CN104870684A - 切削工具用多层薄膜和包含其的切削工具 - Google Patents

切削工具用多层薄膜和包含其的切削工具 Download PDF

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CN104870684A
CN104870684A CN201380068184.9A CN201380068184A CN104870684A CN 104870684 A CN104870684 A CN 104870684A CN 201380068184 A CN201380068184 A CN 201380068184A CN 104870684 A CN104870684 A CN 104870684A
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multilayer film
film
cutting tool
thin film
cycle
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CN104870684B (zh
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安承洙
朴帝勋
康在勋
李成九
安鲜蓉
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Korloy Inc
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Abstract

本发明提供一种切削工具用多层薄膜，其中厚度为几纳米至几十纳米的微尺寸薄膜交替堆积，所述多层薄膜具有较少的品质变动且能够实现优异的耐磨性。本公开的多层薄膜是切削工具用多层薄膜，其中，分别由薄层A、B、C和D形成的多个单元薄膜堆积了超过一次，薄层的弹性模量k满足如下关系：kA>kB，kD>kC或kC>kB，kD>kA，薄层的晶格参数L满足如下关系：LA,LC>LB,LD或LB,LD>LA,LC，并且晶格参数的最大值和最小值之间的差为20％以下。

Description

切削工具用多层薄膜和包含其的切削工具
技术领域
本发明涉及一种切削工具用多层薄膜，更具体地，涉及厚度为几纳米至几十纳米的超晶格薄膜以A-B-C-D或A-B-C-B形式堆积而成的切削工具用多层薄膜，所述多层薄膜具有较少的品质变动并且能够实现优异的耐磨性。
背景技术
自从20世纪80年代后期，为了开发出高硬度的切削工具材料，已经提出多种TiN系多层膜系统。
作为一个实例，通过将TiN或VN反复交替堆积成几纳米的厚度而形成的多层膜形成了所谓的超晶格，尽管各单层具有不同的晶格参数，但上述超晶格具有单一的晶格参数，且各层之间具有共格界面；并且此涂层可实现各单层的常规硬度的两倍以上的高硬度，所以，为了将此现象应用于切削工具用薄膜，已进行了多种尝试。
用于这些超晶格涂层的强化机制的实例包括Koehler模型、Hall-Petch关系和相干应变(Coherency strain)模型，并且这些强化机制涉及在交替沉积A和B材料时通过A和B的晶格参数之间的差异、A和B的弹性模量之间的差异和对A和B的堆积周期的控制来提高硬度。
通常，难以通过交替堆积两种材料来应用上述强化机制中的两种以上机制。特别而言，在多层薄膜的堆积周期在批次(lot)内和批次之间具有严重偏差的大规模生产条件下，难以制造具有优异耐磨性和均一品质的多层薄膜。
相应地，如图1所示，在通过交替堆积两种以上材料形成多层薄膜时，如美国专利第5,700,551号所公开的，通常是常规地以使弹性周期(elastic period)和晶格周期(lattice period)彼此一致的方式进行堆积。然而，在此情况中，难以同时利用前述多种强化机制，因此提高多层膜的耐磨性具有限制。
发明内容
技术问题
本公开的目的是，在形成由超晶格形成的多层薄膜时，提供一种切削工具用多层薄膜和覆盖有所述多层薄膜的切削工具，所述多层薄膜与常规超晶格涂层相比提高了耐磨性，其中，通过调节多层薄膜的晶格周期和弹性周期使两个以上的薄膜强化机制作用于所述多层薄膜。
技术方案
为了解决上述技术问题，本公开提供一种切削工具用多层薄膜，其中，分别由薄层A、B、C和D形成的多个单元薄膜堆积了超过一次，其中，所述薄层的弹性模量k满足如下关系：kA>kB，kD>kC，或kC>kB，kD>kA，所述薄层的晶格参数L满足如下关系：LA,LC>LB,LD，或LB,LD>LA,LC，并且晶格参数L的最大值和最小值之间的差为20％以下。
本公开的多层薄膜中，所述多层薄膜的平均晶格周期λL可以为其平均弹性周期λk的一半。
本公开的多层薄膜中，所述单元薄膜的厚度可以是4nm～至50nm，更优选10nm～30nm。
本公开的多层薄膜中，薄层B和D可由相同的材料形成。
另外，本公开提供一种切削工具，所述切削工具的表面被所述多层薄膜覆盖。
有益效果
根据本公开，在以将四个以上的单元薄膜层层积成膜并随后将该层积的膜反复堆积成两个以上的层的方式形成超晶格多层薄膜时，如图2中那样，控制弹性模量和晶格参数的堆积周期随单元薄膜堆积周期的变化，以使得两个以上的强化机制作用于该多层薄膜。相应地，提供一种切削工具用多层薄膜，其与单个强化机制所作用的多层薄膜相比，具有较少的品质变动和改进的耐磨性。
附图说明
图1表示了常规的超晶格多层薄膜中的弹性周期和晶格周期之间的关系。
图2表示了本发明的超晶格多层薄膜中的弹性周期和晶格周期之间的关系。
图3是表示晶格参数随(Ti1-xAlx)N系薄膜中的铝含量的变化的图。
图4是示出了本公开实施例1的多层薄膜和比较例的多层薄膜的切削性能测试结果的照片。
图5是示出了本公开实施例2的多层薄膜和比较例的多层薄膜的切削性能测试结果的照片。
具体实施方式
以下，根据优选实施方法来详细描述本公开，但本发明构思并不限于以下实施方式。
本发明人发现，当在堆积单元薄膜时将弹性周期和晶格周期调整为彼此不同而不是使这两个周期相互一致时，可以使两种以上的强化机制(即，Koehler模型机制和Hall-Petch关系机制)有效地作用于特别是层积后的超晶格薄膜，由此，相比于主要以单个强化机制作用的多层薄膜，这种多层薄膜的耐磨性有所提高，并且减少了大量生产中的品质变动，以此最终完成了本发明。
本公开的多层薄膜是一种切削工具用多层薄膜，其中，分别由薄层A、B、C和D形成的多个单元薄膜依次堆积而形成的薄膜反复堆积成两层以上，其中，所述单元薄膜的弹性模量k满足如下关系：kA>kB，kD>kC，或kC>kB，kD>kA，所述单元薄膜的晶格参数L满足如下关系：LA,LC>LB,LD，或LB,LD>LA,LC，并且晶格参数L的最大值和最小值之间的差为20％以下。
图2表示了本公开的超晶格多层薄膜中的弹性周期和晶格周期之间的关系的实例。如图2所示，可看出该超晶格多层薄膜不同于图1：弹性周期(蓝色)为晶格周期(红色)的约两倍，因此弹性周期和晶格周期并不彼此一致。
在关于弹性模量的Koehler模型中，描述了当薄膜A和B的厚度变为足够小从而小于或等于20～30nm(相当于大约100个原子层的厚度，即难以产生位错的临界厚度)的时候，会产生强化效果。本发明的构思是将弹性周期和晶格参数周期调节为相互不一致以使得可以产生两种强化机制。
此外，当晶格参数L的最大值和最小值之差大于20％的时候，难以形成超晶格。因此，如有可能，优选调整晶格参数以使所产生的差异在20％以下的范围内。
本公开的多层薄膜意指：由四个层形成多个单元薄膜，各单元薄膜的堆积可按照A-B-C-D或A-B-C-B的顺序形成。即，第二层和第四层可以由不同的材料或相同的材料形成。
另外，使平均弹性周期和平均晶格参数周期之间的差异落入本公开的范围之内，优选地，所述平均弹性周期可以为所述平均晶格周期的两倍。
实施例
在形成超晶格多层薄膜(其中，由四个单元薄膜形成的薄膜反复堆积成两层以上)之前，为了确认各单元薄膜的弹性模量，沉积单层薄膜来测量各单元薄膜的弹性模量。结果显示在表1中。
使用电弧离子镀(其为物理气相沉积(PVD))来沉积单元薄膜。将初始真空压力减少至8.5×10-5托以下，然后注入N2作为反应气体，然后在40毫托以下(优选10毫托至35毫托)的反应气体压力、400℃至600℃的温度和-30V至-150V的基体偏压的条件下进行沉积。
表1
薄膜 目标组成(原子％) 弹性模量k(GPa)
TiN Ti＝99.9 416
TiAlN Ti:Al＝75:25 422
TiAlN Ti:Al＝50:50 430
AlTiN Ti:Al＝33:67 398
CrN Cr＝99.9 475
CrAlN Cr:Al＝50:50 367
AlCrN Cr:Al＝30:70 403
AlCrSiN Cr:Al:Si＝30:65:5 338
构成多层薄膜的各单元薄膜的晶格参数可以在形成单层薄膜后使用XRD分析来获得，但在本公开的实施方式中，各单元薄膜的晶格参数是使用从现有实验和理论获得的原子、离子和共价半径来确定的。具体而言，晶格参数是根据原子比例定量地将共价半径应用到B1HCP结构中而计算得到的。
如图3所示，在(Ti1-xAlx)N系薄膜的情况中，随着铝含量增加，晶格参数倾向于近似线性地减少，因此(Ti1-xAlx)N系薄膜的晶格参数可通过下述方程1获得。
[方程1]
晶格参数:(x是铝的摩尔比例)
实施例1
本公开的实施例1中，将通过本公开的方法形成的TiAlN系多层薄膜的情况与通过常规方法形成的TiAlN系多层薄膜的情况进行比较。
多层薄膜的堆积结构和组成的设定如下述表2所示。将由四个单元薄膜层形成的薄膜反复堆积总共180次，以使平均晶格周期为5至10nm、弹性周期为10至20nm，从而得到最终膜厚度为2.6至3.2μm的多层薄膜。在此情况中，使用A30(型号SPKN1504EDSR，其为可从Korloy获得的P30材料)作为沉积多层薄膜的基体。
表2
在表2中，晶格参数的单位是弹性模量的单位是GPa。
在对上述沉积的多层薄膜的切削性能评估中，使用SKD11(宽：100mm，长：300mm)作为加工件，在切削速度为250m/min、每齿进刀量(feed)为0.2mm/齿且进刀量为2mm的干式条件下进行切削。切削性能通过比较900mm机械加工后的磨损来评估。结果显示在图4中。
如图4所示，可看出在对SKD11的机械加工期间，磨损主要发生为月牙洼磨损，可确认：与比较例1-2至1-5相比，实施例1-1中的月牙洼磨损性有所改善。
实施例2
在本公开的实施例2中，将通过本公开的方法形成的AlCr系多层薄膜的情况与通过常规方法形成的AlCr系多层薄膜的情况进行比较。
多层薄膜的堆积结构和组成的设定如下述表3所示。将由四个单元薄膜层形成的薄膜反复堆积总共180次，以使平均晶格周期为5至10nm、弹性周期为10至20nm，从而得到最终膜厚度为2.3至2.6μm的多层薄膜。在此情况中，使用可从KFC Co.获得的K44UF材料(型号BE2060)作为沉积多层薄膜的基体。
表3
在表3中，晶格参数的单位是，弹性模量的单位是GPa。
在对上述沉积的多层薄膜的切削性能评估中，使用SM45C(宽：90mm，长：300mm)作为加工件，在切削速度为250m/min、每齿进刀量为0.2mm/齿、进刀量为2mm的干式条件下进行切削。在12,000mm的机械加工后比较磨损。结果显示在图5中。
如图5所示，与比较例2-3相比，本公开的实施例2-1和实施例2-2显示出改善的月牙洼磨损性和侧面磨损性。
即，可看出以根据本公开控制弹性周期和晶格周期的方式堆积的超晶格多层薄膜相比于其他情况显示出了改善的耐磨性。

Claims (5)

1.一种切削工具用多层薄膜，其中，分别由薄层A、B、C和D形成的多个单元薄膜堆积了超过一次；
其中，所述薄层的弹性模量k满足如下关系：kA>kB，kD>kC，或kC>kB，kD>kA，
所述薄层的晶格参数L满足如下关系：LA,LC>LB,LD，或LB,LD>LA,LC，并且
所述晶格参数L的最大值和最小值之间的差为20％以下。
2.如权利要求1所述的多层薄膜，其中，所述多层薄膜的平均晶格参数周期λL为其平均弹性模量周期λk的一半。
3.如权利要求1或2所述的多层薄膜，其中，所述单元薄膜的厚度为4nm～50nm。
4.如权利要求1或2所述的多层薄膜，其中，薄层B和D由相同的材料形成。
5.一种切削工具，所述切削工具被权利要求1或2所述的多层薄膜覆盖。
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