TW201711538A - Flexible printed wiring board, concentrating solar power generation module, concentrating solar power generation panel, and method for manufacturing flexible printed wiring board - Google Patents

Flexible printed wiring board, concentrating solar power generation module, concentrating solar power generation panel, and method for manufacturing flexible printed wiring board Download PDF

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Publication number
TW201711538A
TW201711538A TW105118581A TW105118581A TW201711538A TW 201711538 A TW201711538 A TW 201711538A TW 105118581 A TW105118581 A TW 105118581A TW 105118581 A TW105118581 A TW 105118581A TW 201711538 A TW201711538 A TW 201711538A
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Taiwan
Prior art keywords
wiring board
printed wiring
flexible printed
layer
power generation
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TW105118581A
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Chinese (zh)
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Kazumasa Toya
Youichi Nagai
Kenji Saito
Takashi Iwasaki
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Sumitomo Electric Industries
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Publication of TW201711538A publication Critical patent/TW201711538A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
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    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
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    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
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    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0543—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10143—Solar cell
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
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    • Y02E10/52—PV systems with concentrators

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

This flexible printed wiring board for concentrating solar power generation is provided with a conductive layer to which a power generation element is connected, an insulating layer having insulating characteristics, and a reinforcing layer that reinforces the insulating layer, and the conductive layer, the insulating layer, and the reinforcing layer are bonded in this order. The reinforcing layer of the flexible printed wiring board is formed of a material that is same as that of the conductive layer.

Description

撓性印刷配線板，聚光型太陽光發電模組，聚光型太陽光發電面板，及撓性印刷配線板的製造方法 Flexible printed wiring board, concentrating solar power generation module, concentrating solar power generation panel, and manufacturing method of flexible printed wiring board

本發明有關用於令太陽光聚光至發電元件而發電之聚光型太陽光發電(CPV：Concentrated Photovoltaic)的撓性印刷配線板、聚光型太陽光發電模組、及聚光型太陽光發電面板，另有關撓性印刷配線板的製造方法。 The present invention relates to a flexible printed wiring board (CPV: Concentrated Photovoltaic), a concentrating solar power generation module, and a concentrating sunlight for concentrating solar power generation (CPV) for concentrating sunlight to a power generating element. A power generation panel, and a method of manufacturing a flexible printed wiring board.

以往，已知有一種聚光型太陽光發電裝置，是設計成藉由令多數個聚光型太陽光發電模組縱橫排列而成之聚光型太陽光發電面板，來獲得期望的發電電力(例如，參照專利文獻1)。 Conventionally, a concentrating solar power generation device has been known which is designed to obtain desired power generation by concentrating solar power generation panels in which a plurality of concentrating solar power generation modules are arranged vertically and horizontally ( For example, refer to Patent Document 1).

專利文獻1記載之發電裝置中使用的發電模組，是在容器形狀的框體的內部，具備具有發電元件之撓性印刷配線板，並藉由設於框體的表面側之聚光透鏡來將太陽光聚集至發電元件，以在發電元件進行發電。 The power generation module used in the power generation device described in Patent Document 1 is provided with a flexible printed wiring board having a power generating element inside a casing of a container shape, and is provided by a collecting lens provided on the surface side of the casing. The sunlight is collected to the power generating element to generate electricity in the power generating element.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2013-80760號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-80760

專利文獻1記載之撓性印刷配線板，具備連接至發電元件之銅製的導電層、及將此導電層與框體側絕緣之絕緣層，並且具有一定程度的柔軟性以便能夠對於框體密合地安裝。此外，為便於製造時等的取用，在絕緣層的背面側設有補強板，以使撓性印刷配線板帶有一定程度的剛性。此補強板，為了將來自發電元件或導電層的熱往框體側逸散，係由具有散熱性之鋁材所形成。 The flexible printed wiring board described in Patent Document 1 includes a copper conductive layer connected to the power generating element, and an insulating layer that insulates the conductive layer from the frame side, and has a certain degree of flexibility so as to be able to be tightly bonded to the frame. Ground installation. Further, in order to facilitate the use at the time of manufacture or the like, a reinforcing plate is provided on the back side of the insulating layer to impart a certain degree of rigidity to the flexible printed wiring board. The reinforcing plate is formed of an aluminum material having heat dissipation in order to dissipate heat from the power generating element or the conductive layer toward the frame side.

但，由鋁材所構成之補強板，為了確保足夠的散熱性不得不做成較厚，撓性印刷配線板的輕量化等會變得困難。 However, the reinforcing plate made of an aluminum material has to be thick to ensure sufficient heat dissipation, and it is difficult to reduce the weight of the flexible printed wiring board.

此外，銅製的導電層與鋁製的補強板之熱膨脹率相異，因此會因為當藉由熱壓(hot press)等將它們接合時的熱膨脹差等，造成尺寸變得容易發生偏差。又，當進行將由導電層、絕緣層、及補強板接合而成的中間材料切割出期望形狀的撓性印刷配線板之加工的情形下，不能不考量材料相異之導電層與補強板雙方的切斷條件，故現況是採取將導電層及絕緣層、以及補強板各自分別地切斷成期望形狀，其後再將它們接合這樣的製造方法。在此情形下，製造所需之工程變多，並且接合時的對位也變得困難。 Further, since the copper conductive layer and the aluminum reinforcing plate have different thermal expansion rates, the size tends to vary due to a difference in thermal expansion when they are joined by hot press or the like. Further, in the case of processing a flexible printed wiring board in which a conductive material, an insulating layer, and a reinforcing plate are joined to cut a desired shape, it is impossible to consider both the conductive layer and the reinforcing plate which are different in material. Since the cutting conditions are made, the current state is a manufacturing method in which the conductive layer, the insulating layer, and the reinforcing plate are each cut into a desired shape, and then joined together. In this case, the number of works required for manufacturing becomes large, and the alignment at the time of joining becomes difficult.

又，當補強板的剛性低的情形下，切斷後以熱壓等來做接合會變得困難，因此除了上述般來自散熱性的理由之外，基於製造上的理由也必須將補強板形成為較厚以提高剛性。 Further, when the rigidity of the reinforcing plate is low, it is difficult to perform the joining by hot pressing or the like after the cutting. Therefore, in addition to the reason for the heat dissipation as described above, it is necessary to form the reinforcing plate as a reason for manufacturing. Thicker to increase rigidity.

本發明之目的在於解決上述般製造上的問題等，提高製造性。 An object of the present invention is to solve the above-described problems in manufacturing and the like and to improve manufacturability.

本發明之撓性印刷配線板，具備：供發電元件連接之導電層、及具有絕緣性之絕緣層、及補強此絕緣層之補強層，前述導電層、前述絕緣層、及前述補強層依此順序被接合，前述補強層，為和前述導電層藉由同一材料所形成之物。 A flexible printed wiring board according to the present invention includes: a conductive layer to which a power generating element is connected; an insulating layer having an insulating property; and a reinforcing layer for reinforcing the insulating layer, wherein the conductive layer, the insulating layer, and the reinforcing layer are The order is joined, and the reinforcing layer is formed of the same material as the conductive layer.

本發明之聚光型太陽光發電模組，具備：具有安裝面之框體、及被接合於前述安裝面之上述撓性印刷配線板、及對應於前述發電元件而被安裝於前述框體，將太陽光聚光至前述發電元件之透鏡要素。 The concentrating solar power generation module according to the present invention includes: a housing having a mounting surface; and the flexible printed wiring board joined to the mounting surface; and the housing is mounted on the housing corresponding to the power generating element. The sunlight is concentrated to the lens elements of the aforementioned power generating element.

本發明之聚光型太陽光發電面板，係令上述聚光型太陽光發電模組集合複數個而成。 In the concentrating solar power generation panel of the present invention, the concentrating solar power generation module is assembled in plural.

本發明之撓性印刷配線板的製造方法，包含：將供發電元件連接之導電層、及具有絕緣性之絕緣層、及和前述導電層由同一材料所形成而補強前述絕緣層之補強層予以接合，以形成聚光型太陽光發電模組用 的撓性印刷配線板的中間材料之工程；及將前述中間材料切斷加工成期望的形狀之工程。 A method for producing a flexible printed wiring board according to the present invention includes: a conductive layer to which a power generating element is connected, an insulating layer having an insulating property, and a reinforcing layer formed of the same material and reinforcing the insulating layer; Bonding to form a concentrating solar power module Engineering of an intermediate material of a flexible printed wiring board; and engineering of cutting the aforementioned intermediate material into a desired shape.

按照本發明，能夠提高撓性印刷配線板的製造性。 According to the present invention, the manufacturability of the flexible printed wiring board can be improved.

1‧‧‧聚光型太陽光發電面板 1‧‧‧Concentrating solar power panel

1M‧‧‧聚光型太陽光發電模組 1M‧‧‧ Concentrating Solar Power Module

2‧‧‧支柱 2‧‧‧ pillar

3‧‧‧架台 3‧‧‧Rack

11‧‧‧框體 11‧‧‧ frame

11a‧‧‧底板 11a‧‧‧floor

11b‧‧‧緣部 11b‧‧‧Edge

12‧‧‧撓性印刷配線板 12‧‧‧Flexible printed wiring board

12f‧‧‧撓性基板 12f‧‧‧Flexible substrate

13‧‧‧一次聚光部 13‧‧‧One concentrating department

13f‧‧‧菲涅爾透鏡 13f‧‧‧Fresnel lens

14‧‧‧連接器 14‧‧‧Connector

100‧‧‧聚光型太陽光發電裝置 100‧‧‧Concentrating solar power generation device

121‧‧‧發電元件 121‧‧‧Power generation components

121a‧‧‧引線框 121a‧‧‧ lead frame

122‧‧‧二次聚光部 122‧‧‧Secondary concentrating department

123‧‧‧接着層 123‧‧‧Next layer

123’‧‧‧接着層 123’‧‧‧Next layer

124‧‧‧補強板(補強層) 124‧‧‧ reinforcing plate (reinforcing layer)

124’‧‧‧補強板(補強層) 124'‧‧‧ reinforcing plate (reinforcing layer)

125‧‧‧接着層 125‧‧‧Next layer

125’‧‧‧接着層 125’‧‧‧Next layer

126‧‧‧絕緣基材(絕緣層) 126‧‧‧Insulation substrate (insulation layer)

126’‧‧‧絕緣基材(絕緣層) 126'‧‧‧Insulation substrate (insulation layer)

127‧‧‧圖樣(導電層) 127‧‧‧ pattern (conductive layer)

127’‧‧‧圖樣(導電層) 127'‧‧‧ pattern (conductive layer)

128‧‧‧覆蓋膜(保護層) 128‧‧‧ Cover film (protective layer)

128’‧‧‧覆蓋膜(保護層) 128'‧‧‧ Cover film (protective layer)

[圖1]本發明一實施形態之聚光型太陽光發電裝置示意立體圖。 Fig. 1 is a schematic perspective view of a concentrating solar power generation device according to an embodiment of the present invention.

[圖2]聚光型太陽光發電模組放大示意立體圖(部分裁斷)。 [Fig. 2] An enlarged schematic perspective view (partial cutting) of a concentrating solar power generation module.

[圖3]圖2中的III部之放大圖。 FIG. 3 is an enlarged view of a portion III in FIG. 2. FIG.

[圖4]設有發電元件之部位中的聚光型太陽光發電模組的部分截面概要示意圖。 Fig. 4 is a schematic partial cross-sectional view showing a concentrating solar power generation module in a portion where a power generating element is provided.

[圖5]實施形態與習知技術之撓性印刷配線板的截面比較示意說明圖。 Fig. 5 is a schematic explanatory view showing a cross section of a flexible printed wiring board of an embodiment and a prior art.

〔實施形態之要旨〕 [The gist of the embodiment]

就本發明實施形態之要旨而言，至少包含下述者。 The gist of the embodiment of the present invention includes at least the following.

(1)實施形態之撓性印刷配線板， 係接合有供發電元件連接之導電層、及具有絕緣性之絕緣層、及補強此絕緣層之補強層之聚光型太陽光發電模組用的撓性印刷配線板，其中，前述補強層，為和前述導電層藉由同一材料所形成之物。 (1) A flexible printed wiring board of an embodiment, a flexible printed wiring board for a concentrating solar power generation module in which a conductive layer to be connected to a power generating element, an insulating insulating layer, and a reinforcing layer for reinforcing the insulating layer are joined, wherein the reinforcing layer is It is formed by the same material as the foregoing conductive layer.

藉由這樣的構成，補強層與導電層之熱膨脹率會成為相同，故即使將包含它們在內之各層藉由熱壓等予以接合，仍難以發生尺寸的偏差。此外，能夠將補強層與導電層以相同的條件加工，故將包含它們在內之各層予以接合的狀態下，能夠容易加工成期望的形狀。另，本實施形態之撓性印刷配線板中，於導電層與絕緣層之間、絕緣層與補強層之間介著其他層並不會造成妨礙，例如在它們之間亦可設有接着層。 According to this configuration, since the thermal expansion coefficients of the reinforcing layer and the conductive layer are the same, even if the layers including them are joined by hot pressing or the like, dimensional variation is less likely to occur. Further, since the reinforcing layer and the conductive layer can be processed under the same conditions, the layers including the layers can be easily processed into a desired shape. Further, in the flexible printed wiring board of the present embodiment, the other layers are not interposed between the conductive layer and the insulating layer, and between the insulating layer and the reinforcing layer. For example, an adhesive layer may be provided between them. .

(2)前述導電層及前述補強層，亦可為銅製。 (2) The conductive layer and the reinforcing layer may be made of copper.

當補強層為銅製的情形下，相較於習知鋁製的補強層而言熱傳導率高，因此在確保散熱性的前提下能夠形成得較薄。是故，能夠謀求撓性印刷配線板的輕量化。 When the reinforcing layer is made of copper, the heat conductivity is higher than that of the conventional aluminum reinforcing layer, so that it can be formed thinner while ensuring heat dissipation. Therefore, it is possible to reduce the weight of the flexible printed wiring board.

(3)較佳是在接合至前述絕緣層之前述補強層的一面，施加有黑化處理。 (3) Preferably, a blackening treatment is applied to one surface of the reinforcing layer bonded to the insulating layer.

藉此，能夠提高補強層與絕緣層之接合強度。 Thereby, the bonding strength between the reinforcing layer and the insulating layer can be improved.

(4)前述補強層的厚度，較佳是設定在30~140μm的範圍。 (4) The thickness of the reinforcing layer is preferably set in the range of 30 to 140 μm.

這是因為若比此範圍還小，則散熱性或補強的效果會 變小，若比此範圍還大，則輕量化或柔軟性、低成本化的效果會變小的緣故。 This is because if it is smaller than this range, the heat dissipation or reinforcement effect will be When it is larger than this range, the effect of weight reduction, flexibility, and cost reduction will become small.

(5)在供前述發電元件連接之前述導電層的面，亦可設有保護層，其以避開前述發電元件的狀態覆蓋。 (5) A protective layer may be provided on the surface of the conductive layer to which the power generating element is connected, which is covered in a state avoiding the power generating element.

藉由這樣的構成，導電層會受到保護層保護，能夠提高耐久性，並且能夠防止漏電的發生。 With such a configuration, the conductive layer is protected by the protective layer, durability can be improved, and leakage can be prevented from occurring.

(6)在和供前述絕緣層接合之面為相反側的前述補強層之面，亦可設有接着層，其用來接合至聚光型太陽光發電模組的框體。 (6) An adhesive layer may be provided on the surface of the reinforcing layer opposite to the surface to which the insulating layer is bonded, for bonding to the frame of the concentrating solar power generation module.

藉由這樣的構成，能夠迅速且簡單地進行將撓性印刷配線板接着而安裝至聚光型太陽光發電模組的框體之作業。 With such a configuration, the operation of attaching the flexible printed wiring board to the casing of the concentrating solar power generation module can be performed quickly and easily.

(7)實施形態之聚光型太陽光發電模組，具備：具有安裝面之框體、及被接合於前述安裝面之上述(1)~(6)任一項所述之撓性印刷配線板、及對應於此撓性印刷配線板的發電元件而被安裝於前述框體，將太陽光聚光至前述發電元件之透鏡要素。 (7) The concentrating solar power generation module according to the embodiment, comprising: a housing having a mounting surface; and the flexible printed wiring according to any one of (1) to (6) bonded to the mounting surface The board and the power generating element corresponding to the flexible printed wiring board are attached to the housing, and condense sunlight to the lens element of the power generating element.

藉由這樣的構成，能夠提供製造性良好的聚光型太陽光發電模組。 With such a configuration, it is possible to provide a concentrating solar power generation module having excellent manufacturability.

(8)實施形態之聚光型太陽光發電面板，係令上述(7)所述之聚光型太陽光發電模組集合複數個而成。 (8) The concentrating solar power generation panel according to the embodiment is a plurality of concentrating solar power generation modules according to the above (7).

藉由這樣的構成，能夠提供製造性良好的聚光型太陽 光發電面板。 With such a configuration, it is possible to provide a concentrating sun with good manufacturability. Photovoltaic panels.

(9)實施形態之撓性印刷配線板的製造方法，包含：將供發電元件連接之導電層、及具有絕緣性之絕緣層、及和前述導電層由同一材料所形成而補強前述絕緣層之補強層予以接合，以形成聚光型太陽光發電模組用的撓性印刷配線板的中間材料之工程；及將前述中間材料切斷加工成期望的形狀之工程。 (9) A method of manufacturing a flexible printed wiring board according to an embodiment, comprising: a conductive layer to which a power generating element is connected, an insulating layer having an insulating property, and the conductive layer formed of the same material to reinforce the insulating layer The reinforcing layer is joined to form an intermediate material of the flexible printed wiring board for the concentrating solar power generation module; and the process of cutting the intermediate material into a desired shape.

按照此構成，導電層與補強層為相同材料，故在將包含它們在內之各層予以接合的狀態下態夠容易地切斷成期望的形狀，能夠減少製造工程，謀求製造成本的減低。此外，由於是在將包含導電層與補強層在內之各層事先接合的狀態下切斷成期望的形狀，故切斷時能夠降低對補強層要求之剛性，能夠謀求補強層的薄厚度化。 According to this configuration, since the conductive layer and the reinforcing layer are made of the same material, the state in which the layers including the layers are joined can be easily cut into a desired shape, and the manufacturing process can be reduced, and the manufacturing cost can be reduced. In addition, since the respective layers including the conductive layer and the reinforcing layer are previously joined to each other in a desired shape, the rigidity required for the reinforcing layer can be reduced at the time of cutting, and the thickness of the reinforcing layer can be reduced.

〔實施形態之細節〕 [Details of the embodiment]

圖1為本發明一實施形態之聚光型太陽光發電裝置示意立體圖。 Fig. 1 is a schematic perspective view of a concentrating solar power generation device according to an embodiment of the present invention.

圖中，聚光型太陽光發電裝置100，具備聚光型太陽光發電面板1、及在背面中央支撐其之支柱2、及安裝支柱2之架台3。 In the figure, the concentrating solar power generation device 100 includes a concentrating solar power generation panel 1 , a pillar 2 that supports the center of the back surface, and a gantry 3 that mounts the pillars 2 .

聚光型太陽光發電面板1，例如，剔除與支柱2連接用的中央部，係令62個(縱7×橫9-1)聚光型太陽光發電模組1M縱橫集合而成。 In the concentrating solar power generation panel 1, for example, the center portion for connection with the pillar 2 is removed, and 62 (vertical 7×horizon 9-1) concentrating solar power generation modules 1M are assembled vertically and horizontally.

1個聚光型太陽光發電模組1M的額定輸出例如約120W，就聚光型太陽光發電面板1全體而言，成為約7.5kW的額定輸出。 The rated output of the concentrating solar power generation module 1M is, for example, about 120 W, and is a rated output of about 7.5 kW for the entire concentrating solar power generation panel 1 .

太陽光發電面板1，能夠藉由未圖示之旋轉機構以支柱2為軸而朝方位角及仰角的2方向旋動，能夠令聚光型太陽光發電面板1追蹤而總是面向太陽的方向。 The solar power generation panel 1 can be rotated in the azimuth direction and the elevation direction by the support mechanism 2 by the rotation mechanism (not shown), and the concentrating solar power generation panel 1 can be tracked and always facing the sun. .

圖2為聚光型太陽光發電模組(以下亦簡稱為模組)1M放大示意立體圖(部分裁斷)。 2 is an enlarged schematic perspective view (partial cutting) of a concentrating solar power generation module (hereinafter also referred to simply as a module) 1M.

模組1M，就主要的構成要素而言具備：具有底板11a之容器狀(角皿狀)的框體11、及和底板11a的上面(安裝面)相接而設置之撓性印刷配線板12、及以堵塞框體11的開口部分之方式安裝於緣部(brim)11b之一次聚光部13。框體11為金屬製，較佳為鋁製。框體11，藉由金屬製而具有良好的熱傳導性。是故，從撓性印刷配線板12往框體11之散熱性特別好。模組1M的大小，例如，能夠將縱、橫、及深度的尺寸各自做成840mm、640mm、85mm。 The module 1M includes a housing 11 having a container shape (corner-shaped) having a bottom plate 11a, and a flexible printed wiring board 12 provided in contact with an upper surface (mounting surface) of the bottom plate 11a. And attaching to the primary concentrating portion 13 of the brim 11b so as to block the opening portion of the casing 11. The frame 11 is made of metal, preferably aluminum. The casing 11 has good thermal conductivity by being made of metal. Therefore, the heat dissipation from the flexible printed wiring board 12 to the casing 11 is particularly excellent. The size of the module 1M can be, for example, 840 mm, 640 mm, or 85 mm in the vertical, horizontal, and depth dimensions.

一次聚光部13，為菲涅爾透鏡(Fresnel lens)陣列，身為將太陽光聚光的透鏡要素之菲涅爾透鏡13f，是形成為以矩陣狀並排複數個(例如縱16×橫12，共192個)。這樣的一次聚光部13，例如能夠做成以玻璃板為基材，在其背面(內側)形成有矽氧樹脂膜之物。菲涅爾透鏡13f，形成於該樹脂膜。在框體11的外面，設有用來將模組1M的輸出予以取出之連接器14。 The primary concentrating portion 13 is a Fresnel lens array, and the Fresnel lens 13f, which is a lens element that condenses sunlight, is formed in a matrix and arranged in parallel (for example, a vertical 16× horizontal 12 , a total of 192). Such a primary concentrating portion 13 can be formed, for example, by using a glass plate as a base material and a resin film formed on the back surface (inside). A Fresnel lens 13f is formed on the resin film. On the outside of the casing 11, a connector 14 for taking out the output of the module 1M is provided.

圖3為圖2中的III部之放大圖。圖3中，撓性印刷配線板12，具備帶狀之撓性基板12f、及設於其上面之發電元件(太陽電池)121、及設置成罩住該發電元件121之二次聚光部122。發電元件121及二次聚光部122的組合(set)，是在一次聚光部13的對應於各菲涅爾透鏡13f之位置，恰好設有相同個數。二次聚光部122，將從各菲涅爾透鏡13f入射的太陽光聚集至發電元件121上。二次聚光部122，例如為透鏡。本實施形態中，是使用球形的透鏡，但亦可為球形以外的形狀。此外，亦可替換透鏡，而為一面將光漫射一面往下方引導之反射鏡。 Fig. 3 is an enlarged view of a portion III of Fig. 2; In FIG. 3, the flexible printed wiring board 12 includes a strip-shaped flexible substrate 12f, a power generating element (solar battery) 121 provided thereon, and a secondary concentrating portion 122 provided to cover the power generating element 121. . The combination of the power generating element 121 and the secondary condensing unit 122 is exactly the same number in the position of the primary concentrating unit 13 corresponding to each Fresnel lens 13f. The secondary condensing unit 122 collects sunlight incident from each Fresnel lens 13f onto the power generating element 121. The secondary concentrating portion 122 is, for example, a lens. In the present embodiment, a spherical lens is used, but a shape other than a spherical shape may be used. In addition, the lens may be replaced by a mirror that guides the light downward while diffusing the light.

圖4為設有發電元件121之部位中的模組1M的部分截面概要示意圖。 4 is a schematic partial cross-sectional view showing a module 1M in a portion where the power generating element 121 is provided.

撓性基板12f，若把接着層等也想成其一部分，則從下方開始依序由接着層123、補強板(補強層)124、接着層125、絕緣基材(絕緣層)126、圖樣(導電層)127、覆蓋膜(coverlay)(保護層)128所構成。又，撓性印刷配線板12，係構成撓性基板12f之各層與發電元件121及二次聚光部122成為一體，藉此構成。另，圖4所示之各層123~128的厚度，與實際尺寸大致成比例。 When the adhesive layer 12f is also considered to be a part of the adhesive layer 12f, the adhesive layer 12, the reinforcing plate (reinforcing layer) 124, the adhesive layer 125, the insulating substrate (insulating layer) 126, and the pattern are sequentially formed from the lower side. A conductive layer 127 and a coverlay (protective layer) 128 are formed. Further, the flexible printed wiring board 12 is configured such that each layer constituting the flexible board 12f is integrated with the power generating element 121 and the secondary concentrating portion 122. In addition, the thickness of each of the layers 123 to 128 shown in FIG. 4 is approximately proportional to the actual size.

發電元件121，具有輸出端子亦即引線框121a，該引線框121a和圖樣127的規定部位電性連接。此外，圖4中的122a，為在發電元件121上支撐二次聚光部122之支撐體。 The power generating element 121 has a lead frame 121a which is an output terminal, and the lead frame 121a is electrically connected to a predetermined portion of the pattern 127. Further, 122a in FIG. 4 is a support that supports the secondary concentrating portion 122 on the power generating element 121.

圖樣127，例如由銅箔所構成，是在絕緣基材126上藉由蝕刻等而形成。 The pattern 127 is made of, for example, a copper foil, and is formed on the insulating substrate 126 by etching or the like.

絕緣基材126，例如為耐熱性優良之聚醯亞胺製。藉由絕緣基材126，圖樣127與框體11絕緣。 The insulating base material 126 is made of, for example, polyimide having excellent heat resistance. The pattern 127 is insulated from the frame 11 by the insulating substrate 126.

最下方的接着層123，將框體11的底板11a與補強板124互相接着。該接着層123，具有導電性以便將框體11與補強板124保持在相同電位(接地電位)。此外，該接着層123，例如由雙面膠帶所構成，是在撓性印刷配線板12尚未被安裝於框體11之單體的狀態下，事先被安裝於補強板124的下面。 The lowermost layer 123 connects the bottom plate 11a of the frame 11 and the reinforcing plate 124 to each other. The adhesive layer 123 has electrical conductivity to maintain the frame 11 and the reinforcing plate 124 at the same potential (ground potential). In addition, the adhesive layer 123 is formed of, for example, a double-sided tape, and is attached to the lower surface of the reinforcing plate 124 in advance in a state in which the flexible printed wiring board 12 is not attached to the casing 11.

另一接着層125，將補強板124與絕緣基材126互相接着。具體而言，補強板124與絕緣基材126係隔著接着層125藉由熱壓而接合。絕緣基材126與圖樣127，構成為狹義的撓性基板12f。 Another subsequent layer 125 connects the reinforcing plate 124 and the insulating substrate 126 to each other. Specifically, the reinforcing plate 124 and the insulating base material 126 are joined by heat pressing via the adhesive layer 125. The insulating base material 126 and the pattern 127 are configured as a flexible substrate 12f in a narrow sense.

將圖樣127覆蓋之覆蓋膜128，為絕緣材料之層，耐電壓優良。覆蓋膜128，例如能夠做成聚醯亞胺等合成樹脂製。覆蓋膜128，藉由熱熔接而以密合至圖樣127之狀態被接合。覆蓋膜128，藉由覆蓋圖樣127而加以保護，並且防止漏電的發生。 The cover film 128 covered by the pattern 127 is a layer of an insulating material and has excellent withstand voltage. The cover film 128 can be made, for example, of a synthetic resin such as polyimide. The cover film 128 is joined by being heat-sealed to be in close contact with the pattern 127. The cover film 128 is protected by covering the pattern 127 and prevents the occurrence of electric leakage.

覆蓋膜128，熱傳導率被訂為0.2〔W/m．K〕程度。像這樣，覆蓋膜128的熱傳導率被設定地相對較低，藉此能夠抑制太陽光的熱傳導。由此觀點，覆蓋膜128，較佳是做成太陽光的反射率高之「白色」系。 Cover film 128, the thermal conductivity is set to 0.2 [W / m. K] degree. As such, the thermal conductivity of the cover film 128 is set relatively low, whereby heat conduction of sunlight can be suppressed. From this point of view, the cover film 128 is preferably a "white" system in which the reflectance of sunlight is high.

補強板124，是在不喪失柔軟性的程度，使撓 性印刷配線板12帶有若干的剛性。因此，於發電模組1M之製造時等能使撓性印刷配線板12的取用變得容易。此外，藉由補強板124，會獲得撓性印刷配線板12全體的變形防止效果，能夠保持圖樣127的形狀。 The reinforcing plate 124 is scratched without losing flexibility. The printed wiring board 12 has a certain rigidity. Therefore, the use of the flexible printed wiring board 12 can be facilitated during the manufacture of the power generation module 1M. Further, by the reinforcing plate 124, the deformation preventing effect of the entire flexible printed wiring board 12 is obtained, and the shape of the pattern 127 can be maintained.

本實施形態之補強板124，訂為銅製。因此，具有用來使發電元件121或圖樣127等的熱往框體11的底板11a散熱之優良熱傳導性(散熱性)。 The reinforcing plate 124 of the present embodiment is made of copper. Therefore, it has excellent thermal conductivity (heat dissipation) for dissipating heat of the power generating element 121 or the pattern 127 to the bottom plate 11a of the casing 11.

表1中，針對撓性印刷配線板12各層的厚度，分別揭示其推薦值及可適用之範圍。另，表1中各層的上下方向的記載順序，對應於圖4中各層的上下方向的層積順序。 In Table 1, the recommended values and applicable ranges are respectively disclosed for the thicknesses of the respective layers of the flexible printed wiring board 12. The order of the vertical direction of each layer in Table 1 corresponds to the stacking order of the vertical direction of each layer in Fig. 4 .

本實施形態之補強板124為銅製，由散熱性及補強的觀點，理想的厚度是做成105μm。另一方面，習知(例如參照專利文獻1)之撓性基板的補強板是做成鋁 製。鋁的熱傳導率為240W/mK，比銅的熱傳導率400W/mK還小，因此若欲獲得期望的散熱性則不得不將厚度更增大。 The reinforcing plate 124 of the present embodiment is made of copper, and the thickness is preferably 105 μm from the viewpoint of heat dissipation and reinforcement. On the other hand, a reinforcing plate of a flexible substrate (for example, refer to Patent Document 1) is made of aluminum. system. The thermal conductivity of aluminum is 240 W/mK, which is smaller than the thermal conductivity of copper of 400 W/mK, so the thickness has to be increased if desired heat dissipation is desired.

具體而言，本實施形態之銅製的補強板124，厚度為105μm，相對於此，習知之鋁製的補強板厚度做成800μm。其結果，本實施形態之撓性印刷配線板12，相較於將補強板124以外的各層的厚度均設為相同之情形下的習知之撓性印刷配線板，約成為1/5的厚度。圖5視覺地表現了本實施形態與習知技術中撓性印刷配線板12的厚度差異。圖5中，習知技術中，與本實施形態對應之層係標上附「’」之符號。 Specifically, the copper reinforcing plate 124 of the present embodiment has a thickness of 105 μm, whereas the thickness of the conventional reinforcing plate made of aluminum is 800 μm. As a result, the flexible printed wiring board 12 of the present embodiment has a thickness of about 1/5 as compared with the conventional flexible printed wiring board in which the thickness of each layer other than the reinforcing plate 124 is the same. Fig. 5 visually shows the difference in thickness between the present embodiment and the prior art flexible printed wiring board 12. In Fig. 5, in the prior art, the layer corresponding to the embodiment is marked with the symbol "".

另一方面，銅的比重約9.0，比鋁的比重約2.7還大。然而，本實施形態之補強板124的厚度(105μm)，自習知之鋁製的補強板的厚度(800μm)大幅減少，故其重量成為約一半。是故，本實施形態之補強板124，厚度及重量均比習知還小，能夠減低材料費。 On the other hand, the specific gravity of copper is about 9.0, which is larger than the specific gravity of aluminum of about 2.7. However, the thickness (105 μm) of the reinforcing plate 124 of the present embodiment is greatly reduced from the thickness (800 μm) of the conventional reinforcing plate made of aluminum, so that the weight is about half. Therefore, the reinforcing plate 124 of the present embodiment has a smaller thickness and weight than conventional ones, and can reduce the material cost.

此外，補強板124的厚度及重量變小，因此能夠謀求撓性印刷配線板12全體的薄厚度化及輕量化。因此，撓性印刷配線板12的取用變得更容易，能夠使製造太陽光發電模組時的作業性提升。 Further, since the thickness and weight of the reinforcing plate 124 are reduced, it is possible to reduce the thickness and weight of the entire flexible printed wiring board 12. Therefore, the use of the flexible printed wiring board 12 becomes easier, and the workability at the time of manufacturing a photovoltaic power generation module can be improved.

鋁的莫氏硬度約2.5，相對於此，銅的莫氏硬度約3.0，比鋁還稍大。但，本實施形態之補強板124，厚度比習知還變小，因此能夠充分地確保撓性印刷配線板12所要求之柔軟性。 The Mohs hardness of aluminum is about 2.5. In contrast, the Mohs hardness of copper is about 3.0, which is slightly larger than aluminum. However, since the thickness of the reinforcing plate 124 of the present embodiment is smaller than that of the prior art, the flexibility required for the flexible printed wiring board 12 can be sufficiently ensured.

另，如表1所示，補強板124的厚度，能夠設定在30μm~140μm的範圍。這是因為若補強板124的厚度比30μm還小，則就散熱性或補強而言的效果會變小，若比140μm還大，則撓性印刷配線板12的輕量化或柔軟性、低成本化的效果會變小的緣故。另，當重視補強板124的輕量化、柔軟性、及低成本化的情形下，補強板124的厚度更佳是設定在30μm~110μm的範圍。 Further, as shown in Table 1, the thickness of the reinforcing plate 124 can be set in the range of 30 μm to 140 μm. When the thickness of the reinforcing plate 124 is smaller than 30 μm, the effect of heat dissipation or reinforcement is small, and if it is larger than 140 μm, the flexible printed wiring board 12 is lighter, softer, and lower in cost. The effect of theization will be smaller. Further, when the weight, flexibility, and cost of the reinforcing plate 124 are emphasized, the thickness of the reinforcing plate 124 is preferably set in the range of 30 μm to 110 μm.

撓性印刷配線板12，是在形成有圖樣127之絕緣基材126上，隔著接着層125將補強板124接合後，利用加壓等而被切斷加工(沖孔加工)成規定的形狀(細長帶狀)。或是，在形成有圖樣127之絕緣基材126上接合補強板124後，在圖樣127上安裝發電元件121及二次聚光部122，在補強板124安裝接着層123，其後被切斷加工成規定的形狀。 The flexible printed wiring board 12 is formed by bonding the reinforcing plate 124 to the insulating base material 126 on which the pattern 127 is formed, and then cutting (punching) into a predetermined shape by pressurization or the like. (slim ribbon). Alternatively, after the reinforcing plate 124 is joined to the insulating base material 126 on which the pattern 127 is formed, the power generating element 121 and the secondary concentrating portion 122 are attached to the pattern 127, and the adhesive layer 124 is attached to the reinforcing plate 124, and then cut off. Processed into a defined shape.

本實施形態中，圖樣127與補強板124皆為銅製，因此能夠以幾乎相同的條件將它們做切斷加工。是故，即使不將形成了圖樣127之絕緣基材126與補強板124予以分別切斷，也能夠在接合了的狀態下同時進行切斷加工，相較於分別切斷的情形能夠減少製造工程。 In the present embodiment, since the pattern 127 and the reinforcing plate 124 are made of copper, they can be cut by almost the same conditions. Therefore, even if the insulating base material 126 and the reinforcing plate 124 on which the pattern 127 is formed are not cut, the cutting process can be simultaneously performed in the joined state, and the manufacturing process can be reduced as compared with the case of the respective cutting. .

此外，圖樣127與補強板124為相同材料，熱膨脹率亦相同，因此會變得不易因它們藉由熱壓被接合時的熱膨脹差、或接合後受到冷卻時的熱收縮差而發生尺寸偏差。因此，便可提高製品的尺寸精度，能使製品不良減少，使良率提升。 Further, since the pattern 127 and the reinforcing plate 124 are made of the same material and have the same thermal expansion coefficient, it is difficult to cause dimensional deviation due to a difference in thermal expansion when they are joined by hot pressing or a difference in thermal shrinkage when cooled after joining. Therefore, the dimensional accuracy of the product can be improved, the defect of the product can be reduced, and the yield can be improved.

又，當將形成了圖樣127之絕緣基材126與補強板124予以分別切斷後再藉由熱壓接合的情形下，若補強板124的剛性低則會變得難以藉由熱壓適當地接合，但本實施形態中，是將形成了圖樣127之絕緣基材126與補強板124予以事先接合再進行切斷，故對補強板124要求之剛性變低，相對比便能將補強板124薄厚度化。此外，本實施形態中，相較於習知之鋁製的補強板而言是使用加工性好的銅製之補強板124，故能夠提高用於切斷之模具的壽命。此外，薄厚度的銅板流通量大，因此能夠抑制成本。 Further, when the insulating base material 126 and the reinforcing plate 124 on which the pattern 127 is formed are cut and then joined by thermocompression bonding, if the rigidity of the reinforcing plate 124 is low, it becomes difficult to appropriately join by the hot pressing. However, in the present embodiment, the insulating base material 126 and the reinforcing plate 124 on which the pattern 127 is formed are joined and cut in advance, so that the rigidity required for the reinforcing plate 124 is lowered, and the reinforcing plate 124 can be thinned in comparison with each other. Thickness. Further, in the present embodiment, the reinforcing plate made of copper having good workability is used as compared with the conventional reinforcing plate made of aluminum, so that the life of the die for cutting can be improved. Further, since the copper plate having a small thickness is large in flow amount, cost can be suppressed.

補強板124，在接着層125側之面被施加黑化處理，於表面形成有微細的凹凸。如此一來，能夠提高對於絕緣基材126之接着力，並且能夠抑制氣泡的發生。本實施形態中，成功地將接着力提高大約3~5倍。此外，補強板124的接着層123側之面受到鏡面加工。此面，只要透過接着層123與框體11的底板11a做成同電位即足夠，因此亦可不施加黑化處理。 The reinforcing plate 124 is subjected to a blackening treatment on the surface of the adhesive layer 125 side, and fine irregularities are formed on the surface. As a result, the adhesion to the insulating substrate 126 can be increased, and the occurrence of bubbles can be suppressed. In the present embodiment, the adhesion is successfully increased by about 3 to 5 times. Further, the surface of the reinforcing plate 124 on the side of the adhesive layer 123 is mirror-finished. This surface is sufficient to be the same potential as the bottom plate 11a of the casing 11 through the adhesive layer 123. Therefore, the blackening treatment may not be applied.

另，上述實施形態中，框體11訂為金屬製，但並非限定於金屬製，亦可訂為樹脂製。在此情形下，框體11變得尤其輕量，就聚光型太陽光發電模組1M全體而言也變得尤其輕量。另，即使為樹脂亦有熱傳導性，故會獲得一定的散熱性。尤其是，添加了具有高熱傳導性之絕緣性填料(例如氧化鋁、矽石、炭化矽、氧化鎂等)的樹脂，其熱傳導性優良，散熱性提升，故為合適。此外，藉由在樹脂的表面施加金屬塗布，也能將表面的熱傳導性 提高至和金屬同等。 Further, in the above embodiment, the casing 11 is made of metal, but it is not limited to metal, and may be made of resin. In this case, the housing 11 is particularly lightweight, and the concentrating solar power generation module 1M is also particularly lightweight. In addition, even if it is a resin, it has thermal conductivity, so that a certain heat dissipation property is obtained. In particular, a resin having an insulating filler having high thermal conductivity (for example, alumina, vermiculite, tantalum carbide, magnesium oxide, or the like) is added, which is excellent in thermal conductivity and improved heat dissipation. In addition, the thermal conductivity of the surface can also be achieved by applying a metal coating on the surface of the resin. Increase to the same level as metal.

此外，上述實施形態中，二次聚光部122是和發電元件121一起組裝至撓性基板12f上，但亦可將二次聚光部122和撓性基板12f分開設置，此外，也可將二次聚光部本身省略。 Further, in the above-described embodiment, the secondary concentrating portion 122 is assembled to the flexible substrate 12f together with the power generating element 121, but the secondary condensing portion 122 and the flexible substrate 12f may be separately provided, or The secondary concentrating portion itself is omitted.

圖樣127與補強板124，只要是相同材料，則亦可由銅以外的金屬來形成。 The pattern 127 and the reinforcing plate 124 may be formed of a metal other than copper as long as they are the same material.

表1所示各層的推薦值或適用範圍為一例，未必受到限定，也會依各層的素材而變化。尤其是，針對補強板，由散熱性、輕量化、柔軟性、成本的觀點，只要厚度或其範圍被設定成和習知之鋁製的補強板大致同等、或至少1者獲得優良結果即可。 The recommended values or applicable ranges of the respective layers shown in Table 1 are examples, and are not necessarily limited, and may vary depending on the materials of the respective layers. In particular, the reinforcing plate may have a thickness or a range thereof that is set to be substantially equal to or better than a conventional aluminum reinforcing plate from the viewpoints of heat dissipation, weight reduction, flexibility, and cost.

另，本次揭示之實施形態中，應認為所有特點均為示例，並非限制性的事項。本發明之範圍意圖包括申請專利範圍所揭示，與申請專利範圍之意義均等及其範圍內的所有變更。 In addition, in the embodiments disclosed herein, all the features are considered as examples and are not restrictive. The scope of the invention is intended to be embraced by the scope of the claims

11‧‧‧框體 11‧‧‧ frame

11a‧‧‧底板 11a‧‧‧floor

12‧‧‧撓性印刷配線板 12‧‧‧Flexible printed wiring board

12f‧‧‧撓性基板 12f‧‧‧Flexible substrate

121‧‧‧發電元件 121‧‧‧Power generation components

121a‧‧‧引線框 121a‧‧‧ lead frame

122‧‧‧二次聚光部 122‧‧‧Secondary concentrating department

122a‧‧‧支撐體 122a‧‧‧Support

123‧‧‧接着層 123‧‧‧Next layer

124‧‧‧補強板(補強層) 124‧‧‧ reinforcing plate (reinforcing layer)

125‧‧‧接着層 125‧‧‧Next layer

126‧‧‧絕緣基材(絕緣層) 126‧‧‧Insulation substrate (insulation layer)

127‧‧‧圖樣(導電層) 127‧‧‧ pattern (conductive layer)

128‧‧‧覆蓋膜(保護層) 128‧‧‧ Cover film (protective layer)

Claims (10)

一種撓性印刷配線板，具備：供發電元件連接之導電層、及具有絕緣性之絕緣層、及補強此絕緣層之補強層，前述導電層、前述絕緣層、及前述補強層依此順序被接合，前述補強層，和前述導電層藉由同一材料所形成。 A flexible printed wiring board comprising: a conductive layer for connecting a power generating element; an insulating layer having an insulating property; and a reinforcing layer for reinforcing the insulating layer, wherein the conductive layer, the insulating layer, and the reinforcing layer are sequentially Bonding, the aforementioned reinforcing layer, and the aforementioned conductive layer are formed by the same material. 如申請專利範圍第1項所述之撓性印刷配線板，其中，前述導電層及前述補強層為銅製。 The flexible printed wiring board according to claim 1, wherein the conductive layer and the reinforcing layer are made of copper. 如申請專利範圍第1項所述之撓性印刷配線板，其中，在接合至前述絕緣層之前述補強層的一面，施加有黑化處理。 The flexible printed wiring board according to claim 1, wherein a blackening treatment is applied to one surface of the reinforcing layer bonded to the insulating layer. 如申請專利範圍第2項所述之撓性印刷配線板，其中，在接合至前述絕緣層之前述補強層的一面，施加有黑化處理。 The flexible printed wiring board according to claim 2, wherein a blackening treatment is applied to one surface of the reinforcing layer bonded to the insulating layer. 如申請專利範圍第2項所述之撓性印刷配線板，其中，前述補強層的厚度設定在30~140μm的範圍。 The flexible printed wiring board according to claim 2, wherein the thickness of the reinforcing layer is set in a range of 30 to 140 μm. 如申請專利範圍第1項至第5項中任一項所述之撓性印刷配線板，其中，設有保護層，將供前述發電元件連接之前述導電層的面，以避開前述發電元件的狀態予以覆蓋。 The flexible printed wiring board according to any one of the preceding claims, wherein a protective layer is provided, and a surface of the conductive layer to which the power generating element is connected is disposed to avoid the power generating element. The status is covered. 如申請專利範圍第1項至第5項中任一項所述之撓性印刷配線板，其中，在和供前述絕緣層接合之面為相反側的前述補強層之面，設有接着層，其用來接合至聚光型太陽光發電模組的框體。 The flexible printed wiring board according to any one of the first aspect, wherein the surface of the reinforcing layer opposite to the surface to which the insulating layer is bonded is provided with an adhesive layer. It is used to join the frame of the concentrating solar power module. 一種聚光型太陽光發電模組，具備：具有安裝面之框體、及被接合於前述安裝面之申請專利範圍第1項至第5項中任一項所述之撓性印刷配線板、及對應於此撓性印刷配線板的發電元件而被安裝於前述框體，將太陽光聚光至前述發電元件之透鏡要素。 A concentrating solar power generation module comprising: a housing having a mounting surface; and a flexible printed wiring board according to any one of claims 1 to 5, which is bonded to the mounting surface, And the power generation element corresponding to the flexible printed wiring board is attached to the housing, and condenses sunlight to the lens element of the power generating element. 種聚光型太陽光發電面板，係令申請專利範圍第8項所述之聚光型太陽光發電模組集合複數個而成。 A concentrating solar power generation panel is a plurality of concentrating solar power generation modules described in claim 8 of the patent application. 一種撓性印刷配線板的製造方法，包含：將供發電元件連接之導電層、及具有絕緣性之絕緣層、及和前述導電層由同一材料所形成而補強前述絕緣層之補強層予以接合，以形成聚光型太陽光發電模組用的撓性印刷配線板的中間材料之工程；及將前述中間材料切斷加工成期望的形狀之工程。 A method of manufacturing a flexible printed wiring board comprising: bonding a conductive layer to which a power generating element is connected, an insulating layer having an insulating property, and a reinforcing layer formed of the same material and reinforcing the insulating layer; The process of forming an intermediate material of a flexible printed wiring board for a concentrating solar power generation module; and the process of cutting the intermediate material into a desired shape.
TW105118581A 2015-07-09 2016-06-14 Flexible printed wiring board, concentrating solar power generation module, concentrating solar power generation panel, and method for manufacturing flexible printed wiring board TW201711538A (en)

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