CN214315723U - Printed circuit board and camera module that reinforcement temperature warp - Google Patents
Printed circuit board and camera module that reinforcement temperature warp Download PDFInfo
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- CN214315723U CN214315723U CN202023136921.0U CN202023136921U CN214315723U CN 214315723 U CN214315723 U CN 214315723U CN 202023136921 U CN202023136921 U CN 202023136921U CN 214315723 U CN214315723 U CN 214315723U
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Abstract
The utility model discloses a printed circuit board and camera module that reinforcement temperature warp relates to electronic product camera technical field, has solved the technical problem that printed circuit board among the prior art produced deformation because expend with heat and contract with cold. The printed circuit board comprises a printed circuit board substrate and a temperature deformation reinforcing layer, wherein the temperature deformation reinforcing layer comprises at least two metal layers which are mutually laminated and have different thermal expansion coefficients, the printed circuit board substrate is attached to the temperature deformation reinforcing layer, and the bending deformation direction of the temperature deformation reinforcing layer is opposite to the deformation direction of the printed circuit board substrate. The utility model discloses a laminating the metal level that coefficient of thermal expansion is different on printed circuit board, when printed circuit board's temperature variation, heat transfer to metal level, the metal level is bending deformation under the effect of hot bimetallic strip, makes the bending deformation direction of metal level and the deformation opposite direction of printed circuit board base body, can resist printed circuit board's deformation with the bending deformation of metal level.
Description
Technical Field
The utility model relates to an electronic product camera technical field particularly, indicates a printed circuit board and camera module that reinforcement temperature warp.
Background
The camera is widely applied to the technical fields of video conferences, monitoring equipment, mobile phone consumer goods and the like as video input equipment. The printed circuit board is the main spare part of camera, and the camera module passes through the printed circuit board transmission signal of telecommunication.
With the widespread use of cameras, the cameras are often in an environment that is too cold or too hot. Particularly, as the service time of the camera is prolonged, the temperature of a chip for shooting images is obviously increased. Because the printed circuit board is usually of a film structure, the printed circuit board is easily affected by thermal expansion and cold contraction, and the printed circuit board is locally concave or convex, so that the problem of unstable back focal length between the chip and the lens is caused, and the shot image is not clear. In the prior art, the deformation of the printed circuit board is usually compensated by adopting a voice coil motor focusing mode, but the voice coil motor can only adjust the lens and cannot compensate the deformation of the printed circuit board.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at overcoming the not enough of prior art, and the first aspect provides a printed circuit board that reinforcement temperature warp to solve the technical problem that printed circuit board among the prior art produces deformation because expend with heat and contract with cold.
The utility model provides a technical scheme that this technical problem adopted is:
a printed circuit board for stiffening temperature distortion, comprising:
the printed circuit board comprises a printed circuit board substrate and a printed circuit board substrate, wherein the printed circuit board substrate comprises two surfaces which are oppositely arranged, and one surface is provided with an electronic component; and the number of the first and second groups,
the temperature deformation reinforcing layer comprises at least two metal layers with different thermal expansion coefficients, and the at least two metal layers are mutually laminated;
the other side of the printed circuit board substrate is attached to the temperature deformation reinforcing layer, and the bending deformation direction of the temperature deformation reinforcing layer is opposite to the deformation direction of the printed circuit board substrate.
On the basis of the technical scheme, the printed circuit board with the deformation at the reinforcing temperature can be further improved as follows.
Optionally, the temperature deformation reinforcing layer includes a first metal layer and a second metal layer, and a thermal expansion coefficient of the first metal layer is greater than a thermal expansion coefficient of the second metal layer.
Optionally, the first metal layer is disposed between the second metal layer and the printed circuit board substrate, or the second metal layer is disposed between the first metal layer and the printed circuit board substrate.
Optionally, the thickness of the first metal layer is equal to the thickness of the second metal layer.
Optionally, the thickness of the printed circuit board substrate is 0.3-2mm, and the thickness of the temperature deformation reinforcing layer is 0.15-2 mm.
Optionally, the material of the first metal layer is Ni22Cr3, and the material of the second metal layer is Ni 36.
Optionally, the printed circuit board substrate and be provided with the viscose layer between the temperature deformation strengthening layer, the temperature deformation strengthening layer passes through the viscose layer paste in the printed circuit board substrate does not set up the one side of electronic components.
Optionally, the temperature deformation reinforcing layer includes an expansion end and a contraction end, the expansion end is disposed on both sides of the contraction end, and the overall shape of the temperature deformation reinforcing layer is the same as that of the printed circuit board substrate.
In a second aspect, the utility model also provides a camera module, including imaging chip and the printed circuit board of foretell reinforcement temperature deformation, imaging chip set up in just be located the one side that is provided with electronic components on the printed circuit board that the reinforcement temperature warp.
On the basis of the technical scheme, the camera module can be further improved as follows.
Optionally, a support is arranged on the printed circuit board substrate, and a camera assembly located above the imaging chip and a voice coil motor used for driving the camera assembly to move are mounted on the support.
Compared with the prior art, the utility model provides a printed circuit board that reinforcement temperature warp has beneficial effect is:
the utility model discloses a metal level that laminating coefficient of thermal expansion is different on printed circuit board, when printed circuit board's temperature variation, heat transfer to metal level, the metal level is bending deformation under the effect of hot bimetallic strip, the bending deformation direction that makes the metal level is opposite with the deformation direction of printed circuit board base body, can resist printed circuit board's deformation with the bending deformation of metal level to printed circuit board's planarization has been kept, reach and prevent that printed circuit board from producing the effect of deformation because expend with heat and contract with cold.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the reinforced temperature deformed printed circuit board of the present invention;
FIG. 2 is a schematic structural diagram of the printed circuit board of FIG. 1 applied to a camera module;
fig. 3 is a schematic plane structure diagram of the temperature deformation reinforcing layer of the present invention.
In the figure:
1 — a first metal layer; 2-a second metal layer; 3-printed circuit board substrate; 4-an adhesive layer; 51-an enlarged end; 52-a converging end; 6-imaging chip; 7-camera assembly; 8, a bracket; 9-voice coil motor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are merely exemplary of the invention and are not intended to be exhaustive. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1:
the utility model provides a printed circuit board that reinforcement temperature warp, as shown in figure 1, warp the strengthening layer including printed circuit board base member 3 and temperature. The temperature deformation strengthening layer comprises two metal layers with different thermal expansion coefficients, namely a first metal layer 1 and a second metal layer 2. The first metal layer 1 and the second metal layer 2 may be laminated to each other as an integral structure by a hot pressing, double casting, or fusing method. An adhesive layer 4 is arranged between the temperature deformation reinforcing layer and the printed circuit board base body 3, and the temperature deformation reinforcing layer is adhered to the printed circuit board base body 3 through the adhesive layer 4.
Wherein the thermal expansion coefficient of the first metal layer 1 is larger than that of the second metal layer 2. The material of the first metal layer 1 is Ni22Cr3, and the material of the second metal layer 2 is Ni 36. Of course, the first metal layer 1 may also be made of brass, nickel, Fe-Ni-Cr, Fe-Ni-Mn or Mn-Ni-Cu alloy, etc., and the second metal layer may also be made of Invar alloy with Ni 34-50%.
When the temperature of the printed circuit board substrate 3 rises, heat is transferred to the first metal layer 1 and the second metal layer 2. Since the thermal expansion coefficient of the first metal layer 1 is larger than that of the second metal layer 2, the length of the first metal layer 1 is extended relative to that of the second metal layer 2, so that the temperature deformation reinforcing layer is bent and deformed toward one side of the second metal layer 2. When the temperature of the printed circuit board substrate 3 is reduced, the length of the first metal layer 1 is shortened relative to the length of the second metal layer 2, so that the temperature deformation reinforcing layer bends and deforms towards one side of the first metal layer 1.
In general, various electronic components are integrated on the printed circuit board substrate 3, and the various electronic components transmit electric signals through the printed circuit board substrate 3. When the electronic components are operated, a large amount of heat is usually generated, which causes the printed circuit board substrate 3 to be depressed toward the side where the electronic components are not integrated. The utility model discloses utilize the characteristics of temperature deformation strengthening layer bending deformation when temperature variation, the bending deformation direction that makes temperature deformation strengthening layer is opposite with the deformation direction of printed circuit board base member 3, can effectively compensate or restrain the deformation of printed circuit board base member 3. Therefore, the smoothness of the printed circuit board is maintained, and the effect of preventing the printed circuit board from deforming due to expansion caused by heat and contraction caused by cold is achieved.
It is understood that, for a general printed circuit board substrate 3, the direction of deformation of the printed circuit board substrate 3 of the type can be determined in advance by baking. If the printed circuit board substrate 3 is sunken towards one side without the integrated electronic component, the first metal layer 1 of the temperature deformation reinforcing layer is attached between the printed circuit board substrate 3 and the second metal layer 2 in a mode of adhering the adhesive layer 4, so that the bending deformation direction of the temperature deformation reinforcing layer is opposite to the deformation direction of the printed circuit board substrate 3. The bending deformation of the temperature deformation reinforcing layer can resist the deformation of the printed circuit board base body 3 when the temperature of the printed circuit board base body 3 changes. Of course, depending on the arrangement of the copper wires on the printed circuit board substrate 3, the direction of the depression of the printed circuit board substrate 3 may also be oriented towards the side where the electronic components are integrated. At this time, the positions of the first metal layer 1 and the second metal layer 2 are exchanged, so that the second metal layer 2 of the temperature deformation reinforcing layer is attached between the printed circuit board base body 3 and the first metal layer 1 in a manner of adhering the adhesive layer 4, and the bending deformation of the temperature deformation reinforcing layer can resist the deformation of the printed circuit board base body 3.
As shown in fig. 3, the temperature deformation reinforcing layer is attached to the surface of the printed circuit board substrate 3 on which no electronic component is provided, and the temperature deformation reinforcing layer includes an enlarged end 51 and a constricted end 52. The two enlarged ends 51 are disposed on both sides of the contraction end 52, so that the entire temperature deformation reinforcing layer is in an i-shape. The width of the enlarged end 51 is the same as the width of the printed circuit board base body 3, and the distance between the two enlarged ends 51 is the same as the length of the printed circuit board base body 3, so that the overall shape of the temperature deformation reinforcing layer is the same as the overall shape of the printed circuit board base body 3. According to different heating working conditions of the printed circuit board substrate 3, the opening direction of the I-shaped temperature deformation reinforcing layer can be along the width direction of the printed circuit board substrate 3 and the length direction of the printed circuit board substrate 3.
On one hand, the design facilitates the alignment and the lamination of the temperature deformation reinforcing layer and the printed circuit board substrate 3; on the other hand, if the bending deformation of the temperature deformation reinforcing layer is too large, the printed circuit board base body 3 may be excessively bent. By designing the temperature deformation reinforcing layer in the shape of the constricted end 52, the bending deformation strength of the temperature deformation reinforcing layer can be reduced, so that the bending deformation strength of the temperature deformation reinforcing layer matches the deformation of the printed circuit board base body 3. In addition, the contraction end 52 can ensure the bending deformation direction of the temperature deformation reinforcing layer, so that the bending deformation part can accurately act on the deformation part of the printed circuit board base body 3.
The utility model discloses a temperature deformation strengthening layer is not restricted to first metal level 1 and the two-layer structure of second metal level 2. According to the stress condition of the deformation part of the printed circuit board base body 3, the bending stress of the temperature deformation reinforcing layer can be adjusted through three, four, five or more metal layers. Of course, it is also possible to provide a thermal insulation layer of a certain length between the first metal layer 1 and the second metal layer 2 to bend the temperature deformation reinforcing layer in multiple stages, so as to better maintain the flatness of the printed circuit board substrate 3.
Example 2:
the utility model also provides a camera module, as shown in fig. 2, including imaging chip 6, camera subassembly 7, support 8 and the foretell printed circuit board that the reinforcement temperature warp. Imaging chip 6 is integrated on printed circuit board base member 3, and support 8 pastes on printed circuit board base member 3, and camera subassembly 7 is installed on support 8 to camera subassembly 7 is located imaging chip 6 directly over. The temperature deformation reinforcing layer is attached to the surface of the printed circuit board substrate 3 opposite to the imaging chip 6.
In general, for a camera head used in a mobile phone, a tablet or a notebook computer, the thickness of the printed circuit board substrate 3 is usually 0.3-0.5 mm. If the printed circuit board substrate 3 is deformed, the back focal length between the camera module and the imaging chip 6 is unstable, and the temperature drifts. The utility model discloses the temperature deformation strengthening layer that the one side opposite with imaging chip 6 on printed circuit board base member 3 was laminated 0.15mm thick, first metal level 1 is located between printed circuit board base member 3 and second metal level 2 to the thickness of first metal level 1 equals with the thickness of second metal level 2. Because the printed circuit board substrate 3 is of an overhead structure on the side of the temperature deformation reinforcing layer, the printed circuit board substrate 3 is easily deformed toward the side of the temperature deformation reinforcing layer when the temperature rises. Therefore, the first metal layer 1 having a large thermal expansion coefficient is bonded between the second metal layer 2 and the printed circuit board base 3, and the deformation of the printed circuit board base 3 can be resisted by the bending deformation of the temperature deformation reinforcing layer.
It can be understood that, when the thickness of the printed circuit board substrate 3 of the camera used for the vehicle-mounted video, the monitoring camera or the projector is usually 0.5-2mm, the thickness of the temperature deformation reinforcing layer can be designed to be 0.15-2mm, so that the bending stress of the temperature deformation reinforcing layer can resist the deformation of the printed circuit board substrate 3, and the purpose of maintaining the flatness of the printed circuit board substrate 3 is achieved.
It should be noted that in some camera modules, a voice coil motor 9 for driving the camera assembly 7 to move is mounted on the bracket 8. However, the voice coil motor 9 can only adjust the camera assembly 7, and cannot compensate for the deformation of the printed circuit board, and the voice coil motor 9 usually has a limitation on the stroke specification. The utility model discloses with the laminating of temperature deformation strengthening layer on printed circuit board base member 3, not only can keep printed circuit board base member 3's planarization, when the image of shooting same definition, can also select the voice coil motor 9 of less stroke specification moreover to reach the purpose that reduces camera module manufacturing cost.
Example 3:
the utility model discloses on being particularly applied to the printed circuit board base member 3 of certain cell-phone camera module, the thickness of printed circuit board base member 3 is 0.3mm to integrated electronic components is the same on the printed circuit board base member 3. The thickness of the additional temperature deformation reinforcing layer is 0.1mm, and the thickness of the adhesive layer 4 is 0.04 mm. The first metal layer 1 is made of Ni22Cr3, and the second metal layer 2 is made of Ni 36. The deformation results of the printed circuit board base body 3 in the optical axis direction are as follows:
when the temperature of the printed circuit board base 3 to which the temperature deformation reinforcing layer is not mounted is raised from 23 c to 85 c, the center point of the printed circuit board base 3 is depressed 62.63 μm.
When the temperature of the printed circuit board base 3 mounted with the temperature deformation reinforcing layer was raised from 23 c to 85 c, 0.6344 μm was depressed on the center point of the printed circuit board base 3.
When the temperature of the printed circuit board base 3 on which the temperature deformation reinforcing layer was not mounted was lowered from 23 c to-40 c, 78.68 μm was dented on the center point of the printed circuit board base 3.
When the temperature of the printed circuit board base 3 mounted with the temperature deformation reinforcing layer was lowered from 23 c to-40 c, the center point of the printed circuit board base 3 was depressed 0.5972 μm.
Therefore, the temperature deformation reinforcing layer has the effects of compensating and inhibiting the temperature deformation of the printed circuit board base body 3, the flatness of the printed circuit board base body 3 in the range of-40 ℃ to 85 ℃ can be guaranteed, and the thickness of the temperature deformation reinforcing layer is only 0.1mm, so that a good reinforcing effect can be achieved. The whole printed circuit board base body 3 and the temperature deformation reinforcing layer are connected and formed in a sticking mode through the adhesive layer 4, the assembly process is simple, and the camera module is suitable for large-scale production and manufacturing of the camera module.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention.
Claims (10)
1. A printed circuit board for reinforcing temperature distortion, comprising:
the printed circuit board base body (3) comprises two surfaces which are oppositely arranged, wherein one surface is provided with an electronic component; and the number of the first and second groups,
the temperature deformation reinforcing layer comprises at least two metal layers with different thermal expansion coefficients, and the at least two metal layers are mutually laminated;
the other side of the printed circuit board substrate (3) is attached to the temperature deformation reinforcing layer, and the bending deformation direction of the temperature deformation reinforcing layer is opposite to the deformation direction of the printed circuit board substrate (3).
2. A printed circuit board for stiffening temperature deformations according to claim 1, characterized in that the temperature deformation stiffening layer comprises a first metal layer (1) and a second metal layer (2), the coefficient of thermal expansion of the first metal layer (1) being larger than the coefficient of thermal expansion of the second metal layer (2).
3. The printed circuit board of claim 2, wherein the first metal layer (1) is arranged between the second metal layer (2) and a printed circuit board substrate (3), or wherein the second metal layer (2) is arranged between the first metal layer (1) and a printed circuit board substrate (3).
4. A printed circuit board for stiffening temperature deformations according to claim 3, characterized in that the thickness of the first metal layer (1) is equal to the thickness of the second metal layer (2).
5. A printed circuit board reinforced with temperature distortion according to claim 4, characterised in that the thickness of the printed circuit board substrate (3) is 0.3-2mm and the thickness of the temperature distortion stiffening layer is 0.15-2 mm.
6. A printed circuit board with reinforced temperature deformation according to claim 5, wherein the first metal layer (1) is Ni22Cr3, and the second metal layer (2) is Ni 36.
7. The reinforced temperature-deformed printed circuit board according to any one of claims 1 to 6, wherein an adhesive layer (4) is disposed between the printed circuit board substrate (3) and the temperature-deformed reinforcing layer, and the temperature-deformed reinforcing layer is adhered to a surface of the printed circuit board substrate (3) on which no electronic component is disposed through the adhesive layer (4).
8. The reinforced temperature-deformable printed circuit board according to claim 7, wherein the temperature-deformable reinforcing layer comprises an expanded end (51) and a contracted end (52), two expanded ends (51) are arranged on two sides of the contracted end (52), and the overall shape of the temperature-deformable reinforcing layer is the same as that of the printed circuit board substrate (3).
9. A camera module, comprising an imaging chip (6) and the reinforced temperature deformed printed circuit board of any one of claims 1 to 8, wherein the imaging chip (6) is disposed on the reinforced temperature deformed printed circuit board and located on a surface on which an electronic component is disposed.
10. The camera module according to claim 9, wherein a support (8) is disposed on the printed circuit board substrate (3), and a camera assembly (7) located above the imaging chip (6) and a voice coil motor (9) for driving the camera assembly (7) to move are mounted on the support (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023136921.0U CN214315723U (en) | 2020-12-23 | 2020-12-23 | Printed circuit board and camera module that reinforcement temperature warp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023136921.0U CN214315723U (en) | 2020-12-23 | 2020-12-23 | Printed circuit board and camera module that reinforcement temperature warp |
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| Publication Number | Publication Date |
|---|---|
| CN214315723U true CN214315723U (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023136921.0U Active CN214315723U (en) | 2020-12-23 | 2020-12-23 | Printed circuit board and camera module that reinforcement temperature warp |
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| CN (1) | CN214315723U (en) |
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- 2020-12-23 CN CN202023136921.0U patent/CN214315723U/en active Active
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