CN104756235B - 切割胶带 - Google Patents

切割胶带 Download PDF

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Publication number
CN104756235B
CN104756235B CN201380054399.5A CN201380054399A CN104756235B CN 104756235 B CN104756235 B CN 104756235B CN 201380054399 A CN201380054399 A CN 201380054399A CN 104756235 B CN104756235 B CN 104756235B
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CN
China
Prior art keywords
dicing tape
methyl
curing
adhesive layer
acrylate
Prior art date
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Active
Application number
CN201380054399.5A
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English (en)
Chinese (zh)
Other versions
CN104756235A (zh
Inventor
佐野透
矢吹朗
玉川有理
大田乡史
阿久津晃
松原侑弘
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication date
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Publication of CN104756235A publication Critical patent/CN104756235A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN201380054399.5A 2012-10-18 2013-10-15 切割胶带 Active CN104756235B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-230779 2012-10-18
JP2012230779A JP5294366B1 (ja) 2012-10-18 2012-10-18 ダイシングテープ
PCT/JP2013/077898 WO2014061629A1 (ja) 2012-10-18 2013-10-15 ダイシングテープ

Publications (2)

Publication Number Publication Date
CN104756235A CN104756235A (zh) 2015-07-01
CN104756235B true CN104756235B (zh) 2017-05-24

Family

ID=49396755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380054399.5A Active CN104756235B (zh) 2012-10-18 2013-10-15 切割胶带

Country Status (7)

Country Link
JP (1) JP5294366B1 (ja)
KR (1) KR101470802B1 (ja)
CN (1) CN104756235B (ja)
MY (1) MY178666A (ja)
SG (1) SG11201502324TA (ja)
TW (1) TWI506118B (ja)
WO (1) WO2014061629A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6673734B2 (ja) * 2016-03-29 2020-03-25 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP6623098B2 (ja) * 2016-03-29 2019-12-18 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP6661438B2 (ja) * 2016-03-29 2020-03-11 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP6745136B2 (ja) * 2016-05-16 2020-08-26 株式会社アルバック 電子部品の製造方法および処理システム
KR101877897B1 (ko) * 2017-03-06 2018-07-12 엘비세미콘 주식회사 범프 구조체의 제조방법
JP7041476B2 (ja) * 2017-07-04 2022-03-24 日東電工株式会社 ダイシングテープおよびダイシングダイボンドフィルム
JP6566324B2 (ja) 2017-09-29 2019-08-28 サイデン化学株式会社 粘着シート
JP7224231B2 (ja) * 2019-04-17 2023-02-17 日東電工株式会社 ダイシングダイボンドフィルム
JPWO2022255322A1 (ja) * 2021-06-02 2022-12-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101906278A (zh) * 2010-08-12 2010-12-08 华南理工大学 一种单组份醋酸乙烯酯粘合剂及其制备方法
TW201203342A (en) * 2010-04-20 2012-01-16 Nitto Denko Corp Adhesive sheet for semiconductor wafer processing

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726350B2 (ja) * 1992-02-24 1998-03-11 リンテック株式会社 ウェハ貼着用粘着シート
JP2002373871A (ja) * 2001-06-15 2002-12-26 Sekisui Chem Co Ltd Ｉｃチップの製造方法
JP4913584B2 (ja) * 2006-03-27 2012-04-11 古河電気工業株式会社 ウェハ加工方法及びそれに用いるウェハ加工用テープ
JP4970863B2 (ja) * 2006-07-13 2012-07-11 日東電工株式会社 被加工物の加工方法
JP4931519B2 (ja) * 2006-09-01 2012-05-16 日東電工株式会社 活性面貼付ダイシング用粘着テープ又はシートおよび被加工物の切断片のピックアップ方法
JP2010260893A (ja) * 2009-04-30 2010-11-18 Nitto Denko Corp 積層フィルム及び半導体装置の製造方法
JP2011089009A (ja) * 2009-10-22 2011-05-06 Hitachi Maxell Ltd 放射線硬化性粘着剤組成物、それを用いたダイシング用粘着フィルム、及び切断片の製造方法
JP5899622B2 (ja) * 2011-02-08 2016-04-06 日立化成株式会社 半導体用粘接着シート、半導体用粘接着シートの製造方法、半導体ウエハ、半導体装置及び半導体装置の製造方法
JP5803123B2 (ja) * 2011-02-08 2015-11-04 日立化成株式会社 半導体用粘接着シート、それを用いた半導体ウエハ、半導体装置及び半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201203342A (en) * 2010-04-20 2012-01-16 Nitto Denko Corp Adhesive sheet for semiconductor wafer processing
CN101906278A (zh) * 2010-08-12 2010-12-08 华南理工大学 一种单组份醋酸乙烯酯粘合剂及其制备方法

Also Published As

Publication number Publication date
MY178666A (en) 2020-10-20
TW201430092A (zh) 2014-08-01
KR20140097591A (ko) 2014-08-06
WO2014061629A1 (ja) 2014-04-24
TWI506118B (zh) 2015-11-01
KR101470802B1 (ko) 2014-12-08
SG11201502324TA (en) 2015-05-28
JP2014082414A (ja) 2014-05-08
JP5294366B1 (ja) 2013-09-18
CN104756235A (zh) 2015-07-01

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