KR100851819B1 - Semiconductor wafer transfer robot - Google Patents

Abstract

A semiconductor wafer transfer robot is provided to reduce a volume of a transfer chamber and to secure easily an installation space by driving independently upper and lower transfer robots. A first transfer robot(500) is installed at an upper part of a frame(700) positioned in a center part of a transfer chamber. A second transfer robot(600) is installed at a lower part of the frame to face the first transfer robot. The first transfer robot includes a first main rotary shaft(501) rotated by a first rotary motor, at least two or more first arm parts(502) connected to a lower side of the first main rotary shaft, and a pair of first blades(504) installed at one of the first arm parts. The second transfer robot includes a second main rotary shaft(601) rotated by a second rotary motor, at least two or more second arm parts(602) connected to a lower side of the second main rotary shaft, and a pair of second blades(604) installed at one of the second arm parts. The pair of first blades are positioned on a first plane. The pair of second blades are positioned on a second plane. The first and second planes are different from each other.

Description

Semiconductor Wafer Transfer Robot {SEMICONDUCTOR WAFER TRANSFER ROBOT}

1 is a schematic configuration diagram of a conventional substrate manufacturing system.

2 is a schematic structural diagram of a substrate manufacturing system according to an embodiment of the present invention;

3 is a vertical cutaway view of a semiconductor wafer transfer robot according to an embodiment of the present invention.

4 is a plan view of the semiconductor wafer transfer robot shown in FIG. 3;

5A to 5L are operation state diagrams of the semiconductor wafer transfer robot shown in FIGS. 3 and 4.

<Description of the code used in the main part of the drawing>

320: transfer chamber 330a to 332b: process chamber

333a to 335b: substrate stage 340: substrate transfer module

500: upper transfer robot 600: lower transfer robot

501, 601: main rotation axis 502, 502a, 602, 602a: first arm

503, 503a, 603, 603a: second arm 504, 504a, 604, 604a: blade

700: frame 701: top cover

701a, 702a: perforated groove 702: lower support

702b: base 702c: sidewall

702d: through hole A: central axis

The present invention relates to a semiconductor wafer transfer apparatus, and more particularly, to a transfer chamber for transferring a semiconductor wafer to a process chamber or a semiconductor wafer having a process completed in the process chamber to a load lock chamber in an apparatus provided with a plurality of process chambers. It relates to a semiconductor wafer transfer robot used.

Various processes such as deposition or etching are performed on a wafer, which is a semiconductor substrate, for manufacturing a semiconductor device. Recently, a cluster system in which a polygonal transfer chamber is disposed in the center and a plurality of process chambers are disposed around the center in order to increase the efficiency of the process is mainly used.

In a cluster system, the transfer chamber has a rectangular or other polygonal shape and a transfer robot is installed at the center. A load lock chamber is disposed on one side of the transfer chamber, and process chambers are disposed on the other side.

In early cluster systems, the transfer chamber for transferring semiconductor wafers was limited to the transfer of one wafer into the process chamber. That is, the feed robot is rotated 360 ° using the main rotating shaft, the arm of the feed robot is moved forward and backward using the first arm rotating shaft, the second arm rotating shaft, and the blade rotating shaft, and the main rotating shaft is vertically moved using the vertical movement shaft. And seat the wafer on the blade or seat the wafer seated on the blade in a process chamber or load lock chamber.

Such a method is configured to transfer and process a single wafer through a transfer robot, thereby lowering the productivity of the product. Accordingly, in recent years, development of more various transfer robots has been actively conducted to improve the productivity of the product.

In order to improve the productivity of the product, recently, the dual arm method of transferring and processing two wafers simultaneously is mainly used. As an example of such a dual-arm cluster system has been published the name "substrate manufacturing apparatus and substrate transfer module used therein" of the present invention published in Korea Patent Publication No. 2005-72621.

Referring to FIG. 1, a conventional dual arm type substrate manufacturing system will be described.

The semiconductor wafer processing equipment is equipped with an equipment front end module (EFEM) 10, which is one of wafer handling systems. The EFEM 10 includes a frame 12 and a load station 14 on which a substrate storage container (not shown), such as a front open unified pod (FOUP) 18, is placed. Inside the frame 12, a door opener (not shown) for opening and closing the door of the FOUP 18 is installed, and a transfer robot 16 for transferring a wafer between the FOUP 18 and the process facility 20 is disposed. .

The process facility 20 is for performing one or more processes on a wafer, including a loadlock chamber 120, a transfer chamber 140, and a plurality of process chambers. 160 and substrate transfer module 30 are configured. A transfer chamber 140 having a polygonal shape is disposed in the center of the process facility 20, and a load lock chamber 120 is disposed between the EFEM 10 and the transfer chamber 140 in which wafers to be processed are placed. In addition, a plurality of process chambers 20 that perform a predetermined process on the wafer are disposed on each side of the transfer chamber 140, side by side. The same process is performed in the process chambers 160 arranged side by side, and one substrate stage 102 is placed in each process chamber 160.

The substrate transfer module 30 is disposed in the center of the transfer chamber 140. The substrate transfer module 30 transfers the wafer between the load lock chamber 120 and the process chamber 160 or between adjacent process chambers 160. The substrate transfer module 30 is composed of a rotating body, a rotating body driving unit, and two transfer robots each independently driven. Each transfer robot has a blade and an arm. As shown in FIG. 1, the blades are configured in pairs symmetrical to each other, and can rotate 360 ° in the connecting axis between the arm and the blade.

In other words, the above-described conventional cluster system includes, first, a main axis of rotation for rotating the substrate transfer module 30 by 360 °, each first arm axis of rotation for rotating the first arms connected to each transfer robot, and Each second arm rotation axis for rotating the second arms respectively connected to the first arms, each blade rotation axis for rotating the blades respectively connected to the respective second arms, and the entire substrate transfer module 30 are moved up and down. An 8-axis transfer robot consisting of up and down movement shafts should be used.

In addition, the conventional cluster system takes a pair of first wafers waiting in the load lock chamber 120 in a pair of first blades, and then rotates the blade rotational axis by 180 °, thereby waiting for the other waiting in the load lock chamber 120. The pair of second wafers can be taken from the pair of second blades.

Subsequently, the substrate transfer module 30 is rotated to the position of the process chamber 160 to be transferred, and the wafer mounted on the pair of blades of the first or second blade is transferred to the process chamber 160. At this time, the other pair of blades maintains the standby state, and the wafer mounted on the other pair of blades is not transferred to any other process chamber 160.

When a pair of blades seats a wafer in one of the process chambers 160 and then returns to the substrate transfer module 30, each of the blades is rotated 180 ° so that the pair of wafers mounted on the blades is processed in a different process. It may be transferred to the chamber 160.

However, in the conventional cluster system, when one of the pair of blades is rotated in the direction of 180 ° to the other blade when performing the operation of transferring the wafer can perform a separate operation from the current transfer operation none. Therefore, it is difficult to expect an improvement in the productivity of the wafer.

In addition, eight axes are required to operate the substrate transfer module. Therefore, a large number of motors, rotating shafts, pulleys and gears, etc. are required, which increases the overall volume of the substrate transfer module.

In addition, it is practically very difficult to configure eight axes to operate the substrate transfer module, and even if the actual eight-axis transfer robot is configured, the components become too complicated, and thus, there is a high possibility of failure and repair is not easy in case of failure.

The present invention provides a semiconductor wafer transfer robot having improved productivity by cross-installing a dual arm transfer robot having a simple configuration.

The present invention provides a semiconductor wafer transfer robot having a small volume of a transfer robot installed in a dual arm cluster.

The present invention provides a semiconductor wafer transfer robot that can simplify a configuration and cope with failures quickly.

The present invention provides a semiconductor wafer transfer robot that can easily cope with this even if the wafer transfer positions are different.

The present invention provides a transfer robot installed in a transfer chamber for loading and unloading wafers into a load lock chamber and a process chamber, wherein a plurality of transfer robots are separately installed at approximately a central portion of the transfer chamber, and each transfer robot A main rotation shaft to which the transfer robot is independently rotated by a main rotation motor; At least two arms connected to the main axis of rotation and mutually rotated by a forward and backward motor; And at least one pair of blades connected to the arm and advanced back and forth by cross rotation of the arms, for loading and unloading a wafer.

The transfer robot is installed in a frame installed at an approximately center position of the upper transfer chamber, a first transfer robot of the transfer robot is installed on one side of the frame, and a predetermined distance from the frame in which the first transfer robot is installed. A second transfer robot of the transfer robot is installed at a spaced position.

The first transfer robot and the second transfer robot are provided to face each other.

In addition, the first transfer robot may be installed above the frame, and the second transfer robot may be installed below the frame.

In this case, the first transfer robot, the first main rotating shaft which is installed to rotate in the upper portion of the frame; At least two first arm parts disposed in a lower direction of the first main rotation axis; And a pair of first blades installed in a lower direction of any one of the at least two first arm portions.

In addition, the second transfer robot, the second main rotary shaft is installed to rotate in the lower portion of the frame; At least two second arm portions disposed in an upper direction of the second main rotation shaft; And a pair of second blades installed in an upward direction of any one of the at least two second arm portions.

In addition, the pair of first blades are located on the same plane.

In addition, the pair of second blades are located on the same plane.

In addition, the pair of first blades and the pair of second blades are located on different planes from each other, but the pair of first blades are located at a higher position than the pair of second blades.

On the other hand, the first main axis of rotation further comprises a first connecting shaft for connecting the at least two first arm portion, the first connecting shaft is moved up and down by a vertical movement motor.

The apparatus may further include a second connecting shaft connecting the second main rotational shaft and the at least two second arm parts, wherein the second connecting shaft is vertically moved by a vertical movement motor.

In addition, the at least two arms are independently moved forward and backward by respective forward and backward motors.

Hereinafter, exemplary embodiment (s) of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the elements of each drawing, it should be noted that the same elements are denoted by the same reference numerals as much as possible even if they are displayed on different drawings. In addition, in the following description there are shown a number of specific details, such as components of the specific circuit, which are provided only to help a more general understanding of the present invention that the present invention may be practiced without these specific details. It is self-evident to those of ordinary knowledge in Esau. In describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

2 is a schematic structural diagram of a substrate manufacturing system according to an embodiment of the present invention, FIG. 3 is a vertical cutaway view of a semiconductor wafer transfer robot according to an embodiment of the present invention, and FIG. 4 is shown in FIG. 5 is a plan view of the semiconductor wafer transfer robot, and FIGS. 5A to 5L are operation state diagrams of the semiconductor wafer transfer robot shown in FIGS. 3 and 4.

First, referring to FIG. 2, the overall configuration of the substrate manufacturing system applied to the present invention will be described. As the wafer, which is a semiconductor substrate, is largely cured from 200 mm to 300 mm, the substrate manufacturing system 200 performs a process by complete automation. In the process facility 300, an EFEM 400 is installed as an example of a wafer handling system. The EFEM 400 includes a frame 401 and a load station 403 on which a substrate storage container (not shown) is placed, such as a FOUP 402, on one sidewall thereof. Inside the frame 401, a door opener (not shown) for opening and closing the door of the FOUP 402 is installed, and a transfer robot 404 (typically for conveying a wafer between the FOUP 402 and the process facility 300). "Also known as a large base robot" is installed.

On the other hand, the process facility 300 is to perform one or a plurality of processes for the wafer, the load lock chamber 310, the transfer chamber 320, the process chambers 330 and the substrate transfer module 340 is installed Has a configuration of a cluster system. A transfer chamber 320 having a polygonal shape is installed at the center of the process facility 300. In this case, the transfer chamber 320 may have a quadrangular shape or more polygonal shape depending on the type and scale of the work. In the present invention will be described by limiting the use of the quadrilateral transfer chamber 320, it will be noted that the quadrilateral shape of the transfer chamber 320 is only one embodiment in the configuration of the present invention.

In addition, a plurality of process chambers 330a to 332b are disposed on each side of the transfer chamber 320 to perform a predetermined process on the wafer. Here, the plurality of process chambers 330a to 332b may be configured to all perform the same process, or may be configured to perform different processes depending on the nature of the work or the needs of the operator. In addition, two process chambers 330 to 332 are adjacently installed in pairs according to the configuration of the dual arm transfer robot, and a cycle of wafer manufacturing is performed in the pair of process chambers 330 to 332. In addition, each substrate chamber 330a to 332b includes one substrate stage 333a to 335b.

In addition, the substrate transfer module 340 is installed at the center of the transfer chamber 320. The substrate transfer module 340 transfers wafers between the load lock chamber 310 and the process chamber 330 or between adjacent process chambers 330. That is, as shown in Figure 3 and 4, the substrate transfer module 340 is divided into the upper transfer robot 500 and the lower transfer robot 600 is installed, each transfer robot (500, 600) is independent It is operated individually via a drive source (not shown). Here, the upper and lower transfer robots 500 and 600 may also be referred to as "vacuum conveying robots".

The main rotating shafts 501 and 601 are installed up and down at an approximately central portion of the transfer chamber 320, and have a substantially cylindrical shape.

The main rotation shaft 501 of the upper transfer robot 500 is installed on the upper cover 701 of the frame 700 for fixing the upper and lower transfer robots 500 and 600. The upper cover 701 includes a perforated groove 701a having a substantially central portion perforated, and the main rotating shaft 501 of the upper transfer robot 500 is fitted to the rotatable means such as a bearing after the perforated groove 701a is fitted. Is fixed by the installation. The main rotary shaft 501 is configured to be rotatable 360 ° about the central axis ("A" in FIG. 3) by a main upper main rotary motor (not shown).

In addition, the main rotary shaft 601 of the lower transfer robot 600 is installed similar to the one installed on the main rotary shaft 501 of the upper transfer robot 500. That is, the main rotation shaft 601 of the lower transfer robot 600 is installed on the lower support 702 of the frame 700. The lower support 702 includes a perforated groove 702a in which a substantially central portion of the base 702b is perforated, and a bearing or the like after the main rotation shaft 601 of the lower transfer robot 600 is fitted through the perforated groove 702a. It is fixedly installed by the rotatable means.

In addition, a side wall 702c is formed on the side of the lower support 702, and the cover 701 fixed to the upper transfer robot 500 is coupled to the upper side of the side wall 702c. The side wall 702c formed on the side of the lower support 702 is formed with a through hole 702d having a predetermined size so that the arm and the blade to be described later are not obstructed, and the through hole 702d is formed in a process chamber (if necessary). 330 and the load lock chamber 310 may be configured to be open in the installation direction.

The upper main rotating shaft 501 of the upper transfer robot 500 is configured with an upper connecting shaft 505 extending downward from the center axis ("A") position, and the first connecting shaft 505 has a first end at the end thereof. One side of the upper arms 502 and 502a is coupled. The other side of the first upper arm 502, 502a is coupled to one side of the second upper arm 503, 503a, and the other side of the second upper arm 503, 503a is coupled to the upper blade 504, 504a, respectively. . In this case, the first upper arms 502 and 502a may be configured to be directly connected to the upper main rotation shaft 501.

The first upper arms 502, 502a, the second upper arms 503, 503a, and the upper blades 504, 504a of the upper transfer robot 500 are coupled to be interlocked with each other by an interlocking means such as a pulley and a gear. The rotational state is interlocked by a first upper back and forth motor (not shown). That is, when the first upper arm 502 rotates in the clockwise direction, the second upper arm 503 rotates in the counterclockwise direction, and the upper blade 504 rotates in the clockwise direction with each of the arms 502 and 503. The blade 504 is coupled by a pulley and a gear. Further, when the first upper arm 502 rotates clockwise, the paired first upper arms 502a rotate counterclockwise by a second upper forward and backward motor (not shown), and the second The upper arm 503a is rotated clockwise, and the upper blade 504a is rotated counterclockwise so that the spacing between the pair of blades 504, 504a is always kept constant while the blades 504, 504a are loaded lock chamber. It is configured to move forward or backward to either 310 or the process chambers 330a to 332b.

The configuration of the lower transfer robot 600 also has the same configuration as that of the upper transfer robot 500. That is, the lower main rotating shaft 601 of the lower transfer robot 600 is configured with a lower connecting shaft 605 extending upward from the center axis ("A") position, and at the end of the lower connecting shaft 605. One side of the first lower arms 602 and 602a is coupled. The other side of the first lower arm 602, 602a is coupled to one side of the second lower arm 603, 603a, and the other side of the second lower arm 603, 603a is coupled to the lower blade 604, 604a, respectively. . In this case, the first lower arms 602 and 602a may be configured to be directly connected to the lower main rotation shaft 601.

The first lower arms 602 and 602a, the second lower arms 603 and 603a and the lower blades 604 and 604a of the lower transfer robot 600 are coupled to be interlocked with each other by an interlocking means such as a pulley and a gear. The rotational state is interlocked by a first lower forward and backward motor (not shown). That is, when the first lower arm 602 rotates in the clockwise direction, the second lower arm 603 rotates in the counterclockwise direction, and the lower blade 604 rotates in the clockwise direction with the respective arms 602 and 603. The blade 604 is coupled by a pulley and a gear. Also, when the first lower arm 602 rotates clockwise, the paired first lower arms 602a rotate counterclockwise by a second lower forward and backward motor (not shown), and the second The lower arm 603a is rotated clockwise and the lower blade 604a is rotated counterclockwise so that the spacing between the pair of blades 604, 604a remains constant while the blades 604, 604a remain in the load lock chamber. It is configured to move forward or backward to either 310 or the process chambers 330a to 332b.

In addition, the main rotation axis 501 of the upper transfer robot 500 is moved in the vertical direction by the upper vertical movement motor (not shown). The lower transfer robot 500 also moves the main rotating shaft 601 in the vertical direction by the lower vertical movement motor, which is not shown.

That is, the transfer robot of the present invention is configured such that the upper transfer robot 500 and the lower transfer robot 600 are operated separately, and the arms 502 and 503 and the blade 504 of the upper transfer robot 500 are different from each other. It is driven independently of the pair of arms 502a and 503a and the blade 504a. Similarly, the arms 602 and 603 and the blade 604 of the lower transfer robot 600 are driven independently of the other pair of arms 602a and 603a and the blade 604a.

In addition, the transfer robot of the present invention is a pair of the upper main rotary shaft 501 for rotating the entire upper transfer robot 500, and the front and rear of the respective arms (502, 502a, 503, 503a) and the blades (504, 504a) , The upper transfer robot 500 having four axes including a forward and backward axis of movement, an up and down movement shaft for moving the upper transfer robot 500 up and down, a lower main rotation shaft 601 for rotating the entire lower transfer robot 600, and each arm. Four-axis lower transfer robot 600 consisting of a pair of forward and backward axes for moving forward and backward through 602, 602a, 603, and 603a and the blades 604 and 604a, and a vertical movement axis for moving the lower transfer robot 600 up and down. These are installed so as to be symmetrical with each other on the upper and lower sides of the frame 700.

An operation according to an embodiment of the present invention having the above-described configuration will be described in detail with reference to FIGS. 5A to 5E.

First, since the pretreatment process represented by the EFEM 400 is the same as a conventional pretreatment process, it will be briefly described.

A plurality of wafers loaded in the FOUP 402 are positioned to be transferred through the load station 403, and the transfer robot 404 installed in the EPEM 400 loads a pair of wafers loaded in the FOUP 402 into the load lock chamber. Transfer to 310.

In addition, when the wafer processed by the process facility 300 is transferred to the load lock chamber 310, the transfer robot 404 collects the wafer placed in the load lock chamber 301 and loads the wafer again in the FOUP 402. Repeat this process repeatedly.

On the other hand, when a new wafer (W1) is loaded in the load lock chamber 310, any one of the upper and lower transfer robot (500, 600) in the transfer chamber 320 in the direction in which the load lock chamber 310 is installed It rotates to load the new wafer W1 loaded in the load lock chamber 310. For example, when the upper transfer robot 500 wants to load a new wafer W1 loaded in the load lock chamber 310, the blades 504 and 504a of the upper transfer robot 500 each have a load lock chamber ( The upper main axis of rotation is rotated to face each wafer W1 in 310. Subsequently, when the first upper arms 502 and 502a are rotated clockwise or counterclockwise in the direction in which the first upper arms 5002 and 502a approach each other, the second upper arms 503 and 503a become the first upper arm. It rotates in the opposite direction to the arms 502, 502a, and eventually the blades 504, 504a are advanced in the direction of the load lock chamber 310.

When the approximately center of the blades 504 and 504a reaches the approximately center of the wafer W1 loaded on the load lock chamber 310, the main rotating shaft 501 of the upper transfer robot 500 is moved upward, and the wafer is moved upward. The wafer W1 is lifted up, and thus the wafer W1 is loaded on the upper blades 504 and 504a (see FIG. 5A above).

Thereafter, when the first upper arms 5002 and 502a of the upper transfer robot 500 are rotated clockwise or counterclockwise in a direction away from each other, the second upper arms 503 503a rotates in the opposite direction to the first upper arms 502, 502a, and eventually the blades 504, 504a retreat from the load lock chamber 310 (see FIG. 5B above).

When the blade is retracted until the upper transfer robot 500 rotates in the transfer chamber 320 without any problems, the main rotation axis 501 of the upper transfer robot 500 is rotated by a predetermined angle (90 ° and 180 ° in FIG. 5). , 270 °) so that the blades 504 and 504a on which the wafer W1 is loaded are positioned in any of the process chambers 330a to 332b, and the blade ( The wafers W1 are positioned in the process chambers 330a to 332b by advancing 504 and 504a. When the blades 504 and 504a are located in any one of the process chambers 330a to 332b, the upper main rotation shaft 501 of the upper transfer robot 500 is moved downward, and the wafer W1 is moved to the process chamber 330a. It is unloaded to the substrate stages (any one of 333a to 335b) in any one of ˜332b (see FIG. 5C above).

Meanwhile, as described above, the lower transfer robot 600 may perform any task regardless of the operation of the upper transfer robot 500 while the upper transfer robot 500 performs the operation. That is, the lower transfer robot 600 takes a new wafer W2 from the load lock chamber 310 as described above, and moves the process chambers 330a to 332b which are in operation in the upper transfer robot 500. The wafer W2 may be loaded in any one of the remaining process chambers except the wafer W3, and the wafer W3, which has been processed, may be extracted from the process chambers 330a through 332b and unloaded into the load lock chamber 310. (See FIG. 5D above). On the other hand, the above-described process may be repeated sequentially or discontinuously for each process chamber (330a ~ 332b) until the process is completed for all the wafers in the load lock chamber (310). This process is well illustrated in Figures 5e-5l.

Here, in representing the wafers W1 to W3, the wafers with an empty interior in FIG. 5 are wafers in which the process is not performed, and the wafers in which the inside is hatched in one direction are wafers in a process in progress, and Wafers shaded in both directions are wafers in which the process is completed.

In addition, the transfer robot of the present invention is that the left arms 502, 503, 602a, 603a and the left blades 504, 604a are independent of the right arms 502a, 503a, 602, 603 and the right blades 504a, 604. Since each of the wafers W1 to W3 is positioned at the center of the process chambers 330a to 332b, the wafers W1 to W3 may be individually controlled. The technique for detecting the center point of the wafer is well represented in the "Wafer Processing Apparatus and Method" of Korean Patent Publication No. 1998-42482, and corresponds to a technique sufficiently well known by many previous materials.

And, the main rotary motor for driving the main rotary shaft (501, 601) of the upper and lower transfer robot (500, 600), respectively, the first arms (502, 502a, 602, 602a) and the second arms (503, 503a, Forward and backward motors for driving the second arms 503, 503a, 603, 603a and the blades 504, 504a, 604, 604a, respectively, while driving the 603, 603a, respectively, and the main shaft 5001. It is noted that the configuration of the vertical movement motors for vertically transferring the 601 is a conventional technique that has been proposed in a conventional transfer robot.

As described above, although the specific embodiment (s) have been described in the detailed description of the present invention, various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiment (s), but should be defined by the appended claims and equivalents thereof.

According to the present invention, a pair of four-axis transfer robots are installed on the upper side and the lower side of the transfer chamber, respectively, and the pair of four-axis transfer robots are independently driven so that the lower transfer robot moves upward while the upper transfer robot performs the process. Productivity is improved because independent processes can be performed regardless of the robot's work.

The present invention is divided into the upper and lower sides of the pair of four-axis transfer robot transfer chamber, respectively, the volume of the transfer chamber is small, it is easy to ensure a space to install the process equipment.

According to the present invention, four-axis transfer robots are separately installed on the upper side and the lower side of the transfer chamber, thereby simplifying the configuration of the transfer robots, thereby simplifying the repair work of the transfer robots in the event of a failure, and promptly coping with a failure. .

According to the present invention, since the dual arms of the upper transfer robot and the lower transfer robot are installed to be moved in the front-rear direction by their respective axes, even if the transfer positions of the wafers are different, they can be easily coped with.

Claims (9)

A transfer robot installed in a transfer chamber for loading and unloading wafers into a load lock chamber and a process chamber, The transfer robot includes a first transfer robot installed on an upper portion of the frame installed at an approximately center portion of the transfer chamber and a second transfer robot disposed below the frame opposite to the first transfer robot. The first transfer robot is installed so as to rotate on the upper portion of the frame, and is connected to the first main rotation axis, the lower direction of the first main rotation axis, the first transfer robot is independently rotated by a first main rotation motor, At least two first arm portions mutually rotated by an upper and rearward motor, and a pair of first blades installed in a lower direction of any one of the at least two first arm portions, The second transfer robot is installed to rotate in the lower portion of the frame, and is connected by a second main rotation motor to the second main rotary shaft, the upper direction of the second main rotary shaft independent rotation, At least two or more second arm parts mutually rotated by a lower forward and backward motor, and a pair of second blades installed in an upward direction of any one of the at least two or more second arm parts, And the pair of first blades are located on a first plane, the pair of second blades are located on a second plane, and the first plane and the second plane are different planes. Wafer Transfer Robot. delete delete delete delete The method of claim 1, The pair of first blades and the pair of second blades are located on different planes from each other, And the pair of first blades is positioned at a higher position than the pair of second blades. The method of claim 1, Further comprising a first connecting shaft connecting the first main rotational axis and the at least two first arm portion, The first connecting shaft is a semiconductor wafer transfer robot that is moved up and down by a vertical movement motor. The method of claim 1, And a second connecting shaft connecting the second main rotational shaft and the at least two second arm parts. The second connecting shaft is a semiconductor wafer transfer robot that is moved up and down by a vertical movement motor. The method of claim 1, The at least two cancers, A semiconductor wafer transfer robot that is independently moved back and forth by each forward and backward motor.

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