HK1212141A1 - Chassis and portable apparatus - Google Patents

Chassis and portable apparatus

Info

Publication number
HK1212141A1
HK1212141A1 HK15112689.4A HK15112689A HK1212141A1 HK 1212141 A1 HK1212141 A1 HK 1212141A1 HK 15112689 A HK15112689 A HK 15112689A HK 1212141 A1 HK1212141 A1 HK 1212141A1
Authority
HK
Hong Kong
Prior art keywords
chassis
portable apparatus
portable
Prior art date
Application number
HK15112689.4A
Other languages
Chinese (zh)
Inventor
織田喜光
山本晉司
Original Assignee
Neomax Materials Co Ltd
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neomax Materials Co Ltd, Hitachi Metals Ltd filed Critical Neomax Materials Co Ltd
Publication of HK1212141A1 publication Critical patent/HK1212141A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
HK15112689.4A 2014-01-09 2015-12-24 Chassis and portable apparatus HK1212141A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014002136A JP5965418B2 (en) 2014-01-09 2014-01-09 Chassis and mobile devices

Publications (1)

Publication Number Publication Date
HK1212141A1 true HK1212141A1 (en) 2016-06-03

Family

ID=53621875

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15112689.4A HK1212141A1 (en) 2014-01-09 2015-12-24 Chassis and portable apparatus

Country Status (5)

Country Link
JP (1) JP5965418B2 (en)
KR (1) KR101760557B1 (en)
CN (1) CN104780739B (en)
HK (1) HK1212141A1 (en)
TW (1) TWI612880B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6358378B1 (en) * 2017-08-09 2018-07-18 日立金属株式会社 Clad material manufacturing method
WO2020184489A1 (en) * 2019-03-14 2020-09-17 日立金属株式会社 Magnesium clad material, housing for electronic devices, and component for mobile objects
WO2022183957A1 (en) * 2021-03-05 2022-09-09 江苏康瑞新材料科技股份有限公司 Composite plate, composite plate texturing device, and manufacturing method
EP4336980A1 (en) * 2021-07-20 2024-03-13 Samsung Electronics Co., Ltd. Electronic device comprising heat dissipation structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48102059A (en) * 1972-04-06 1973-12-21
JPS5978675U (en) * 1982-11-18 1984-05-28 株式会社ケンウッド Case bodies for electrical equipment, etc.
JPH11156995A (en) * 1997-09-25 1999-06-15 Daido Steel Co Ltd Clad plate, battery case using it, and manufacture thereof
JPH11233076A (en) * 1998-02-13 1999-08-27 Toshiba Battery Co Ltd Battery pack
JP2002294376A (en) * 2001-03-29 2002-10-09 Showa Denko Kk Aluminum-dissimilar metal clad plate and production method therefor
JP4785104B2 (en) * 2001-07-30 2011-10-05 日立金属株式会社 Thin-walled molded product and method for producing the same
JP4627400B2 (en) * 2002-08-29 2011-02-09 株式会社Ｎｅｏｍａｘマテリアル Aluminum / nickel clad and battery external terminals
JP4159897B2 (en) * 2003-02-26 2008-10-01 東洋鋼鈑株式会社 Surface-treated Al plate excellent in solderability, heat sink using the same, and method for producing surface-treated Al plate excellent in solderability
CN1565773A (en) * 2003-07-03 2005-01-19 富骅企业股份有限公司 Composite board forming method specified for radiator
JP5053510B2 (en) * 2004-12-27 2012-10-17 冨士発條株式会社 Power supply device outer can and power supply device using the outer can
JP4799294B2 (en) * 2006-06-30 2011-10-26 古河スカイ株式会社 Method for producing high formability Al-Mg alloy plate
JP2008063623A (en) * 2006-09-08 2008-03-21 Furukawa Sky Kk Method for producing aluminum alloy sheet for forming
JP2010087289A (en) * 2008-09-30 2010-04-15 Nippon Chemicon Corp Electrolytic capacitor module
JP4961512B2 (en) * 2010-06-08 2012-06-27 株式会社Ｎｅｏｍａｘマテリアル Aluminum copper clad material
JP5830727B2 (en) * 2010-06-10 2015-12-09 富山県 Coupling member and manufacturing method

Also Published As

Publication number Publication date
TW201542080A (en) 2015-11-01
TWI612880B (en) 2018-01-21
JP2015128883A (en) 2015-07-16
KR101760557B1 (en) 2017-07-31
JP5965418B2 (en) 2016-08-03
KR20150083423A (en) 2015-07-17
CN104780739A (en) 2015-07-15
CN104780739B (en) 2018-02-13

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