JP6290371B2 - 画像認識に基づくアブレーションパターン位置の再現 - Google Patents

画像認識に基づくアブレーションパターン位置の再現 Download PDF

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Publication number
JP6290371B2
JP6290371B2 JP2016502744A JP2016502744A JP6290371B2 JP 6290371 B2 JP6290371 B2 JP 6290371B2 JP 2016502744 A JP2016502744 A JP 2016502744A JP 2016502744 A JP2016502744 A JP 2016502744A JP 6290371 B2 JP6290371 B2 JP 6290371B2
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laser
sample
image
planned
kernel image
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Japanese (ja)
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JP2016519289A5 (enExample
JP2016519289A (ja
Inventor
サマーフィールド，リーフ，クリスチャン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N2001/045—Laser ablation; Microwave vaporisation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/50—Machine tool, machine tool null till machine tool work handling
    • G05B2219/50057—Compensation error by probing test, machined piece, post or pre process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J49/00—Particle spectrometers or separator tubes
    • H01J49/02—Details
    • H01J49/04—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
    • H01J49/0459—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components for solid samples
    • H01J49/0463—Desorption by laser or particle beam, followed by ionisation as a separate step

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Laser Beam Processing (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2016502744A 2013-03-15 2014-03-14 画像認識に基づくアブレーションパターン位置の再現 Active JP6290371B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361792016P 2013-03-15 2013-03-15
US61/792,016 2013-03-15
US14/211,976 2014-03-14
US14/211,976 US10026195B2 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall
PCT/US2014/028241 WO2014144012A1 (en) 2013-03-15 2014-03-14 Image recognition base ablation pattern position recall

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018020149A Division JP6463526B2 (ja) 2013-03-15 2018-02-07 レーザアブレーション装置

Publications (3)

Publication Number Publication Date
JP2016519289A JP2016519289A (ja) 2016-06-30
JP2016519289A5 JP2016519289A5 (enExample) 2017-03-23
JP6290371B2 true JP6290371B2 (ja) 2018-03-07

Family

ID=51537588

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016502744A Active JP6290371B2 (ja) 2013-03-15 2014-03-14 画像認識に基づくアブレーションパターン位置の再現
JP2018020149A Active JP6463526B2 (ja) 2013-03-15 2018-02-07 レーザアブレーション装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018020149A Active JP6463526B2 (ja) 2013-03-15 2018-02-07 レーザアブレーション装置

Country Status (5)

Country Link
US (1) US10026195B2 (enExample)
JP (2) JP6290371B2 (enExample)
KR (2) KR102294198B1 (enExample)
CN (1) CN105229446B (enExample)
WO (1) WO2014144012A1 (enExample)

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US11293872B2 (en) * 2014-09-18 2022-04-05 Universiteit Gent Laser ablation probe
JP6955931B2 (ja) * 2017-08-22 2021-10-27 株式会社ディスコ 検査用ウエーハ及びエネルギー分布の検査方法
KR101976441B1 (ko) * 2018-11-27 2019-08-28 주식회사 21세기 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법
KR102028864B1 (ko) * 2019-05-07 2019-11-04 연세대학교 산학협력단 광원 위치를 보정하기 위한 현미경 장치 및 그 방법
JP6997480B2 (ja) * 2020-05-12 2022-01-17 オーケーラボ有限会社 レーザー走査顕微鏡、レーザー走査顕微鏡システム及びレーザーアブレーションシステム
CN117388043B (zh) 2023-11-02 2024-03-29 中国地质科学院地质研究所 一种单颗粒榍石的溶解方法及单颗粒榍石的（铀-钍）/氦定年方法
CN118514871B (zh) * 2024-07-19 2024-09-24 江西飞行学院 一种激光烧蚀反制无人机试验方法

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EP1339522A1 (en) * 2000-11-13 2003-09-03 Micmacmo Aps Laser ablation
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US7119351B2 (en) * 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
KR20040016067A (ko) * 2002-08-14 2004-02-21 삼성전자주식회사 감광막 노광 방법 및 이를 이용한 노광 설비
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Also Published As

Publication number Publication date
KR102175071B1 (ko) 2020-11-06
KR20150129853A (ko) 2015-11-20
JP2018126788A (ja) 2018-08-16
WO2014144012A1 (en) 2014-09-18
US20140288693A1 (en) 2014-09-25
JP6463526B2 (ja) 2019-02-06
CN105229446A (zh) 2016-01-06
CN105229446B (zh) 2017-10-10
JP2016519289A (ja) 2016-06-30
US10026195B2 (en) 2018-07-17
KR20200128448A (ko) 2020-11-12
KR102294198B1 (ko) 2021-08-30

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