CN104780739B - 机壳和便携设备 - Google Patents

机壳和便携设备 Download PDF

Info

Publication number
CN104780739B
CN104780739B CN201510009045.XA CN201510009045A CN104780739B CN 104780739 B CN104780739 B CN 104780739B CN 201510009045 A CN201510009045 A CN 201510009045A CN 104780739 B CN104780739 B CN 104780739B
Authority
CN
China
Prior art keywords
layers
casing
thickness
alloys
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510009045.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN104780739A (zh
Inventor
织田喜光
山本晋司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Proterial Metals Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of CN104780739A publication Critical patent/CN104780739A/zh
Application granted granted Critical
Publication of CN104780739B publication Critical patent/CN104780739B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CN201510009045.XA 2014-01-09 2015-01-08 机壳和便携设备 Active CN104780739B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014002136A JP5965418B2 (ja) 2014-01-09 2014-01-09 シャーシおよび携帯機器
JP2014-002136 2014-01-09

Publications (2)

Publication Number Publication Date
CN104780739A CN104780739A (zh) 2015-07-15
CN104780739B true CN104780739B (zh) 2018-02-13

Family

ID=53621875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510009045.XA Active CN104780739B (zh) 2014-01-09 2015-01-08 机壳和便携设备

Country Status (5)

Country Link
JP (1) JP5965418B2 (ja)
KR (1) KR101760557B1 (ja)
CN (1) CN104780739B (ja)
HK (1) HK1212141A1 (ja)
TW (1) TWI612880B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6358378B1 (ja) * 2017-08-09 2018-07-18 日立金属株式会社 クラッド材の製造方法
JP7147957B2 (ja) * 2019-03-14 2022-10-05 日立金属株式会社 マグネシウムクラッド材、電子機器用筐体および移動体用部品
KR20230154870A (ko) * 2021-03-05 2023-11-09 지앙수 캉루이 뉴 머티리얼 테크놀로지 컴퍼니 리미티드 금속 재료 복합 가공 방법
EP4336980A1 (en) * 2021-07-20 2024-03-13 Samsung Electronics Co., Ltd. Electronic device comprising heat dissipation structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102059A (ja) * 1972-04-06 1973-12-21
JPS5978675U (ja) * 1982-11-18 1984-05-28 株式会社ケンウッド 電気機器等のケ−ス体
JPH11156995A (ja) * 1997-09-25 1999-06-15 Daido Steel Co Ltd クラッド板とこれを用いた電池用ケース並びにこれらの製造方法
JPH11233076A (ja) * 1998-02-13 1999-08-27 Toshiba Battery Co Ltd 組電池
JP2002294376A (ja) * 2001-03-29 2002-10-09 Showa Denko Kk アルミニウム−異種金属クラッド材およびその製造方法
JP4785104B2 (ja) * 2001-07-30 2011-10-05 日立金属株式会社 薄肉成形体およびその製造方法
JP4627400B2 (ja) * 2002-08-29 2011-02-09 株式会社Neomaxマテリアル アルミニウム/ニッケルクラッド材および電池用外部端子
JP4159897B2 (ja) * 2003-02-26 2008-10-01 東洋鋼鈑株式会社 ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法
CN1565773A (zh) * 2003-07-03 2005-01-19 富骅企业股份有限公司 一种适用于散热器的复合板材成型方法
JP5053510B2 (ja) * 2004-12-27 2012-10-17 冨士発條株式会社 電源装置用外装缶及び当該外装缶を使用した電源装置
JP4799294B2 (ja) * 2006-06-30 2011-10-26 古河スカイ株式会社 高成形性Al−Mg系合金板の製造方法
JP2008063623A (ja) * 2006-09-08 2008-03-21 Furukawa Sky Kk 成形加工用アルミニウム合金板の製造方法
JP2010087289A (ja) * 2008-09-30 2010-04-15 Nippon Chemicon Corp 電解コンデンサモジュール
KR101276496B1 (ko) * 2010-06-08 2013-06-18 가부시키가이샤 네오맥스 마테리아르 알루미늄 구리 클래드재
JP5830727B2 (ja) * 2010-06-10 2015-12-09 富山県 結合部材及びその製造方法

Also Published As

Publication number Publication date
JP5965418B2 (ja) 2016-08-03
JP2015128883A (ja) 2015-07-16
HK1212141A1 (en) 2016-06-03
KR101760557B1 (ko) 2017-07-31
CN104780739A (zh) 2015-07-15
TW201542080A (zh) 2015-11-01
TWI612880B (zh) 2018-01-21
KR20150083423A (ko) 2015-07-17

Similar Documents

Publication Publication Date Title
TWI576035B (zh) Manufacture of enclosures and enclosures
CN104780739B (zh) 机壳和便携设备
US8391011B2 (en) Cooling device
TWI659828B (zh) 附散熱用金屬材之結構物、印刷電路板、電子機器及散熱用金屬材
US7745928B2 (en) Heat dissipation plate and semiconductor device
TWI614851B (zh) 包括多層加強件之電子封裝體
JP2003168882A (ja) 熱伝導性シート
JP2009016626A (ja) 半導体モジュール装置および半導体モジュール装置の製造方法ならびにフラットパネル型表示装置,プラズマディスプレイパネル
CN101577257A (zh) 电子部件
TWI655892B (zh) 附散熱用金屬材之結構物、印刷電路板及電子機器、散熱用金屬材
EP3579674B1 (en) Cladded metal structures for dissipation of heat in a portable electronic device
TW201639706A (zh) 散熱積層結構及其製造方法
JP5914968B2 (ja) ヒートシンク付パワーモジュール用基板及びその製造方法
JP6754973B2 (ja) グラファイト放熱板
US9299633B2 (en) Semiconductor device, heat radiation member, and manufacturing method for semiconductor device
JP5955500B2 (ja) 放熱構造
TW201711538A (zh) 撓性印刷配線板,聚光型太陽光發電模組,聚光型太陽光發電面板,及撓性印刷配線板的製造方法
KR20120076309A (ko) 휴대폰 냉각장치
KR102039791B1 (ko) 반도체칩 실장방법 및 반도체칩 패키지
JPH0537491Y2 (ja)
TWI551674B (zh) 石墨熱導體、電子裝置及石墨熱導體製造方法
JP2012119563A (ja) 半導体装置用フレキシブル基板および半導体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1212141

Country of ref document: HK

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20170110

Address after: Tokyo, Japan

Applicant after: HITACHI METALS, Ltd.

Address before: Osaka Japan

Applicant before: NEOMAX MAT Co.,Ltd.

Applicant before: Hitachi Metals, Ltd.

Effective date of registration: 20170110

Address after: Osaka Japan

Applicant after: NEOMAX MAT Co.,Ltd.

Applicant after: HITACHI METALS, Ltd.

Address before: Osaka Japan

Applicant before: NEOMAX MATERIALS CO.,LTD.

Applicant before: Hitachi Metals, Ltd.

GR01 Patent grant
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1212141

Country of ref document: HK