CN104810335B - 碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法 - Google Patents

碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法 Download PDF

Info

Publication number
CN104810335B
CN104810335B CN201410643282.7A CN201410643282A CN104810335B CN 104810335 B CN104810335 B CN 104810335B CN 201410643282 A CN201410643282 A CN 201410643282A CN 104810335 B CN104810335 B CN 104810335B
Authority
CN
China
Prior art keywords
carbon nanotube
thermoplastic resin
thermosetting resin
nanotube sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410643282.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN104810335A (zh
Inventor
织田卓哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN104810335A publication Critical patent/CN104810335A/zh
Application granted granted Critical
Publication of CN104810335B publication Critical patent/CN104810335B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
CN201410643282.7A 2014-01-23 2014-11-06 碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法 Active CN104810335B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-010306 2014-01-23
JP2014010306A JP6261352B2 (ja) 2014-01-23 2014-01-23 カーボンナノチューブシート及び半導体装置とカーボンナノチューブシートの製造方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN104810335A CN104810335A (zh) 2015-07-29
CN104810335B true CN104810335B (zh) 2018-11-13

Family

ID=53545463

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410643282.7A Active CN104810335B (zh) 2014-01-23 2014-11-06 碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法

Country Status (3)

Country Link
US (1) US9873825B2 (https=)
JP (1) JP6261352B2 (https=)
CN (1) CN104810335B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190021230A (ko) * 2016-06-28 2019-03-05 니폰 제온 가부시키가이샤 방열 장치
KR102546241B1 (ko) 2016-10-05 2023-06-22 삼성전자주식회사 반도체 패키지
US11004680B2 (en) * 2016-11-26 2021-05-11 Texas Instruments Incorporated Semiconductor device package thermal conduit
US10861763B2 (en) 2016-11-26 2020-12-08 Texas Instruments Incorporated Thermal routing trench by additive processing
WO2018156878A1 (en) * 2017-02-24 2018-08-30 Lintec Of America, Inc. Nanofiber thermal interface material
JP7338738B2 (ja) * 2018-08-23 2023-09-05 株式会社レゾナック 半導体デバイスの製造方法、熱伝導シート、及び熱伝導シートの製造方法
US11482466B2 (en) 2018-08-23 2022-10-25 Showa Denko Materials Co., Ltd. Method of manufacturing semiconductor device, thermally conductive sheet, and method of manufacturing thermally conductive sheet
US11915991B2 (en) * 2021-03-26 2024-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676568A (zh) * 2004-04-02 2005-10-05 清华大学 一种热界面材料及其制造方法
CN1841714A (zh) * 2005-03-29 2006-10-04 台湾积体电路制造股份有限公司 半导体元件封装结构
CN103227157A (zh) * 2012-01-25 2013-07-31 富士通株式会社 电子器件及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101054467B (zh) * 2006-04-14 2010-05-26 清华大学 碳纳米管复合材料及其制备方法
US7489033B2 (en) * 2006-11-10 2009-02-10 Intel Corporation Electronic assembly with hot spot cooling
ATE474876T1 (de) * 2007-02-22 2010-08-15 Dow Corning Verfahren zur herstellung leitfähiger folien sowie in diesem verfahren hergestellte artikel
JP5104688B2 (ja) * 2007-10-22 2012-12-19 富士通株式会社 シート状構造体及びその製造方法並びに電子機器
JP5276565B2 (ja) * 2009-10-14 2013-08-28 新光電気工業株式会社 放熱用部品
JP5295932B2 (ja) 2009-11-02 2013-09-18 新光電気工業株式会社 半導体パッケージ及びその評価方法、並びにその製造方法
JP5842349B2 (ja) * 2011-03-18 2016-01-13 富士通株式会社 シート状構造体、シート状構造体の製造方法、電子機器及び電子機器の製造方法
JP5673325B2 (ja) 2011-04-20 2015-02-18 富士通株式会社 カーボンナノチューブの形成方法及び熱拡散装置
KR101332866B1 (ko) * 2012-02-16 2013-11-22 앰코 테크놀로지 코리아 주식회사 반도체 장치
JP5928181B2 (ja) * 2012-06-18 2016-06-01 富士通株式会社 電子機器の製造方法及び電子機器
US9041192B2 (en) * 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1676568A (zh) * 2004-04-02 2005-10-05 清华大学 一种热界面材料及其制造方法
CN1841714A (zh) * 2005-03-29 2006-10-04 台湾积体电路制造股份有限公司 半导体元件封装结构
CN103227157A (zh) * 2012-01-25 2013-07-31 富士通株式会社 电子器件及其制造方法

Also Published As

Publication number Publication date
JP2015138903A (ja) 2015-07-30
US9873825B2 (en) 2018-01-23
US20150206822A1 (en) 2015-07-23
CN104810335A (zh) 2015-07-29
JP6261352B2 (ja) 2018-01-17

Similar Documents

Publication Publication Date Title
CN104810335B (zh) 碳纳米管片以及半导体装置、碳纳米管片的制造方法以及半导体装置的制造方法
KR102864411B1 (ko) 반도체 장치
CN101540302B (zh) 片结构和制造片结构的方法
JP5276565B2 (ja) 放熱用部品
CN111211059A (zh) 电子封装件及其制法与散热件
CN106847781B (zh) 功率模块封装及其制造方法
CN114765142B (zh) 电子封装件及其制法
CN113555329A (zh) 包含前侧热提取结构的功率放大器装置及其制造方法
CN111492473A (zh) 半导体封装体及其制造方法
TWI242863B (en) Heat dissipating structure and semiconductor package with the heat dissipating structure
CN101425486A (zh) 一种封装结构
JP2001217340A (ja) 半導体装置及びその製造方法
JP6283293B2 (ja) カーボンナノチューブシートの製造方法
JP2002033411A (ja) ヒートスプレッダ付き半導体装置及びその製造方法
JP2011187877A (ja) 半導体装置及びその製造方法
TWI721898B (zh) 半導體封裝結構
JP5013116B2 (ja) シート状構造体及びその製造方法並びに電子機器
CN108346630B (zh) 散热型封装结构
JP6223903B2 (ja) カーボンナノチューブシート及び電子機器とカーボンナノチューブシートの製造方法及び電子機器の製造方法
JP5808227B2 (ja) 放熱用部品、半導体パッケージ及びその製造方法
JP2001217359A (ja) 放熱用フィン及びその製造方法並びに半導体装置
CN112951815A (zh) 半导体结构及其制造方法
CN209947825U (zh) 一种功率器件
TWI897604B (zh) 具有散熱結構的電子部件
JP5974591B2 (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant