CN104780739A - Chassis and portable apparatus - Google Patents
Chassis and portable apparatus Download PDFInfo
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- CN104780739A CN104780739A CN201510009045.XA CN201510009045A CN104780739A CN 104780739 A CN104780739 A CN 104780739A CN 201510009045 A CN201510009045 A CN 201510009045A CN 104780739 A CN104780739 A CN 104780739A
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- layer
- casing
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- alloy
- heat
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a chassis, the chassis is composed of a cladding material, and a Al layer and a Cu layer are jointed to form the cladding material, the Al layer is composed of Al or Al alloy, the Cu layer is composed of Cu or Cu alloy, and the thermal conductivity coefficient of the Cu layer is larger than that of the Al layer.
Description
Technical field
The present invention relates to the casing of the equipment being such as applicable to the electronic unit be built-in with heat release and possess the portable equipment of this casing.
Background technology
At present, in portable equipment etc., use casing in order to protect the display part for showing image from the impact of outside.Such as, in Japanese Unexamined Patent Publication 2006-113589 publication, disclose a kind of display unit, it possesses panel unit and for the casing be made up of SUS that is fixing and supporting faceplate unit.
On the other hand, in recent years, lightweight is wished in the electronic equipments such as portable equipment.Now, the ratio due to SUS is great (proportion is about 7.8), therefore, in the structure described in Japanese Unexamined Patent Publication 2006-113589 publication, is difficult to the lightweight realizing casing and display unit.Therefore, in order to make casing lightweight, propose the scheme of the casing of a kind of Al (proportion is about 2.7) using proportion less than SUS.Such as, in Japanese Unexamined Patent Publication 2008-177275 publication, this casing is disclosed.
Disclose a kind of mobile phone terminal in Japanese Unexamined Patent Publication 2008-177275 publication, it possesses: the electronic units such as display and the mode with housing electronic parts are formed and by the basket portion (casing) of aluminium parts insert molding in resin.In this mobile phone terminal, be pasted with between the thermal source and basket portion of electronic circuit etc. for guaranteeing the heat conducting fin containing graphite.
But, in the basket portion of the mobile phone terminal described in Japanese Unexamined Patent Publication 2008-177275 publication, the lightweight in basket portion can be realized, on the other hand, because the heat conductivity of Al is insufficient, can not fully conduct to aluminium parts entirety via fin from heat source to the heat of the aluminium parts in basket portion, therefore, there is the problem can not fully dispelled the heat in basket portion.
Summary of the invention
The present invention completes to solve problem as described above, and an object of the present invention is that providing a kind of can realize lightweight and carry out the casing dispelled the heat and the portable equipment possessing this casing fully.
A first aspect of the present invention provides a kind of casing (chassis), its covering (clad) material engaged by Al layer and Cu layer is formed, above-mentioned Al layer is made up of Al or Al alloy, and above-mentioned Cu layer is made up of Cu or Cu alloy, and the coefficient of heat conduction is larger than Al layer.
As mentioned above, the casing of a first aspect of the present invention is made up of clad material Al layer and the coefficient of heat conduction Cu layer larger than Al layer engaged, the Cu layer utilizing the coefficient of heat conduction larger than Al layer, compared with situation about being only made up of Al layer with casing, can improve the heat conductivity of casing.Thus, heat promptly can be delivered to casing entirety, therefore, it is possible to dispel the heat fully in casing.In addition, by using the Al layer that proportion is little, compared with situation about being only made up of Cu layer with casing, casing lightweight can be made.In addition, be made up of clad material Al layer and Cu layer engaged casing, Al layer and Cu layer directly engage, therefore, situation about indirectly being engaged by bonding agent with Al sheet material and Cu sheet material is compared, and heat transfer also can be carried out effectively in the interface of Al layer and Cu layer.Thereby, it is possible to heat is promptly passed to casing entirety, therefore, it is possible to dispel the heat fully in casing.
Wherein, said in the present invention " casing " refers to the basket, housing, framework, housing etc. of the purposes of needs heat dispersion to a certain degree and mechanical strength.Such as comprise: be fixed for showing the casing of display part of image or the casing for the protection of the integrated circuit be installed on substrate of portable equipment etc., for the protection of the casing of the electronic unit in portable equipment.Also comprise: the casing with the function of framework (framework) of portable equipment, to have for the casing of the function of the lead-in wire be electrically connected and the casing etc. for blocking electromagnetism.
In the casing of above-mentioned first aspect, the Al alloy that preferred Al layer is more than 200MPa by 0.2% yield strength is formed.According to such formation, the mechanical strength of Al layer increases, therefore, it is possible to fully guarantee the mechanical strength of casing.Therefore, it is possible to obtain lightweight and high heat dispersion and the also high casing of mechanical strength.
In the casing of above-mentioned first aspect, the thickness of preferred Al layer is more than 60% of the aggregate thickness of Al layer and Cu layer.According to such formation, the ratio of the little Al layer of proportion can be increased, therefore, it is possible to realize the lightweight of casing further.
In the casing of above-mentioned first aspect, the thickness of preferred Cu layer is greater than 40% of the aggregate thickness of Al layer and Cu layer.According to such formation, the ratio of the coefficient of heat conduction Cu layer larger than Al layer can be increased, therefore, it is possible to improve the heat dispersion of casing further.
In the casing of above-mentioned first aspect, preferred Cu layer is made up of Cu.According to such formation, the Cu layer be made up of the Cu that the coefficient of heat conduction is higher than Cu alloy can be utilized to improve the heat dispersion of casing further.
In the casing of above-mentioned first aspect, preferred Al layer comprises an Al layer and the 2nd Al layer, and an above-mentioned Al layer engages with Cu layer on the surface in the side of Cu layer, is made up of Al or Al alloy; Above-mentioned 2nd Al layer engages with Cu layer on the surface at the opposite side of Cu layer, is made up of Al or Al alloy.Clad material has the three-decker that lamination successively has an Al layer, Cu layer and the 2nd Al layer.If have the clad material utilizing an Al layer and the 2nd Al layer to clip the three-decker of Cu layer from both sides like this, ductility different due to Al layer and Cu layer can be suppressed and casing that is that cause bends.Further, be there is by clad material the three-decker utilizing an Al layer and the 2nd Al layer to clip Cu layer, the surface of the Cu layer of corrosion-resistant can be suppressed to be exposed to outside, therefore, it is possible to improve the corrosion resistance of casing.
In the structure be made up of the above-mentioned clad material with the three-decker of an Al layer, Cu layer and the 2nd Al layer, preferably the mean value of the thickness of the 2nd Al layer is less than more than 95% 105% of the mean value of the thickness of an Al layer.According to such formation, casing can be made the structure of almost symmetry on thickness direction.That is, form an Al layer and the 2nd Al layer by same kind (Al system) metal material, and formed ± 5% within roughly equal thickness, therefore, it is possible to suppress due to an Al layer different with the thickness of slab of the 2nd Al layer and cause bend.Therefore, it is possible to suppress casing to bend further.
In the structure that the clad material of the above-mentioned three-decker by having an Al layer, Cu layer and the 2nd Al layer is formed, preferably an Al layer and the 2nd Al layer are made up of the Al alloy with same composition.According to such formation, the ductility of Cu layer both sides can be made substantially identical, therefore, it is possible to suppress casing to bend further.In addition, when the mean value of the thickness of the 2nd Al layer is less than more than 95% 105% of the mean value of the thickness of an Al layer, an Al layer and the 2nd Al layer can be made to be made up of the Al alloy with same composition and make ± 5% within substantially equal thickness, therefore, do not need to carry out the surface of casing and the differentiation at the back side, and the process in manufacture process of casing etc. can be made to be more prone to.
In the structure that the clad material of the above-mentioned three-decker by having an Al layer, Cu layer and the 2nd Al layer is formed, preferably the thickness of an Al layer and the thickness of the 2nd Al layer add up to more than 60% of the aggregate thickness of an Al layer, Cu layer and the 2nd Al layer.According to such formation, the ratio of the little Al layer of proportion and the 2nd Al layer can be increased, therefore, it is possible to realize the lightweight of casing further.
In the structure that the clad material of the above-mentioned three-decker by having an Al layer, Cu layer and the 2nd Al layer is formed, the thickness of preferred Cu layer is greater than 40% of the aggregate thickness of an Al layer, Cu layer and the 2nd Al layer.According to such formation, the ratio of the coefficient of heat conduction than an Al layer and the large Cu layer of the 2nd Al layer can be increased, therefore, it is possible to improve the heat dispersion of casing further.
In the casing of above-mentioned first aspect, preferred Al layer is made up of Al-Mg alloy.According to such formation, by using containing the proportion Mg less than Al and the mechanical strength Al-Mg alloy higher than Al, high heat radiationization can be obtained and furthermore achieved that the casing of lightweight and mechanical strength.
In addition, casing of the present invention can as the casing of the portable equipment of the electronic unit be built-in with heat release.By light-weighted casing can be realized what require to apply in light-weighted portable equipment the invention described above, portable equipment can be made to alleviate the amount of alleviating of casing.In addition, due to the heat from the electronic unit of easy heat release can be made effectively to be released by casing of the present invention, therefore, it is possible to suppress the accumulation of heat in electronic unit, suppress the malfunction of the electronic unit caused because of accumulation of heat.In addition, when electronic unit and the chassis contact of adjoint heat release, the heat from electronic unit more effectively can be released.Wherein, " electronic unit " not only comprises the parts that display or integrated circuit (IC) etc. utilize electric power, also comprises the parts of the supply electric power such as battery.
In the casing of above-mentioned first aspect, preferably at the plating Sn layer being formed with Sn or Sn alloy formation at least partially on casing surface.According to such formation, when the casing without plating Sn layer being welded in support etc., the misgrowth sometimes of the Sn contained by scolding tin (whisker), therefore, by forming plating Sn layer in the part at least participating in welding on casing surface, the misgrowth of Sn can be suppressed.
In the casing of above-mentioned first aspect, preferably at the Ni layer being formed with Ni or Ni alloy formation at least partially on casing surface.According to such formation, when making circuit and chassis contact, contact with the Ni layer of casing by making circuit, the resistance (contact resistance) in the contact portion of casing and circuit can be suppressed to increase, therefore, also casing can be used as the current circuit of realizing circuit ground connection (earth, ground connection).In addition, because the corrosion resistance of Ni layer is high, therefore, it is possible to improve the corrosion resistance of casing further.
In the casing of above-mentioned first aspect, the thickness of the casing be preferably made up of clad material is more than 0.1mm below 1.0mm.According to such formation, the sufficient mechanical strength as casing can be guaranteed, and suppress because thickness is excessive and cause and use the equipment enlarging of casing.
In the casing of above-mentioned first aspect, preferred clad material has the double-decker that lamination successively has Al layer and Cu layer.According to such formation, having lamination successively with clad material has an Al layer, Cu layer to compare with the situation of the three-decker of the 2nd Al layer, Cu layer larger than Al layer for the coefficient of heat conduction can be configured in apart from the nearer position of the electronic unit etc. with heat release, therefore, it is possible to improve the heat dispersion of casing further.
A second aspect of the present invention provides a kind of portable equipment, possess: with electronic unit and the casing that the heat from electronic unit is released of heat release, the clad material that casing is engaged by Al layer and Cu layer is formed, this Al layer is made up of Al or Al alloy, and this Cu layer is made up of Cu or Cu alloy and the coefficient of heat conduction is larger than Al layer.
As mentioned above, the portable equipment of second aspect present invention possesses the casing that the clad material that engaged by Al layer and the coefficient of heat conduction Cu layer larger than Al layer is formed, by the Cu layer that the coefficient of heat conduction is larger than Al layer, compared with situation about being only made up of Al layer with casing, the heat conductivity of casing can be improved.Thereby, it is possible to heat is promptly passed to casing entirety, therefore, it is possible to dispel the heat fully in casing.In addition, by using the Al layer that proportion is little, compared with situation about being only made up of Cu layer with casing, casing lightweight can be made.In addition, the clad material engaged by Al layer and Cu layer by casing is formed, and Al layer and Cu layer directly engage, therefore, situation about indirectly being engaged by bonding agent with Al sheet material and Cu sheet material is compared, and heat transfer also can be carried out effectively in the interface of Al layer and Cu layer.Thereby, it is possible to heat is promptly passed to casing entirety, therefore, can dispel the heat fully in casing.
In the portable equipment of above-mentioned second aspect, the Al alloy that preferred Al layer is more than 200MPa by 0.2% yield strength is formed.According to such formation, lightweight, high heat dispersion and the also high casing of mechanical strength forms portable equipment can be used.
In the portable equipment of above-mentioned second aspect, preferred casing abuts with the electronic unit with heat release.According to such formation, utilize the casing abutted with electronic unit, can more reliably the heat of electronic unit be released.
In the portable equipment of above-mentioned second aspect, preferably also possesses substrate upper surface being arranged electronic unit; With on the upper surface being configured at substrate in the mode of surrounding electronic unit and the support abutted with casing.According to such formation, even there is electronic unit do not abut with casing and utilize substrate, support and casing to make the portable equipment of such structure of electronic unit and external isolation, because the casing with high heat dispersion is configured near electronic unit, therefore, the heat of the electronic unit from easy heat release can be released effectively from casing, and make the portable equipment lightweight being provided with substrate.
Accompanying drawing explanation
Fig. 1 is the stereogram of the internal structure of the portable equipment representing one embodiment of the present invention.
Fig. 2 is the exploded perspective view of the internal structure of the portable equipment representing one embodiment of the present invention.
Fig. 3 is the sectional view of the structure of the casing of the portable equipment representing one embodiment of the present invention.
Fig. 4 is the schematic diagram of the manufacturing process of the casing of portable equipment for illustration of one embodiment of the present invention.
Fig. 5 is the schematic diagram of the observation for illustration of the state of temperature in order to confirm the casing that effect of the present invention is carried out and sheet material.
Fig. 6 is the table of the measurement result representing confirmation effect of the present invention and carry out etc.
Fig. 7 represents to confirm effect of the present invention and the curve chart of the relation of Cu ratio and maximum temperature and the coefficient of heat conduction in the embodiment of carrying out.
Fig. 8 represents to confirm effect of the present invention and the curve chart of the relation of Cu ratio and proportion in the embodiment of carrying out.
Fig. 9 is the sectional view of the structure of the casing of the first variation representing one embodiment of the present invention.
Figure 10 is the exploded perspective view of the internal structure of the portable equipment of the second variation representing one embodiment of the present invention.
Figure 11 is the sectional view of the casing structure of the 3rd variation representing one embodiment of the present invention.
Figure 12 is the sectional view of the casing structure of the 4th variation representing one embodiment of the present invention.
Embodiment
Below, based on accompanying drawing, execution mode the present invention specialized is described.
First, with reference to Fig. 1 ~ Fig. 3, the internal structure of the portable equipment 100 of one embodiment of the present invention is described.
In the portable equipment 100 of present embodiment, as depicted in figs. 1 and 2, from top (Z1 side), display 1, casing 2, substrate 3 and battery 4 is configured with successively.Wherein, when display 1, casing 2 and substrate 3 are formed as top view, length direction has the length L1 of about 100mm and Width has the roughly rectangular shape of the length L2 of about 50mm.In addition, roughly rectangular shape less than substrate 3 when battery 4 is formed as top view.
Display 1 is made up of liquid crystal display or OLED display etc., has the function of the upper surface display image in Z1 side.The lower surface of the Z2 side of this display 1 abuts (contact) with the upper surface of the Z1 side of casing 2.That is, display 1 is configured near casing 2.Further, be formed as display 1 show image time heat release, display 1 produce heat mainly via the structure that casing 2 is externally released.In addition, display 1 is an example of " electronic unit " of the present invention.
Casing 2 is made up of the sheet material of roughly rectangular shape Z-direction with about 0.2mm thickness t1.This casing 2 has protection display 1 from the function of the impact from outside and the function of externally being released by the heat from display 1 and CPU31.Battery 4 has the function to the supply such as display 1 and substrate 3 electric power.
In addition, execution is provided with for controlling the CPU31 of the program of portable equipment 100 etc. at the upper surface of the Z1 side of substrate 3.The upper surface of the Z1 side of this CPU31 abuts (contact) with below the Z2 side of casing 2.That is, CPU31 is configured near casing 2.Further, be formed as CPU31 owing to performing program etc. for controlling portable equipment 100 entirety and heat release, the heat that produces at CPU31 is mainly via the structure that casing 2 is externally released.Wherein, CPU31 is an example of " electronic unit " of the present invention.
At this, in the present embodiment, as shown in Figure 3, casing 2 is made up of the clad material of three-decker (Al layer/Cu layer/Al layer), and this clad material comprises: the Cu layer 21 be made up of Cu, to engage with the surperficial 21a of the Z1 side of Cu layer 21 and the Al layer 22 be made up of Al-Mg alloy and engaging with the surperficial 21b of the Z2 side of Cu layer 21 and the Al layer 23 be made up of Al-Mg alloy.That is, casing 2 has the clad material of the three-decker of Al layer 22, Cu layer 21 and Al layer 23 (Al layer/Cu layer/Al layer) to form by lamination successively.In addition, Cu layer 21, Al layer 22 and 23 are engaged by rolling and firmly engage each other.Wherein, Al layer 22 and 23 is an example of " an Al layer " of the present invention and " the 2nd Al layer " respectively.In addition, surperficial 21a and 21b is an example on " side surface " of the present invention and " opposite side surface " respectively.
Cu layer 21 is formed by the Cu of the purity more than 99.9% such as oxygen-free copper, tough pitch copper and phosphorized copper.In addition, Al layer 22 and 23 is made up of the A5052 (JIS standard) in Al-Mg alloy or GM55 (UACJ Corporation's system).In addition, Al layer 22 and Al layer 23 are made up of the Al-Mg alloy of same composition.
In addition, the Cu forming Cu layer 21 has the coefficient of heat conduction of about 390W/ (m × K) and the proportion of about 8.9.On the other hand, form in the Al-Mg alloy of Al layer 22 and 23, A5052 has the coefficient of heat conduction of about 138W/ (m × K) and the proportion of about 2.7, and GM55 has the coefficient of heat conduction of about 117W/ (m × K) and the proportion of about 2.7.That is, Cu layer 21 has the coefficient of heat conduction higher than Al layer 22 and 23, has larger proportion on the other hand.
In addition, the Cu forming Cu layer 21 has 0.2% yield strength of about 210MPa.On the other hand, form in the Al-Mg alloy of Al layer 22 and 23, A5052 has 0.2% yield strength of about 270MPa, and GM55 has 0.2% yield strength of about 310MPa.That is, 0.2% yield strength of Al layer 22 and 23 is formed as substantially in the structure of more than 200MPa.In addition, in order to casing 2 being formed the thin thickness of about 0.2mm and guaranteeing mechanical strength, 0.2% yield strength of the clad material of optimum selecting three-layer structure is large.
In addition, Cu layer 21, Al layer 22 and Al layer 23 have thickness t2, t3 and t4 in z-direction respectively.At this, the thickness t3 of Al the layer 22 and thickness t4 of Al layer 23 is substantially equivalent.Specifically, formed in the mode of less than more than 95% 105% of the mean value of the mean value of the thickness t4 of the Al layer 23 thickness t3 that is Al layer 22.At this, each interface of Cu layer 21, Al layer 22 and Al layer 23 is not sometimes smooth planar but is formed as fluctuating shape.In this case, the mean value of the thickness t4 of Al layer 23 is less than more than 95% 105% of the mean value of the thickness t3 of Al layer 22 time, and in the manufacture of reality, the thickness t4 of the thickness t3 and Al layer 23 that can be considered as Al layer 22 processes substantially equally.
In addition, in the present embodiment, when more paying attention to the high heat dispersion of casing 2 in the lightweight and high heat dispersion of casing 2, the thickness t2 of preferred Cu layer 21 is greater than 40% of the aggregate thickness (thickness of casing 2) t1 (=t2+t3+t4) of Cu layer 21, Al layer 22 and Al layer 23.In addition, in the light-weighted situation paying attention to casing 2, the aggregate thickness (=t3+t4) of preferred Al layer 22 and 23 casing 2 thickness t1 more than 60%.That is, the thickness t4 of the thickness t3 of preferred Al layer 22 and Al layer 23 all casing 2 thickness t1 more than 30%.
In addition, in the light-weighted situation paying attention to casing 2, the proportion of preferred casing 2 is roughly below 5.
In addition, in the present embodiment, the surface of casing 2 does not configure whatever.That is, the surface of casing 2 is not configured for the graphite flake of heat radiation.Thereby, it is possible to suppress to cause the coefficient of heat conduction to reduce when bonding graphite flake because bubble invades between sheet material and casing 2, and the operation of the thin graphite flake of bonding thickness can be cut down.
Then, the manufacturing process of the casing 2 of one embodiment of the present invention is described with reference to Fig. 1, Fig. 3 and Fig. 4.
First, as shown in Figure 4, the Cu sheet material 121 be made up of Cu, the Al sheet material 122 be made up of any one Al-Mg alloy of A5052 or GM55 and Al sheet material 123 is prepared.Now, the thickness of Al sheet material 122 is equal to substantially with the thickness of Al sheet material 123, and regulates the thickness of the thickness of Cu sheet material 121, the thickness of Al sheet material 122 and Al sheet material 123 according to the character (lightweight and high heat dispersion) of made casing 2.Specifically, when paying attention to the high heat dispersion of casing 2, make the thickness of Cu sheet material 121 be greater than Cu sheet material 121, Al sheet material 122 and 123 aggregate thickness 40%.In addition, in the light-weighted situation paying attention to casing 2, the thickness of the thickness of Al sheet material 122 and Al sheet material 123 is made to be respectively more than 30% of the aggregate thickness of Cu sheet material 121, Al sheet material 122 and Al sheet material 123.
Then, under the state being configured between Al sheet material 122 and Al sheet material 123 by Cu sheet material 121, use roller 105 is rolled joint continuously with the reduction ratio of about 60%.Thus, continuously formed have about 0.4mm thickness and successively lamination have the clad material 102 of Al layer 22, Cu layer 21 and Al layer 23.
Then, under the reduction atmosphere of about 500 DEG C, clad material 102 diffusion annealing about 1 minute is made.Afterwards, clad material 102 is rolled continuously till reaching about 0.24mm.Afterwards, under the reduction atmosphere of about 500 DEG C, make clad material 102 diffusion annealing about 1 minute again, be then rolled continuously with the reduction ratio of regulation.Thus, the clad material 102 with about 0.2mm thickness t1 (with reference to Fig. 3) is formed continuously.Now, to be made up of the Al-Mg alloy with same composition and the Al layer 22 and 23 that is substantially equal to of thickness by engaging respectively on surperficial 21a and 21b of Cu layer 21, clad material 102 can be suppressed to bend.
Then, as shown in Figure 1, become by clad material 102 (with reference to Fig. 4) stamping-out length direction to have the length L1 of about 100mm and Width has the roughly rectangular shape of the length L2 of about 50mm, manufacture casing 2 thus.In addition, casing 2 can be processed into the shape of regulation by punch process etc.
Following effect can be obtained by present embodiment.
In the present embodiment, as mentioned above, form casing 2 by the clad material of three-decker (Al/Cu/Al), this clad material engages form by having the coefficient of heat conduction Cu layer 21 higher than Al layer 22 and 23, the Al layer 22 be made up of Al-Mg alloy and the Al layer 23 that is made up of Al-Mg alloy.Thus, utilize the Cu layer 21 that the coefficient of heat conduction is larger than Al layer 22 and 23, compared with situation about being only made up of Al layer with casing 2, the heat conductivity of casing 2 can be improved.Thus, heat promptly can be delivered to casing 2 overall, therefore, it is possible to dispel the heat fully in casing 2.In addition, by using the Al layer 22 and 23 that proportion is little, compared with situation about being only made up of Cu layer 21 with casing 2, casing 2 lightweight can be made.In addition, the clad material engaged by Cu layer 21, Al layer 22 and Al layer 23 by casing 2 is formed, Al layer 22 and 23 directly engages with Cu layer 21, therefore, situation about indirectly being engaged by bonding agent with Al sheet material and Cu sheet material is compared, and also effectively can carry out heat transfer at the interface of Al layer 22 and 23 and Cu layer 21.Thereby, it is possible to it is overall heat to be promptly delivered to casing 2, therefore, it is possible to dispel the heat fully in casing 2.
In addition, in the present embodiment, by being the mechanical strength increase that the Al-Mg alloy of more than 200MPa forms Al layer 22 and 23, Al layer 22 and 23 by 0.2% yield strength, therefore, it is possible to fully guarantee the mechanical strength of casing 2.Thus, lightweight and high heat dispersion can be obtained and the also high casing 2 of mechanical strength.
In addition, in the present embodiment, in the light-weighted situation paying attention to casing 2, by making that the aggregate thickness (=t3+t4) of Al layer 22 and 23 is Cu layer 21, aggregate thickness (thickness of the casing 2) t1 of Al layer 22 and Al layer 23 more than 60%, fully can increase the ratio of the little Al layer of proportion 22 and 23, therefore, it is possible to realize the lightweight of casing 2 further.
In addition, in the present embodiment, when paying attention to the high heat dispersion of casing 2,40% of aggregate thickness (thickness of the casing 2) t1 of Cu layer 21, Al layer 22 and Al layer 23 is greater than by making the thickness t2 of Cu layer 21, fully can increase the ratio of the coefficient of heat conduction Cu layer 21 larger than Al layer 22 and 23, therefore, it is possible to improve the heat dispersion of casing 2 further.
In addition, in the present embodiment, by being made up of the Cu layer 21 of casing 2 Cu, the coefficient of heat conduction of usual Cu is higher than Cu alloy, utilizes the Cu layer 21 be made up of Cu can improve the heat dispersion of casing 2 further.
In addition, in the present embodiment, form casing 2 by the clad material of three-decker (Al layer/Cu layer/Al layer), this clad material comprises: the Cu layer 21 be made up of Cu, to engage with the surperficial 21a of the Z1 side of Cu layer 21 and the Al layer 22 be made up of Al-Mg alloy and engaging with the surperficial 21b of the Z2 side of Cu layer 21 and the Al layer 23 be made up of Al-Mg alloy.Thus, clad material has the three-decker utilizing Al layer 22 and Al layer 23 to clip Cu layer 21 from both sides, thereby, it is possible to suppress because Al layer 22 is different from the ductility of Cu layer 21 with 23 and cause casing 2 bending.In addition, had by clad material and utilize Al layer 22 and Al layer 23 three-decker of Cu layer 21 from sandwich, surperficial 21a and 21b of the Cu layer 21 of corrosion-resistant can be suppressed to expose to outside, therefore, it is possible to improve the corrosion resistance of casing 2.
In addition, in the present embodiment, in the Al layer 22 formed by same composition (A5052 or GM55) and Al layer 23, make thickness (t3 and t4) substantially equivalent.That is, the mean value of the thickness t4 of Al layer 23 is made to be less than more than 95% 105% of the mean value of the thickness t3 of Al layer 22.Thereby, it is possible to make casing 2 be formed as the structure of the upper almost symmetry of thickness direction (Z-direction).Namely, Al layer 22 and Al layer 23 are made up of the Al-Mg alloy with same composition, and to make ± 5% within substantially equal thickness, therefore, do not need to distinguish the surface of casing 2 and the back side, and process in can making the manufacture process of casing 2 etc. is more easy.In addition, substantially equivalent by thickness (t3 and t4), can suppress due to Al layer 22 different with the thickness of slab of Al layer 23 and cause bending, therefore, it is possible to suppress casing 2 to bend further.
In addition, in the present embodiment, by by containing the proportion Mg less than Al and the Al-Mg alloy of mechanical strength A5052 or GM55 higher than Al forms Al layer 22 and 23, high heat radiationization can be obtained and furthermore achieved that the casing 2 of lightweight and mechanical strength.
In addition, in the present embodiment, as shown in Figure 1, by display 1 or CPU31 are configured at there is high heat dispersion casing 2 near, the heat from display 1 or CPU31 can be released from casing 2 effectively.In addition, by making display 1 or CPU31 abut with the casing 2 with high heat dispersion, the heat from display 1 or CPU31 more effectively can be released from casing 2.Thereby, it is possible to suppress accumulation of heat in display 1 or CPU31, therefore, it is possible to suppress due to heat and cause display 1 or CPU31 to occur malfunction.
In addition, in the present embodiment, by making the thickness t1 of the casing 2 be made up of clad material be about 0.2mm, the sufficient mechanical strength as casing 2 can be guaranteed, and suppress because thickness t1 is excessive and cause and use the portable equipment 100 of casing 2 to maximize.
In addition, in the present embodiment, in portable equipment 100, be formed as abutting (contact) with the lower surface of Z2 side of display 1 of heat release with the upper surface of the Z1 side of casing 2 and the upper surface of Z1 side of the CPU31 of adjoint heat release and the lower surface of the Z2 side of casing 2 abut the structure of (contact).Thereby, it is possible to utilize the casing 2 abutted with display 1 and CPU31 to be released by the heat of display 1 and CPU31 more reliably.
(embodiment)
Then, with reference to Fig. 2, Fig. 3, Fig. 5 ~ Fig. 8 in order to confirm that the mensuration of heat dispersion that effect of the present invention is carried out and the mensuration of mechanical strength are described.Wherein, unless otherwise specified, " thickness " or " thickness of slab " refers to mean value.
The casing 2 of the above-mentioned execution mode shown in Fig. 3 is used in the present embodiment.Specifically, as embodiment 1 ~ 4, prepare clad material, this clad material possesses the Cu layer 21 be made up of Cu, the Al layer be made up of the A5052 in Al-Mg alloy 22 and 23, and Al layer 22, Cu layer 21 and Al layer 23 lamination successively.Now, in embodiment 1 ~ 4, the thickness t1 (=t2+t3+t4, total thickness of slab) of flat clad material (casing 2) is 0.2mm, and the thickness t3 of Al layer 22 is identical with the thickness t4 of Al layer 23.And, flat clad material is formed as the length direction (X-direction) shown in Fig. 5 and there is the length L1 of 100mm and Width (Y-direction) has the roughly rectangular shape of the length L2 of 50mm, thus, the casing 2 of embodiment 1 ~ 4 is made.
At this, as shown in Figure 6, in embodiment 1 ~ 4, the ratio (t3:t2:t4) of the thickness of the Al layer 22 of formation casing 2, Cu layer 21 and Al layer 23 is made to be respectively 1:2:1,1:1:1,2:1:2 and 4.5:1:4.5.That is, the thickness t2 of Cu layer 21 is made to be respectively 50%, 33%, 20% and 10% relative to the ratio (Cu ratio) of the thickness t1 of casing 2.In addition, the aggregate thickness of Al layer 22 and Al layer 23 (=t3+t4) is made to be respectively 50%, 67%, 80% and 90% relative to the ratio (Al ratio) of the thickness t1 of casing 2.
In addition, as comparative example 1, use the flat sheet material be made up of Cu monomer with 0.2mm thickness.In addition, as comparative example 2, use the flat sheet material be made up of A5052 monomer with 0.2mm thickness.Wherein, comparative example 1 is the same with the casing 2 of embodiment 1 ~ 4 with the sheet material of 2, is formed as the roughly rectangular shape that length direction has the length L1 of 100mm, Width has the length L2 of 50mm.
In addition, use proportion and the coefficient of heat conduction of comparative example 1 and 2 (Cu and A5052), obtain proportion and the coefficient of heat conduction of the casing 2 of embodiment 1 ~ 4 according to the thickness ratio of Cu layer 21, Al layer 22 and Al layer 23 respectively.
(heat dispersion)
In the evaluation of heat dispersion, for the casing 2 of embodiment 1 ~ 4 and the sheet material of comparative example 1 and 2, observe Temperature Distribution when being configured with heat releasing source in its surface.Specifically, as shown in Figure 5, the radiator 31a corresponding with CPU31 (with reference to Fig. 2) of the heat releasing source as present embodiment is attached on the lower surface of Z2 side of casing 2 and sheet material.This radiator 31a has the length L3 of 10mm in the x-direction and the z-direction.
Then, radiator 31a heats by the electric power by supplying 1W to radiator 31a.Then, infra-red thermal imaging device is used to observe the Temperature Distribution of the casing 2 after 5 points and sheet material from top (Z1 side).Then, the temperature at the position that temperature is the highest in casing 2 and sheet material is measured, using this measured value as maximum temperature.
As the result of the heat dispersion shown in Fig. 6 and Fig. 7, in the casing 2 of embodiment 1 ~ 4, along with Cu ratio increases (reduction of Al ratio), maximum temperature reduces.Can this is presumably because that the ratio increase of the Cu (390W/ (m × K)) that the coefficient of heat conduction is high makes the heat dispersion of casing 2 improve, result, maximum temperature reduces.
Particularly be greater than in the embodiment 1 (50%) of 40% at Cu ratio, maximum temperature is 43.8 DEG C, also lower than 44 DEG C.Thus, can confirm that the casing 2 of embodiment 1 can improve heat dispersion effectively.In addition, the curve chart according to Fig. 7 can confirm, when Cu ratio is greater than 40%, maximum temperature can be made to be less than 44.5 DEG C, fully can improve heat dispersion.
In addition, in the casing 2 of embodiment 1 ~ 4, along with Cu ratio increases (reduction of Al ratio), the coefficient of heat conduction increases, and also can confirm thus, by increasing Cu ratio, fully can improve heat dispersion.
(proportion)
Proportion according to Fig. 6 and Fig. 8, in the casing 2 of embodiment 1 ~ 4, reduces along with Cu ratio reduces (increase of Al ratio) proportion.Particularly also little than 5 at embodiment 2 (33%), 3 (20%) and 4 (10%) the middle confirmation proportion of Cu ratio below 40%.Can confirm that the casing 2 of embodiment 2 ~ 4 can realize lightweight effectively thus.In addition, the curve chart according to Fig. 8 can confirm, proportion can be made to be less than 5, can realize lightweight fully (Al ratio is more than 60%) at Cu ratio below 40%.
(mechanical strength)
In addition, in order to evaluate mechanical strength, stress deformation curve chart being measured to the casing 2 of embodiment 1 ~ 4 and the sheet material of comparative example 1 and 2, obtains the stress (0.2% yield strength) during the permanent deformation of generation 0.2%.
As the result shown in Fig. 6, in the casing 2 of embodiment 1 ~ 4, along with Cu ratio reduces (increase of Al ratio), 0.2% yield strength increases.The cause that the Cu of the 0.2% yield strength ratio formation Cu layer 21 of the A5052 forming Al layer 22 and 23 is large can be thised is presumably because.In addition, when the thickness of thinning casing 2 makes it reach more than 0.1mm below 0.3mm, 0.2% yield strength of casing 2 is more than 200MPa, can guarantee the sufficient mechanical strength as casing, thus preferably.Even if can think that the thickness of casing 2 of embodiment 1 ~ 4 is thinning thus to reach more than 0.1mm below 0.3mm, also sufficient mechanical strength can be guaranteed.
Evaluation according to above-mentioned heat dispersion, proportion and mechanical strength can judge, along with Cu ratio increases, heat dispersion improves, and proportion increases on the other hand.In addition, by using the Cu layer be made up of Cu and a pair Al layer be made up of the Al-Mg alloy (A5052) of more than 200MPa, mechanical strength can be made to reach more than 200MPa.Wherein, when paying attention to high heat dispersion, by making Cu ratio be greater than 40%, the heat dispersion of casing can fully be improved; In the light-weighted situation of attention, by making Al ratio be more than 60%, fully can realize the lightweight of casing.And then can think: Cu ratio is any one performance that the casing of 40% (Al ratio is 60%) or the ratio near it fully can meet high heat dispersion, low-gravity and high mechanical properties.
Wherein, this time disclosed execution mode and embodiment all just illustrate in all, and without any restriction.Scope of the present invention is not represented by the explanation of the above-described embodiment and examples, but is represented by claim, also comprises and all changes in the meaning of the equalization of claim and scope.
Such as, there is the clad material of the three-decker of Al layer 22, Cu layer 21 and Al layer 23 (Al layer/Cu layer/Al layer) to form the example of casing 2 exemplified with by lamination successively in the above-described embodiment, but the present invention is not limited thereto.In the present invention, also can the first variation of above-mentioned execution mode as shown in Figure 9 such, form casing 202 by the clad material of double-decker (Al layer/Cu layer), this clad material comprises the Cu layer 221 that is made up of Cu and engages with the surperficial 221a of the Z1 side of Cu layer 221 and the Al layer 222 be made up of Al-Mg alloy.In this case, preferably Cu layer 221 high for the coefficient of heat conduction is configured in the side (such as CPU side) producing large calorimetric.Thus, with clad material, there is lamination Al layer 22, Cu layer 21 successively to compare with the situation (above-mentioned execution mode) of the three-decker of Al layer 23, Cu layer 221 larger than Al layer 222 for the coefficient of heat conduction can be configured in apart from the nearer position of the electronic unit (display or CPU etc.) with heat release, therefore, it is possible to improve the heat dispersion of casing 202 further.In addition, when paying attention to the high heat dispersion of casing 202, the thickness t2 of preferred Cu layer 221 is greater than 40% of the aggregate thickness of Cu layer 221 and Al layer 222 (thickness of casing 202) t1 (=t2+t3).In addition, in the light-weighted situation paying attention to casing 202, the thickness t3 of preferred Al layer 222 is more than 60% of the thickness t1 of casing 202.In addition, casing also can be the clad material of more than four-layer structure.Now, clad material can be the clad material formed primarily of Al layer and Cu layer.
In addition, in the above-described embodiment, Fig. 1 illustrates the example of the lower face side of Z2 side battery 4 being configured at substrate 3, but the present invention is not limited thereto.In the present invention, also can the portable equipment 300 of the second variation of above-mentioned execution mode as shown in Figure 10 such, to configure battery 304 in the upper mode adjacent with substrate 303 of Width (Y-direction), and formed in the mode that CPU31 and battery 304 all abut with casing 2.Thus, be not only the heat from display 1 and CPU31, the heat from battery 304 also can be released by casing 2 effectively.Wherein, battery 304 is examples of " electronic unit " of the present invention.
In addition, in the above-described embodiment, Fig. 1 illustrates the example that the upper surface of the Z1 side of CPU31 is abutted with the lower surface of the Z2 side of casing 2, but the present invention is not limited thereto.In the present invention, CPU also can be made not abut with casing.Such as, the 3rd variation of above-mentioned execution mode as shown in figure 11, uses scolding tin 432 at the upper support 433 engaging the frame-shaped of surrounding CPU31 of the upper surface (face of Z1 side) of substrate 403.And the mode that also can abut with the upper surface of support 433 with the lower surface of the lid casing 402 be made up of the clad material of three-decker (face of Z2 side), is fixed on support 433 by casing 402.Thus, even there is CPU31 do not abut with casing 402 and utilize substrate 403, support 433 and casing 402 by the portable terminal device (not shown) of the structure of CPU31 and external isolation, because the casing 402 with high heat dispersion is configured near CPU31, therefore, the heat of the CPU31 from easy heat release can be released effectively by casing 402, and the portable terminal device lightweight being provided with substrate 403 can be made.
In this case, as shown in figure 11, on the surface of casing 402, preferably form plating Sn layer 402a.In addition, plating Sn layer 433a is preferably formed on the surface of support 433.The installation of casing 402 on support 433 can adopt mechanical system to utilize screw or riveted joint to carry out, but in the installation of micro-element, mostly utilize not shown welding to carry out.When the casing without plating Sn layer being welded in support etc., the misgrowth sometimes of the Sn contained by scolding tin (whisker).Therefore, preferably plating Sn layer 402a is formed to the part at least participating in welding of casing 402.This plating Sn layer 402a can the surface of clad material before the shape making casing 402 be formed, and also can be formed on the surface of casing 402 after the shape making casing 402.Wherein, if the fixture etc. considered productivity ratio and formed required for coating, preferably after the shape making casing 402, roughly whole on the surface of casing 402 and the back side (two sides) above forms plating Sn layer 402a.Wherein, as plating Sn layer, the coating be made up of Sn or Sn alloy can be applied, the coating be more preferably made up of the Sn of purity more than 99%.
In addition, illustrate the example that casing 2 is set in the portable equipment 100 possessing display 1 in the above-described embodiment, but the present invention is not limited thereto.Such as, also casing can be located at do not have display can be portable router etc.In this case, casing can be utilized effectively to release from the battery of router or the heat of CPU.In addition, also can casing be used in the mini-plant of fixed, casing can also be used as the basket of SSD (Solid State Drive: solid state hard disc).
In addition, the thickness t1 illustrating casing 2 in above-mentioned execution mode is about the example of 0.2mm, but the present invention is not limited thereto.In the present invention, the thickness of casing can be less than 0.2mm, also can be greater than 0.2mm.In addition, the sufficient mechanical strength as casing can be guaranteed when the thickness of casing is about more than 0.1mm, thus preferably.In addition, can suppress because thickness is excessive and cause and use the equipment enlarging of casing when the thickness of casing is about below 1.0mm, thus preferably.In addition, compared with the situation paying much attention to miniaturization that portable equipment is such, when for comparing the casing thinking little of miniaturized SSD, the thickness of casing can be made to be about more than 0.6mm below 1.0mm.In this case, even if use the less Al (A1000 system) of 0.2% yield strength as the metal material of formation Al layer of the present invention, due to casing thickness greatly, thus also fully can guarantee mechanical strength.
In addition, the electronic unit illustrated in the above-described embodiment as easy heat release uses the example of display 1 and CPU31, in above-mentioned second variation, illustrate the example of electronic unit use display 1, CPU31 and the battery 304 as easy heat release, but the present invention is not limited thereto.In the present invention, as the electronic unit of easily heat radiation, such as, the electronic unit of power circuit etc. can also be used.
In addition, illustrate the example of the casing 2 that use one is made up of three layers of clad material in the above-described embodiment, but the present invention is not limited thereto.In the present invention, for the casing of the display part of fixing display image and/or for the protection of the casing etc. of integrated circuit being installed on substrate, multiple casing parts be made up of clad material can be used to form portable equipment.
In addition, illustrate the example that Al layer 22 (an Al layer) is formed by identical Al-Mg alloy with Al layer 23 (the 2nd Al layer) in the above-described embodiment, but the present invention is not limited thereto.In the present invention, also an Al layer and the 2nd Al layer can be made up of different Al or Al alloys.
In addition, illustrate the example that Al layer 22 (an Al layer) and Al layer 23 (the 2nd Al layer) are formed by A5052 or GM55 in the above-described embodiment, but the present invention is not limited thereto.In the present invention, also an Al layer and the 2nd Al layer can be made up of Al or the Al alloy beyond A5052 and GM55.Such as, when one Al layer and the 2nd Al layer are made up of made of Al-Cu alloy (A2000 system) such as Al-Mg-Si alloy (A6000 system), A2219 such as Al-Mg alloy (A5000 system) or A6061,0.2% yield strength can be made to reach about more than 200MPa by the suitable process (hardening process etc.) when making sheet material, therefore, it is possible to guarantee the mechanical strength as casing, thus preferably.In addition, when not too requiring mechanical strength according to environment for use etc., also can be less than the Al (A1000 system) of about 200MPa by 0.2% yield strength or Al alloy forms an Al layer and the 2nd Al layer.
In addition, illustrate the example that Cu layer 21 is formed by the Cu of purity more than 99.9% in the above-described embodiment, but the present invention is not limited thereto.In the present invention, the Cu purity of the C19400 (CDA standard) that also can be made up of Cu-2.30Fe-0.10Zn-0.03P etc. be about more than 97% Cu alloy form Cu layer.Because the mechanical strength of these Cu alloys is higher than Cu, therefore, it is possible to improve the mechanical strength of casing further.
In addition, illustrate the example that what does not all configure on the surface of casing 2 in the above-described embodiment, but the present invention is not limited thereto.In the present invention, can be formed on the surface of casing and be used for the Cu layers of foil of heat conduction, also can be configured for the sheet material of the heat conductivity adhesive sheet of bonding display or the graphite flake etc. for electric heating on the surface of casing.If have the casing of this structure, as the casing of thin-walled with high heat dispersion, availability in the market improves further.In addition, as long as above-mentioned sheet material is formed at the position at least contacted with the electronic unit of portable equipment in casing surface.In addition, also can the 4th variation of above-mentioned execution mode as shown in figure 12 such, above on the surface (upper and lower two surfaces) of casing 2 form Ni layer 502b.Wherein, this Ni layer 502b can be formed by plating, also can form as clad material and casing 2.Thereby, it is possible to suppress casing 2 to increase with the resistance (contact resistance) in the contact portion of not shown circuit, therefore, also casing 2 can be used as the current circuit of realizing circuit ground connection (ground connection).Further, Ni layer 502b is utilized also can to improve the corrosion resistance of casing 2.Wherein, as the metal material forming Ni layer 502b, the material be made up of the Ni alloy of Ni or Ni-P alloy etc. can be applied.In addition, as long as Ni layer 502b is formed at the position at least contacted with the electronic unit of portable equipment in the surface of casing 2, upper and lower two surperficial arbitrary surfaces also only can be located at.
In addition, illustrate the example that the upper surface of the Z1 side of CPU31 abuts with the lower surface of the Z2 side of casing 2 in the above-described embodiment, but the present invention is not limited thereto.In the present invention, CPU and casing can be bonding by the bonding agent of heat conductivity, also can across other component configuration CPU and casing.
Claims (20)
1. a casing, is characterized in that:
The clad material engaged by Al layer and Cu layer is formed,
Described Al layer is made up of Al or Al alloy,
Described Cu layer is made up of Cu or Cu alloy, and the coefficient of heat conduction is larger than described Al layer.
2. casing as claimed in claim 1, is characterized in that:
Described Al layer is made up of the Al alloy of 0.2% yield strength at more than 200MPa.
3. casing as claimed in claim 1 or 2, is characterized in that:
The thickness of described Al layer is more than 60% of the aggregate thickness of described Al layer and described Cu layer.
4. casing as claimed in claim 1 or 2, is characterized in that:
The thickness of described Cu layer is greater than 40% of the aggregate thickness of described Al layer and described Cu layer.
5. casing as claimed in claim 1 or 2, is characterized in that:
Described Cu layer is made up of Cu.
6. casing as claimed in claim 1 or 2, is characterized in that:
Described Al layer comprises an Al layer and the 2nd Al layer,
A described Al layer engages with described Cu layer on the surface in the side of described Cu layer, is made up of Al or Al alloy,
Described 2nd Al layer engages with described Cu layer on the surface at the opposite side of described Cu layer, is made up of Al or Al alloy,
Described clad material has the three-decker that lamination successively has a described Al layer, described Cu layer and described 2nd Al layer.
7. casing as claimed in claim 6, is characterized in that:
The mean value of the thickness of described 2nd Al layer is less than more than 95% 105% of the mean value of the thickness of a described Al layer.
8. casing as claimed in claim 6, is characterized in that:
A described Al layer and described 2nd Al layer are made up of the Al alloy with same composition.
9. casing as claimed in claim 6, is characterized in that:
The thickness of a described Al layer and the thickness of described 2nd Al layer add up to more than 60% of the aggregate thickness of a described Al layer, described Cu layer and described 2nd Al layer.
10. casing as claimed in claim 6, is characterized in that:
The thickness of described Cu layer is greater than 40% of the aggregate thickness of a described Al layer, described Cu layer and described 2nd Al layer.
11. casings as claimed in claim 1 or 2, is characterized in that:
Described Al layer is made up of Al-Mg alloy.
12. casings according to claim 1 and 2, is characterized in that:
Casing as the portable equipment of the electronic unit be built-in with heat release uses.
13. casings as claimed in claim 1 or 2, is characterized in that:
The plating Sn layer be made up of Sn or Sn alloy is formed at least partially on the surface of described casing.
14. casings as claimed in claim 1 or 2, is characterized in that:
The Ni layer be made up of Ni or Ni alloy is formed at least partially on the surface of described casing.
15. casings as claimed in claim 1 or 2, is characterized in that:
The thickness of the described casing be made up of described clad material is more than 0.1mm below 1.0mm.
16. casings as claimed in claim 1 or 2, is characterized in that:
Described clad material has the double-decker that lamination successively has described Al layer and described Cu layer.
17. 1 kinds of portable equipments, is characterized in that possessing:
With the electronic unit of heat release; With
By the casing that the heat from described electronic unit is released, the clad material that this casing is engaged by Al layer and Cu layer is formed, and described Al layer is made up of Al or Al alloy, and described Cu layer is made up of Cu or Cu alloy and the coefficient of heat conduction is larger than described Al layer.
18. portable equipments as claimed in claim 17, is characterized in that:
The Al alloy that the described Al layer of described casing is more than 200MPa by 0.2% yield strength is formed.
19. portable equipments as described in claim 17 or 18, is characterized in that:
Described casing abuts with the described electronic unit with heat release.
20. portable equipments as described in claim 17 or 18, is characterized in that also possessing:
Substrate, its upper surface arranges described electronic unit; With
Support, is configured in the mode of surrounding described electronic unit on the upper surface of described substrate, and abuts with described casing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-002136 | 2014-01-09 | ||
| JP2014002136A JP5965418B2 (en) | 2014-01-09 | 2014-01-09 | Chassis and mobile devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104780739A true CN104780739A (en) | 2015-07-15 |
| CN104780739B CN104780739B (en) | 2018-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510009045.XA Active CN104780739B (en) | 2014-01-09 | 2015-01-08 | Casing and portable equipment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5965418B2 (en) |
| KR (1) | KR101760557B1 (en) |
| CN (1) | CN104780739B (en) |
| HK (1) | HK1212141A1 (en) |
| TW (1) | TWI612880B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230026298A1 (en) * | 2021-07-20 | 2023-01-26 | Samsung Electronics Co., Ltd. | Electronic device including heat dissipation structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6358378B1 (en) * | 2017-08-09 | 2018-07-18 | 日立金属株式会社 | Clad material manufacturing method |
| CN113597370A (en) * | 2019-03-14 | 2021-11-02 | 日立金属株式会社 | Magnesium clad material, case for electronic device, and member for moving body |
| WO2022183957A1 (en) * | 2021-03-05 | 2022-09-09 | 江苏康瑞新材料科技股份有限公司 | Composite plate, composite plate texturing device, and manufacturing method |
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- 2014-01-09 JP JP2014002136A patent/JP5965418B2/en active Active
- 2014-12-22 TW TW103144745A patent/TWI612880B/en active
- 2014-12-23 KR KR1020140186969A patent/KR101760557B1/en active IP Right Grant
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2015
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| CN100482866C (en) * | 2003-02-26 | 2009-04-29 | 东洋钢钣株式会社 | Surface-treated al sheet excellent in solderability, heat sink using the same, and method for producing surface-treated al sheet excellent in solderability |
| CN1565773A (en) * | 2003-07-03 | 2005-01-19 | 富骅企业股份有限公司 | Composite board forming method specified for radiator |
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| Publication number | Publication date |
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| HK1212141A1 (en) | 2016-06-03 |
| KR101760557B1 (en) | 2017-07-31 |
| JP5965418B2 (en) | 2016-08-03 |
| JP2015128883A (en) | 2015-07-16 |
| TW201542080A (en) | 2015-11-01 |
| TWI612880B (en) | 2018-01-21 |
| KR20150083423A (en) | 2015-07-17 |
| CN104780739B (en) | 2018-02-13 |
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