DE4413077C2 - Verfahren und Vorrichtung zur chemischen Behandlung von Substraten - Google Patents

Verfahren und Vorrichtung zur chemischen Behandlung von Substraten

Info

Publication number
DE4413077C2
DE4413077C2 DE4413077A DE4413077A DE4413077C2 DE 4413077 C2 DE4413077 C2 DE 4413077C2 DE 4413077 A DE4413077 A DE 4413077A DE 4413077 A DE4413077 A DE 4413077A DE 4413077 C2 DE4413077 C2 DE 4413077C2
Authority
DE
Germany
Prior art keywords
basin
fluid
substrate
substrates
hood
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4413077A
Other languages
German (de)
English (en)
Other versions
DE4413077A1 (de
Inventor
Robin Dipl Phys Schild
Milan Dr Kozak
Johann Dipl Ing Durst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag Microtech GmbH
Original Assignee
Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE4413077A priority Critical patent/DE4413077C2/de
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Priority to US08/367,358 priority patent/US5569330A/en
Priority to KR1019960705774A priority patent/KR100364161B1/ko
Priority to PCT/EP1994/001585 priority patent/WO1995028736A1/de
Priority to CN94195079A priority patent/CN1047870C/zh
Priority to EP94917638A priority patent/EP0755571B1/de
Priority to AT94917638T priority patent/ATE208086T1/de
Priority to DE59409931T priority patent/DE59409931D1/de
Priority to TW083104843A priority patent/TW279997B/zh
Priority to JP7088410A priority patent/JP2908277B2/ja
Priority to DE19537879A priority patent/DE19537879C2/de
Publication of DE4413077A1 publication Critical patent/DE4413077A1/de
Application granted granted Critical
Publication of DE4413077C2 publication Critical patent/DE4413077C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/10—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing sonic or ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/40—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
DE4413077A 1994-04-15 1994-04-15 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten Expired - Fee Related DE4413077C2 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE4413077A DE4413077C2 (de) 1994-04-15 1994-04-15 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DE59409931T DE59409931D1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten
PCT/EP1994/001585 WO1995028736A1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten
CN94195079A CN1047870C (zh) 1994-04-15 1994-05-17 化学处理基片的方法和装置
EP94917638A EP0755571B1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten
AT94917638T ATE208086T1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten
US08/367,358 US5569330A (en) 1994-04-15 1994-05-17 Method and device for chemically treating substrates
KR1019960705774A KR100364161B1 (ko) 1994-04-15 1994-05-17 화학적기판처리방법및그장치
TW083104843A TW279997B (https=) 1994-04-15 1994-05-27
JP7088410A JP2908277B2 (ja) 1994-04-15 1995-04-13 基板の化学処理のための方法及び装置
DE19537879A DE19537879C2 (de) 1994-04-15 1995-10-11 Verfahren und Vorrichtung zum Behandeln von Substraten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4413077A DE4413077C2 (de) 1994-04-15 1994-04-15 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten

Publications (2)

Publication Number Publication Date
DE4413077A1 DE4413077A1 (de) 1995-10-19
DE4413077C2 true DE4413077C2 (de) 1997-02-06

Family

ID=6515519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4413077A Expired - Fee Related DE4413077C2 (de) 1994-04-15 1994-04-15 Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
DE59409931T Expired - Fee Related DE59409931D1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59409931T Expired - Fee Related DE59409931D1 (de) 1994-04-15 1994-05-17 Verfahren und vorrichtung zur chemischen behandlung von substraten

Country Status (8)

Country Link
US (1) US5569330A (https=)
EP (1) EP0755571B1 (https=)
KR (1) KR100364161B1 (https=)
CN (1) CN1047870C (https=)
AT (1) ATE208086T1 (https=)
DE (2) DE4413077C2 (https=)
TW (1) TW279997B (https=)
WO (1) WO1995028736A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830162A1 (de) * 1998-07-06 2000-01-20 Steag Electronic Systems Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten
US6189552B1 (en) 1996-11-22 2001-02-20 Steag Microtech Gmbh Substrate processing device
US6244282B1 (en) 1996-11-04 2001-06-12 Steag Microtech Gmbh Substrate treatment device

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US5849104A (en) * 1996-09-19 1998-12-15 Yieldup International Method and apparatus for cleaning wafers using multiple tanks
DE19549490C2 (de) * 1995-01-05 2001-01-18 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
US5714203A (en) * 1995-08-23 1998-02-03 Ictop Entwicklungs Gmbh Procedure for the drying of silicon
DE19541436C2 (de) 1995-11-07 1998-10-08 Steag Micro Tech Gmbh Anlage zur Behandlung von Gegenständen in einem Prozeßtank
KR0179784B1 (ko) * 1995-12-19 1999-04-15 문정환 반도체 웨이퍼 세정장치
DE19637875C2 (de) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Anlage zur Naßbehandlung von Substraten
DE19652526C2 (de) * 1996-04-22 2000-12-07 Steag Micro Tech Gmbh Transporteinrichtung für Substrate und Verfahren zum Beladen der Transporteinrichtung mit Substraten
KR100310378B1 (ko) * 1996-04-22 2001-11-22 페터 옐리히, 울리히 비블 유체용기내의기판처리장치및방법
DE19703646C2 (de) * 1996-04-22 1998-04-09 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
JP2000500926A (ja) * 1996-04-22 2000-01-25 ステアーグ ミクロテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング 流体コンテナ内で基板を処理するための装置および方法
DE19616402C2 (de) * 1996-04-24 2001-11-29 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
DE19616400C2 (de) * 1996-04-24 2001-08-30 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
DE19654903C2 (de) * 1996-04-24 1998-09-24 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
US6240938B1 (en) 1996-05-29 2001-06-05 Steag Microtech Gmbh Device for treating substrates in a fluid container
DE19644779C2 (de) * 1996-10-28 2001-06-28 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten, insbesondere auch von Halbleiterwafern
DE19640848C2 (de) * 1996-10-03 1998-07-16 Steag Microtech Gmbh Pliezhaus Verfahren und Vorrichtung zum Behandeln von Substraten
DE19644254A1 (de) * 1996-10-24 1998-05-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE19644253A1 (de) 1996-10-24 1998-05-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE19644255C1 (de) 1996-10-24 1998-04-30 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten und Verwendung der Vorrichtung
US5954068A (en) * 1996-12-06 1999-09-21 Steag Microtech Gmbh Device and method for treating substrates in a fluid container
KR100226489B1 (ko) * 1996-12-28 1999-10-15 김영환 웨이퍼 지지 및 이송 기구
DE19706072C1 (de) 1997-02-17 1998-06-04 Steag Microtech Gmbh Pliezhaus Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter
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JP4602540B2 (ja) * 2000-12-12 2010-12-22 オメガセミコン電子株式会社 基板処理装置
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6244282B1 (en) 1996-11-04 2001-06-12 Steag Microtech Gmbh Substrate treatment device
US6189552B1 (en) 1996-11-22 2001-02-20 Steag Microtech Gmbh Substrate processing device
DE19830162A1 (de) * 1998-07-06 2000-01-20 Steag Electronic Systems Gmbh Verfahren und Vorrichtung zum Reinigen von Substraten

Also Published As

Publication number Publication date
CN1145691A (zh) 1997-03-19
EP0755571B1 (de) 2001-10-31
US5569330A (en) 1996-10-29
TW279997B (https=) 1996-07-01
WO1995028736A1 (de) 1995-10-26
KR100364161B1 (ko) 2003-04-16
EP0755571A1 (de) 1997-01-29
KR970702576A (ko) 1997-05-13
DE59409931D1 (de) 2001-12-06
DE4413077A1 (de) 1995-10-19
ATE208086T1 (de) 2001-11-15
CN1047870C (zh) 1999-12-29

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