CN105097747A - 智能卡芯片封装结构及封装方法 - Google Patents
智能卡芯片封装结构及封装方法 Download PDFInfo
- Publication number
- CN105097747A CN105097747A CN201510549723.1A CN201510549723A CN105097747A CN 105097747 A CN105097747 A CN 105097747A CN 201510549723 A CN201510549723 A CN 201510549723A CN 105097747 A CN105097747 A CN 105097747A
- Authority
- CN
- China
- Prior art keywords
- chip
- substrate
- flip
- pin
- weld pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 238000012856 packing Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
Landscapes
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510549723.1A CN105097747B (zh) | 2015-09-01 | 2015-09-01 | 智能卡芯片封装结构及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510549723.1A CN105097747B (zh) | 2015-09-01 | 2015-09-01 | 智能卡芯片封装结构及封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105097747A true CN105097747A (zh) | 2015-11-25 |
CN105097747B CN105097747B (zh) | 2018-07-06 |
Family
ID=54577851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510549723.1A Active CN105097747B (zh) | 2015-09-01 | 2015-09-01 | 智能卡芯片封装结构及封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105097747B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105789190A (zh) * | 2016-05-12 | 2016-07-20 | 黄祖辉 | 一种集成芯片、集成芯片系统和集成芯片的生产方法 |
CN105845588A (zh) * | 2016-03-30 | 2016-08-10 | 上海伊诺尔信息技术有限公司 | 卷带式智能卡模块贴片封装结构及制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101199434A (zh) * | 2006-12-11 | 2008-06-18 | 通用电气公司 | 模块化传感器组件及其制造方法 |
CN101286505A (zh) * | 2008-05-26 | 2008-10-15 | 日月光半导体制造股份有限公司 | 具有天线的半导体封装结构 |
CN101517737A (zh) * | 2006-09-25 | 2009-08-26 | 皇家飞利浦电子股份有限公司 | 通过芯片通孔的倒装片互连 |
CN104008982A (zh) * | 2013-02-23 | 2014-08-27 | 南茂科技股份有限公司 | 芯片封装工艺及芯片封装 |
CN104347571A (zh) * | 2013-08-07 | 2015-02-11 | 万国半导体股份有限公司 | 功率控制器件及其制备方法 |
CN204991695U (zh) * | 2015-09-01 | 2016-01-20 | 上海伊诺尔信息技术有限公司 | 智能卡芯片封装结构 |
-
2015
- 2015-09-01 CN CN201510549723.1A patent/CN105097747B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101517737A (zh) * | 2006-09-25 | 2009-08-26 | 皇家飞利浦电子股份有限公司 | 通过芯片通孔的倒装片互连 |
CN101199434A (zh) * | 2006-12-11 | 2008-06-18 | 通用电气公司 | 模块化传感器组件及其制造方法 |
CN101286505A (zh) * | 2008-05-26 | 2008-10-15 | 日月光半导体制造股份有限公司 | 具有天线的半导体封装结构 |
CN104008982A (zh) * | 2013-02-23 | 2014-08-27 | 南茂科技股份有限公司 | 芯片封装工艺及芯片封装 |
CN104347571A (zh) * | 2013-08-07 | 2015-02-11 | 万国半导体股份有限公司 | 功率控制器件及其制备方法 |
CN204991695U (zh) * | 2015-09-01 | 2016-01-20 | 上海伊诺尔信息技术有限公司 | 智能卡芯片封装结构 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105845588A (zh) * | 2016-03-30 | 2016-08-10 | 上海伊诺尔信息技术有限公司 | 卷带式智能卡模块贴片封装结构及制造方法 |
CN105789190A (zh) * | 2016-05-12 | 2016-07-20 | 黄祖辉 | 一种集成芯片、集成芯片系统和集成芯片的生产方法 |
CN105789190B (zh) * | 2016-05-12 | 2018-11-23 | 黄祖辉 | 一种集成芯片、集成芯片系统和集成芯片的生产方法 |
Also Published As
Publication number | Publication date |
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CN105097747B (zh) | 2018-07-06 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190620 Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Shanghai Inore Information Electronics Co.,Ltd. Address before: Room 1001, Building No. 1628 Suzhao Road, Minhang District, Shanghai 201158 Patentee before: SHANGHAI ETERNAL INFORMATION TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee after: Lianxin (Shanghai) Microelectronics Technology Co.,Ltd. Country or region after: China Address before: Room 301, Room 3, Building 2, No. 3576 Zhaolou Road, Minhang District, Shanghai, 201112 Patentee before: Shanghai Inore Information Electronics Co.,Ltd. Country or region before: China |
|
CP03 | Change of name, title or address |