CN104769709A - 涉及包括多存储器裸片的半导体封装体的方法和布置 - Google Patents

涉及包括多存储器裸片的半导体封装体的方法和布置 Download PDF

Info

Publication number
CN104769709A
CN104769709A CN201380046324.2A CN201380046324A CN104769709A CN 104769709 A CN104769709 A CN 104769709A CN 201380046324 A CN201380046324 A CN 201380046324A CN 104769709 A CN104769709 A CN 104769709A
Authority
CN
China
Prior art keywords
die
substrate
multiple memory
memory dies
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380046324.2A
Other languages
English (en)
Chinese (zh)
Inventor
S·苏塔德加
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marvell World Trade Ltd
Original Assignee
Marvell World Trade Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of CN104769709A publication Critical patent/CN104769709A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07537—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/859—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Semiconductor Memories (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)
CN201380046324.2A 2012-07-23 2013-07-23 涉及包括多存储器裸片的半导体封装体的方法和布置 Pending CN104769709A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261674703P 2012-07-23 2012-07-23
US61/674,703 2012-07-23
US201261675626P 2012-07-25 2012-07-25
US61/675,626 2012-07-25
US13/947,936 2013-07-22
US13/947,936 US9117790B2 (en) 2012-06-25 2013-07-22 Methods and arrangements relating to semiconductor packages including multi-memory dies
PCT/US2013/051694 WO2014018538A1 (en) 2012-07-23 2013-07-23 Methods and arrangements relating to semiconductor packages including multi-memory dies

Publications (1)

Publication Number Publication Date
CN104769709A true CN104769709A (zh) 2015-07-08

Family

ID=49945870

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380046324.2A Pending CN104769709A (zh) 2012-07-23 2013-07-23 涉及包括多存储器裸片的半导体封装体的方法和布置

Country Status (5)

Country Link
US (1) US9117790B2 (https=)
JP (1) JP2015527736A (https=)
KR (1) KR20150040893A (https=)
CN (1) CN104769709A (https=)
WO (1) WO2014018538A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111103653A (zh) * 2018-10-26 2020-05-05 美光科技公司 具有光子集成电路(pic)芯片的半导体封装
CN114242669A (zh) * 2022-02-28 2022-03-25 甬矽电子(宁波)股份有限公司 堆叠封装结构和堆叠结构封装方法
US11525956B2 (en) 2018-10-26 2022-12-13 Micron Technology, Inc. Semiconductor devices having electro-optical substrates

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8674483B2 (en) 2011-06-27 2014-03-18 Marvell World Trade Ltd. Methods and arrangements relating to semiconductor packages including multi-memory dies
US9497861B2 (en) * 2012-12-06 2016-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package with interposers
US9589927B2 (en) 2014-09-19 2017-03-07 Nxp Usa, Inc. Packaged RF amplifier devices with grounded isolation structures and methods of manufacture thereof
US9337774B2 (en) 2014-09-19 2016-05-10 Freescale Semiconductor, Inc. Packaged RF amplifier devices and methods of manufacture thereof
US11079725B2 (en) 2019-04-10 2021-08-03 Deere & Company Machine control using real-time model
US11653588B2 (en) 2018-10-26 2023-05-23 Deere & Company Yield map generation and control system
US11240961B2 (en) 2018-10-26 2022-02-08 Deere & Company Controlling a harvesting machine based on a geo-spatial representation indicating where the harvesting machine is likely to reach capacity
US11672203B2 (en) 2018-10-26 2023-06-13 Deere & Company Predictive map generation and control
US11467605B2 (en) 2019-04-10 2022-10-11 Deere & Company Zonal machine control
US11957072B2 (en) 2020-02-06 2024-04-16 Deere & Company Pre-emergence weed detection and mitigation system
US11178818B2 (en) 2018-10-26 2021-11-23 Deere & Company Harvesting machine control system with fill level processing based on yield data
US11641800B2 (en) 2020-02-06 2023-05-09 Deere & Company Agricultural harvesting machine with pre-emergence weed detection and mitigation system
US11589509B2 (en) 2018-10-26 2023-02-28 Deere & Company Predictive machine characteristic map generation and control system
US12069978B2 (en) 2018-10-26 2024-08-27 Deere & Company Predictive environmental characteristic map generation and control system
US11234366B2 (en) 2019-04-10 2022-02-01 Deere & Company Image selection for machine control
US11778945B2 (en) 2019-04-10 2023-10-10 Deere & Company Machine control using real-time model
US12225846B2 (en) 2020-02-06 2025-02-18 Deere & Company Machine control using a predictive map
US12035648B2 (en) 2020-02-06 2024-07-16 Deere & Company Predictive weed map generation and control system
US12329148B2 (en) 2020-02-06 2025-06-17 Deere & Company Predictive weed map and material application machine control
US11477940B2 (en) 2020-03-26 2022-10-25 Deere & Company Mobile work machine control based on zone parameter modification
US11410949B2 (en) * 2020-07-27 2022-08-09 Micron Technology, Inc. Memory devices with backside bond pads under a memory array
US12178158B2 (en) 2020-10-09 2024-12-31 Deere & Company Predictive map generation and control system for an agricultural work machine
US11849672B2 (en) 2020-10-09 2023-12-26 Deere & Company Machine control using a predictive map
US11650587B2 (en) 2020-10-09 2023-05-16 Deere & Company Predictive power map generation and control system
US11844311B2 (en) 2020-10-09 2023-12-19 Deere & Company Machine control using a predictive map
US11895948B2 (en) 2020-10-09 2024-02-13 Deere & Company Predictive map generation and control based on soil properties
US11635765B2 (en) 2020-10-09 2023-04-25 Deere & Company Crop state map generation and control system
US11946747B2 (en) 2020-10-09 2024-04-02 Deere & Company Crop constituent map generation and control system
US11825768B2 (en) 2020-10-09 2023-11-28 Deere & Company Machine control using a predictive map
US11983009B2 (en) 2020-10-09 2024-05-14 Deere & Company Map generation and control system
US11474523B2 (en) 2020-10-09 2022-10-18 Deere & Company Machine control using a predictive speed map
US12419220B2 (en) 2020-10-09 2025-09-23 Deere & Company Predictive map generation and control system
US12013245B2 (en) 2020-10-09 2024-06-18 Deere & Company Predictive map generation and control system
US11871697B2 (en) 2020-10-09 2024-01-16 Deere & Company Crop moisture map generation and control system
US11675354B2 (en) 2020-10-09 2023-06-13 Deere & Company Machine control using a predictive map
US11845449B2 (en) 2020-10-09 2023-12-19 Deere & Company Map generation and control system
US11927459B2 (en) 2020-10-09 2024-03-12 Deere & Company Machine control using a predictive map
US12069986B2 (en) 2020-10-09 2024-08-27 Deere & Company Map generation and control system
US11727680B2 (en) 2020-10-09 2023-08-15 Deere & Company Predictive map generation based on seeding characteristics and control
US11864483B2 (en) 2020-10-09 2024-01-09 Deere & Company Predictive map generation and control system
US11592822B2 (en) 2020-10-09 2023-02-28 Deere & Company Machine control using a predictive map
US11849671B2 (en) 2020-10-09 2023-12-26 Deere & Company Crop state map generation and control system
US12386354B2 (en) 2020-10-09 2025-08-12 Deere & Company Predictive power map generation and control system
US11711995B2 (en) 2020-10-09 2023-08-01 Deere & Company Machine control using a predictive map
US11889788B2 (en) 2020-10-09 2024-02-06 Deere & Company Predictive biomass map generation and control
US12550802B2 (en) 2020-10-08 2026-02-17 Deere & Company Predictive machine characteristic map generation and control system
US11874669B2 (en) 2020-10-09 2024-01-16 Deere & Company Map generation and control system
US12422847B2 (en) 2020-10-09 2025-09-23 Deere & Company Predictive agricultural model and map generation
US11889787B2 (en) 2020-10-09 2024-02-06 Deere & Company Predictive speed map generation and control system
US12250905B2 (en) 2020-10-09 2025-03-18 Deere & Company Machine control using a predictive map
US12127500B2 (en) 2021-01-27 2024-10-29 Deere & Company Machine control using a map with regime zones
JP7584180B2 (ja) * 2021-04-08 2024-11-15 ウルトラメモリ株式会社 モジュール及びその製造方法
US12229886B2 (en) 2021-10-01 2025-02-18 Deere & Company Historical crop state model, predictive crop state map generation and control system
US12310286B2 (en) 2021-12-14 2025-05-27 Deere & Company Crop constituent sensing
US12302791B2 (en) 2021-12-20 2025-05-20 Deere & Company Crop constituents, predictive mapping, and agricultural harvester control
US12245549B2 (en) 2022-01-11 2025-03-11 Deere & Company Predictive response map generation and control system
US12520759B2 (en) 2022-01-26 2026-01-13 Deere & Company Systems and methods for predicting material dynamics
US12082531B2 (en) 2022-01-26 2024-09-10 Deere & Company Systems and methods for predicting material dynamics
US12295288B2 (en) 2022-04-05 2025-05-13 Deere &Company Predictive machine setting map generation and control system
US12284934B2 (en) 2022-04-08 2025-04-29 Deere & Company Systems and methods for predictive tractive characteristics and control
US12058951B2 (en) 2022-04-08 2024-08-13 Deere & Company Predictive nutrient map and control
US12298767B2 (en) 2022-04-08 2025-05-13 Deere & Company Predictive material consumption map and control
US12582035B2 (en) 2022-04-08 2026-03-24 Deere & Company Systems and methods for predictive power requirements and control
US12358493B2 (en) 2022-04-08 2025-07-15 Deere & Company Systems and methods for predictive power requirements and control

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314708A (zh) * 2000-03-09 2001-09-26 夏普公司 半导体装置
US6638789B1 (en) * 2000-09-26 2003-10-28 Amkor Technology, Inc. Micromachine stacked wirebonded package fabrication method
CN1463036A (zh) * 2001-07-10 2003-12-24 株式会社东芝 存储器芯片和使用该芯片的“芯片上芯片”器件及其制造方法
CN1561545A (zh) * 2001-09-28 2005-01-05 摩托罗拉公司 带多行焊接焊盘的半导体芯片
CN1694251A (zh) * 2004-04-30 2005-11-09 尔必达存储器株式会社 通过堆叠组合体内的丝焊与外部端子相连的半导体器件
US20060226529A1 (en) * 2001-03-30 2006-10-12 Fujitsu Limited Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
US20070176278A1 (en) * 2003-03-21 2007-08-02 Advanced Semiconductor Engineering, Inc. Multi-chips stacked package
US20080087999A1 (en) * 2006-10-16 2008-04-17 Powertech Technology Inc. Micro BGA package having multi-chip stack
US20080160674A1 (en) * 2006-12-28 2008-07-03 Hem Takiar Method of making a semiconductor device having multiple die redistribution layer
CN101404279A (zh) * 2008-11-11 2009-04-08 华亚微电子（上海）有限公司 一种多芯片3d堆叠封装结构
CN101599483A (zh) * 2008-06-04 2009-12-09 奇景光电股份有限公司 堆叠式裸芯封装
CN102110678A (zh) * 2009-12-31 2011-06-29 日月光半导体制造股份有限公司 半导体封装件及其制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235264A (ja) * 1988-03-15 1989-09-20 Toshiba Corp 半導体集積回路装置
CN100407422C (zh) * 2001-06-07 2008-07-30 株式会社瑞萨科技 半导体装置及其制造方法
JP2003023135A (ja) * 2001-07-06 2003-01-24 Sharp Corp 半導体集積回路装置
US7095103B1 (en) * 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
KR100621547B1 (ko) * 2004-01-13 2006-09-14 삼성전자주식회사 멀티칩 패키지
JP5131812B2 (ja) * 2007-02-07 2013-01-30 ルネサスエレクトロニクス株式会社 半導体装置
KR101185886B1 (ko) * 2007-07-23 2012-09-25 삼성전자주식회사 유니버설 배선 라인들을 포함하는 반도체 칩, 반도체패키지, 카드 및 시스템
US8704379B2 (en) * 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
KR20110041301A (ko) * 2009-10-15 2011-04-21 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
US8674483B2 (en) 2011-06-27 2014-03-18 Marvell World Trade Ltd. Methods and arrangements relating to semiconductor packages including multi-memory dies
TWI565026B (zh) * 2012-01-05 2017-01-01 威盛電子股份有限公司 晶片封裝結構

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314708A (zh) * 2000-03-09 2001-09-26 夏普公司 半导体装置
US6638789B1 (en) * 2000-09-26 2003-10-28 Amkor Technology, Inc. Micromachine stacked wirebonded package fabrication method
US20060226529A1 (en) * 2001-03-30 2006-10-12 Fujitsu Limited Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
CN1463036A (zh) * 2001-07-10 2003-12-24 株式会社东芝 存储器芯片和使用该芯片的“芯片上芯片”器件及其制造方法
CN1561545A (zh) * 2001-09-28 2005-01-05 摩托罗拉公司 带多行焊接焊盘的半导体芯片
US20070176278A1 (en) * 2003-03-21 2007-08-02 Advanced Semiconductor Engineering, Inc. Multi-chips stacked package
CN1694251A (zh) * 2004-04-30 2005-11-09 尔必达存储器株式会社 通过堆叠组合体内的丝焊与外部端子相连的半导体器件
US20080087999A1 (en) * 2006-10-16 2008-04-17 Powertech Technology Inc. Micro BGA package having multi-chip stack
US20080160674A1 (en) * 2006-12-28 2008-07-03 Hem Takiar Method of making a semiconductor device having multiple die redistribution layer
CN101599483A (zh) * 2008-06-04 2009-12-09 奇景光电股份有限公司 堆叠式裸芯封装
CN101404279A (zh) * 2008-11-11 2009-04-08 华亚微电子（上海）有限公司 一种多芯片3d堆叠封装结构
CN102110678A (zh) * 2009-12-31 2011-06-29 日月光半导体制造股份有限公司 半导体封装件及其制造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111103653A (zh) * 2018-10-26 2020-05-05 美光科技公司 具有光子集成电路(pic)芯片的半导体封装
US11525956B2 (en) 2018-10-26 2022-12-13 Micron Technology, Inc. Semiconductor devices having electro-optical substrates
US12300680B2 (en) 2018-10-26 2025-05-13 Micron Technology, Inc. Semiconductor packages having photon integrated circuit (PIC) chips
CN114242669A (zh) * 2022-02-28 2022-03-25 甬矽电子(宁波)股份有限公司 堆叠封装结构和堆叠结构封装方法
CN114242669B (zh) * 2022-02-28 2022-07-08 甬矽电子(宁波)股份有限公司 堆叠封装结构和堆叠结构封装方法

Also Published As

Publication number Publication date
US9117790B2 (en) 2015-08-25
KR20150040893A (ko) 2015-04-15
JP2015527736A (ja) 2015-09-17
WO2014018538A1 (en) 2014-01-30
US20140021598A1 (en) 2014-01-23

Similar Documents

Publication Publication Date Title
CN104769709A (zh) 涉及包括多存储器裸片的半导体封装体的方法和布置
US8310063B2 (en) Semiconductor package structure and manufacturing process thereof
TWI741015B (zh) 積體電路裝置及組裝其之方法
CN104952855B (zh) 包括叠置的电子部件的电子组件
TWI706526B (zh) 藉由混合接合之半導體晶片與另一晶片的組合
KR20200109244A (ko) 기판 패치 재구성 옵션들
CN111868925A (zh) 芯片尺度薄3d管芯堆叠封装
US20150221614A1 (en) High-bandwidth dram using interposer and stacking
CN103890942A (zh) 堆叠式封装体结构
US9105610B2 (en) Methods and arrangements relating to semiconductor packages including multi-memory dies
TWI419270B (zh) 封裝堆疊結構
KR20150007990A (ko) 복수의 다이를 위한 패키지 어셈블리 구성 및 연관 기법
CN103579208A (zh) 三维集成电路及其制作方法
CN104851863A (zh) 一种集成电路、引线键合封装芯片及倒装封装芯片
US9059160B1 (en) Semiconductor package assembly
KR20120096754A (ko) 인터포저를 이용한 웨이퍼 칩의 3차원 스택 구조
US20160035701A1 (en) Semiconductor tsv device package for circuit board connection
TW201724408A (zh) 半導體元件中之功能性晶片島狀部的積體堆疊層
CN204424248U (zh) 硅通孔结构
CN105164806A (zh) 层叠封装结构
CN102856306A (zh) 半导体器件系统级封装结构及封装模组
CN103928416B (zh) 具有无源器件的半导体封装件及其堆叠方法
US20170047305A1 (en) Packaging arrangements including a serializing dram interface die
US20200043894A1 (en) Thermally-optimized tunable stack in cavity package-on-package
CN111009521A (zh) 多芯片封装模组

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150708