HK1212141A1 - 機殼和便携設備 - Google Patents
機殼和便携設備Info
- Publication number
- HK1212141A1 HK1212141A1 HK15112689.4A HK15112689A HK1212141A1 HK 1212141 A1 HK1212141 A1 HK 1212141A1 HK 15112689 A HK15112689 A HK 15112689A HK 1212141 A1 HK1212141 A1 HK 1212141A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- chassis
- portable apparatus
- portable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014002136A JP5965418B2 (ja) | 2014-01-09 | 2014-01-09 | シャーシおよび携帯機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1212141A1 true HK1212141A1 (zh) | 2016-06-03 |
Family
ID=53621875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15112689.4A HK1212141A1 (zh) | 2014-01-09 | 2015-12-24 | 機殼和便携設備 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5965418B2 (zh) |
KR (1) | KR101760557B1 (zh) |
CN (1) | CN104780739B (zh) |
HK (1) | HK1212141A1 (zh) |
TW (1) | TWI612880B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6358378B1 (ja) * | 2017-08-09 | 2018-07-18 | 日立金属株式会社 | クラッド材の製造方法 |
US11931821B2 (en) | 2019-03-14 | 2024-03-19 | Proterial, Ltd. | Magnesium clad material, electronic device housing, and mobile object component |
WO2022183958A1 (zh) * | 2021-03-05 | 2022-09-09 | 江苏康瑞新材料科技股份有限公司 | 一种手机边框及制造方法 |
US12083567B2 (en) | 2021-03-05 | 2024-09-10 | Jiangsu Kangrui New Material Technology Co., Ltd. | Method for making a metal material composite |
EP4302991A1 (en) | 2021-03-05 | 2024-01-10 | Jiangsu Kangrui New Material Technology Co., Ltd. | Mobile phone frame and manufacturing method |
EP4336980A4 (en) * | 2021-07-20 | 2024-11-06 | Samsung Electronics Co Ltd | ELECTRONIC DEVICE COMPRISING A HEAT DISSIPATION STRUCTURE |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48102059A (zh) * | 1972-04-06 | 1973-12-21 | ||
JPS5978675U (ja) * | 1982-11-18 | 1984-05-28 | 株式会社ケンウッド | 電気機器等のケ−ス体 |
JPH11156995A (ja) * | 1997-09-25 | 1999-06-15 | Daido Steel Co Ltd | クラッド板とこれを用いた電池用ケース並びにこれらの製造方法 |
JPH11233076A (ja) * | 1998-02-13 | 1999-08-27 | Toshiba Battery Co Ltd | 組電池 |
JP2002294376A (ja) * | 2001-03-29 | 2002-10-09 | Showa Denko Kk | アルミニウム−異種金属クラッド材およびその製造方法 |
JP4785104B2 (ja) * | 2001-07-30 | 2011-10-05 | 日立金属株式会社 | 薄肉成形体およびその製造方法 |
JP4627400B2 (ja) * | 2002-08-29 | 2011-02-09 | 株式会社Neomaxマテリアル | アルミニウム/ニッケルクラッド材および電池用外部端子 |
JP4159897B2 (ja) * | 2003-02-26 | 2008-10-01 | 東洋鋼鈑株式会社 | ハンダ性に優れた表面処理Al板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Al板の製造方法 |
CN1565773A (zh) * | 2003-07-03 | 2005-01-19 | 富骅企业股份有限公司 | 一种适用于散热器的复合板材成型方法 |
JP5053510B2 (ja) * | 2004-12-27 | 2012-10-17 | 冨士発條株式会社 | 電源装置用外装缶及び当該外装缶を使用した電源装置 |
JP4799294B2 (ja) * | 2006-06-30 | 2011-10-26 | 古河スカイ株式会社 | 高成形性Al−Mg系合金板の製造方法 |
JP2008063623A (ja) * | 2006-09-08 | 2008-03-21 | Furukawa Sky Kk | 成形加工用アルミニウム合金板の製造方法 |
JP2010087289A (ja) * | 2008-09-30 | 2010-04-15 | Nippon Chemicon Corp | 電解コンデンサモジュール |
US9266188B2 (en) * | 2010-06-08 | 2016-02-23 | Neomax Materials Co., Ltd. | Aluminum copper clad material |
JP5830727B2 (ja) * | 2010-06-10 | 2015-12-09 | 富山県 | 結合部材及びその製造方法 |
-
2014
- 2014-01-09 JP JP2014002136A patent/JP5965418B2/ja active Active
- 2014-12-22 TW TW103144745A patent/TWI612880B/zh active
- 2014-12-23 KR KR1020140186969A patent/KR101760557B1/ko active IP Right Grant
-
2015
- 2015-01-08 CN CN201510009045.XA patent/CN104780739B/zh active Active
- 2015-12-24 HK HK15112689.4A patent/HK1212141A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR101760557B1 (ko) | 2017-07-31 |
KR20150083423A (ko) | 2015-07-17 |
JP5965418B2 (ja) | 2016-08-03 |
CN104780739A (zh) | 2015-07-15 |
TWI612880B (zh) | 2018-01-21 |
TW201542080A (zh) | 2015-11-01 |
JP2015128883A (ja) | 2015-07-16 |
CN104780739B (zh) | 2018-02-13 |
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