DE69705679T2 - Verfahren und Vorrichtung zur Trocknung von flachen Gegenständen - Google Patents

Verfahren und Vorrichtung zur Trocknung von flachen Gegenständen

Info

Publication number
DE69705679T2
DE69705679T2 DE69705679T DE69705679T DE69705679T2 DE 69705679 T2 DE69705679 T2 DE 69705679T2 DE 69705679 T DE69705679 T DE 69705679T DE 69705679 T DE69705679 T DE 69705679T DE 69705679 T2 DE69705679 T2 DE 69705679T2
Authority
DE
Germany
Prior art keywords
flat objects
drying flat
drying
objects
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69705679T
Other languages
English (en)
Other versions
DE69705679D1 (de
Inventor
Hideki Munakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69705679D1 publication Critical patent/DE69705679D1/de
Application granted granted Critical
Publication of DE69705679T2 publication Critical patent/DE69705679T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/12—Drying solid materials or objects by processes not involving the application of heat by suction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE69705679T 1996-08-06 1997-08-01 Verfahren und Vorrichtung zur Trocknung von flachen Gegenständen Expired - Lifetime DE69705679T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22313696A JP3244220B2 (ja) 1996-08-06 1996-08-06 平板状物の乾燥方法および乾燥装置

Publications (2)

Publication Number Publication Date
DE69705679D1 DE69705679D1 (de) 2001-08-23
DE69705679T2 true DE69705679T2 (de) 2002-05-08

Family

ID=16793365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69705679T Expired - Lifetime DE69705679T2 (de) 1996-08-06 1997-08-01 Verfahren und Vorrichtung zur Trocknung von flachen Gegenständen

Country Status (6)

Country Link
US (1) US6125554A (de)
EP (1) EP0823607B1 (de)
JP (1) JP3244220B2 (de)
DE (1) DE69705679T2 (de)
MY (1) MY120941A (de)
TW (1) TW384510B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
US20020129838A1 (en) * 2001-03-15 2002-09-19 Larry Myland Substrate aspiration assembly
JP4628580B2 (ja) 2001-04-18 2011-02-09 信越半導体株式会社 貼り合せ基板の製造方法
WO2003066246A1 (en) * 2002-02-06 2003-08-14 Akrion, Llc Capillary drying of substrates
US7415985B2 (en) 2003-09-24 2008-08-26 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning and drying apparatus
US7396259B2 (en) * 2005-06-29 2008-07-08 Fci Americas Technology, Inc. Electrical connector housing alignment feature
US20070094885A1 (en) * 2005-11-03 2007-05-03 Alan Walter Apparatus and method for removing trace amounts of liquid from substrates during single-substrate processing
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
JP2009044211A (ja) 2007-08-06 2009-02-26 Sony Corp 波形等化器およびその制御方法、並びに受信装置およびその制御方法
DE102014213172A1 (de) * 2014-07-07 2016-01-07 Dürr Ecoclean GmbH Anlage für das Trocknen von Werkstücken
US10195303B2 (en) 2015-12-11 2019-02-05 Novartis Ag Method and system for removing a liquid from a container for accommodating an ophthalmic lens

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231794B2 (de) * 1973-03-07 1977-08-17
JPS60223130A (ja) * 1984-04-19 1985-11-07 Sharp Corp 基板の洗滌乾燥方法及びその装置
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
JPH05259264A (ja) * 1992-03-11 1993-10-08 Fujitsu Ltd 半導体ウェーハ整列装置
JPH05259136A (ja) * 1992-03-12 1993-10-08 Tokyo Electron Ltd 洗浄処理装置
JPH0693449A (ja) 1992-09-14 1994-04-05 Tokai Carbon Co Ltd 金属基材へのカーボン被覆法
JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5475892A (en) * 1993-10-29 1995-12-19 Texas Instruments Incorporated Semiconductor wafer particle extractor
US5704493A (en) * 1995-12-27 1998-01-06 Dainippon Screen Mfg. Co., Ltd. Substrate holder

Also Published As

Publication number Publication date
JPH1050657A (ja) 1998-02-20
EP0823607A2 (de) 1998-02-11
EP0823607A3 (de) 1998-04-08
JP3244220B2 (ja) 2002-01-07
US6125554A (en) 2000-10-03
TW384510B (en) 2000-03-11
MY120941A (en) 2005-12-30
DE69705679D1 (de) 2001-08-23
EP0823607B1 (de) 2001-07-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition