CN1047870C - 化学处理基片的方法和装置 - Google Patents

化学处理基片的方法和装置 Download PDF

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Publication number
CN1047870C
CN1047870C CN94195079A CN94195079A CN1047870C CN 1047870 C CN1047870 C CN 1047870C CN 94195079 A CN94195079 A CN 94195079A CN 94195079 A CN94195079 A CN 94195079A CN 1047870 C CN1047870 C CN 1047870C
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CN
China
Prior art keywords
substrate
fluid
storage tank
chemically treated
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94195079A
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English (en)
Chinese (zh)
Other versions
CN1145691A (zh
Inventor
R·施尔德
M·科扎克
J·德斯特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Microtech GmbH
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Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Publication of CN1145691A publication Critical patent/CN1145691A/zh
Application granted granted Critical
Publication of CN1047870C publication Critical patent/CN1047870C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/10—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing sonic or ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/40—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
CN94195079A 1994-04-15 1994-05-17 化学处理基片的方法和装置 Expired - Fee Related CN1047870C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4413077A DE4413077C2 (de) 1994-04-15 1994-04-15 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DEP4413077.5 1994-04-15

Publications (2)

Publication Number Publication Date
CN1145691A CN1145691A (zh) 1997-03-19
CN1047870C true CN1047870C (zh) 1999-12-29

Family

ID=6515519

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94195079A Expired - Fee Related CN1047870C (zh) 1994-04-15 1994-05-17 化学处理基片的方法和装置

Country Status (8)

Country Link
US (1) US5569330A (https=)
EP (1) EP0755571B1 (https=)
KR (1) KR100364161B1 (https=)
CN (1) CN1047870C (https=)
AT (1) ATE208086T1 (https=)
DE (2) DE4413077C2 (https=)
TW (1) TW279997B (https=)
WO (1) WO1995028736A1 (https=)

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DE19541436C2 (de) 1995-11-07 1998-10-08 Steag Micro Tech Gmbh Anlage zur Behandlung von Gegenständen in einem Prozeßtank
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DE19637875C2 (de) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Anlage zur Naßbehandlung von Substraten
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Also Published As

Publication number Publication date
CN1145691A (zh) 1997-03-19
EP0755571B1 (de) 2001-10-31
US5569330A (en) 1996-10-29
DE4413077C2 (de) 1997-02-06
TW279997B (https=) 1996-07-01
WO1995028736A1 (de) 1995-10-26
KR100364161B1 (ko) 2003-04-16
EP0755571A1 (de) 1997-01-29
KR970702576A (ko) 1997-05-13
DE59409931D1 (de) 2001-12-06
DE4413077A1 (de) 1995-10-19
ATE208086T1 (de) 2001-11-15

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