CN105190837B - 用于保护等离子体处理系统中的真空密封件的系统及方法 - Google Patents
用于保护等离子体处理系统中的真空密封件的系统及方法 Download PDFInfo
- Publication number
- CN105190837B CN105190837B CN201480025553.0A CN201480025553A CN105190837B CN 105190837 B CN105190837 B CN 105190837B CN 201480025553 A CN201480025553 A CN 201480025553A CN 105190837 B CN105190837 B CN 105190837B
- Authority
- CN
- China
- Prior art keywords
- heat
- side wall
- plasma process
- process system
- vacuum seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/166—Sealing means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361821326P | 2013-05-09 | 2013-05-09 | |
US61/821,326 | 2013-05-09 | ||
PCT/US2014/037415 WO2014182981A1 (en) | 2013-05-09 | 2014-05-09 | System and method for protection of vacuum seals in plasma processing systems |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105190837A CN105190837A (zh) | 2015-12-23 |
CN105190837B true CN105190837B (zh) | 2018-03-06 |
Family
ID=51867760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480025553.0A Active CN105190837B (zh) | 2013-05-09 | 2014-05-09 | 用于保护等离子体处理系统中的真空密封件的系统及方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10049858B2 (zh) |
JP (1) | JP6440689B2 (zh) |
KR (1) | KR101829716B1 (zh) |
CN (1) | CN105190837B (zh) |
SG (1) | SG11201506961YA (zh) |
TW (1) | TWI628689B (zh) |
WO (1) | WO2014182981A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10319568B2 (en) * | 2013-11-12 | 2019-06-11 | Tokyo Electron Limited | Plasma processing apparatus for performing plasma process for target object |
CN104733273B (zh) * | 2013-12-18 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种反应腔室及等离子体加工设备 |
KR20160128762A (ko) * | 2015-04-29 | 2016-11-08 | 주식회사 테라세미콘 | 실링부재 |
JP6524531B2 (ja) * | 2015-12-17 | 2019-06-05 | パナソニックIpマネジメント株式会社 | プラズマ処理装置およびプラズマ処理方法 |
JP6683575B2 (ja) * | 2016-09-01 | 2020-04-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
KR102116475B1 (ko) * | 2020-02-24 | 2020-05-28 | 피에스케이 주식회사 | 실링 유지 부재 및 기판 처리 장치 |
CN113471095B (zh) * | 2020-03-31 | 2024-05-14 | 长鑫存储技术有限公司 | 应用于半导体工艺的腔室 |
KR20230106869A (ko) * | 2022-01-07 | 2023-07-14 | 피에스케이 주식회사 | 기판 처리 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451343B (en) * | 1999-03-19 | 2001-08-21 | Applied Materials Inc | Microwave plasma generating apparatus with improved heat protection of sealing O-rings |
CN1608305A (zh) * | 2001-08-03 | 2005-04-20 | 应用材料公司 | 用于等离子室的悬挂式分气歧管 |
CN101427062A (zh) * | 2005-07-07 | 2009-05-06 | 马特森技术公司 | 具有腐蚀抑制件的密封结构和方法 |
CN102194638A (zh) * | 2010-02-24 | 2011-09-21 | 东京毅力科创株式会社 | 处理装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2067762A5 (zh) * | 1969-11-15 | 1971-08-20 | Queroy Ets | |
US3741022A (en) * | 1970-11-23 | 1973-06-26 | J Olson | Probing device for microcircuits |
BR5701149U (pt) * | 1977-09-16 | 1978-03-07 | P Negrao | Atenuador |
JPS5837682A (ja) | 1981-08-29 | 1983-03-04 | 株式会社島津製作所 | 等高線作図装置 |
JPS5837682U (ja) * | 1981-09-07 | 1983-03-11 | ソニー株式会社 | ステレオプラグアダプタ− |
JP3007432B2 (ja) | 1991-02-19 | 2000-02-07 | 東京エレクトロン株式会社 | 熱処理装置 |
US6308654B1 (en) * | 1996-10-18 | 2001-10-30 | Applied Materials, Inc. | Inductively coupled parallel-plate plasma reactor with a conical dome |
US5964468A (en) * | 1997-01-14 | 1999-10-12 | Garlock Inc | Anti-buckling spiral wound gasket |
JP2001217097A (ja) * | 2000-02-02 | 2001-08-10 | Toshiba Corp | 高周波プラズマ装置 |
JP3698960B2 (ja) * | 2000-06-09 | 2005-09-21 | 三菱電機株式会社 | 光海底中継器用ケーブル導入装置の絶縁構造 |
JP2002164685A (ja) * | 2000-11-29 | 2002-06-07 | Matsushita Electric Ind Co Ltd | 真空処理装置と電磁シールド装置及び傾斜コイルばね |
CN1679136A (zh) * | 2002-08-30 | 2005-10-05 | 艾克塞利斯技术公司 | 微波等离子体发生器的气体管端盖 |
JP4268798B2 (ja) * | 2002-12-02 | 2009-05-27 | アプライド マテリアルズ インコーポレイテッド | シール部材及びプラズマ処理装置 |
JP4563760B2 (ja) * | 2004-09-24 | 2010-10-13 | 株式会社日立国際電気 | 半導体製造装置及び半導体装置の製造方法 |
US20060236931A1 (en) * | 2005-04-25 | 2006-10-26 | Varian Semiconductor Equipment Associates, Inc. | Tilted Plasma Doping |
JP2010023894A (ja) | 2008-07-23 | 2010-02-04 | N Tech:Kk | コンテナ内袋の開袋装置及び開袋方法 |
US8236706B2 (en) * | 2008-12-12 | 2012-08-07 | Mattson Technology, Inc. | Method and apparatus for growing thin oxide films on silicon while minimizing impact on existing structures |
JP2010238944A (ja) * | 2009-03-31 | 2010-10-21 | Panasonic Corp | プラズマ処理装置 |
CN102753727A (zh) * | 2010-03-31 | 2012-10-24 | 东京毅力科创株式会社 | 等离子体处理装置和等离子体处理方法 |
-
2014
- 2014-05-08 TW TW103116358A patent/TWI628689B/zh active
- 2014-05-09 JP JP2016513098A patent/JP6440689B2/ja not_active Expired - Fee Related
- 2014-05-09 KR KR1020157029909A patent/KR101829716B1/ko active IP Right Grant
- 2014-05-09 WO PCT/US2014/037415 patent/WO2014182981A1/en active Application Filing
- 2014-05-09 SG SG11201506961YA patent/SG11201506961YA/en unknown
- 2014-05-09 CN CN201480025553.0A patent/CN105190837B/zh active Active
- 2014-05-09 US US14/771,525 patent/US10049858B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW451343B (en) * | 1999-03-19 | 2001-08-21 | Applied Materials Inc | Microwave plasma generating apparatus with improved heat protection of sealing O-rings |
CN1608305A (zh) * | 2001-08-03 | 2005-04-20 | 应用材料公司 | 用于等离子室的悬挂式分气歧管 |
CN101427062A (zh) * | 2005-07-07 | 2009-05-06 | 马特森技术公司 | 具有腐蚀抑制件的密封结构和方法 |
CN102194638A (zh) * | 2010-02-24 | 2011-09-21 | 东京毅力科创株式会社 | 处理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105190837A (zh) | 2015-12-23 |
TWI628689B (zh) | 2018-07-01 |
US20160013025A1 (en) | 2016-01-14 |
TW201513163A (zh) | 2015-04-01 |
US10049858B2 (en) | 2018-08-14 |
KR20150131367A (ko) | 2015-11-24 |
KR101829716B1 (ko) | 2018-02-19 |
JP2016524787A (ja) | 2016-08-18 |
JP6440689B2 (ja) | 2018-12-19 |
WO2014182981A1 (en) | 2014-11-13 |
SG11201506961YA (en) | 2015-11-27 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
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Effective date of registration: 20181129 Address after: American California Co-patentee after: Beijing Yitang Semiconductor Technology Co., Ltd. Patentee after: Mattson Tech Inc. Address before: American California Patentee before: Mattson Tech Inc. |
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CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: MATTSON TECHNOLOGY, Inc. Patentee after: Beijing Yitang Semiconductor Technology Co.,Ltd. Address before: California, USA Patentee before: MATTSON TECHNOLOGY, Inc. Patentee before: Beijing Yitang Semiconductor Technology Co.,Ltd. |