CN105009225B - 具有电磁干扰减轻特性的聚合物复合物 - Google Patents
具有电磁干扰减轻特性的聚合物复合物 Download PDFInfo
- Publication number
- CN105009225B CN105009225B CN201480009672.7A CN201480009672A CN105009225B CN 105009225 B CN105009225 B CN 105009225B CN 201480009672 A CN201480009672 A CN 201480009672A CN 105009225 B CN105009225 B CN 105009225B
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- China
- Prior art keywords
- particle
- polymer
- matrix
- fluorocarbon
- compound
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- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361767482P | 2013-02-21 | 2013-02-21 | |
| US61/767,482 | 2013-02-21 | ||
| PCT/US2014/016828 WO2014130431A2 (en) | 2013-02-21 | 2014-02-18 | Polymer composites with electromagnetic interference mitigation properties |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105009225A CN105009225A (zh) | 2015-10-28 |
| CN105009225B true CN105009225B (zh) | 2019-08-16 |
Family
ID=50239981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480009672.7A Expired - Fee Related CN105009225B (zh) | 2013-02-21 | 2014-02-18 | 具有电磁干扰减轻特性的聚合物复合物 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US9704613B2 (https=) |
| EP (1) | EP2959490A2 (https=) |
| JP (2) | JP2016515298A (https=) |
| CN (1) | CN105009225B (https=) |
| WO (1) | WO2014130431A2 (https=) |
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| WO2014025949A2 (en) | 2012-08-09 | 2014-02-13 | Trinder Ii Kenneth Gauthier | Antimicrobial solid surfaces and treatments and processes for preparing the same |
| EP3085215B1 (en) | 2013-12-18 | 2019-09-04 | 3M Innovative Properties Company | Electromagnetic interference (emi) shielding products using titanium monoxide (tio) based materials |
| WO2016039830A1 (en) * | 2014-09-12 | 2016-03-17 | Sabic Global Technologies B.V. | Use of ambient-robust solution processing for preparing nanoscale organic ferroelectric films |
| EP3308614B1 (en) | 2015-06-09 | 2020-08-19 | 3M Innovative Properties Company | High frequency electromagnetic interference (emi) composites |
| CN108475552B (zh) | 2015-12-29 | 2022-07-12 | 3M创新有限公司 | 用于高频电磁干扰(emi)应用的复合物 |
| AT518664B1 (de) * | 2016-04-22 | 2017-12-15 | Trench Austria Gmbh | HGÜ-Luftdrosselspule und Verfahren zur Herstellung |
| WO2018081394A1 (en) | 2016-10-31 | 2018-05-03 | 3M Innovative Properties Company | High-dielectric-loss composites for electromagnetic interference (emi) applications |
| JP6757973B2 (ja) * | 2016-11-18 | 2020-09-23 | 独立行政法人国立高等専門学校機構 | 複合素子の製造方法 |
| CN106793727A (zh) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | 一种电磁屏蔽膜及其制备方法 |
| US11434381B2 (en) | 2017-03-06 | 2022-09-06 | Bic-Violex Sa | Coating |
| CN107129736B (zh) * | 2017-04-17 | 2019-11-12 | 中国人民解放军61489部队 | 一种具有辐射屏蔽能力的放射性沾染控制与清除材料 |
| CN107249291B (zh) * | 2017-06-22 | 2019-02-05 | 朱勇 | 电力调度自动化系统用电磁屏蔽材料 |
| CN107135641A (zh) * | 2017-07-11 | 2017-09-05 | 苏州城邦达力材料科技有限公司 | 一种新型非金属体系的电磁屏蔽膜及其制备方法 |
| CN107172873A (zh) * | 2017-07-11 | 2017-09-15 | 苏州城邦达力材料科技有限公司 | 一种导电高分子材料电磁屏蔽膜及其制备方法 |
| JP7286623B2 (ja) * | 2018-03-30 | 2023-06-05 | ダイキン工業株式会社 | 電波吸収材料および電波吸収シート |
| WO2019193528A1 (en) | 2018-04-06 | 2019-10-10 | 3M Innovative Properties Company | Radar standing wave dampnening components and systems |
| JP6588596B2 (ja) * | 2018-05-07 | 2019-10-09 | 藤森工業株式会社 | 粘着剤層及び粘着フィルム |
| US11873403B2 (en) | 2018-05-16 | 2024-01-16 | 3M Innovative Properties Company | Electric field grading composition, methods of making the same, and composite articles including the same |
| JP7264391B2 (ja) * | 2018-07-11 | 2023-04-25 | 北川工業株式会社 | 熱伝導組成物 |
| CN109111873A (zh) * | 2018-08-06 | 2019-01-01 | 广州市花林景观工程有限公司 | 具有电磁屏蔽效果的建筑用塑料卷材 |
| CN109021854A (zh) * | 2018-08-06 | 2018-12-18 | 广州市花林景观工程有限公司 | 一种半导电塑料卷材结构 |
| CN108912966A (zh) * | 2018-08-06 | 2018-11-30 | 广州市花林景观工程有限公司 | 用于卫生间的多功能涂料的制备方法 |
| US12022642B2 (en) | 2018-08-21 | 2024-06-25 | Laird Technologies, Inc. | Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes |
| EP4350442A3 (en) * | 2018-08-21 | 2024-07-03 | Laird Technologies, Inc. | Patterned materials and films and systems and methods for making the same |
| WO2020170608A1 (ja) * | 2019-02-20 | 2020-08-27 | 住友金属鉱山株式会社 | 電磁波吸収材料及び電磁波吸収体 |
| JP6733857B1 (ja) * | 2019-02-20 | 2020-08-05 | 住友金属鉱山株式会社 | 電磁波吸収材料及び電磁波吸収体 |
| EP3942574B1 (en) | 2019-03-18 | 2023-11-15 | 3M Innovative Properties Company | Multilayer electric field grading article, methods of making the same, and articles including the same |
| JP6733858B1 (ja) * | 2019-04-15 | 2020-08-05 | 住友金属鉱山株式会社 | 電磁波吸収材料及び電磁波吸収体 |
| WO2020213215A1 (ja) * | 2019-04-15 | 2020-10-22 | 住友金属鉱山株式会社 | 電磁波吸収材料及び電磁波吸収体 |
| CN110157346B (zh) * | 2019-05-06 | 2021-05-07 | 费植煌 | 一种含石墨烯的装饰膜 |
| JP2019206726A (ja) * | 2019-09-12 | 2019-12-05 | 藤森工業株式会社 | 粘着剤層及び粘着フィルム |
| CN111826617A (zh) * | 2019-11-06 | 2020-10-27 | 深圳科诺桥科技股份有限公司 | 电磁波屏蔽膜及其制备方法 |
| JP7737984B2 (ja) * | 2020-05-29 | 2025-09-11 | 京セラ株式会社 | 樹脂組成物及び電子部品 |
| US12604449B2 (en) | 2020-12-29 | 2026-04-14 | 3M Innovative Properties Company | Electromagnetic absorbing composites |
| CN112920451B (zh) * | 2021-02-09 | 2021-11-16 | 复旦大学 | 一种金属碳化物太赫兹电磁屏蔽复合材料及其制备方法 |
| WO2022181615A1 (ja) | 2021-02-25 | 2022-09-01 | 三井化学株式会社 | 電磁波吸収熱伝導性材料、及び電磁波吸収熱伝導性筐体 |
| US12394911B2 (en) | 2021-04-08 | 2025-08-19 | 3M Innovative Properties Company | Anti-reflective assemblies |
| CN116162373B (zh) * | 2022-11-01 | 2023-11-10 | 开滦(集团)有限责任公司 | 一种基于二茂铁基聚合物包覆MXene复合材料的聚甲醛涂料及制备方法和应用 |
| EP4421866A1 (en) * | 2023-02-24 | 2024-08-28 | Infineon Technologies AG | Radio frequency semiconductor device and method for fabricating a radio frequency semiconductor device |
| CN116675560A (zh) * | 2023-05-24 | 2023-09-01 | 中国人民解放军海军工程大学 | 一种高温泡沫陶瓷复合结构吸波材料及其制备方法 |
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| WO2012092200A2 (en) * | 2010-12-28 | 2012-07-05 | Saint-Gobain Performance Plastics Corporation | Polymers with metal filler for emi shielding |
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-
2014
- 2014-02-18 CN CN201480009672.7A patent/CN105009225B/zh not_active Expired - Fee Related
- 2014-02-18 EP EP14709033.6A patent/EP2959490A2/en not_active Withdrawn
- 2014-02-18 JP JP2015558903A patent/JP2016515298A/ja active Pending
- 2014-02-18 WO PCT/US2014/016828 patent/WO2014130431A2/en not_active Ceased
- 2014-02-18 US US14/769,554 patent/US9704613B2/en not_active Expired - Fee Related
-
2017
- 2017-06-07 US US15/616,272 patent/US10340054B2/en not_active Expired - Fee Related
-
2019
- 2019-04-03 JP JP2019071096A patent/JP2019143149A/ja active Pending
- 2019-05-21 US US16/418,214 patent/US20190279783A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074668A (ja) * | 2010-08-30 | 2012-04-12 | Ist Corp | 電波吸収体の製造方法、電波吸収体 |
| WO2012092200A2 (en) * | 2010-12-28 | 2012-07-05 | Saint-Gobain Performance Plastics Corporation | Polymers with metal filler for emi shielding |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014130431A3 (en) | 2014-11-20 |
| US20170271040A1 (en) | 2017-09-21 |
| US20190279783A1 (en) | 2019-09-12 |
| US20160019996A1 (en) | 2016-01-21 |
| EP2959490A2 (en) | 2015-12-30 |
| JP2019143149A (ja) | 2019-08-29 |
| JP2016515298A (ja) | 2016-05-26 |
| US9704613B2 (en) | 2017-07-11 |
| CN105009225A (zh) | 2015-10-28 |
| WO2014130431A2 (en) | 2014-08-28 |
| US10340054B2 (en) | 2019-07-02 |
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