablation probe
JP6955931B2 (ja) * 2017-08-22 2021-10-27 株式会社ディスコ 検査用ウエーハ及びエネルギー分布の検査方法
KR101976441B1 (ko) * 2018-11-27 2019-08-28 주식회사 21세기 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법
KR102028864B1 (ko) * 2019-05-07 2019-11-04 연세대학교 산학협력단 광원 위치를 보정하기 위한 현미경 장치 및 그 방법
JP6997480B2 (ja) * 2020-05-12 2022-01-17 オーケーラボ有限会社 レーザー走査顕微鏡、レーザー走査顕微鏡システム及びレーザーアブレーションシステム
CN117388043B (zh) 2023-11-02 2024-03-29 中国地质科学院地质研究所 一种单颗粒榍石的溶解方法及单颗粒榍石的（铀-钍）/氦定年方法
CN118514871B (zh) * 2024-07-19 2024-09-24 江西飞行学院 一种激光烧蚀反制无人机试验方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523543A (en) * 1994-09-09 1996-06-04 Litel Instruments Laser ablation control system and method
CN1667359A (zh) * 2005-03-04 2005-09-14 清华大学 超精密工作台自标定方法及装置
CN101584051A (zh) * 2006-11-08 2009-11-18 奥尔利康巴尔策斯涂料（英国）有限公司 用于太阳能电池板划线的激光束校准的方法和设备
CN101990480A (zh) * 2008-04-10 2011-03-23 应用材料股份有限公司 激光刻划平台与杂合书写策略
CN102194642A (zh) * 2010-02-18 2011-09-21 株式会社岛津制作所 质谱仪

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210227B2 (ja) * 1995-11-10 2001-09-17 日本電子株式会社 レーザアブレーション分析装置
US5844149A (en) * 1996-09-19 1998-12-01 Nkk Corporation Method for analyzing solid specimen and apparatus therefor
JPH11201944A (ja) * 1998-01-09 1999-07-30 Jeol Ltd レーザーアブレーション装置
JP3610771B2 (ja) * 1998-04-13 2005-01-19 松下電器産業株式会社 ワークの位置認識方法
JP3763229B2 (ja) * 1999-05-11 2006-04-05 松下電器産業株式会社 画像認識による位置検出方法
EP1339522A1 (en) * 2000-11-13 2003-09-03 Micmacmo Aps Laser ablation
JP2003270208A (ja) * 2002-03-14 2003-09-25 Tdk Corp 試料ホルダ、レーザアブレーション装置、レーザアブレーション方法、試料分析装置、試料分析方法及び試料ホルダ用保持台
US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
KR20040016067A (ko) * 2002-08-14 2004-02-21 삼성전자주식회사 감광막 노광 방법 및 이를 이용한 노광 설비
GB2399311B (en) 2003-03-04 2005-06-15 Xsil Technology Ltd Laser machining using an active assist gas
JP4284104B2 (ja) * 2003-05-14 2009-06-24 株式会社日立ハイテクノロジーズ 大気圧レーザイオン化質量分析装置
US7977026B2 (en) 2004-02-06 2011-07-12 Rohm And Haas Electronic Materials Llc Imaging methods
US20070012665A1 (en) * 2005-07-12 2007-01-18 Hewlett-Packard Development Company Lp Laser ablation
US20070050165A1 (en) * 2005-08-31 2007-03-01 Alcon Refractivehorizons, Inc. System and method for automatic self-alignment of a surgical laser
JP2007102462A (ja) * 2005-10-04 2007-04-19 Nippon Telegr & Teleph Corp <Ntt> 画像合成方法、システム、端末、および画像合成プログラム
JP2008261837A (ja) * 2007-03-20 2008-10-30 Mitsubishi Chemicals Corp マコーレート様構造を有する機能性微粒子
US8274735B2 (en) * 2007-09-14 2012-09-25 Fry Robert C Analytical laser ablation of solid samples for ICP, ICP-MS, and FAG-MS analysis
WO2009126910A2 (en) * 2008-04-11 2009-10-15 Applied Materials, Inc. Laser scribe inspection methods and systems
JP5384178B2 (ja) * 2008-04-21 2014-01-08 株式会社森精機製作所 加工シミュレーション方法及び加工シミュレーション装置
WO2009137494A1 (en) * 2008-05-05 2009-11-12 Applied Spectra, Inc. Laser ablation apparatus and method
KR101026010B1 (ko) * 2008-08-13 2011-03-30 삼성전기주식회사 레이저 가공장치 및 레이저 가공방법
US8319964B2 (en) * 2009-07-10 2012-11-27 University Of Florida Research Foundation, Inc. Method and apparatus to laser ablation—laser induced breakdown spectroscopy
JP5552798B2 (ja) * 2009-11-11 2014-07-16 新日鐵住金株式会社 レーザを用いた元素分析方法及び元素分析装置
KR101249950B1 (ko) * 2010-11-10 2013-04-11 유병소 이미지 취득 장치를 구비하는 레이저 리프트 오프 장비 및 이를 이용한 레이저 가공방법
US8554353B2 (en) * 2011-12-14 2013-10-08 Gwangju Institute Of Science And Technology Fabrication system of CIGS thin film solar cell equipped with real-time analysis facilities for profiling the elemental components of CIGS thin film using laser-induced breakdown spectroscopy

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5523543A (en) * 1994-09-09 1996-06-04 Litel Instruments Laser ablation control system and method
CN1667359A (zh) * 2005-03-04 2005-09-14 清华大学 超精密工作台自标定方法及装置
CN101584051A (zh) * 2006-11-08 2009-11-18 奥尔利康巴尔策斯涂料（英国）有限公司 用于太阳能电池板划线的激光束校准的方法和设备
CN101990480A (zh) * 2008-04-10 2011-03-23 应用材料股份有限公司 激光刻划平台与杂合书写策略
CN102194642A (zh) * 2010-02-18 2011-09-21 株式会社岛津制作所 质谱仪

Also Published As

Publication number Publication date
KR102175071B1 (ko) 2020-11-06
KR20150129853A (ko) 2015-11-20
JP2018126788A (ja) 2018-08-16
JP6290371B2 (ja) 2018-03-07
WO2014144012A1 (en) 2014-09-18
US20140288693A1 (en) 2014-09-25
JP6463526B2 (ja) 2019-02-06
CN105229446A (zh) 2016-01-06
JP2016519289A (ja) 2016-06-30
US10026195B2 (en) 2018-07-17
KR20200128448A (ko) 2020-11-12
KR102294198B1 (ko) 2021-08-30

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Effective date of registration: 20190314

Address after: Nebraska

Patentee after: Elemental Science Laser Company

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Patentee before: Electro Scient Ind Inc.