CN104780739B - Casing and portable equipment - Google Patents
Casing and portable equipment Download PDFInfo
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- CN104780739B CN104780739B CN201510009045.XA CN201510009045A CN104780739B CN 104780739 B CN104780739 B CN 104780739B CN 201510009045 A CN201510009045 A CN 201510009045A CN 104780739 B CN104780739 B CN 104780739B
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- layers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of casing, its clad material formed by Al layers and the engagement of Cu layers is formed, and the Al layers are made up of Al or Al alloys, and Cu layers are made up of Cu or Cu alloys and the coefficient of heat conduction is bigger than Al layer.
Description
Technical field
The present invention relates to for example suitable for be built-in with heat release electronic unit equipment casing and possess the machine
The portable equipment of shell.
Background technology
At present, in portable equipment etc., in order to protect the display part for display image to use machine from the impact of outside
Shell.For example, disclosing a kind of display device in Japanese Unexamined Patent Publication 2006-113589 publications, it possesses panel unit and used
In fixed and supporting faceplate unit the casing being made up of SUS.
On the other hand, in recent years, lightweight is wished in the electronic equipment such as portable equipment.Now, because SUS ratio is great
(proportion is about 7.8), therefore, in the structure described in Japanese Unexamined Patent Publication 2006-113589 publications, it is difficult to realize casing and show
The lightweight of showing device.Therefore, in order that casing lightweight, it is proposed that (proportion is about by a kind of Al smaller than SUS using proportion
2.7) scheme of casing.For example, disclose this casing in Japanese Unexamined Patent Publication 2008-177275 publications.
A kind of mobile phone terminal is disclosed in Japanese Unexamined Patent Publication 2008-177275 publications, it possesses：The ministrys of electronics industry such as display
Part and formed in a manner of housing electronic part and by aluminium parts insert molding in the basket portion (casing) of resin.The mobile phone is whole
In end, the fin containing graphite for ensuring heat transfer is pasted between the thermal source of electronic circuit etc. and basket portion.
But in the basket portion of the mobile phone terminal described in Japanese Unexamined Patent Publication 2008-177275 publications, basket can be realized
The lightweight in body portion, on the other hand, because Al heat conductivity is insufficient, via fin from heat source to the aluminium in basket portion
The heat of part can not fully conduct it is overall to aluminium parts, the problem of accordingly, there exist can not fully be radiated in basket portion.
The content of the invention
The present invention completes to solve problem as described above, and an object of the present invention is to provide a kind of energy
Enough realize lightweight and be sufficiently carried out the casing of radiating and possess the portable equipment of the casing.
The first aspect of the present invention provides a kind of casing (chassis), its covering formed by Al layers and the engagement of Cu layers
(clad) material is formed, and above-mentioned Al layers are made up of Al or Al alloys, and above-mentioned Cu layers are made up of Cu or Cu alloys, and the coefficient of heat conduction
It is bigger than Al layer.
As described above, the casing of the first aspect of the present invention is by Al layers and the coefficient of heat conduction Cu layer bigger than Al layer are engaged
The clad material that forms is formed, using the coefficient of heat conduction Cu layer bigger than Al layer, compared with casing is only by the situation that Al layers are formed,
The heat conductivity of casing can be improved.Thus, it is possible to heat is quickly transferred to casing entirety, therefore, it is possible in casing
It is sufficiently carried out radiating.In addition, by using the small Al layers of proportion, compared with casing is only by the situation that Cu layers are formed, can make
Casing lightweight.In addition, being made up of casing the clad material for forming Al layers and the engagement of Cu layers, Al layers and Cu layers are directly
Engagement, therefore, compared with the situation that Al sheet materials and Cu sheet materials are engaged indirectly by bonding agent, on the interface of Al layers and Cu layers
Also heat transfer can effectively be carried out.Thereby, it is possible to which heat is rapidly transferred into casing entirety, therefore, it is possible in casing
It is sufficiently carried out radiating.
Wherein, " casing " described in the present invention refers to the purposes of needs heat dispersion to a certain degree and mechanical strength
Basket, housing, framework, housing etc..Such as including：It is fixed for the casing of the display part of display image or the use of portable equipment
In the casing of integrated circuit that is installed on substrate of protection etc., casing for protecting the electronic unit in portable equipment.Also
Including：The casing of the function with framework (framework) of portable equipment, with for electrically connect lead function casing with
And casing for blocking electromagnetism etc..
In the casing of above-mentioned first aspect, preferably Al layers by 0.2% yield strength be more than 200MPa Al alloy structures
Into.According to such composition, the mechanical strength of Al layers increases, therefore, it is possible to substantially ensure that the mechanical strength of casing.Accordingly, it is capable to
Access lightweight and high heat dispersion and mechanical strength also high casing.
In the casing of above-mentioned first aspect, preferably the thickness of Al layers be the aggregate thickness of Al layers and Cu layers 60% with
On.According to such composition, the ratio of the small Al layers of proportion can be increased, therefore, it is possible to further realize the lightweight of casing.
In the casing of above-mentioned first aspect, preferably the thickness of Cu layers is more than the 40% of the aggregate thickness of Al layers and Cu layers.
According to such composition, the ratio of the coefficient of heat conduction Cu layer bigger than Al layer can be increased, therefore, it is possible to further improve casing
Heat dispersion.
In the casing of above-mentioned first aspect, preferably Cu layers are made up of Cu.According to such composition, it can utilize and be passed by heat
Lead the heat dispersion that the Cu layers that the high Cu of coefficient ratio Cu alloys is formed further improve casing.
In the casing of above-mentioned first aspect, preferably Al layers include the first Al layers and the 2nd Al layers, and above-mentioned first Al layers exist
Engage with Cu layers on one side surface of Cu layers, be made up of Al or Al alloys；Above-mentioned 2nd Al layers are on another side surface of Cu layers
Engage with Cu layers, be made up of Al or Al alloys.Clad material has the three of the first Al layers, Cu layers and the 2nd Al layers with lamination successively
Rotating fields.If so there is the covering material for the three-decker for being clipped Cu layers from both sides using the first Al layers and the 2nd Al layers
Material, can suppress due to Al layers are different from the ductility of Cu layers and caused by casing bending.Also, have by clad material
The three-decker of Cu layers is clipped using the first Al layers and the 2nd Al layers, the surface that can suppress the Cu layers of corrosion-resistant is exposed to
Outside, therefore the corrosion resistance of casing can be improved.
In the structure being made up of the clad material of the above-mentioned three-decker with the first Al layers, Cu layers and the 2nd Al layers,
It is preferred that the average value of the thickness of the 2nd Al layers is less than more than the 95% 105% of the average value of the thickness of the first Al layers.According to this
The composition of sample, casing can be made to the structure of almost symmetry on thickness direction.That is, it is made up of same species (Al systems) metal material
First Al layers and the 2nd Al layers, and the roughly equal thickness formed within ± 5%, therefore, it is possible to suppress due to the first Al
Layer it is different with the thickness of slab of the 2nd Al layers and caused by bend.Therefore, it is possible to further suppress casing bending.
In the structure that the above-mentioned clad material by the three-decker with the first Al layers, Cu layers and the 2nd Al layers is formed,
It is preferred that the first Al layers and the 2nd Al layers are made up of the Al alloys with same composition.According to such composition, Cu layers two can be made
The ductility of side is essentially identical, therefore can further suppress casing bending.In addition, the average value in the thickness of the 2nd Al layers is
In the case of less than more than the 95% 105% of the average value of the thickness of first Al layers, can make the first Al layers and the 2nd Al layers by
Al alloys with same composition form and the of substantially equal thickness within ± 5% are made, and therefore, there is no need to carry out machine
The differentiation on the surface and the back side of shell, and can be more prone to the processing in manufacturing process of casing etc..
In the structure that the above-mentioned clad material by the three-decker with the first Al layers, Cu layers and the 2nd Al layers is formed,
It is preferred that the first Al layer thickness and the 2nd Al layers thickness the aggregate thickness for adding up to the first Al layers, Cu layers and the 2nd Al layers
More than 60%.According to such composition, the ratio of the first small Al layers of proportion and the 2nd Al layers can be increased, therefore, it is possible to enter
One step realizes the lightweight of casing.
In the structure that the above-mentioned clad material by the three-decker with the first Al layers, Cu layers and the 2nd Al layers is formed,
It is preferred that the thickness of Cu layers is more than the 40% of the aggregate thickness of the first Al layers, Cu layers and the 2nd Al layers., can according to such composition
Increase the ratio of the coefficient of heat conduction Cu layer bigger than the first Al layers and the 2nd Al layers, therefore, it is possible to further improve dissipating for casing
Hot property.
In the casing of above-mentioned first aspect, preferably Al layers are made up of Al-Mg alloys.According to such composition, by making
With containing the proportion Mg smaller than Al and the mechanical strength Al-Mg alloy higher than Al, high radiatingization and further reality can be obtained
The casing of lightweight and mechanical strength is showed.
In addition, the casing of the present invention can be as the casing for the portable equipment for being built-in with the electronic unit with heat release.It is logical
Light-weighted casing can be realized in light-weighted portable equipment is required using the invention described above by crossing, and can make portable equipment
Mitigate the mitigation amount of casing.Further, since the heat of the electronic unit from easy heat release can be made by the casing of the present invention
Effectively release, therefore the accumulation of heat in electronic unit can be suppressed, suppress the malfunction of the electronic unit caused by accumulation of heat.
In addition, in the case of with the electronic unit and chassis contact of heat release, can be by the heat from electronic unit more effectively
Release.Wherein, " electronic unit " not only includes the part using electric power such as display or integrated circuit (IC), also including battery etc.
The part of supply electric power.
In the casing of above-mentioned first aspect, at least a portion preferably on casing surface is formed formed with Sn or Sn alloys
Plating Sn layers.According to such composition, in the case where support etc. will be welded in without the casing of plating Sn layers, contained by scolding tin
Sn misgrowths sometimes (whisker), therefore, pass through casing surface at least participate in welding part formed plating Sn layers, energy
Enough suppress Sn misgrowth.
In the casing of above-mentioned first aspect, at least a portion preferably on casing surface is formed formed with Ni or Ni alloys
Ni layers.According to such composition, in the case where making circuit and chassis contact, by making circuit be contacted with the Ni layers of casing,
Resistance (contact resistance) increase in the contact portion of casing and circuit can be suppressed, accordingly it is also possible to which casing is used for
Realize the current circuit of circuit ground (earth, being grounded).Further, since the corrosion resistance of Ni layers is high, therefore, it is possible to further
Improve the corrosion resistance of casing.
In the casing of above-mentioned first aspect, the thickness for the casing being preferably made up of clad material is more than 0.1mm 1.0mm
Below.According to such composition, it can be ensured that as the sufficient mechanical strength of casing, and suppress to make because thickness is excessive
Into the equipment enlarging using casing.
In the casing of above-mentioned first aspect, preferably there is clad material the bilayer that lamination has Al layers and Cu layers successively to tie
Structure.According to such composition, there is the three-decker of the first Al layers, Cu layers and the 2nd Al layers with lamination successively with clad material
Situation is compared, can by the coefficient of heat conduction Cu layer configuration bigger than Al layer away from electronic unit etc. with heat release closer to position
Put, therefore, it is possible to further improve the heat dispersion of casing.
The second aspect of the present invention provides a kind of portable equipment, possesses：With heat release electronic unit and electronics will be come from
The casing that the heat of part is released, the clad material that casing is formed by Al layers and the engagement of Cu layers are formed, and the Al layers are closed by Al or Al
Gold is formed, and the Cu layers are made up of Cu or Cu alloys and the coefficient of heat conduction is bigger than Al layer.
As described above, the portable equipment of second aspect of the present invention possesses by Al layers and the coefficient of heat conduction Cu layer bigger than Al layer
The casing that the clad material formed is formed is engaged, by the coefficient of heat conduction Cu layer bigger than Al layer, is only made up of with casing Al layers
Situation compare, it is possible to increase the heat conductivity of casing.Thereby, it is possible to which heat is rapidly transferred into casing entirety, accordingly, it is capable to
It is enough to be sufficiently carried out radiating in casing.In addition, by using the small Al layers of proportion, the situation phase being only made up of with casing Cu layers
Than casing lightweight can be made.In addition, the clad material formed by casing by Al layers and the engagement of Cu layers is formed, Al layers and Cu
Layer directly engagement, therefore, compared with the situation that Al sheet materials and Cu sheet materials are engaged indirectly by bonding agent, in Al layers and Cu layers
Also heat transfer can be effectively carried out on interface.Thereby, it is possible to which heat is rapidly transferred into casing entirety, therefore, in casing
In can be sufficiently carried out radiating.
In the portable equipment of above-mentioned second aspect, preferably Al layers are closed by the Al that 0.2% yield strength is more than 200MPa
Gold is formed.According to such composition, can using lightweight, high heat dispersion and mechanical strength, also high casing forms portable set
It is standby.
In the portable equipment of above-mentioned second aspect, preferably casing abuts with the electronic unit of heat release.According to so
Composition, using the casing abutted with electronic unit, more reliably the heat of electronic unit can be released.
In the portable equipment of above-mentioned second aspect, preferably it is also equipped with setting the substrate of electronic unit on upper surface；With with
Surround the support that the mode of electronic unit is configured on the upper surface of substrate and abutted with casing.According to such composition, i.e.,
Make not abut with casing with electronic unit and be isolated from the outside electronic unit using substrate, support and casing
The portable equipment of such structure, because the casing with high heat dispersion is configured near electronic unit, therefore, it is possible in the future
Effectively released from casing from the heat of the electronic unit of easy heat release, and make the portable equipment lightweight provided with substrate.
Brief description of the drawings
Fig. 1 is the stereogram of the internal structure for the portable equipment for representing one embodiment of the present invention.
Fig. 2 is the exploded perspective view of the internal structure for the portable equipment for representing one embodiment of the present invention.
Fig. 3 is the sectional view of the structure of the casing for the portable equipment for representing one embodiment of the present invention.
Fig. 4 is the schematic diagram for illustrating the manufacturing process of the casing of the portable equipment of one embodiment of the present invention.
Fig. 5 is the observation for illustrating the casing and the state of temperature of sheet material in order to confirm the effect of the present invention and carry out
Schematic diagram.
Fig. 6 has been expressed as the table of the effect for confirming the present invention and measurement result carried out etc..
Cu ratios pass with maximum temperature and heat in the embodiment that Fig. 7 has been expressed as the effect for confirming the present invention and carried out
Lead the curve map of the relation of coefficient.
The curve of Cu ratios and the relation of proportion in the embodiment that Fig. 8 has been expressed as the effect for confirming the present invention and carried out
Figure.
Fig. 9 is the sectional view of the construction of the casing for the first variation for representing one embodiment of the present invention.
Figure 10 is that the decomposition of the internal structure of the portable equipment for the second variation for representing one embodiment of the present invention is stood
Body figure.
Figure 11 is the sectional view of the casing structure for the 3rd variation for representing one embodiment of the present invention.
Figure 12 is the sectional view of the casing structure for the 4th variation for representing one embodiment of the present invention.
Embodiment
Below, the embodiment for embodying the present invention is illustrated based on accompanying drawing.
First, 1~Fig. 3 of reference picture, the internal structure of the portable equipment 100 of one embodiment of the present invention is said
It is bright.
In the portable equipment 100 of present embodiment, as depicted in figs. 1 and 2, display is configured with successively from top (Z1 sides)
Device 1, casing 2, substrate 3 and battery 4.Wherein, length direction has when display 1, casing 2 and substrate 3 are formed as top view
Length L2s of the about 100mm length L1 and width with about 50mm generally rectangular shape.In addition, the shape of battery 4
As generally rectangular shape smaller than substrate 3 during top view.
Display 1 is made up of liquid crystal display or organic el display etc., with the upper surface display image in Z1 sides
Function.The lower surface of the Z2 sides of the display 1 abuts (contact) with the upper surface of the Z1 sides of casing 2.That is, display 1 configures
Near casing 2.Also, be formed as display 1 in display image heat release, in heat caused by display 1 mainly via casing 2
The structure released to outside.In addition, display 1 is one of " electronic unit " of the invention.
Casing 2 is by having the sheet material of about 0.2mm thickness t1 generally rectangular shape to form in Z-direction.The casing 2 has
Protect what display 1 was released from the function of the impact from outside and by the heat from display 1 and CPU31 to outside
Function.Battery 4 has the function to the supply electric power such as display 1 and substrate 3.
In addition, the CPU31 for performing the program for being used for controlling portable equipment 100 etc. is provided with the upper surface of the Z1 sides of substrate 3.
The upper surface of the Z1 sides of the CPU31 abuts (contact) with below the Z2 sides of casing 2.That is, CPU31 is configured near casing 2.And
And be formed as CPU31 due to perform program for being used for controlling portable equipment 100 overall etc. and heat release, in heat caused by CPU31
The structure mainly released via casing 2 to outside.Wherein, CPU31 is one of " electronic unit " of the invention.
Here, in the present embodiment, as shown in figure 3, covering material of the casing 2 by three-decker (Al layers/Cu layers/Al layers)
Material is formed, and the clad material includes：The Cu layers 21 that are made up of Cu, engage and by Al-Mg with the surface 21a of the Z1 sides of Cu layers 21
The Al layers 22 of alloy composition and the Al layers 23 for engaging with the surface 21b of the Z2 sides of Cu layers 21 and being made up of Al-Mg alloys.That is,
Casing 2 is had the clad material structure of the three-decker (Al layers/Cu layers/Al layers) of Al layers 22, Cu layers 21 and Al layers 23 by lamination successively
Into.In addition, Cu layers 21, Al layers 22 and 23 are firmly engaged each other by rolling engagement.Wherein, Al layers 22 and 23 are this respectively
One of " the first Al layers " and " the 2nd Al layers " of invention.In addition, surface 21a and 21b are " side surface " of the invention respectively
One of " another side surface ".
Cu layers 21 are formed by the Cu of the purity such as oxygen-free copper, tough pitch copper and phosphorized copper more than 99.9%.In addition, Al layers 22 and 23
It is made up of the A5052 (JIS standards) in Al-Mg alloys or GM55 (UACJ Corporation's system).In addition, Al layers 22 and Al layers 23
It is made up of the Al-Mg alloys of same composition.
In addition, the Cu for forming Cu layers 21 has about 390W/ (m × K) coefficient of heat conduction and about 8.9 proportion.The opposing party
Face, in the Al-Mg alloys for forming Al layers 22 and 23, A5052 has about 138W/ (m × K) coefficient of heat conduction and about 2.7 ratio
Weight, GM55 have about 117W/ (m × K) coefficient of heat conduction and about 2.7 proportion.That is, Cu layers 21 have higher than Al layer 22 and 23
The coefficient of heat conduction, on the other hand with larger proportion.
In addition, the Cu for forming Cu layers 21 has about 210MPa 0.2% yield strength.On the other hand, the He of Al layers 22 is formed
In 23 Al-Mg alloys, A5052 has about 270MPa 0.2% yield strength, 0.2% surrenders of the GM55 with about 310MPa
Intensity.That is, 0.2% yield strength of Al layers 22 and 23 is formed as substantially in more than 200MPa structure.In addition, in order to by casing
2 form about 0.2mm thin thickness and ensure mechanical strength, 0.2% yield strength of the clad material of optimum selecting three-layer structure
Greatly.
In addition, Cu layers 21, Al layers 22 and Al layers 23 have thickness t2, t3 and t4 respectively in z-direction.Here, Al layers 22
Thickness t3 and Al layer 23 thickness t4 it is substantially equivalent.Specifically, using the thickness t4 of Al layers 23 average value as Al layers 22
Less than more than 95% 105% mode of thickness t3 average value is formed.Here, Cu layers 21, Al layers 22 and Al layers 23 it is each
Interface be not flat planar sometimes but be formed as undulated.In this case, the thickness t4 of Al layers 23 average value
In less than more than the 95% 105% of the thickness t3 of Al layers 22 average value, in the manufacture of reality, Al layers 22 can be considered as
The thickness t4 of thickness t3 and Al layer 23 is substantially equally handled.
In addition, in the present embodiment, more pay attention to the high radiating of casing 2 in the lightweight of casing 2 and high heat dispersion
In the case of performance, the preferably thickness t2 of Cu layers 21 is more than the aggregate thickness (thickness of casing 2 of Cu layers 21, Al layers 22 and Al layers 23
Degree) t1 (=t2+t3+t4) 40%.In addition, pay attention to casing 2 it is light-weighted in the case of, preferably Al layers 22 and 23 is total
Thickness (=t3+t4) casing 2 thickness t1 more than 60%.That is, the preferably thickness t4 of thickness t3 and the Al layer 23 of Al layers 22
Casing 2 thickness t1 more than 30%.
In addition, pay attention to casing 2 it is light-weighted in the case of, preferably the proportion of casing 2 is substantially below 5.
In addition, in the present embodiment, whatever it is configured without on the surface of casing 2.That is, on the surface of casing 2
The graphite flake of radiating is not configured to.Thereby, it is possible to suppress when being bonded graphite flake because bubble is invaded between sheet material and casing 2
And cause the coefficient of heat conduction to reduce, and the process that the thin graphite flake of adhesive thickness can be cut down.
Then, reference picture 1, Fig. 3 and Fig. 4 illustrate the manufacturing process of the casing 2 of one embodiment of the present invention.
First, as shown in figure 4, prepare be made up of Cu Cu sheet materials 121, by A5052 or GM55 any Al-Mg close
The Al sheet materials 122 and Al sheet materials 123 that gold is formed.Now, make the thickness of the thickness and Al sheet materials 123 of Al sheet materials 122 substantially equivalent,
And adjust the thickness of Cu sheet materials 121, Al sheet materials 122 according to the property (lightweight and high heat dispersion) of made casing 2
Thickness and Al sheet materials 123 thickness.Specifically, in the case where paying attention to the high heat dispersion of casing 2, Cu sheet materials 121 are made
Thickness be more than Cu sheet materials 121, Al sheet materials 122 and 123 aggregate thickness 40%.In addition, paying attention to the light-weighted of casing 2
In the case of, it is respectively Cu sheet materials 121, Al sheet materials 122 and Al sheet materials 123 to make the thickness of Al sheet materials 122 and the thickness of Al sheet materials 123
Aggregate thickness more than 30%.
Then, in the state of Cu sheet materials 121 are configured between Al sheet materials 122 and Al sheet materials 123, using roller 105 with
About 60% reduction ratio continuously carries out rolling engagement.Thus, it is continuously formed the thickness with about 0.4mm and folds successively
Layer has the clad material 102 of Al layers 22, Cu layers 21 and Al layers 23.
Then, the diffusion annealing of clad material 102 about 1 minute is made under about 500 DEG C of reduction atmosphere.Afterwards, to covering material
Material 102 is carried out continuously rolling untill about 0.24mm is reached.Afterwards, clad material 102 is made under about 500 DEG C of reduction atmosphere
Diffusion annealing about 1 minute again, is then carried out continuously rolling with defined reduction ratio.Thus, being continuously formed has about 0.2mm
Thickness t1 (reference picture 3) clad material 102.Now, by engaged respectively on the surface 21a and 21b of Cu layers 21 by with
The Al layers 22 and 23 that the Al-Mg alloys of same composition are formed and thickness is substantially equivalent, can suppress clad material 102 and bend.
Then, as shown in figure 1, clad material 102 (reference picture 4) is punched into length of the length direction with about 100mm
The length L2 of L1 and width with about 50mm generally rectangular shape, thus manufactures casing 2.In addition, casing 2 can
To be processed into defined shape by punch process etc..
Following effect can be obtained by present embodiment.
In the present embodiment, as described above, forming casing 2 by the clad material of three-decker (Al/Cu/Al), the bag
Layer material by with the coefficient of heat conduction Cu layer 21 higher than Al layer 22 and 23, the Al layers 22 being made up of Al-Mg alloys and by
The engagement of Al layers 23 that Al-Mg alloys are formed forms.Thus, using the coefficient of heat conduction Cu layer 21 bigger than Al layer 22 and 23, with machine
The situation that shell 2 is only made up of Al layers is compared, it is possible to increase the heat conductivity of casing 2.Thus, it is possible to heat is quickly transferred to
Casing 2 is overall, therefore, it is possible to be sufficiently carried out radiating in casing 2.In addition, by using the small Al layers 22 and 23 of proportion, with
The situation that casing 2 is only made up of Cu layers 21 is compared, and can make the lightweight of casing 2.In addition, by casing 2 by Cu layers 21, Al layers 22
Engage the clad material formed with Al layers 23 to form, Al layers 22 and 23 directly engage with Cu layers 21, therefore, with Al sheet materials and Cu plates
The situation that material is engaged indirectly by bonding agent is compared, and heat also can be effectively carried out at the interface of Al layers 22 and 23 and Cu layers 21
Conduction.Thereby, it is possible to which heat is quickly transferred into the entirety of casing 2, therefore can be sufficiently carried out radiating in casing 2.
In addition, in the present embodiment, by forming Al by the Al-Mg alloys that 0.2% yield strength is more than 200MPa
The increase of the mechanical strength of layer 22 and 23, Al layer 22 and 23, therefore the mechanical strength of casing 2 can be substantially ensured that.Thus, it is possible to
To lightweight and high heat dispersion and mechanical strength also high casing 2.
In addition, in the present embodiment, pay attention to casing 2 it is light-weighted in the case of, by the conjunction for making Al layers 22 and 23
Count more than the 60% of aggregate thickness (thickness of casing 2) t1 that thickness (=t3+t4) is Cu layers 21, Al layers 22 and Al layers 23, energy
The ratio of the small Al layers 22 and 23 of enough fully increase proportion, therefore, it is possible to further realize the lightweight of casing 2.
In addition, in the present embodiment, in the case where paying attention to the high heat dispersion of casing 2, by the thickness for making Cu layers 21
T2 is more than aggregate thickness (thickness of casing 2) t1 of Cu layers 21, Al layers 22 and Al layers 23 40% is spent, can fully increase hot biography
The ratio of the big Cu layers 21 of coefficient ratio Al layers 22 and 23 is led, therefore, it is possible to further improve the heat dispersion of casing 2.
In addition, in the present embodiment, by being made up of the Cu layers 21 of casing 2 Cu, the usual Cu coefficient of heat conduction compares Cu
Alloy is high, and the heat dispersion of casing 2 can be further improved using the Cu layers 21 being made up of Cu.
In addition, in the present embodiment, casing 2 is formed by the clad material of three-decker (Al layers/Cu layers/Al layers), should
Clad material includes：The Cu layers 21 that are made up of Cu, engage with the surface 21a of the Z1 sides of Cu layers 21 and be made up of Al-Mg alloys
Al layers 22 and the Al layers 23 for engaging with the surface 21b of the Z2 sides of Cu layers 21 and being made up of Al-Mg alloys.Thus, clad material
With the three-decker for clipping Cu layers 21 from both sides using Al layers 22 and Al layers 23, thereby, it is possible to suppress due to Al layers 22 and 23
It is different from the ductility of Cu layers 21 and cause casing 2 to bend.In addition, by clad material have using Al layers 22 and Al layers 23 from
Sandwich the three-decker of Cu layers 21, and the surface 21a and 21b that can suppress the Cu layers 21 of corrosion-resistant expose to outer
Portion, therefore, it is possible to improve the corrosion resistance of casing 2.
In addition, in the present embodiment, in the Al layers 22 and Al layers 23 formed by same composition (A5052 or GM55),
Make thickness (t3 and t4) substantially equivalent.That is, the average value for making the thickness t4 of Al layers 23 is the thickness t3 of Al layers 22 average value
Less than more than 95% 105%.Thereby, it is possible to casing 2 is formed as the structure of almost symmetry on thickness direction (Z-direction).That is, Al
22 and Al of layer layers 23 are made up of the Al-Mg alloys with same composition, and the of substantially equal thickness within ± 5% is made,
It therefore, there is no need to distinguish the surface and the back side of casing 2, and the processing in manufacturing process of casing 2 etc. can be made more easy.
In addition, it is substantially equivalent by thickness (t3 and t4), it can suppress curved caused by the thickness of slab difference of Al layers 22 and Al layers 23
Song, bent therefore, it is possible to further suppress casing 2.
In addition, in the present embodiment, by by containing the proportion Mg smaller than Al and the mechanical strength A5052 higher than Al
Or GM55 Al-Mg alloys form Al layers 22 and 23, high radiatingization can be obtained and furthermore achieved that lightweight and machinery
The casing 2 of intensity.
In addition, in the present embodiment, as shown in figure 1, by the way that display 1 or CPU31 are configured at high-cooling property
Near the casing 2 of energy, the heat from display 1 or CPU31 can effectively be released from casing 2.In addition, by making display
Device 1 or CPU31 abut with the casing 2 with high heat dispersion, can by the heat from display 1 or CPU31 from casing 2 more
Effectively release.Thereby, it is possible to suppress accumulation of heat in display 1 or CPU31, therefore, it is possible to suppress to cause due to heat
There is malfunction in display 1 or CPU31.
In addition, in the present embodiment, the thickness t1 by the casing 2 for making to be made up of clad material is about 0.2mm, can
Ensure the sufficient mechanical strength as casing 2, and suppress to cause the portable equipment using casing 2 because thickness t1 is excessive
100 maximizations.
In addition, in the present embodiment, in portable equipment 100, be formed as under the Z2 sides with the display 1 of heat release
Surface abuts upper surface and the casing 2 of the CPU31 of (contact) and adjoint heat release Z1 sides with the upper surface of the Z1 sides of casing 2
Z2 sides lower surface abut (contact) structure.Thereby, it is possible to more reliable using the casing 2 abutted with display 1 and CPU31
Ground releases display 1 and CPU31 heat.
(embodiment)
Then, reference picture 2, Fig. 3, Fig. 5~Fig. 8 are for for the survey of heat dispersion for confirming the effect of the present invention and carrying out
Fixed and mechanical strength measure illustrates.Wherein, unless otherwise specified, " thickness " or " thickness of slab " refers to average value.
The casing 2 of the above-mentioned embodiment shown in Fig. 3 is used in the present embodiment.Specifically, it is accurate as embodiment 1~4
Standby clad material, the clad material possess the Cu layers 21 being made up of Cu, the and of Al layers 22 being made up of the A5052 in Al-Mg alloys
23, and Al layers 22, Cu layers 21 and Al layers 23 lamination successively.Now, in embodiment 1~4, flat clad material (casing 2)
Thickness t1 (=t2+t3+t4, total thickness of slab) be 0.2mm, and the thickness t3 of Al layers 22 is identical with the thickness t4 of Al layers 23.And
And flat clad material is formed as to length L1 of the length direction (X-direction) with 100mm and the width side shown in Fig. 5
To the length L2 of (Y-direction) with 50mm generally rectangular shape, thus, the casing 2 of embodiment 1~4 is made.
Here, as shown in fig. 6, in embodiment 1~4, make the thickness of the Al layers 22 of composition casing 2, Cu layers 21 and Al layers 23
Ratio (t3：t2：T4 it is respectively) 1：2：1、1：1：1、2：1：2 and 4.5：1：4.5.That is, make the thickness t2 of Cu layers 21 relative to
The thickness t1 of casing 2 ratio (Cu ratios) is respectively 50%, 33%, 20% and 10%.In addition, make Al layers 22 and Al layers 23
Aggregate thickness (=t3+t4) is respectively 50%, 67%, 80% and 90% relative to the thickness t1 of casing 2 ratio (Al ratios).
In addition, as comparative example 1, the flat sheet material being made up of Cu monomers with 0.2mm thickness is used.In addition,
As comparative example 2, the flat sheet material being made up of A5052 monomers with 0.2mm thickness is used.Wherein, comparative example 1 and 2
Sheet material as the casing 2 of embodiment 1~4, be formed as length L1 of the length direction with 100mm, width with
50mm length L2 generally rectangular shape.
In addition, using comparative example 1 and 2 (Cu and A5052) proportion and the coefficient of heat conduction, according to Cu layers 21, the and of Al layers 22
The thickness ratio of Al layers 23 obtains the proportion and the coefficient of heat conduction of the casing 2 of embodiment 1~4 respectively.
(heat dispersion)
In the evaluation of heat dispersion, the sheet material of casing 2 and comparative example 1 and 2 for embodiment 1~4, observe at it
Temperature Distribution during heat releasing source is configured with surface.Specifically, as shown in figure 5, using as the heat releasing source of present embodiment
On the lower surface for the Z2 sides that radiator 31a corresponding with CPU31 (reference picture 2) is attached at casing 2 and sheet material.Radiator 31a
There is 10mm length L3 in the x-direction and the z-direction.
Then, radiator 31a is heated by supplying 1W electric power to radiator 31a.Then, using infra-red thermal imaging
The Temperature Distribution of casing 2 and sheet material of the device from top (Z1 sides) after 5 points.Then, temperature is determined in casing 2 and sheet material most
The temperature at high position, using the measured value as maximum temperature.
As the result of the heat dispersion shown in Fig. 6 and Fig. 7, in the casing 2 of embodiment 1~4, as Cu ratios increase
(reduction of Al ratios), maximum temperature reduce.It is considered that this is due to the high Cu of the coefficient of heat conduction (390W/ (m × K)) ratio
Increase causes the heat dispersion of casing 2 to improve, as a result, maximum temperature reduces.
Particularly in embodiment 1 (50%) of the Cu ratios more than 40%, maximum temperature is 43.8 DEG C, also lower than 44 DEG C.
Thus, it is possible to heat dispersion can be effectively improved by confirming the casing 2 of embodiment 1.In addition, the curve map according to Fig. 7 can
To confirm, in the case where Cu ratios are more than 40%, it is less than 44.5 DEG C that can make maximum temperature, can fully improve thermal diffusivity
Energy.
In addition, in the casing 2 of embodiment 1~4, as Cu ratios increase (reduction of Al ratios), coefficient of heat conduction increase, by
It can be identified that this is by increasing Cu ratios, can fully improve heat dispersion.
(proportion)
According to the proportion shown in Fig. 6 and Fig. 8, in the casing 2 of embodiment 1~4, as Cu ratios reduce, (Al ratios increase
Proportion reduces greatly).The middle confirmation ratio of embodiment 2 (33%), 3 (20%) and 4 (10%) particularly in Cu ratios below 40%
It is again also smaller than 5.It is possible thereby to lightweight can be effectively realized by confirming the casing 2 of embodiment 2~4.In addition, according to Fig. 8
Curve map it has been confirmed that in Cu ratios below 40% in the case of (Al ratios be more than 60%), can make proportion for 5 with
Under, it can fully realize lightweight.
(mechanical strength)
In addition, in order to evaluate mechanical strength, the sheet material measure stress of casing 2 and comparative example 1 and 2 to embodiment 1~4 becomes
Shape curve map, obtain the stress (0.2% yield strength) when producing 0.2% permanent deformation.
As the result shown in Fig. 6, in the casing 2 of embodiment 1~4, as Cu ratios reduce (increase of Al ratios),
0.2% yield strength increases.It is considered that 0.2% yield strength ratio that this is due to the A5052 for forming Al layers 22 and 23 is formed
The reason big Cu of Cu layers 21.In addition, when the thickness that casing 2 is thinned reaches more than 0.1mm below 0.3mm, casing 2
0.2% yield strength is more than 200MPa, it can be ensured that as the sufficient mechanical strength of casing, thus preferably.It is possible thereby to
Even if thinking that the thickness of the casing 2 of embodiment 1~4 is thinned reaches more than 0.1mm below 0.3mm, sufficient machine can also ensure that
Tool intensity.
It may determine that according to the evaluation of above-mentioned heat dispersion, proportion and mechanical strength, as Cu ratios increase, heat dispersion
Improve, and another aspect proportion increases.In addition, by using the Cu layers being made up of Cu and the Al-Mg alloys by more than 200MPa
(A5052) a pair of the Al layers formed, can make mechanical strength reach more than 200MPa.Wherein, the feelings of high heat dispersion are being paid attention to
Under condition, by making Cu ratios be more than 40%, the heat dispersion of casing can be fully improved；In the case of attention is light-weighted, lead to
Crossing makes Al ratios be more than 60%, can fully realize the lightweight of casing.And then it can consider：Cu ratios are 40% (Al ratios
Rate is that the casing of the ratio 60%) or near it can fully meet any of high heat dispersion, low-gravity and high mechanical properties
Kind performance.
Wherein, this time disclosed embodiment and embodiment simply illustrate in all aspects, without any restrictions.
The scope of the present invention is represented by the explanation of the above-described embodiment and examples, but is represented by claim,
Also include being had altered in the impartial meaning and scope with claim.
For example, in the above-described embodiment exemplified with the three-layered node for having Al layers 22, Cu layers 21 and Al layers 23 by lamination successively
The clad material (Al layers/Cu layers/Al layers) of structure forms the example of casing 2, but the invention is not restricted to this.In the present invention, also may be used
As the first variation of above-mentioned embodiment as shown in Figure 9, it is made up of the clad material of double-decker (Al layers/Cu layers)
Casing 202, the clad material include the Cu layers 221 that are made up of Cu and engaged with the surface 221a of the Z1 sides of Cu layers 221 and by
The Al layers 222 that Al-Mg alloys are formed.Produced largely in such a situation it is preferred that the high Cu layers 221 of the coefficient of heat conduction are configured
The side (such as CPU side) of heat.Thus, there is the three-layered node of lamination Al layers 22, Cu layers 21 and Al layers 23 successively with clad material
The situation (above-mentioned embodiment) of structure is compared, and can be configured the coefficient of heat conduction Cu layer 221 bigger than Al layer 222 and be put away from adjoint
Electronic unit (display or CPU etc.) closer proximity of heat, therefore, it is possible to further improve the heat dispersion of casing 202.Separately
Outside, in the case where paying attention to the high heat dispersion of casing 202, the preferably thickness t2 of Cu layers 221 is more than Cu layers 221 and Al layers 222
Aggregate thickness (thickness of casing 202) t1 (=t2+t3) 40%.In addition, paying attention to the light-weighted situation of casing 202
Under, the preferably thickness t3 of Al layers 222 is more than the 60% of the thickness t1 of casing 202.In addition, casing can also be four-layer structure with
On clad material.Now, clad material can be the clad material being mainly made up of Al layers and Cu layers.
In addition, in the above-described embodiment, Fig. 1 illustrates the example of the lower face side for the Z2 sides that battery 4 is configured to substrate 3
Son, but the invention is not restricted to this.In the present invention, the second variation of above-mentioned embodiment that can also be as shown in Figure 10 it is portable
Equipment 300 is such, configures battery 304 in a manner of adjacent with substrate 303 on width (Y-direction), and with CPU31 and
The mode that battery 304 abuts with casing 2 is formed.Thus, the heat from display 1 and CPU31 is not only, from battery
304 heat can also be released effectively by casing 2.Wherein, battery 304 is one of " electronic unit " of the invention.
In addition, in the above-described embodiment, Fig. 1 is illustrated under the upper surface for the Z1 sides for making CPU31 and the Z2 sides of casing 2
The example that surface abuts, but the invention is not restricted to this.In the present invention, CPU can also be made not abutted with casing.For example, such as Figure 11
3rd variation of shown above-mentioned embodiment, bag is engaged on the upper surface of substrate 403 (face of Z1 sides) using scolding tin 432
Enclose the support 433 of CPU31 frame-shaped.Furthermore, it is also possible to the lid casing 402 that is made up of the clad material of three-decker
The mode that lower surface (face of Z2 sides) abuts with the upper surface of support 433, is fixed on support 433 by casing 402.Thus,
Even not abutted with CPU31 with casing 402 and using substrate 403, support 433 and casing 402 by CPU31 and outside
The portable terminal device (not shown) of the structure of portion's isolation, because the casing 402 with high heat dispersion is configured near CPU31,
Therefore, it is possible to which the heat of the CPU31 from easy heat release is effectively released by casing 402, and can make to be provided with substrate
403 portable terminal device lightweight.
In this case, as shown in figure 11, plating Sn layers 402a is formed preferably on the surface of casing 402.Additionally, it is preferred that
The surface of support 433 forms plating Sn layers 433a.Installation of the casing 402 on support 433 can use mechanical system to utilize
Screw or riveting are carried out, but are carried out mostly using welding (not shown) in the installation of micro-element.To not have plating Sn layers
Casing be welded in support etc. in the case of, the Sn misgrowths sometimes (whisker) contained by scolding tin.It is therefore preferable that to casing
402 part at least participating in welding forms plating Sn layers 402a.Plating Sn layers 402a can be before the shape of casing 402 be made
The surface of clad material formed, can also be formed after the shape of casing 402 is made on the surface of casing 402.Wherein, such as
Fixture required for fruit consideration productivity ratio and formation coating etc., preferably after the shape of casing 402 is made, in casing 402
Surface and being formed substantially in entire surface for the back side (two sides) plate Sn layers 402a.Wherein, as plating Sn layers, can apply by Sn or Sn
The coating that alloy is formed, the coating being more preferably made up of the Sn of purity more than 99%.
In addition, the example that casing 2 is set in the portable equipment 100 for possess display 1 is illustrated in the above-described embodiment
Son, but the invention is not restricted to this.For example, it is also possible to casing is located at router that can be portable without display etc..At this
In the case of, the battery from router or CPU heat can effectively be released using casing.Alternatively, it is also possible to by casing
For that in the mini-plant of fixed, casing can also be used as into SSD (Solid State Drive：Solid state hard disc) basket.
In addition, the example that the thickness t1 that casing 2 is illustrated in above-mentioned embodiment is about 0.2mm, but the invention is not restricted to
This.In the present invention, the thickness of casing can be less than 0.2mm, can also be more than 0.2mm.In addition, the thickness of casing is about
The sufficient mechanical strength as casing is able to ensure that during more than 0.1mm, thus preferably.In addition, the thickness of casing is about 1.0mm
It can suppress to cause the equipment enlarging using casing because thickness is excessive when following, thus preferably.In addition, and portable equipment
Such situation for paying much attention to miniaturization is compared, and in the casing for comparing the SSD for thinking little of miniaturization, can make casing
Thickness be about more than 0.6mm below 1.0mm.In this case, even if using the less Al (A1000 of 0.2% yield strength
System) as the metal material for forming Al layers of the invention, because the thickness of casing is big, thus can also substantially ensure that mechanical strong
Degree.
In addition, illustrating in the above-described embodiment display 1 and CPU31 are used as the electronic unit of easy heat release
Example, illustrated in above-mentioned second variation and use display 1, CPU31 and battery 304 as the electronic unit of easy heat release
Example, but the invention is not restricted to this.In the present invention, as the electronic unit easily to radiate, such as power supply can also be used
The electronic unit of circuit etc..
In addition, the example using a casing 2 being made up of three layers of clad material is illustrated in the above-described embodiment, but
The invention is not restricted to this.In the present invention, it is installed on base for the casing of the display part of fixing display image and/or for protecting
Casing of the integrated circuit of plate etc., portable equipment can be formed with part by the casing that clad material is formed using multiple.
In addition, Al layers 22 (the first Al layers) and Al layers 23 (the 2nd Al layers) are illustrated in the above-described embodiment by identical
The example that forms of Al-Mg alloys, but the invention is not restricted to this.In the present invention, can also be by different Al or Al alloy structures
Into the first Al layers and the 2nd Al layers.
In addition, illustrate in the above-described embodiment Al layers 22 (the first Al layers) and Al layers 23 (the 2nd Al layers) by
The example that A5052 or GM55 is formed, but the invention is not restricted to this.In the present invention, can also be by the Al beyond A5052 and GM55
Or Al alloys form the first Al layers and the 2nd Al layers.For example, the first Al layers and the 2nd Al layers by Al-Mg alloys (A5000 systems) or
When the made of Al-Cu alloy such as the Al-Mg-Si alloys such as A6061 (A6000 systems), A2219 (A2000 systems) is formed, by making sheet material
When proper treatment (hardening processing etc.) 0.2% yield strength can be made to reach about more than 200MPa, therefore be able to ensure that work
For the mechanical strength of casing, thus preferably.In addition, in the case where less requiring mechanical strength according to use environment etc.,
First Al layers and the 2nd Al layers can be formed by Al (A1000 system) of 0.2% yield strength less than about 200MPa or Al alloys.
In addition, the example that Cu layers 21 are formed by the Cu of purity more than 99.9% is illustrated in the above-described embodiment, but this
Invention not limited to this.In the present invention, can also (CDA be marked by C19400 that Cu-2.30Fe-0.10Zn-0.03P is formed
It is accurate) etc. Cu purity be about more than 97% Cu alloys form Cu layers.Because the mechanical strength of these Cu alloys is higher than Cu, therefore
The mechanical strength of casing can further be improved.
In addition, the example that what is all configured without on the surface of casing 2 is illustrated in the above-described embodiment, but this hair
Bright not limited to this.In the present invention, the Cu layers of foil for heat conduction can be formed on the surface of casing, can also be in the table of casing
The sheet material of the heat conductivity adhesive sheet for being bonded display or the graphite flake for electric heating etc. is configured on face.If there is this
The casing of kind structure, as the casing of the thin-walled with high heat dispersion, availability in the market further improves.In addition,
As long as above-mentioned sheet material is formed at the position at least contacted with the electronic unit of portable equipment in casing surface.In addition,
4th variation of above-mentioned embodiment that can be as shown in figure 12 is such, the shape on the surface of casing 2 (upper and lower two surfaces)
Into Ni layers 502b.Wherein, Ni layers 502b can be formed by plating, can also be used as clad material and 2 integral landform of casing
Into.Thereby, it is possible to suppress casing 2 and resistance (contact resistance) increase in the contact portion of circuit (not shown), therefore, also may be used
So that casing 2 to be used as to be used for the current circuit for realizing circuit ground (ground connection).Also, it can also improve casing using Ni layers 502b
2 corrosion resistance.Wherein, as the metal material for forming Ni layers 502b, the Ni alloys by Ni or Ni-P alloys etc. can be applied
The material of composition.In addition, as long as Ni layers 502b is formed at what is at least contacted in the surface of casing 2 with the electronic unit of portable equipment
Position, it can also only be located at any surface on upper and lower two surfaces.
In addition, the lower surface for illustrating the upper surface of CPU31 Z1 sides and the Z2 sides of casing 2 in the above-described embodiment is supported
The example connect, but the invention is not restricted to this.In the present invention, CPU and casing can be bonded by the bonding agent of heat conductivity,
CPU and casing can be configured across other parts.
Claims (18)
- A kind of 1. casing, it is characterised in that：The clad material formed by Al layers and the engagement of Cu layers is formed,The Al layers are made up of Al or Al alloys,The Cu layers are made up of Cu or Cu alloys, and the coefficient of heat conduction is bigger than the Al layers,The Al layers include the first Al layers and the 2nd Al layers,The first Al layers engage on a side surface of the Cu layers with the Cu layers, are made up of Al or Al alloys,The 2nd Al layers engage on another side surface of the Cu layers with the Cu layers, are made up of Al or Al alloys.
- 2. casing as claimed in claim 1, it is characterised in that：The Al layers are made up of Al alloys of 0.2% yield strength in more than 200MPa.
- 3. casing as claimed in claim 1 or 2, it is characterised in that：The thickness of the Al layers is more than the 60% of the aggregate thickness of the Al layers and the Cu layers.
- 4. casing as claimed in claim 1 or 2, it is characterised in that：The thickness of the Cu layers is more than the 40% of the aggregate thickness of the Al layers and the Cu layers.
- 5. casing as claimed in claim 1 or 2, it is characterised in that：The clad material has the three-decker of the first Al layers, the Cu layers and the 2nd Al layers for lamination successively.
- 6. casing as claimed in claim 1 or 2, it is characterised in that：The average value of the thickness of the 2nd Al layers for the first Al layers thickness average value more than 95% 105% with Under.
- 7. casing as claimed in claim 1 or 2, it is characterised in that：The first Al layers and the 2nd Al layers are made up of the Al alloys with same composition.
- 8. casing as claimed in claim 1 or 2, it is characterised in that：The thickness of the first Al layers and the thickness of the 2nd Al layers add up to the first Al layers, Cu layers and described More than the 60% of the aggregate thickness of 2nd Al layers.
- 9. casing as claimed in claim 1 or 2, it is characterised in that：The thickness of the Cu layers is more than the 40% of the aggregate thickness of the first Al layers, the Cu layers and the 2nd Al layers.
- 10. casing as claimed in claim 1 or 2, it is characterised in that：The Al layers are made up of Al-Mg alloys.
- 11. casing according to claim 1 or 2, it is characterised in that：Casing as the portable equipment for being built-in with the electronic unit with heat release uses.
- 12. casing as claimed in claim 1 or 2, it is characterised in that：At least a portion on the surface of the casing forms the plating Sn layers being made up of Sn or Sn alloys.
- 13. casing as claimed in claim 1 or 2, it is characterised in that：At least a portion on the surface of the casing forms the Ni layers being made up of Ni or Ni alloys.
- 14. casing as claimed in claim 1 or 2, it is characterised in that：The thickness for the casing being made up of the clad material is more than 0.1mm below 1.0mm.
- 15. a kind of portable equipment, it is characterised in that possess：With the electronic unit of heat release；WithThe casing that heat from the electronic unit is released, the clad material structure that the casing is formed by Al layers and the engagement of Cu layers Into the Al layers are made up of Al or Al alloys, and the Cu layers are made up of Cu or Cu alloys and the coefficient of heat conduction is than the Al layers Greatly,The Al layers include the first Al layers and the 2nd Al layers,The first Al layers engage on a side surface of the Cu layers with the Cu layers, are made up of Al or Al alloys,The 2nd Al layers engage on another side surface of the Cu layers with the Cu layers, are made up of Al or Al alloys.
- 16. portable equipment as claimed in claim 15, it is characterised in that：The Al layers of the casing are made up of the Al alloys that 0.2% yield strength is more than 200MPa.
- 17. the portable equipment as described in claim 15 or 16, it is characterised in that：The casing abuts with the electronic unit of heat release.
- 18. the portable equipment as described in claim 15 or 16, it is characterised in that be also equipped with：Substrate, the electronic unit is set on its upper surface；WithSupport, it is configured in a manner of surrounding the electronic unit on the upper surface of the substrate, and is abutted with the casing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014002136A JP5965418B2 (en) | 2014-01-09 | 2014-01-09 | Chassis and mobile devices |
| JP2014-002136 | 2014-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104780739A CN104780739A (en) | 2015-07-15 |
| CN104780739B true CN104780739B (en) | 2018-02-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510009045.XA Active CN104780739B (en) | 2014-01-09 | 2015-01-08 | Casing and portable equipment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5965418B2 (en) |
| KR (1) | KR101760557B1 (en) |
| CN (1) | CN104780739B (en) |
| HK (1) | HK1212141A1 (en) |
| TW (1) | TWI612880B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6358378B1 (en) * | 2017-08-09 | 2018-07-18 | 日立金属株式会社 | Clad material manufacturing method |
| WO2020184489A1 (en) * | 2019-03-14 | 2020-09-17 | 日立金属株式会社 | Magnesium clad material, housing for electronic devices, and component for mobile objects |
| WO2022183957A1 (en) * | 2021-03-05 | 2022-09-09 | 江苏康瑞新材料科技股份有限公司 | Composite plate, composite plate texturing device, and manufacturing method |
| EP4336980A1 (en) * | 2021-07-20 | 2024-03-13 | Samsung Electronics Co., Ltd. | Electronic device comprising heat dissipation structure |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48102059A (en) * | 1972-04-06 | 1973-12-21 | ||
| JPS5978675U (en) * | 1982-11-18 | 1984-05-28 | 株式会社ケンウッド | Case bodies for electrical equipment, etc. |
| JPH11156995A (en) * | 1997-09-25 | 1999-06-15 | Daido Steel Co Ltd | Clad plate, battery case using it, and manufacture thereof |
| JPH11233076A (en) * | 1998-02-13 | 1999-08-27 | Toshiba Battery Co Ltd | Battery pack |
| JP2002294376A (en) * | 2001-03-29 | 2002-10-09 | Showa Denko Kk | Aluminum-dissimilar metal clad plate and production method therefor |
| JP4785104B2 (en) * | 2001-07-30 | 2011-10-05 | 日立金属株式会社 | Thin-walled molded product and method for producing the same |
| JP4627400B2 (en) * | 2002-08-29 | 2011-02-09 | 株式会社Ｎｅｏｍａｘマテリアル | Aluminum / nickel clad and battery external terminals |
| JP4159897B2 (en) * | 2003-02-26 | 2008-10-01 | 東洋鋼鈑株式会社 | Surface-treated Al plate excellent in solderability, heat sink using the same, and method for producing surface-treated Al plate excellent in solderability |
| CN1565773A (en) * | 2003-07-03 | 2005-01-19 | 富骅企业股份有限公司 | Composite board forming method specified for radiator |
| JP5053510B2 (en) * | 2004-12-27 | 2012-10-17 | 冨士発條株式会社 | Power supply device outer can and power supply device using the outer can |
| JP4799294B2 (en) * | 2006-06-30 | 2011-10-26 | 古河スカイ株式会社 | Method for producing high formability Al-Mg alloy plate |
| JP2008063623A (en) * | 2006-09-08 | 2008-03-21 | Furukawa Sky Kk | Method for producing aluminum alloy sheet for forming |
| JP2010087289A (en) * | 2008-09-30 | 2010-04-15 | Nippon Chemicon Corp | Electrolytic capacitor module |
| JP4961512B2 (en) * | 2010-06-08 | 2012-06-27 | 株式会社Ｎｅｏｍａｘマテリアル | Aluminum copper clad material |
| JP5830727B2 (en) * | 2010-06-10 | 2015-12-09 | 富山県 | Coupling member and manufacturing method |
-
2014
- 2014-01-09 JP JP2014002136A patent/JP5965418B2/en active Active
- 2014-12-22 TW TW103144745A patent/TWI612880B/en active
- 2014-12-23 KR KR1020140186969A patent/KR101760557B1/en active IP Right Grant
-
2015
- 2015-01-08 CN CN201510009045.XA patent/CN104780739B/en active Active
- 2015-12-24 HK HK15112689.4A patent/HK1212141A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201542080A (en) | 2015-11-01 |
| TWI612880B (en) | 2018-01-21 |
| JP2015128883A (en) | 2015-07-16 |
| KR101760557B1 (en) | 2017-07-31 |
| JP5965418B2 (en) | 2016-08-03 |
| KR20150083423A (en) | 2015-07-17 |
| HK1212141A1 (en) | 2016-06-03 |
| CN104780739A (en) | 2015-07-15 |
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