CN105051861B - 适合于在电子器件制造中处理基板的处理系统、设备及方法 - Google Patents

适合于在电子器件制造中处理基板的处理系统、设备及方法 Download PDF

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Publication number
CN105051861B
CN105051861B CN201480016045.6A CN201480016045A CN105051861B CN 105051861 B CN105051861 B CN 105051861B CN 201480016045 A CN201480016045 A CN 201480016045A CN 105051861 B CN105051861 B CN 105051861B
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China
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chamber
pass
processing
channel
substrate
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CN201480016045.6A
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Chinese (zh)
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CN105051861A (zh
Inventor
史蒂夫·S·洪坎
保罗·B·路透
埃里克·A·恩格尔哈特
加内什·巴拉萨布拉曼尼恩
陈兴隆
胡安·卡洛斯·罗奇-阿尔维斯
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86187—Plural tanks or compartments connected for serial flow

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
CN201480016045.6A 2013-03-15 2014-03-10 适合于在电子器件制造中处理基板的处理系统、设备及方法 Active CN105051861B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361788825P 2013-03-15 2013-03-15
US61/788,825 2013-03-15
PCT/US2014/022656 WO2014150234A1 (en) 2013-03-15 2014-03-10 Processing systems, apparatus, and methods adapted to process substrates in electronic device manufacturing

Publications (2)

Publication Number Publication Date
CN105051861A CN105051861A (zh) 2015-11-11
CN105051861B true CN105051861B (zh) 2017-11-14

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CN201480016045.6A Active CN105051861B (zh) 2013-03-15 2014-03-10 适合于在电子器件制造中处理基板的处理系统、设备及方法

Country Status (6)

Country Link
US (1) US9524889B2 (https=)
JP (1) JP6178488B2 (https=)
KR (1) KR101734821B1 (https=)
CN (1) CN105051861B (https=)
TW (1) TWI623055B (https=)
WO (1) WO2014150234A1 (https=)

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US20150090295A1 (en) 2013-09-28 2015-04-02 Applied Materials, Inc. Apparatus and methods for a mask inverter
KR101770970B1 (ko) 2013-09-30 2017-08-24 어플라이드 머티어리얼스, 인코포레이티드 이송 챔버 가스 퍼지 장치, 전자 디바이스 프로세싱 시스템들, 및 퍼지 방법들
JP6466955B2 (ja) 2013-11-04 2019-02-06 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 側面数増強対応移送チャンバ、半導体デバイスの製造処理ツール及び処理方法
US10520371B2 (en) 2015-10-22 2019-12-31 Applied Materials, Inc. Optical fiber temperature sensors, temperature monitoring apparatus, and manufacturing methods
US10741428B2 (en) * 2016-04-11 2020-08-11 Applied Materials, Inc. Semiconductor processing chamber
US10119191B2 (en) 2016-06-08 2018-11-06 Applied Materials, Inc. High flow gas diffuser assemblies, systems, and methods
US10684159B2 (en) 2016-06-27 2020-06-16 Applied Materials, Inc. Methods, systems, and apparatus for mass flow verification based on choked flow
SG11201901208RA (en) * 2016-10-18 2019-05-30 Mattson Tech Inc Systems and methods for workpiece processing
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
US10361099B2 (en) 2017-06-23 2019-07-23 Applied Materials, Inc. Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems
JP6991325B2 (ja) * 2017-10-16 2022-01-12 アプライド マテリアルズ インコーポレイテッド デュアルロードロック構成による高温加熱支持ペデスタル
US11107709B2 (en) 2019-01-30 2021-08-31 Applied Materials, Inc. Temperature-controllable process chambers, electronic device processing systems, and manufacturing methods
JP7316121B2 (ja) * 2019-07-05 2023-07-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
WO2021011229A1 (en) * 2019-07-12 2021-01-21 Applied Materials, Inc. Robot for simultaneous substrate transfer
JP7240980B2 (ja) * 2019-07-29 2023-03-16 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
JP7402658B2 (ja) * 2019-11-01 2023-12-21 東京エレクトロン株式会社 基板収容ユニット及び基板搬送装置における真空搬送ユニットのメンテナンス方法
JP7759192B2 (ja) * 2020-05-12 2025-10-23 エーエスエム・アイピー・ホールディング・ベー・フェー 高スループットマルチチャンバ基材処理システム
CN117963755A (zh) * 2024-02-06 2024-05-03 北京北方华创微电子装备有限公司 起吊装置及半导体工艺设备

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CN102810499A (zh) * 2011-05-31 2012-12-05 细美事有限公司 处理基材的设备和方法

Also Published As

Publication number Publication date
US20140263165A1 (en) 2014-09-18
JP6178488B2 (ja) 2017-08-09
TW201442138A (zh) 2014-11-01
CN105051861A (zh) 2015-11-11
KR20150132416A (ko) 2015-11-25
WO2014150234A1 (en) 2014-09-25
JP2016512925A (ja) 2016-05-09
US9524889B2 (en) 2016-12-20
TWI623055B (zh) 2018-05-01
KR101734821B1 (ko) 2017-05-12

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