CN104919346B - 光传输模块和摄像装置 - Google Patents

光传输模块和摄像装置 Download PDF

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Publication number
CN104919346B
CN104919346B CN201480004872.3A CN201480004872A CN104919346B CN 104919346 B CN104919346 B CN 104919346B CN 201480004872 A CN201480004872 A CN 201480004872A CN 104919346 B CN104919346 B CN 104919346B
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CN
China
Prior art keywords
substrate
vcsel
conversion element
transmission module
photoelectric conversion
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CN201480004872.3A
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English (en)
Chinese (zh)
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CN104919346A (zh
Inventor
本原宽幸
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Olympus Corp
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Olympus Corp
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00011—Operational features of endoscopes characterised by signal transmission
    • A61B1/00013—Operational features of endoscopes characterised by signal transmission using optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • H04B10/2589—Bidirectional transmission
    • H04B10/25891—Transmission components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Surgery (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Radiology & Medical Imaging (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Pathology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Endoscopes (AREA)
  • Semiconductor Lasers (AREA)
CN201480004872.3A 2013-01-18 2014-01-14 光传输模块和摄像装置 Active CN104919346B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-007805 2013-01-18
JP2013007805A JP6300442B2 (ja) 2013-01-18 2013-01-18 光伝送モジュールおよび撮像装置
PCT/JP2014/050425 WO2014112461A1 (ja) 2013-01-18 2014-01-14 光伝送モジュールおよび撮像装置

Publications (2)

Publication Number Publication Date
CN104919346A CN104919346A (zh) 2015-09-16
CN104919346B true CN104919346B (zh) 2018-07-06

Family

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Application Number Title Priority Date Filing Date
CN201480004872.3A Active CN104919346B (zh) 2013-01-18 2014-01-14 光传输模块和摄像装置

Country Status (5)

Country Link
US (1) US9762329B2 (enExample)
EP (1) EP2947486A4 (enExample)
JP (1) JP6300442B2 (enExample)
CN (1) CN104919346B (enExample)
WO (1) WO2014112461A1 (enExample)

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WO2016151813A1 (ja) * 2015-03-25 2016-09-29 オリンパス株式会社 光伝送モジュールおよび内視鏡
WO2018092234A1 (ja) 2016-11-17 2018-05-24 オリンパス株式会社 光モジュール、撮像モジュールおよび内視鏡
WO2018092233A1 (ja) * 2016-11-17 2018-05-24 オリンパス株式会社 光モジュール、撮像モジュールおよび内視鏡
CN106443912B (zh) * 2016-12-15 2018-10-02 华进半导体封装先导技术研发中心有限公司 一种光互联模块
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WO2018173261A1 (ja) * 2017-03-24 2018-09-27 オリンパス株式会社 内視鏡および光電複合モジュール
WO2019077643A1 (ja) 2017-10-16 2019-04-25 オリンパス株式会社 内視鏡および内視鏡システム
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WO2020217351A1 (ja) * 2019-04-24 2020-10-29 オリンパス株式会社 内視鏡用撮像装置、および、内視鏡
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EP3901677A1 (en) * 2020-04-21 2021-10-27 Koninklijke Philips N.V. Optical transmission of signals to or from an electronic element
US11327237B2 (en) 2020-06-18 2022-05-10 Apple Inc. Display-adjacent optical emission or reception using optical fibers
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US11839133B2 (en) 2021-03-12 2023-12-05 Apple Inc. Organic photodetectors for in-cell optical sensing
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Also Published As

Publication number Publication date
JP2014137584A (ja) 2014-07-28
CN104919346A (zh) 2015-09-16
EP2947486A4 (en) 2016-04-20
WO2014112461A1 (ja) 2014-07-24
EP2947486A1 (en) 2015-11-25
JP6300442B2 (ja) 2018-03-28
US20150318924A1 (en) 2015-11-05
US9762329B2 (en) 2017-09-12

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