SG11201901208RA - Systems and methods for workpiece processing - Google Patents

Systems and methods for workpiece processing

Info

Publication number
SG11201901208RA
SG11201901208RA SG11201901208RA SG11201901208RA SG11201901208RA SG 11201901208R A SG11201901208R A SG 11201901208RA SG 11201901208R A SG11201901208R A SG 11201901208RA SG 11201901208R A SG11201901208R A SG 11201901208RA SG 11201901208R A SG11201901208R A SG 11201901208RA
Authority
SG
Singapore
Prior art keywords
processing
chamber
international
workpieces
loadlock
Prior art date
Application number
SG11201901208RA
Inventor
Michael Yang
Ryan Pakulski
Original Assignee
Mattson Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mattson Tech Inc filed Critical Mattson Tech Inc
Publication of SG11201901208RA publication Critical patent/SG11201901208RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automation & Control Theory (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Turning (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111111111111111111010111 01111101011H011H11111110111111111111111110111111111111 Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\"\" WO 2018/075262 Al 26 April 2018 (26.04.2018) WIP0 I PCT (51) International Patent Classification: DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HO1L 21/67 (2006.01) HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, (21) International Application Number: KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, PCT/US2017/055460 MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (22) International Filing Date: SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, 06 October 2017 (06.10.2017) TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (25) Filing Language: English (84) Designated States (unless otherwise indicated, for every (26) Publication Language: English kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, (30) Priority Data: UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, 62/409,538 18 October 2016 (18.10.2016) US TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FF FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, (71) Applicant: MATTSON TECHNOLOGY, INC. MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, [US/US]; 47131 BAYSIDE PARKWAY, FREMONT, Cal- TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ifornia 94538 (US). KM, ML, MR, NE, SN, TD, TG). (72) Inventors: YANG, Michael; 47131 Bayside Parkway, Fre- mont, California 94538 (US). PAKULSKI, Ryan; 47131 Published: Bayside Parkway, Fremont, California 94538 (US). — with international search report (Art. 21(3)) (74) Agent: WORKMAN, J., Parks; DORITY & MANNING, — P.A., P 0 BOX 1449, GREENVILLE, South Carolina = 29602-1449 (US). = _ (81) Designated States (unless otherwise indicated, for every _ kind of national protection available): AE, AG, AL, AM, = AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, = (54) Title: SYSTEMS AND METHODS FOR WORKPIECE PROCESSING — (57) : Systems and methods for processing workpieces, such as = 100 semiconductor workpieces are provided. One example embodiment is di- 115 rected to a processing system for processing a plurality of workpieces. The = = , plasma processing system can include a loadlock chamber. The loadlock _ 12 = E.. I- = = 122 — = 150 4111111\ Nv I 1 10 34 chamber can include a workpiece column configured to support a plurality of workpieces in a stacked arrangement. The system can further include at -----130 least two process chambers. The at least two process chambers can have at least two processing stations. Each processing station can have a work- 132 piece support for supporting a workpiece during processing in the process chamber. The system further includes a transfer chamber in process flow r : 1_1 loadlock The = 110 ----114 communication with the chamber and the process chamber. transfer chamber includes a rotary robot. The rotary robot can be config- ured to transfer a plurality of workpieces from the stacked arrangement in 5 26 2 Al 111111 -----112 the loadlock chamber to the at least two processing stations. c3b iie-rN 4 _ 118 118 Il 0 ei FIG. 1 C
SG11201901208RA 2016-10-18 2017-10-06 Systems and methods for workpiece processing SG11201901208RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662409538P 2016-10-18 2016-10-18
PCT/US2017/055460 WO2018075262A1 (en) 2016-10-18 2017-10-06 Systems and methods for workpiece processing

Publications (1)

Publication Number Publication Date
SG11201901208RA true SG11201901208RA (en) 2019-05-30

Family

ID=61904701

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901208RA SG11201901208RA (en) 2016-10-18 2017-10-06 Systems and methods for workpiece processing

Country Status (7)

Country Link
US (2) US10580672B2 (en)
JP (2) JP2019537253A (en)
KR (4) KR102650824B1 (en)
CN (1) CN109716498B (en)
SG (1) SG11201901208RA (en)
TW (3) TWI762518B (en)
WO (1) WO2018075262A1 (en)

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JP7254924B2 (en) * 2018-11-19 2023-04-10 マトソン テクノロジー インコーポレイテッド Systems and methods for processing workpieces
US11508560B2 (en) 2019-05-14 2022-11-22 Beijing E-Town Semiconductor Technology Co., Ltd Focus ring adjustment assembly of a system for processing workpieces under vacuum
TWI797461B (en) * 2019-07-26 2023-04-01 日商新川股份有限公司 Packaging device
JP7458212B2 (en) * 2020-03-11 2024-03-29 東京エレクトロン株式会社 Board transport system and board transport method
US20220009102A1 (en) * 2020-07-10 2022-01-13 Divergent Technologies, Inc. Robotic assembly cell
CN113314448B (en) * 2021-05-13 2022-07-22 长江存储科技有限责任公司 Semiconductor transmission apparatus and control method thereof

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Also Published As

Publication number Publication date
US20180108548A1 (en) 2018-04-19
JP2019537253A (en) 2019-12-19
CN109716498A (en) 2019-05-03
TWI762518B (en) 2022-05-01
TW202301525A (en) 2023-01-01
KR20190058469A (en) 2019-05-29
TWI781067B (en) 2022-10-11
US11257696B2 (en) 2022-02-22
KR102498492B1 (en) 2023-02-10
US10580672B2 (en) 2020-03-03
TWI829337B (en) 2024-01-11
JP2021145141A (en) 2021-09-24
WO2018075262A1 (en) 2018-04-26
KR20210027503A (en) 2021-03-10
KR102650824B1 (en) 2024-03-26
KR20210139479A (en) 2021-11-22
CN109716498B (en) 2023-10-24
US20200176288A1 (en) 2020-06-04
TW202226425A (en) 2022-07-01
TW201830543A (en) 2018-08-16
KR20230023061A (en) 2023-02-16

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